JP2008185583A - Electronic component transport device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component transport device and method that can be easily manufactured and reduce the cost of manufacture. <P>SOLUTION: This device includes: a workstation; a first supplying and mounting tool and a first collecting and mounting tool on a first side of the workstation; a second supplying and mounting tool and a second collecting and mounting tool in a second side; and a first pickup device and a second pickup device. The first and second supplying and mounting tools mount electronic components, and are available for suction by the first pickup device and the second pickup device and for transport to the workstation. Suction nozzles are installed in lifting rods of the first pickup device and the second pickup device, and slide-rail sets are installed in frames above the workstation. The first and second pickup devices are slidable in the three axis directions, the electronic components are correctly supplied to the workstation, an electronic device is placed on the workstation in stable horizontality, and, thus, operation becomes easier and operational quality is improved. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a first pickup device and a second pickup device that are installed above a workstation and are slidable in three axial directions. The electronic components are transferred to the workstation in a rotary manner, and the electronic components are stably leveled. The present invention relates to an electronic component transfer apparatus and method that can perform an operation by placing the device on a workstation to facilitate manufacturing and improve work quality.

  1, 2, and 3 show the invention according to Patent Document 1, and the test apparatus includes a test table 10, first and second pickup mechanisms 20 and 30, and supply and delivery mechanisms 40 and 50. Among them, first and second pickup mechanisms 20, 30 are provided on both sides of the test table 10, and each pickup mechanism has a lateral movement structure and a lifting structure combined with each other. Each lateral movement structure includes lateral slide rails 21 and 31 and lateral screws 22 and 32 provided on the frame. The lateral screws 22 and 32 are driven by motors 23 and 33, and screw sleeves 241 and 341 and a lateral slide sheet 242 are driven. , 342 including slide devices 24 and 34 are slidably installed on the sideways slide rails 21 and 31 and the sideways screws 22 and 32 in a screwed manner, and vertically oriented slide sheets 243 and 343 are provided on different surfaces. The elevating structure has vertical slide rails 251 and 351 on the side surfaces of the pickup devices 25 and 35 having suction nozzles on the bottom surface, and is slidably combined in the vertical slide sheets 243 and 343 of the slide devices 24 and 34. The lateral movement structure also includes lateral slide sheets 252 and 352 on the upper surfaces of the pickup devices 25 and 35, and is slidably combined with the lateral slide rails 261 and 361 of the support frames 26 and 36. The elevating structure includes two longitudinal slide seats 262 and 362 and screw sleeves 263 and 363 on the other surface of the support frames 26 and 36, and the frame is provided with longitudinal slide rails 27 and 37 and longitudinal screws 28 and 38, respectively. In combination, the longitudinal screws 28 and 38 are driven by the motors 29 and 39, so that when the motors 23 and 33 of each laterally moving structure drive the lateral screws 22 and 32, the lateral slide sheet 242 of the slide devices 24 and 34. 342 and the lateral slide seats 252 and 352 of the pickup devices 25 and 35 are driven to form a reciprocating movement in the X direction on the lateral slide rails 21 and 31 of the frame and the lateral slide rails 261 and 361 of the support frames 26 and 36. . When the motors 29 and 39 of the lifting structures drive the vertical screws 28 and 38, the vertical slide sheets 262 and 362 of the support frames 26 and 36 and the vertical slide rails 251 and 351 of the pickup devices 25 and 35 are driven. Thus, the Z-direction reciprocation is formed on the vertical slide rails 27 and 37 of the frame and the vertical slide sheets 243 and 343 of the slide devices 24 and 34. The supply mechanism 40 and the delivery mechanism 50 are provided in front of and behind the test table 10, respectively, have a mounting table structure including mounting tables 41 and 51, transfer ICs, and suction nozzles 42. , 52 is provided, and the IC is picked up and left. The suction nozzle 42 of the supply mechanism 40 places the IC to be tested on the mounting table 41, the mounting table 41 sends it below the pickup device 25 of the first supply mechanism 20, and the first pickup mechanism 20 The IC on the mounting table 41 is adsorbed by the adsorbing nozzle of the apparatus 25 and the test is performed by placing it on the test table 10. The mounting table 41 returns to its original position even if it moves in the opposite direction, and mounts the next IC. When the mounting table 41 of the supply mechanism 40 further transfers another IC to the side of the test table 10, the pickup device 35 of the second pickup mechanism 30 moves in the X direction, and the pickup device 35 is mounted on the supply mechanism 40. The IC is adsorbed by being placed on the mounting table 41. After the IC test of the first pickup mechanism 20 is completed, the pickup device 25 is driven and moved sideways to reach the placement table 51 of the delivery mechanism 50, and the pickup device 25 is lowered to place the IC on the placement table 51. At the same time, the pick-up device 35 of the second pick-up mechanism 30 moves in the XZ direction, and the pick-up device 35 places another IC on the test table 10 to perform the test. When the IC of the second pickup mechanism 30 is tested, the pickup device 25 of the first pickup mechanism 20 moves in the opposite direction and sucks the IC on the mounting table 41 of the supply mechanism 40 again. The pick-up device 35 of the second pick-up mechanism 30 sends the IC that has been tested on the mounting table 51 of the sending mechanism 50, and at this time, the first pick-up mechanism 20 places a new IC to be tested on the test table 10 for testing. Thus, the first and second pick-up mechanisms 20 and 30 sequentially transfer the ICs in order and use them for the test work.

