CN209906917U

CN209906917U - Electroplating device for mobile phone shell

Info

Publication number: CN209906917U
Application number: CN201920350344.3U
Authority: CN
Inventors: 尹连花
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-03-20
Filing date: 2019-03-20
Publication date: 2020-01-07
Anticipated expiration: 2029-03-20

Abstract

The utility model discloses an electroplating device for cell-phone shell, including plating bath, electrode slice and switch, the electrode slice buckle is installed in the inside both sides of plating bath, the switch is inlayed in plating bath side surface, and electric connection between the anodal and electrode slice of switch, the plating bath top is inlayed and is had the locating rack, locating rack surface mosaic has electric telescopic handle, electric telescopic handle is located the plating bath, and electric telescopic handle surface mosaic has the support frame, electric connection between switch negative pole and the support frame, the inside bottom surface mosaic of plating bath has electric heater. The utility model discloses a sealed rubber ring of installation is detained on lug surface cover can effectively avoid the inside operation of electroplating of adversary's casing in the liquid infiltration cell-phone shell, simultaneously through the sealing plug of lug surface rotation installation, can possess the cell-phone shell that some sealed surfaces have the camera hole, supplies power in the bracket frame through the switch to the electrode slice, electroplates the operation through plating solution adversary's casing.

Description

Electroplating device for mobile phone shell

Technical Field

The utility model relates to an electroplate the device, in particular to cell-phone shell is with electroplating device.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electroplating, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electroplating, thereby playing roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The outer layer of many coins is also plated.

And at the in-process of production cell-phone, often need electroplate the operation to the cell-phone as required, and traditional cell-phone shell electroplates device work efficiency and is slower, and cell-phone shell inside also can electroplate moreover, can't satisfy the requirement of producer to the product. To this end, we propose a plating apparatus for a mobile phone case.

Disclosure of Invention

The utility model aims to provide a cell-phone shell is with electroplating device can effectively solve the problem among the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an electroplating device for cell-phone shell, includes plating bath, electrode slice and switch, the electrode slice buckle is installed in the inside both sides of plating bath, the switch is inlayed in a side surface of plating bath, and electric connection between the anodal and electrode slice of switch, the plating bath top is inlayed and is had the locating rack, locating rack surface mosaic has electric telescopic handle, electric telescopic handle is located the plating bath, and electric telescopic handle surface mosaic has the bracket, electric connection between switch negative pole and the bracket, the inside bottom surface mosaic of plating bath has electric heater.

Further, an air pump is installed on the surface of the bottom end of the electroplating bath in a buckling mode, an air delivery pipe is installed on an air outlet of the air pump in a buckling mode, and one end of the air delivery pipe is located at the bottom end inside the electroplating bath.

Furthermore, a convex block is installed on the surface of the bracket in a sliding and buckling mode, a sealing rubber ring is installed on the surface of the convex block in a sleeved and buckled mode, a threaded hole is formed in the surface of the top end of the convex block, and a sealing plug is installed inside the threaded hole in a rotating mode.

Furthermore, a temperature sensor is installed on the surface of the inner wall of the electroplating bath in a buckling mode, a display is embedded on the surface of the positioning frame 4, and the display is electrically connected with the temperature sensor.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. this kind of electroplating device for cell-phone shell can effectively avoid the liquid infiltration adversary casing inside to electroplate the operation through the sealed rubber ring of lug surface cover knot installation in the cell-phone shell, simultaneously through the sealing plug of lug surface rotation installation, can possess sealed some surfaces and have the cell-phone shell of camera hole, supplies power in the bracket through the switch to the electrode slice, electroplates the operation through plating solution adversary casing.

2. This kind of electroplating device for cell-phone shell passes through the inside bottom mosaic electric heater of plating bath, can heat the plating solution, required temperature when making the plating solution satisfy the cell-phone shell and electroplate, the temperature sensor through the inside mosaic of plating bath can measure the plating solution temperature simultaneously and show on the display, the person of conveniently controlling records and regulates and control the temperature, air pump through plating bath bottom surface buckle installation, the accessible gas-supply pipe carries out the air feed inside the plating bath, thereby mix the inside plating solution of plating bath and flow messenger's plating solution can be better with cell-phone shell production reaction.

Drawings

Fig. 1 is a schematic view of the whole structure of the electroplating device for the mobile phone shell of the present invention.

Fig. 2 is a schematic view of the structure of the object holder of the electroplating device for mobile phone housing of the present invention.

In the figure: 1. an electroplating bath; 2. an electrode sheet; 3. a switch; 4. a positioning frame; 5. a display; 6. an electric telescopic rod; 7. a rack; 8. a bump; 9. sealing the rubber ring; 10. a threaded hole; 11. a sealing plug; 12. an air pump; 13. a gas delivery pipe; 14. an electric heater; 15. temperature sensor.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-2, an electroplating device for a mobile phone shell comprises an electroplating bath 1, electrode plates 2 and a switch 3, wherein the electrode plates 2 are installed on two sides inside the electroplating bath 1 in a buckled manner, the switch 3 is embedded on the surface of one side of the electroplating bath 1, the positive electrode of the switch 3 is electrically connected with the electrode plates 2, a positioning frame 4 is embedded at the top end of the electroplating bath 1, an electric telescopic rod 6 is embedded on the surface of the positioning frame 4, the electric telescopic rod 6 is located inside the electroplating bath 1, a bracket 7 is embedded on the surface of the electric telescopic rod 6, an electric heater 14 is embedded on the surface of the bottom end inside the electroplating bath 1, and the negative electrode of the switch 3 is electrically.

