CN109309036B - Substrate transfer device - Google Patents
Substrate transfer device Download PDFInfo
- Publication number
- CN109309036B CN109309036B CN201711452683.4A CN201711452683A CN109309036B CN 109309036 B CN109309036 B CN 109309036B CN 201711452683 A CN201711452683 A CN 201711452683A CN 109309036 B CN109309036 B CN 109309036B
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- moving
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- 239000000758 substrate Substances 0.000 title claims abstract description 98
- 238000004378 air conditioning Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a substrate transfer apparatus including: a supporting unit provided at an upper portion of a loading table for supporting a substrate; a first transfer unit supported by the support unit; a connection unit connected to the first transfer unit; a second transfer unit connected to the connection unit; and a holding unit connected to the second transfer unit and holding the substrate.
Description
Technical Field
The present invention relates to a substrate transfer apparatus for transferring a substrate in a vertical (vertical) direction.
Background
In general, in a process of manufacturing a liquid crystal display panel, an organic electroluminescence display panel, an inorganic electroluminescence display panel, a transmissive projection substrate, and a reflective projection substrate of a flat panel display, there is a process of transferring a brittle glass substrate (hereinafter referred to as "substrate") such as glass.
In order to transfer the substrate in the horizontal and vertical directions, various substrate transfer apparatuses having different structures are used. In particular, the device for transferring the substrate in the vertical direction needs to lift the substrate in a direction opposite to the gravitational direction, and a structure for slidably moving a holding unit for holding the substrate is required. The structure of the sliding movement holding unit may be applied to a substrate transfer apparatus, and may be a structure in which a ball screw is vertically provided and a ball nut connected to the holding unit is moved along with the ball screw, or a structure in which a connecting rod connected to the holding unit is moved in a vertical direction by air pressure or hydraulic pressure.
In the structure in which the ball screw is vertically provided and the ball nut connected to the holding unit is moved along the ball screw, the ball screw needs to be vertically provided, and therefore, a predetermined height needs to be ensured in order to provide the substrate transfer device.
As shown in fig. 1 and 2, in the substrate transfer apparatus 20 in which the driving unit 23 moves the link 26 connected to the holding unit 25 in the vertical direction, the driving unit 23 accommodating the link 26 has a predetermined height, and therefore, a height work space higher than the ground up to the tip of the driving unit 23 needs to be secured in order to install the substrate transfer apparatus 20.
In addition, there has been proposed a method in which a plurality of apparatuses capable of performing a plurality of processes for processing a substrate, such as a substrate processing process and a substrate dicing process, are vertically arranged. The plurality of devices are vertically disposed, as compared with the case where the plurality of devices are horizontally disposed, so that the operation space can be reduced. When the plurality of devices are arranged vertically, the substrate moves in the vertical direction and is transferred to each device. For this reason, a working space higher than the height of the substrate transfer apparatus must be ensured. However, the working space in the building is generally limited, and when the height of the working space is limited, it is difficult to further increase the height of the working space. Therefore, there is a problem that a solution of vertically arranging the apparatus to reduce the width of the working space is difficult to realize in practice.
Disclosure of Invention
In order to solve the above-described problems of the prior art, an object of the present invention is to provide a substrate transfer apparatus that reduces the vertical height of a space required for installing the substrate transfer apparatus while securing a vertical transfer distance of a substrate.
In order to achieve the above object, the present invention provides a substrate transfer apparatus comprising: a supporting unit provided at an upper portion of a loading table for supporting a substrate; a first transfer unit supported by the support unit; a connection unit connected to the first transfer unit; a second transfer unit connected to the connection unit; and a holding unit connected to the second transfer unit and holding the substrate.
The second transfer unit is movably connected to the connection unit.
The first transfer unit includes a first guide portion supported by the support unit and vertically elongated and a first moving portion moving along the first guide portion, and the second transfer unit includes a second guide portion supported by the connection unit and vertically elongated and a second moving portion moving along the second guide portion.
And a moving device for vertically moving the second guide part relative to the connecting unit is arranged between the connecting unit and the second guide part.
The upper end of the second guide part is positioned at the same position as the upper end of the first guide part or the upper end of the second guide part is positioned below the upper end of the first guide part in a state in which the first moving part is lifted to the highest height and the second moving part is lifted to the highest height.
The first transfer unit is capable of moving the connection unit in a vertical direction, and the second transfer unit is capable of moving the holding unit in a vertical direction.
The connecting unit is movably connected with the second guide part of the second transfer unit.
The connecting unit is connected with the first moving part of the first transferring unit.
The holding unit is connected to the second moving part of the second transfer unit.