Taiwan Patent Application No. 093110783

  In the invention described in the above-mentioned Patent Document 1, the pickup devices 25 and 35 having the suction nozzles of the first and second pickup mechanisms 20 and 30 can only move in the XZ biaxial direction. 25 and 35 cannot finely adjust the positions in the three-axis directions of XYZ at the respective pickup positions and leaving positions. For this reason, the position of movement of the mounting tables 41 and 51 relative to the test table 10 and the pickup The localization position of the movement of the devices 25 and 35 with respect to the test table 10 and the mounting tables 41 and 51 must have absolute accuracy in both assembly and design. However, under the restriction of movement in the two-axis direction of XZ, it becomes impossible to accurately transfer the IC and perform the test work. With a concrete cost of the problem. In addition, the pick-up devices 25 and 35 are installed on both sides of the test table 10 in the form of L-shaped arms, and the suction nozzles 253 and 353 are pressed down against the IC to be tested, but the leveling at that time is deteriorated, The test quality is affected.

  Therefore, the present invention provides a kind of transfer pickup device that can slide in three axial directions, and compensates for errors between the relative positions by a method of finely adjusting the movement, thereby facilitating manufacture and stable operation. Enable execution.

The invention of claim 1 is an electronic component transfer device,
At least one workstation, to which electronic components to perform work are sent to perform the work of the electronic components;
A first supply mounting tool, the first supply mounting tool being placed on one side of the workstation and mounting an electronic component for performing work;
A first supply mounting tool, which is a second supply mounting tool, which is located on the other side of the workstation and on which an electronic component for performing work is placed;
A first collection placement tool, which is located on the same side as the first supply placement tool, and on which the completed electronic component is placed;
A second collection placement tool, which is located on the same side as the second supply placement tool, and places the completed electronic component; and
A first pick-up device, which is mounted on a frame above the workstation with a slide rail set, is slidable in three axial directions, and transfers electronic components to perform work; and
A second pickup device, which is mounted on a frame above the workstation with a slide rail set, is slidable in three axial directions, and transfers electronic components to perform work; and
It is set as the electronic component transfer apparatus characterized by including.
According to a second aspect of the present invention, in the electronic component transfer device according to the first aspect, the first supply mounting tool and the second supply mounting tool are fixed or movable supply mounting tools. And an electronic component transfer device.
According to a third aspect of the present invention, in the electronic component transfer apparatus according to the first aspect, the first collection mounting tool and the second collection mounting tool are fixed or movable collection mounting tools. And an electronic component transfer device.
According to a fourth aspect of the present invention, in the electronic component transfer device according to the first aspect, the first pickup device has a suction nozzle attached to the front end of the lifting rod, and the electronic component on the supply mounting device is collected by the workstation and the electronic component. The electronic component transfer device is characterized in that the electronic component is transferred between mounting tools, and the electronic component is subjected to a lower pressure for work.
According to a fifth aspect of the present invention, in the electronic component transfer device according to the first aspect, the second pickup device has a suction nozzle attached to the front end of the lifting rod, and the electronic component on the supply mounting device is collected by the workstation. The electronic component transfer device is characterized in that the electronic component is transferred between mounting tools, and the electronic component is subjected to a lower pressure for work.
