CN109290938A - 一种实时侦测钻石掉落的装置及其方法、研磨机 - Google Patents
一种实时侦测钻石掉落的装置及其方法、研磨机 Download PDFInfo
- Publication number
- CN109290938A CN109290938A CN201811317343.5A CN201811317343A CN109290938A CN 109290938 A CN109290938 A CN 109290938A CN 201811317343 A CN201811317343 A CN 201811317343A CN 109290938 A CN109290938 A CN 109290938A
- Authority
- CN
- China
- Prior art keywords
- signal
- diamond
- fallen
- polishing pad
- optical sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 60
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000003287 optical effect Effects 0.000 claims abstract description 76
- 238000005498 polishing Methods 0.000 claims abstract description 54
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims description 23
- 230000007547 defect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811317343.5A CN109290938B (zh) | 2018-11-06 | 2018-11-06 | 一种实时侦测钻石掉落的装置及其方法、研磨机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811317343.5A CN109290938B (zh) | 2018-11-06 | 2018-11-06 | 一种实时侦测钻石掉落的装置及其方法、研磨机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109290938A true CN109290938A (zh) | 2019-02-01 |
CN109290938B CN109290938B (zh) | 2020-11-27 |
Family
ID=65145392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811317343.5A Active CN109290938B (zh) | 2018-11-06 | 2018-11-06 | 一种实时侦测钻石掉落的装置及其方法、研磨机 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109290938B (zh) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030092270A1 (en) * | 2001-11-15 | 2003-05-15 | Ronfu Chu | CMP machine dresser and method for detecting the dislodgement of diamonds from the same |
US20040089070A1 (en) * | 2002-11-12 | 2004-05-13 | Elledge Jason B. | Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces |
US20060228995A1 (en) * | 2003-03-03 | 2006-10-12 | Micron Technology, Inc. | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
CN101352834A (zh) * | 2007-07-27 | 2009-01-28 | 中芯国际集成电路制造(上海)有限公司 | 研磨垫整理装置及研磨垫整理方法 |
CN101659025A (zh) * | 2008-08-25 | 2010-03-03 | 东京毅力科创株式会社 | 探针研磨方法、探针研磨用程序及探针装置 |
CN103035552A (zh) * | 2011-10-06 | 2013-04-10 | 株式会社东芝 | 异物检查装置及半导体制造装置 |
CN103878687A (zh) * | 2014-03-20 | 2014-06-25 | 上海华力微电子有限公司 | 一种防止研磨垫刮伤晶圆的系统 |
US20160343597A1 (en) * | 2015-05-22 | 2016-11-24 | Samsung Electronics Co., Ltd. | Apparatus for treating substrate |
CN205844212U (zh) * | 2016-08-03 | 2016-12-28 | 常州驰网智能检测技术有限公司 | 一种液晶玻璃表面异物的检测设备 |
CN108145606A (zh) * | 2017-11-23 | 2018-06-12 | 浙江工业大学 | 一种抛光过程中抛光液大颗粒实时在线监测装置 |
CN208476833U (zh) * | 2018-08-07 | 2019-02-05 | 杨欣薇 | 钻石快速批量筛选检测仪 |
-
2018
- 2018-11-06 CN CN201811317343.5A patent/CN109290938B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030092270A1 (en) * | 2001-11-15 | 2003-05-15 | Ronfu Chu | CMP machine dresser and method for detecting the dislodgement of diamonds from the same |
US20040089070A1 (en) * | 2002-11-12 | 2004-05-13 | Elledge Jason B. | Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces |
US20060228995A1 (en) * | 2003-03-03 | 2006-10-12 | Micron Technology, Inc. | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
CN101352834A (zh) * | 2007-07-27 | 2009-01-28 | 中芯国际集成电路制造(上海)有限公司 | 研磨垫整理装置及研磨垫整理方法 |
CN101659025A (zh) * | 2008-08-25 | 2010-03-03 | 东京毅力科创株式会社 | 探针研磨方法、探针研磨用程序及探针装置 |
CN103035552A (zh) * | 2011-10-06 | 2013-04-10 | 株式会社东芝 | 异物检查装置及半导体制造装置 |
CN103878687A (zh) * | 2014-03-20 | 2014-06-25 | 上海华力微电子有限公司 | 一种防止研磨垫刮伤晶圆的系统 |
US20160343597A1 (en) * | 2015-05-22 | 2016-11-24 | Samsung Electronics Co., Ltd. | Apparatus for treating substrate |
CN205844212U (zh) * | 2016-08-03 | 2016-12-28 | 常州驰网智能检测技术有限公司 | 一种液晶玻璃表面异物的检测设备 |
CN108145606A (zh) * | 2017-11-23 | 2018-06-12 | 浙江工业大学 | 一种抛光过程中抛光液大颗粒实时在线监测装置 |
CN208476833U (zh) * | 2018-08-07 | 2019-02-05 | 杨欣薇 | 钻石快速批量筛选检测仪 |
Also Published As
Publication number | Publication date |
---|---|
CN109290938B (zh) | 2020-11-27 |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230719 Address after: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee after: Huaian Xide Industrial Design Co.,Ltd. Address before: No. 599, East Changjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: HUAIAN IMAGING DEVICE MANUFACTURER Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20240811 Address after: Room 206, 2nd Floor, Ruichang Building, No. 1002 Fuqiang Road, Haibin Community, Futian Street, Futian District, Shenzhen City, Guangdong Province 518000 Patentee after: Shenzhen Xinjia Trading Co.,Ltd. Country or region after: China Address before: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: Huaian Xide Industrial Design Co.,Ltd. Country or region before: China |