The connecting unit is fixedly connected with the second guide part of the second transferring unit.
Effects of the invention
In the substrate transfer apparatus according to the embodiment of the invention, in order to vertically move the substrate, the first transfer unit and the second transfer unit which are vertically disposed are operated together, and the maximum height of the substrate transfer apparatus required for the maximum lifting holding unit can be reduced as compared with the substrate transfer apparatus in the related art. Thus, the height of the space required for installing the substrate transfer device can be reduced, and the degree of freedom of installing the substrate transfer device can be increased. Furthermore, it is easy to realize a solution of vertically arranging the device to reduce the width of the working space.
Drawings
Fig. 1 and 2 are schematic views schematically showing a substrate transfer apparatus according to the related art.
Fig. 3 is a schematic view schematically showing a substrate transfer apparatus according to a first embodiment of the present invention.
Fig. 4a to 4c are schematic operation sequence diagrams of the substrate transfer apparatus according to the first embodiment of the present invention.
Fig. 5 is a schematic diagram showing a substrate transfer apparatus according to a first embodiment of the present invention compared with a substrate transfer apparatus according to the prior art.
Fig. 6 is a schematic view schematically showing a substrate transfer apparatus according to a second embodiment of the present invention.
Fig. 7a to 7d are schematic views illustrating an operation sequence of the substrate transfer apparatus according to the second embodiment of the present invention.
Fig. 8 is a schematic diagram showing a substrate transfer apparatus according to a second embodiment of the present invention compared with a substrate transfer apparatus according to the prior art.
Reference numerals:
10: loading table 200 substrate transfer apparatus
210: the first transfer unit 220: second transfer unit
230: the supporting unit 240: connection unit
250: gripping unit 270: mobile device
Detailed Description
Hereinafter, a substrate transfer apparatus according to an embodiment of the present invention will be described with reference to the drawings.
As shown in fig. 3 to 5, the substrate transfer apparatus 200 in the first embodiment of the present invention includes: a support unit 230 disposed above the loading table 10 supporting the substrate S; a first transfer unit 210 supported by the support unit 230; a connection unit 240 connected to the first transfer unit 210; a second transfer unit 220 connected to the connection unit 240; and a holding unit 250 connected to the second transfer unit 220 for holding the substrate S.
The support unit 230 may be in the shape of a support bar elongated in a horizontal direction.
The first transfer unit 210 and the second transfer unit 220 may be vertically disposed. The second transfer unit 220 is connected to the first transfer unit 210 through a connection unit 240.
The first transfer unit 210 is provided to the support unit 230 to be movable in a horizontal direction. That is, the first transfer unit 210 may move along the support unit 230. For this, a driving device 260 is provided between the first transfer unit 210 and the support unit 230 such that the first transfer unit 210 moves along the support unit 230. The driving means 260 may be an actuator operated according to pneumatic or hydraulic pressure, a linear motor operated according to electromagnetic interaction, or a linear moving means such as a ball screw means.
The first transfer unit 210 moves the connection unit 240 and the second transfer unit 220 connected to the connection unit 240 in a vertical direction. The first transfer unit 210 includes: a first guide part 211 supported by the support unit 230 and vertically extended; a first moving part 212 moving along the first guide part 211. For example, the first transfer unit 210 may be an actuator, and in this case, the first guide part 211 may be a cylinder, and the first moving part 212 may be a connection rod moving along the first guide part 211 according to the air pressure or the hydraulic pressure in the first guide part 211. Here, the first moving part 212 may be elongated longer in the vertical direction. In another example, the first transfer unit 210 may be a ball screw device, and in this case, the first guide portion 211 may be a guide portion including a ball screw, and the first moving portion 212 may include a ball nut connected to the ball screw to interact with the ball screw. As another example, the first transfer unit 210 may be a transfer device in which the first guide portion 211 is vertically extended, and the first moving portion 212 obtains power from a predetermined driving source to vertically move along the first guide portion 211.
In the drawings, the two first transfer units 210 are provided in the horizontal direction, but the present invention is not limited to the number and arrangement of the first transfer units 210. That is, the number of the first transfer units 210 may be appropriately set according to the weight, size, shape, etc. of the objects (i.e., the second transfer unit 220, the holding unit 250, and the substrate S) vertically transferred by the first transfer unit 210.
The second transfer unit 220 moves the holding unit 250 in the vertical direction. The second transfer unit 220 may be synchronized or linked with the operation of the first transfer unit 210 or operate independently of the operation of the first transfer unit 210. Also, the second transfer unit 220 may operate together with the operation of the first transfer unit 210. However, for convenience of explanation, a process of operating the first transfer unit 210 and then operating the second transfer unit 220 is illustrated in fig. 4a to 4c, but the present invention is not limited to the operation sequence of the first transfer unit 210 and the second transfer unit 220. That is, the second transfer unit 220 may operate prior to the first transfer unit 210.