In this embodiment, as shown in fig. 1, the air pump 12 is fastened to the bottom of the electroplating tank 1, and air can be supplied to the inside of the electroplating tank through the air pipe 13, so that the electroplating solution in the electroplating tank can be stirred to flow, and the electroplating solution can better react with the mobile phone shell.

The air pump 12 is installed on the surface of the bottom end of the electroplating bath 1 in a buckled mode, the air delivery pipe 13 is installed on an air outlet of the air pump 12 in a buckled mode, and one end of the air delivery pipe 13 is located at the bottom end inside the electroplating bath 1.

In this embodiment, as shown in fig. 1, the sealing payment 9 installed by engaging the surface of the bump 8 can effectively prevent liquid from permeating into the mobile phone case to electroplate the interior of the mobile phone case, and meanwhile, the sealing plug 11 installed by rotating the surface of the bump 8 can seal some mobile phone cases with camera holes on the surface.

The surface of the bracket 7 is provided with a convex block 8 in a sliding buckle manner, the surface of the convex block 8 is provided with a sealing rubber ring 9 in a sleeving and buckling manner, the top surface of the convex block 8 is provided with a threaded hole 10, and the inside of the threaded hole 10 is rotatably provided with a sealing plug 11.

In this embodiment, as shown in fig. 1, the electric heater 14 embedded in the bottom end of the plating tank 1 can heat the plating solution to make the plating solution meet the temperature required for the plating of the mobile phone shell, and the temperature sensor 15 embedded in the plating tank 1 can measure and display the temperature of the plating solution on the display 5, so that the operator can record and regulate the temperature conveniently.

The temperature sensor 15 is installed on the surface of the inner wall of the electroplating bath 1 in a buckling mode, the display 5 is embedded in the surface of the positioning frame 4, and the display 5 is electrically connected with the temperature sensor 15.

It should be noted that the utility model relates to an electroplating device for a mobile phone shell, which comprises an electroplating bath 1, an electrode plate 2, a switch 3, a positioning frame 4, a display 5, an electric telescopic rod 6, a bracket 7, a convex block 8, a sealing rubber ring 9, a threaded hole 10, a sealing plug 11, an air pump 12, a gas pipe 13, an electric heater 14 and a temperature sensor 15, wherein the components are all universal standard components or components known by technicians in the field, the structure and the principle of the components are all known by technical instruction manuals or conventional experimental methods, electroplating solution is poured into the electroplating bath 1 during working, the mobile phone shell is buckled and installed on the convex block 8 on the surface of the bracket 7, the sealing rubber ring 9 installed by sleeving and buckling on the surface of the convex block 8 can effectively prevent liquid from permeating into the interior of the mobile phone shell in the mobile phone shell, and the sealing plug 11 installed by rotating the surface of the convex block 8, can possess some sealed surfaces and have the cell-phone shell of camera hole, supply power in bracket 7 to electrode slice 2 through the switch, electroplate the operation to the cell-phone shell through the plating solution, through the inside embedded electric heater 14 in bottom of plating bath 1, can heat the plating solution, make the plating solution satisfy required temperature when the cell-phone shell is electroplated, can measure the display on display 5 with the plating solution temperature through the inside embedded temperature-sensing ware 15 of plating bath 1 simultaneously, the person of conveniently controlling records and regulates and control the temperature, air pump 12 through the surface buckle installation of 1 bottom of plating bath, accessible gas-supply pipe 13 carries out the air feed to the inside of plating bath, thereby mix the inside plating solution of plating bath and flow and make the plating solution can be better produce the reaction with the cell-phone shell.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a cell-phone shell is with electroplating device, includes plating bath (1), electrode slice (2) and switch (3), electrode slice (2) buckle is installed in the inside both sides of plating bath (1), switch (3) are inlayed in plating bath (1) side surface, and electric connection, its characterized in that between switch (3) positive pole and electrode slice (2): plating bath (1) top is inlayed and is had locating rack (4), locating rack (4) surface mosaic has electric telescopic handle (6), electric telescopic handle (6) are located plating bath (1), and electric telescopic handle (6) surface mosaic has bracket (7), electric connection between switch (3) negative pole and the bracket (7), inside bottom surface mosaic of plating bath (1) has electric heater (14).

2. A plating apparatus for a handset case according to claim 1, characterized in that: an air pump (12) is installed on the surface of the bottom end of the electroplating bath (1) in a buckled mode, an air delivery pipe (13) is installed on an air outlet of the air pump (12) in a buckled mode, and one end of the air delivery pipe (13) is located at the bottom end inside the electroplating bath (1).

3. A plating apparatus for a handset case according to claim 1, characterized in that: lug (8) are installed to bracket (7) surface thread slipping, sealing rubber ring (9) are installed to lug (8) surface eye-splice, screw hole (10) have been seted up on lug (8) top surface, sealing plug (11) are installed to screw hole (10) inside rotation.

4. A plating apparatus for a handset case according to claim 1, characterized in that: the temperature sensor (15) is installed on the surface of the inner wall of the electroplating bath (1) in a buckling mode, the display (5) is embedded in the surface of the positioning frame (4), and the display (5) is electrically connected with the temperature sensor (15).