The invention of claim 6 is an electronic component transfer method,
A. A step in which the first pickup device is positioned on the first supply mounting tool portion and waits for pickup of an electronic component to be operated; and a second pickup device is positioned above the workstation and waits for execution of work on the electronic component;
B. After completion of the work of the electronic components in the workstation, the electronic components completed by the second pickup device are transferred to the second collecting and placing device, and the electronic components to be worked by the first pickup device are transferred to the workstation. Steps to be carried out,
C. Simultaneously performing work on the electronic components in the workstation, the second pick-up device moving to the second supply platform part and waiting for pick-up of the electronic components to perform the next set of work;
D. After the work of the electronic components in the workstation is completed, the electronic components completed by the first pick-up device are transferred to the first collecting and placing device, and the second pick-up device performs the next set of operations as work pieces. Steps to transfer to the station for work execution,
E. The first pickup device moves to the first supply mounting part and waits for the electronic component to perform the next set of operations at the same time as performing the operation on the electronic component in the workstation;
The electronic component transfer method is characterized by including the above steps A to E.
According to a seventh aspect of the present invention, in the electronic component transfer method according to the sixth aspect, when the first pick-up device sucks the electronic component to be operated and transfers it to a work station for use in the operation, the electronic component is reduced in pressure for the operation. The electronic component transfer method is characterized by providing the electronic component.
According to an eighth aspect of the present invention, in the electronic component transfer method according to the sixth aspect, when the second pickup device picks up the electronic component to be operated and transfers it to the work station for use in the operation, the electronic component is reduced in pressure for the operation. The electronic component transfer method is characterized by providing the electronic component.
According to a ninth aspect of the present invention, in the electronic component transfer method according to the sixth aspect, the electronic components that perform work on the first supply mounting tool and the second supply mounting tool are left untransferred by the supply-side transport mechanism. This is an electronic component transfer method.
According to a tenth aspect of the present invention, in the electronic component transfer method according to the sixth aspect, the completed electronic parts on the first collection mounting device and the second collection mounting device are transferred to the collection mechanism by the sending side transport mechanism. The electronic component transfer device is characterized by being classified and left unattended.

  The present invention provides a kind of electronic component transfer apparatus and method, which includes a workstation, a first supply platform on one side of the workstation, a first collection platform, and a second supply platform on the other side. And a second collection mounting tool, a first pickup device, and a second pickup device. Among them, a suction nozzle is provided at the front ends of the lifting rods of the first pickup device and the second pickup device, and the lifting rods are installed on a frame above the workstation by a slide rail set, respectively, and can slide in three axial directions. The first pick-up device and the second pick-up device can be slid in the three-axis directions at the time of performing the work, and are finely adjusted and moved between the workstation, the first and second supply placement tools, and the first and second collection placement tools. To achieve the objective of facilitating manufacturing and reducing manufacturing costs.