The second transfer unit 220 includes: a second guide 221 supported by the connection unit 240 and vertically extended; and a second moving part 222 moving along the second guide part 221. For example, the second transfer unit 220 may be an actuator, in which case the second guide 221 may be a cylinder, and the second moving part 222 may be a connection rod moving along the second guide 221 according to the air pressure or the hydraulic pressure within the second guide 221. Here, the second moving part 222 may be elongated longer in the vertical direction. In another example, the second transfer unit 220 may be a ball screw device, and in this case, the second guide 221 is a guide including a ball screw, and the second moving portion 222 includes a ball nut connected to the ball screw and interacting with the ball screw. As another example, the second transfer unit 220 may be a transfer device in which the second guide 221 is vertically extended, and the second moving part 222 obtains power from a predetermined driving source to vertically move along the second guide 221.
In addition, although the structure in which one second transfer unit 220 is connected to two first transfer units 210 is shown in the drawings, the present invention is not limited to the number and arrangement of the second transfer units 220. That is, the number of the second transfer units 220 may be appropriately set according to the weight, size, shape, etc. of the objects (i.e., the holding unit 250 and the substrate S) vertically transferred by the second transfer units 220.
In addition, in the embodiment of the present invention, a structure including the first transfer unit 210 and the second transfer unit 220 is suggested, for example, more transfer units may be vertically disposed, and a connection unit is disposed between the plurality of transfer units, so that the plurality of transfer units may be connected to each other. According to the above configuration, a plurality of transfer units are operated together in order to vertically move the substrate S, so that the maximum height H2 required for the substrate transfer apparatus 200 to raise the holding unit 250 at the highest level can be lowered as compared with the substrate transfer apparatus 20 in the related art.
The connection unit 240 may be in the shape of a block connecting the first transfer unit 210 and the second transfer unit 220.
The connection unit 240 may be connected with the first moving part 212 of the first transfer unit 210. The connection unit 240 may be connected to the second guide 221 of the second transfer unit 220. Thus, when the first transfer unit 210 is operated, the second transfer unit 220 connected to the connection unit 240 may be vertically lifted and lowered together with the connection unit 240.
The holding unit 250 may be a structure including a clamp that holds the substrate S while pressing both sides of the substrate S, or may have a structure that adsorbs one side of the substrate S using vacuum.
According to the above structure, as shown in fig. 4a to 4c, when the first transfer unit 210 is operated, the first moving part 212 can be lifted and lowered along the first guide part 211. In addition, as the first moving unit 212 is lifted, the connection unit 240 and the second transfer unit 220 are lifted.
First, as shown in fig. 4a and 4b, when the first moving part 212 of the first transfer unit 210 is lifted along the first guide part 211, the connection unit 240 and the second transfer unit 220 are also lifted. Thereby, the holding unit 250 and the substrate S can be raised to a predetermined height. As shown in fig. 4b and 4c, when the second transfer unit 220 is operated and the second moving part 222 is lifted up along the second guide part 221, the holding unit 250 and the substrate S can be lifted up further. Thus, as shown in fig. 4c, the substrate S can be greatly raised by the raising of the second transfer unit 220 according to the operation of the first transfer unit 210 and the raising of the holding unit 250 according to the operation of the second transfer unit 220.
Here, the first guide portion 211 and the second guide portion 221 are arranged such that the upper end E2 of the second guide portion 221 is located at the same position as the upper end E1 of the first guide portion 211 or at a position below the upper end E1 of the first guide portion 211 in a state where the first moving portion 212 is raised to the highest level and the second moving portion 222 is raised to the highest level. That is, the first guide portion 211 and the second guide portion 221 are disposed such that the upper end E2 of the second guide portion 221 is located at the same position as the upper end E1 of the first guide portion 211 or at a position below the upper end E1 of the first guide portion 211 in a state where the substrate S is raised to the maximum height. For this, the length of the second guide 221 may be designed based on the length of the first guide 211. According to the above configuration, the upper end E2 of the second guide 221 does not exceed the height of the upper end E1 of the first guide 211 in a state where the substrate S is raised to the maximum height, and thus, there is no need to increase the installation height of the substrate transfer apparatus 200.