  The present invention also provides an electronic component transfer apparatus and method, in which the lifting rods of the first pickup apparatus and the second pickup apparatus are each erected on a frame above the workstation by a slide rail set, respectively, It is slidable, and when performing work, the lifting rod drives the suction nozzle to accurately place the electronic component above the workstation, and performs the work by pressing the electronic component stably at a good level. Increase quality.

  Please refer to FIG. When the present invention is deployed and used in a test sorter, the test sorter includes a supply mechanism 60, a supply transport mechanism 70, a work area 80, a delivery transport mechanism 90, and a collection mechanism 100. The supply-side transport mechanism 70 sends electronic components waiting for testing on the supply mechanism 60 to the first and second supply platforms 81 and 82 in the work area 80, and the first and second collection platforms in the work area 80. The electronic components that have been tested on the tools 83 and 84 are sent to the collecting mechanism 100 by the sending-side transport mechanism 90 and classified and collected according to the test results.

  Please refer to FIGS. The work area 80 of the present invention is a work station 85, a first supply placement tool 81 and a first collection placement tool 83 located on one side of the work station 85, and a second supply placement located on the other side of the work station 85. A tool 82, a second collecting and mounting tool 84, a first pickup device 86, and a second pickup device 87. The first and second supply placement tools 81 and 82 place electronic components waiting for the test, and the first and second collection placement tools 83 and 84 place electronic components that have been tested. The first and second supply mounting tools 81 and 82 and the first and second collecting mounting tools 83 and 84 are positioned at a relative position of the workstation 85 in a fixed manner, and the first and second pickup devices 86 and 87 and It is used for supply and collection operations by the supply-side transport mechanism and the delivery-side transport mechanism, or each is independently slidable to the left and right, and is positioned at the corresponding position of the corresponding workstation 85, The two pickup devices 86 and 87 and the supply side transport mechanism and the supply side transport mechanism are used for supply and collection operations. The first pickup device 86 and the second pickup device 87 are installed on the frame above the workstation 85 by slide rail sets 861 and 871, respectively, and can slide in three axial directions (XYZ). Two suction nozzles 864 and 874 are attached to the front ends of the lifting rods 862 and 872 of the first pickup device 86 and the second pickup device 87 by laterally facing plates 863 and 873, whereby the slide rail sets 861 and 871 and the lifting rod 862 are mounted. , 872 and laterally facing plates 863, 873 drive the suction nozzles 864, 874 to be slid in three axial directions (XYZ), thereby transferring the electronic components to the workstation and executing the test. it can.

  Please refer to FIG. According to the electronic component transfer method of the present invention, when the test operation is performed in the work area 80, the second pickup device 87 is positioned above the work station 85 and presses the electronic component 110 to perform the test operation. The pickup device 86 is placed on the first supply mounting tool 81 and waits for the pickup of the electronic component 111 to be tested. Please refer to FIG. After the test of the electronic component 110 is completed, the second pick-up device 87 transfers the test completed electronic component 110 to the second collection platform 84 and leaves it, and the sending-side transport mechanism classifies and leaves the collection mechanism according to the test result. To serve. Further, the first pickup device 86 sucks and transfers the electronic component 111 to be tested onto the workstation 85, and presses the electronic component 111 to be used for the test work. As shown in FIG. 9, simultaneously with the execution of the test operation of the electronic component 111, the second pickup device 87 completes the leaving of the electronic component 110 that has been tested, and then translates to the second supply mounting tool 82 portion. The second pickup device 87 prepares to pick up the electronic component 112 that has already been transferred to the second supply mounting tool 82 by the supply-side transport mechanism. As shown in FIG. 10, subsequently, after the test of the electronic component 111 is completed, the electronic component 111 completed by the first pickup device 86 is transferred to the first collecting / mounting tool 83 and left there, and the delivery side transport mechanism Will be left in the collection mechanism according to the test results. At the same time, the second pickup device 87 picks up the electronic component 112 to be tested and transfers it to the work station 85, and presses the electronic component 112 for testing. As shown in FIG. 11, at the same time when the electronic component 112 is tested, the first pick-up device 86 completes the test completed electronic component 111 and then moves in parallel to the first supply mounting tool 81 portion. Since the electronic component 113 to be tested has already been transferred onto the first supply mounting tool 81 by the supply side transport mechanism, the first pickup device 86 performs the next test on the first supply mounting tool 81. The first pickup device 86 and the second pickup device 87 transfer the electronic components alternately on both sides of the workstation 85 in a rotary manner.