As shown in fig. 5, in order to raise and lower the substrate S, the first transfer unit 210 and the second transfer unit 220 are operated together so that the maximum height H2 of the substrate transfer apparatus 200 is lower than the maximum height H1 of the substrate transfer apparatus 20 in the related art in which only the connection rod 26 is raised to the maximum height when the grip unit 250 is raised to the highest position. That is, assuming that the vertical movement height H of the grip unit 25 in the related art is the same as the vertical movement height H of the grip unit 250, the maximum height H2 of the first transfer unit 210 in the present invention is lower than the maximum height H1 of the driving unit 23 in the related art.
Thus, according to the structure of the present invention, the height of the space required for installing the substrate transfer apparatus 200 can be reduced.
A substrate transfer apparatus according to a second embodiment of the present invention will be described below with reference to fig. 6 to 8. The same portions as those in the first embodiment described above will be denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in fig. 6 and 8, according to the substrate transfer apparatus 200 in the second embodiment of the present invention, the second transfer unit 220 is vertically movably connected to the connection unit 240. For this, a moving device 270 for vertically moving the second guide 221 is provided between the connection unit 240 and the second guide 221. Thereby, as the moving device 270 vertically moves the second guide 221, the holding unit 250 may vertically move with respect to the connection unit 240.
The moving device 270 may be an actuator operating according to a pneumatic or hydraulic cloud top, a linear motor operating in electromagnetic interaction, or a linear moving device such as a ball screw device.
Also, the process in which the second transfer unit 220 is lifted by the moving device 270 may be performed simultaneously with the operation of the first transfer unit 210, or may be performed separately. However, for convenience of explanation, a process of operating the first transfer unit 210 and then operating the moving device 270 after operating the second transfer unit 220 is illustrated in fig. 7a to 7d, but the present invention is not limited to the operation sequence of the first transfer unit 210, the second transfer unit 220, and the moving device 270. That is, the first transfer unit 210, the second transfer unit 220, and the moving device 270 may be operated at the same time, or the moving device 270 may be operated prior to the first transfer unit 210 or the second transfer unit 220. The first transfer unit 210, the second transfer unit 220, and the moving device 270 may operate in synchronization with each other or in linkage with each other, or may operate independently of each other.
As shown in fig. 7a to 7d and 8, the second transfer unit 220 can be lifted and lowered with respect to the connection unit 240, so that the height of the holding unit 250 can be more accurately and freely adjusted. Also, the second transfer unit 220 may be lifted with respect to the connection unit 240, and thus the vertical movement height H of the grip unit 250 may be further increased.
According to the above configuration, as shown in fig. 7a and 7b, the first moving part 212 of the first transfer unit 210 is lifted up along the first guide part 211, and the connection unit 240 and the second transfer unit 220 are lifted up. Thereby, the holding unit 250 and the substrate S can be raised to a predetermined height. As shown in fig. 7b and 7c, when the second transfer unit 220 is operated and the second moving part 222 is lifted up along the second guide part 221, the holding unit 250 and the substrate S can be lifted up further. As shown in fig. 7c and 7d, the moving device 270 is operated and the second transfer unit 220 is moved up, so that the holding unit 250 and the substrate S can be moved up further. Thus, as shown in fig. 7d, the substrate S can be greatly raised as the holding unit 250 is raised by the operations of the first transfer unit 210, the second transfer unit 220, and the moving device 270.
As in the first embodiment of the present invention, in a state where the first moving part 212 is raised to the highest level and the second moving part 222 is raised to the highest level, the first guide part 211 and the second guide part 221 may be configured such that the upper end E2 of the second guide part 221 is positioned at the same position as the upper end E1 of the first guide part 211 or at a position below the upper end E1 of the first guide part 211. Accordingly, the height of the upper end E2 of the second guide 221 does not exceed the height of the upper end E1 of the first guide 211 in a state where the substrate S is raised to the maximum height, and thus the installation height of the substrate transfer apparatus 200 does not further increase.
As shown in fig. 8, in order to lift the substrate S, the first transfer unit 210, the second transfer unit 220, and the moving device 270 are operated together, and thus, the maximum height H2 of the substrate transfer device 200 when the grip unit 250 is lifted to the highest position is lower than the maximum height H1 of the substrate transfer device 20 of the related art in which only the connection rod 26 is lifted to the maximum height. That is, assuming that the vertical movement height H of the grip unit 25 in the related art is the same as the vertical movement height H of the grip unit 250, the maximum height H2 of the first transfer unit 210 of the present invention is lower than the maximum height H1 of the driving unit 23 in the related art.
Therefore, according to the structure of the present invention, the space height required for the installation of the substrate transfer apparatus 200 can be reduced.