  The first pick-up device 86 and the second pick-up device 87 of the present invention are slidable in the three-axis directions, so that each of the working point, the fixed supply mounting tool, and the fixed collecting mounting tool can be adjusted by a fine adjustment movement method. An error between the relative positions can be compensated, thereby achieving an effect that the manufacturing is easy and the manufacturing cost can be reduced.

  Please refer to FIG. The first pick-up device 86 and the second pick-up device 87 of the present invention are slidable in the three-axis directions, and the suction nozzles 864, 874 at the front ends of the lifting rods 862, 872 are accurately set to the true position of the workstation 85 when performing a test operation. The electronic component can be left from the top, and the average lower pressure is provided with a good levelness, and the electronic component is stably held for execution of the test work, thereby achieving the purpose of improving the work quality.

  As a result, the present invention not only can achieve the purpose of facilitating the production and reduce the production cost, but also can effectively improve the quality of test work, and is an invention having practicality and inventive step, the same or similar. The product has not been published prior to its filing and has patent requirements.

FIG. 10 is a layout display diagram of the IC test apparatus of Patent Document 1. FIG. 10 is a display diagram of the first pickup device of the IC test apparatus of Patent Document 1. It is a display figure of the 2nd pick-up apparatus of the IC test apparatus of patent document 1. It is the arrangement | positioning display figure which has arrange | positioned this invention to the test sorter. 1 is a structural diagram of the present invention. It is a display figure of the pick-up apparatus of this invention. It is a pick-up operation | movement display figure (1) of this invention. It is a pickup operation | movement display figure (2) of this invention. It is a pickup operation | movement display figure (3) of this invention. It is a pickup operation | movement display figure (4) of this invention. It is a pick-up operation | movement display figure (5) of this invention. FIG. 6 is a state display diagram in which the pickup device of the present invention lowers the electronic component and performs test work.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Test stand 20 1st pick-up mechanism 21 Lateral slide rail 22 Lateral screw 23 Motor 24 Slide apparatus 241 Screw sleeve 242 Lateral slide sheet 243 Vertical slide sheet 25 Pickup apparatus 251 Vertical slide rail 252 Horizontal slide sheet 253 Adsorption nozzle 26 Support frame 261 Horizontal slide rail 262 Vertical slide sheet 263 Screw sleeve 27 Vertical slide rail 28 Vertical screw 29 Motor 30 Second pickup mechanism 31 Horizontal slide rail 32 Horizontal screw 33 Motor 34 Slide device 341 Screw sleeve 342 Horizontal slide sheet 343 Vertical Slide sheet 35 Pickup device 351 Vertical slide rail 3 52 Horizontal slide sheet 353 Adsorption nozzle 36 Support frame 361 Horizontal slide rail 362 Vertical slide sheet 363 Screw sleeve 37 Vertical slide rail 38 Vertical screw 39 Motor 40 Supply mechanism 41 Mounting table 42 Adsorption nozzle 50 Delivery mechanism 51 Mounting table 52 Adsorption Nozzle 60 Supply mechanism 70 Supply-side transport mechanism 80 Work area 81 First supply mounting tool 82 Second supply mounting tool 83 First collection mounting tool 84 Second collection mounting tool 85 Workstation 86 First pickup device 861 Slide Rail set 862 Lifting rod 863 Horizontally facing plate 864 Suction nozzle 87 Second pickup device 871 Slide rail set 872 Lifting rod 873 Horizontally facing plate 874 Suction nozzle 90 Delivery side transport mechanism 100 Collecting mechanism 10,111,112,113 electronic components

Claims (10)

In the electronic component transfer device,
At least one workstation, to which electronic components to perform work are sent to perform the work of the electronic components;
A first supply mounting tool, the first supply mounting tool being placed on one side of the workstation and mounting an electronic component for performing work;
A first supply mounting tool, which is a second supply mounting tool, which is located on the other side of the workstation and on which an electronic component for performing work is placed;
A first collection placement tool, which is located on the same side as the first supply placement tool, and on which the completed electronic component is placed;
A second collection placement tool, which is located on the same side as the second supply placement tool, and places the completed electronic component; and
A first pick-up device, which is mounted on a frame above the workstation with a slide rail set, is slidable in three axial directions, and transfers electronic components to perform work; and
A second pickup device, which is mounted on a frame above the workstation with a slide rail set, is slidable in three axial directions, and transfers electronic components to perform work; and
An electronic component transfer device comprising:   2. The electronic component transfer apparatus according to claim 1, wherein the first supply mounting tool and the second supply mounting tool are fixed or movable supply mounting tools. .   2. The electronic component transfer apparatus according to claim 1, wherein the first collection mounting device and the second collection mounting device are fixed or movable collection mounting devices. .   2. The electronic component transfer device according to claim 1, wherein the first pickup device has a suction nozzle attached to a front end of the lifting rod, and transfers the electronic component on the supply mounting device between the workstation and the collection mounting device. In addition, the electronic component transfer device is characterized by lowering the pressure of the electronic component and using it for work.   2. The electronic component transfer device according to claim 1, wherein the second pickup device has a suction nozzle attached to a front end of the lifting rod, and transfers the electronic component on the supply mounting device between the workstation and the collection mounting device. In addition, the electronic component transfer device is characterized by lowering the pressure of the electronic component and using it for work. In the electronic component transfer method,
A. A step in which the first pickup device is positioned on the first supply mounting tool portion and waits for pickup of an electronic component to be operated; and a second pickup device is positioned above the workstation and waits for execution of work on the electronic component;
B. After completion of the work of the electronic components in the workstation, the electronic components completed by the second pickup device are transferred to the second collecting and placing device, and the electronic components to be worked by the first pickup device are transferred to the workstation. Steps to be carried out,
C. Simultaneously performing work on the electronic components in the workstation, the second pick-up device moving to the second supply platform part and waiting for pick-up of the electronic components to perform the next set of work;
D. After the work of the electronic components in the workstation is completed, the electronic components completed by the first pick-up device are transferred to the first collecting and placing device, and the second pick-up device performs the next set of operations as work pieces. Steps to transfer to the station for work execution,
E. The first pickup device moves to the first supply mounting part and waits for the electronic component to perform the next set of operations at the same time as performing the operation on the electronic component in the workstation;
An electronic component transfer method comprising the steps A to E described above.
.   The electronic component transfer method according to claim 6, wherein when the first pickup device sucks and transfers the electronic component to be operated to the work station to be used for work, the electronic component is subjected to pressure reduction for use in the work. Electronic component transfer method.   The electronic component transfer method according to claim 6, wherein when the second pickup device sucks the electronic component to be operated and transfers it to a work station to be used for the operation, the electronic component is subjected to a lower pressure for the operation. Electronic component transfer method.   7. The electronic component transfer method according to claim 6, wherein the electronic components that perform the operations on the first supply mounting tool and the second supply mounting tool are left unloaded by a supply-side transport mechanism. Parts transfer method.   7. The electronic component transfer method according to claim 6, wherein work-completed electronic components on the first collection platform and the second collection platform are transported to a collection mechanism by a sending-side transport mechanism and left unsorted. A method for transferring an electronic component.

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