In the substrate transfer apparatus 200 according to the embodiment of the present invention described above, the first transfer unit 210 and the second transfer unit 220, which are vertically disposed, operate together in order to vertically move the substrate S, and the maximum height H2 of the substrate transfer apparatus 200 required for the maximum ascent gripping unit 250 can be reduced as compared with the substrate transfer apparatus 20 according to the related art. Thus, the height of the space required for installing the substrate transfer apparatus 200 can be reduced, and the degree of freedom of installation of the substrate transfer apparatus 200 can be increased. Furthermore, it is easy to realize a solution of vertically arranging the device to reduce the width of the working space.
Although the preferred embodiments of the present invention have been described in the foregoing description, the scope of the present invention is not limited to the specific embodiments, and may be appropriately modified within the scope of the claims.
Claims (9)
1. A substrate transfer apparatus, comprising:
a supporting unit provided at an upper portion of a loading table for supporting a substrate;
a first transfer unit supported by the support unit;
a connection unit connected to the first transfer unit;
a second transfer unit connected to the connection unit; a kind of electronic device with high-pressure air-conditioning system
A holding unit connected to the second transfer unit and holding the substrate;
wherein the first transfer unit includes:
a first guide part supported by the support unit and vertically extended; and
a first moving part moving along the first guide part;
wherein the second transfer unit includes:
a second guide part supported by the connection unit and vertically extended; and
a second moving part moving along the second guide part;
wherein when the first moving part is lifted, the upper end of the second guiding part is positioned at a height equal to or higher than the height of the supporting unit.
2. The substrate transfer apparatus according to claim 1, wherein the second transfer unit is movably connected to the connection unit.
3. The substrate transfer apparatus according to claim 1, wherein the first transfer unit is capable of moving the connection unit in a vertical direction, and the second transfer unit is capable of moving the holding unit in a vertical direction.
4. The substrate transfer apparatus according to claim 2, wherein the connection unit is movably connected to the second guide portion of the second transfer unit.
5. The substrate transfer apparatus according to claim 1, wherein the connection unit is connected to a first moving portion of the first transfer unit.
6. The substrate transfer apparatus according to claim 1, wherein the holding unit is connected to a second moving portion of the second transfer unit.
7. The substrate transfer apparatus according to claim 1, wherein the connection unit is fixedly connected to the second guide portion of the second transfer unit.
8. The substrate transfer apparatus according to claim 1, wherein,
and a moving device for vertically moving the second guide part relative to the connecting unit is arranged between the connecting unit and the second guide part.
9. The substrate transfer apparatus according to claim 1, wherein,
the upper end of the second guide part is positioned at the same position as the upper end of the first guide part or the upper end of the second guide part is positioned below the upper end of the first guide part in a state in which the first moving part is lifted to the highest height and the second moving part is lifted to the highest height.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170094925A KR102538425B1 (en) | 2017-07-26 | 2017-07-26 | Apparatus for conveying substrate |
| KR10-2017-0094925 | 2017-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109309036A CN109309036A (en) | 2019-02-05 |
| CN109309036B true CN109309036B (en) | 2023-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711452683.4A Active CN109309036B (en) | 2017-07-26 | 2017-12-28 | Substrate transfer device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102538425B1 (en) |
| CN (1) | CN109309036B (en) |
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| JP2003183015A (en) * | 2001-12-17 | 2003-07-03 | Sharp Corp | Device for making thin plate |
| KR100976391B1 (en) * | 2009-10-06 | 2010-08-18 | 유승진 | Print circuit board detector |
| KR20130005138A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Double-arm type three step cassette lifting robot |
| CN104723053A (en) * | 2013-12-20 | 2015-06-24 | 珠海格力电器股份有限公司 | Stroke amplifier |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3963576B2 (en) * | 1998-05-20 | 2007-08-22 | 日機装株式会社 | Film component laminating apparatus and laminating method |
| US6604624B2 (en) * | 1998-09-22 | 2003-08-12 | Hirata Corporation | Work conveying system |
-
2017
- 2017-07-26 KR KR1020170094925A patent/KR102538425B1/en active IP Right Grant
- 2017-12-28 CN CN201711452683.4A patent/CN109309036B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003183015A (en) * | 2001-12-17 | 2003-07-03 | Sharp Corp | Device for making thin plate |
| KR100976391B1 (en) * | 2009-10-06 | 2010-08-18 | 유승진 | Print circuit board detector |
| KR20130005138A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Double-arm type three step cassette lifting robot |
| CN104723053A (en) * | 2013-12-20 | 2015-06-24 | 珠海格力电器股份有限公司 | Stroke amplifier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109309036A (en) | 2019-02-05 |
| KR20190012310A (en) | 2019-02-11 |
| KR102538425B1 (en) | 2023-06-01 |
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