CN109254170B - Integrated quartz double-vibration beam accelerometer and preparation method thereof - Google Patents
Integrated quartz double-vibration beam accelerometer and preparation method thereof Download PDFInfo
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- CN109254170B CN109254170B CN201811450018.6A CN201811450018A CN109254170B CN 109254170 B CN109254170 B CN 109254170B CN 201811450018 A CN201811450018 A CN 201811450018A CN 109254170 B CN109254170 B CN 109254170B
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- 239000010453 quartz Substances 0.000 title claims abstract description 102
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 102
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 35
- 230000007797 corrosion Effects 0.000 claims description 29
- 238000005260 corrosion Methods 0.000 claims description 29
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 25
- 229910052737 gold Inorganic materials 0.000 claims description 19
- 239000010931 gold Substances 0.000 claims description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052804 chromium Inorganic materials 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 13
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical class N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000009461 vacuum packaging Methods 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- RZVXOCDCIIFGGH-UHFFFAOYSA-N chromium gold Chemical compound [Cr].[Au] RZVXOCDCIIFGGH-UHFFFAOYSA-N 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
- G01P15/0922—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up of the bending or flexing mode type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The embodiment of the invention discloses an integrated quartz double-vibration beam accelerometer and a preparation method thereof, wherein the integrated quartz double-vibration beam accelerometer comprises the following components: the assembly area, the flexible beam, the vibration beam, the mass block and the metal electrode are integrally formed, and the mass block is connected to the assembly area through the flexible Liang Jizhen beam; the distance between the upper surface of the flexible beam and the upper surface of the mass block is equal to the distance between the lower surface of the flexible beam and the lower surface of the mass block, one end of the vibration beam is connected to the upper surface of the assembly area, and the other end of the vibration beam is connected to the upper surface of the mass block. The integrated quartz dual-vibrating-beam accelerometer has the characteristics of compact structure, assembly-free and easy processing compared with a split type accelerometer, and the dual-vibrating-beam accelerometer can avoid vacuum packaging, is more stable and reliable in use, has the flexible beam positioned in the middle of the upper surface and the lower surface of the mass block, improves the sensitivity of a device, has inconsistent thickness of the flexible beam and thickness of the vibrating beam, and increases the degree of freedom of design.
Description
Technical Field
The invention relates to a micro-electromechanical system, in particular to an integrated quartz double-vibration beam accelerometer and a preparation method thereof.
Background
The quartz vibrating beam accelerometer is an MEMS inertial sensor which utilizes the force-frequency characteristic sensitive inertial force of the quartz vibrating beam, has the advantages of direct digital output, good bias stability, good scale factor stability, flexible range design and the like, can be widely used in the fields of tactical missile attitude control, inertial navigation, earth resource exploration and the like, and has important military value and name use value.
The traditional quartz vibrating beam accelerometer is mainly divided into an integral type and a split type, the split type structure is typically represented as RBA500 of Honeywell corporation, the quartz vibrating beam accelerometer consists of a quartz double-beam vibrating beam and a metal mass block, the quartz vibrating beam accelerometer needs to be precisely assembled, and the problems of thermal mismatch of different materials and glue aging are faced, so that the long-term stability and reliability are poor. The integral structure is typically represented by a French ONERA design structure, and the vibration beam and the mass structure are all made of quartz materials, so that the integral structure has the advantages of compact structure and integral molding, but Shan Zhenliang is adopted, vacuum packaging is required, and the performance of the device can be influenced by the change of the vacuum degree in use.
Aiming at the problems, zhang Zhaoyun and the like of the electronic engineering institute of China engineering physical institute provide an integrated quartz double-vibration-beam accelerometer (application number: 201811339689.5), which has the advantages of compact structure and integrated molding, and can avoid the problem of vacuum packaging. However, the flexible beam of the accelerometer is positioned on one side of the mass block, the sensitivity is high without the structure that the flexible beam is positioned between the upper surface and the lower surface of the mass block, the thickness of the flexible beam of the accelerometer is the same as that of the vibration beam, and the design freedom degree is limited. In order to solve the problems, the invention provides a structure that the flexible beam is positioned between the upper surface and the lower surface of the mass block, the thickness of the flexible beam is inconsistent with that of the vibration beam, and a corresponding preparation process is provided.
Disclosure of Invention
The invention aims to provide an integrated quartz double-vibration beam accelerometer and a preparation method thereof, and compared with a split quartz double-vibration beam accelerometer which has the characteristics of compact structure, no assembly and easy processing, the integrated quartz double-vibration beam accelerometer adopts double-vibration beams, so that vacuum packaging can be avoided, the integrated quartz double-vibration beam accelerometer is more stable and reliable in use, the flexible beams are positioned between the upper surface and the lower surface of a mass block, the sensitivity of a device is improved, the thickness of the flexible beams is inconsistent with the thickness of the vibration beams, and the degree of freedom of design is increased. .
To achieve the above object, according to an aspect of the present invention, there is provided an integrated quartz dual vibration beam accelerometer comprising: the vibration beam comprises an assembly area, a flexible beam, a vibration beam, a mass block and a metal electrode which are integrally formed, wherein the mass block is connected to the assembly area through the flexible beam and the vibration beam;
the vibration beam comprises a first straight beam and a second straight beam, wherein the first straight beam and the second straight beam are arranged in parallel, one end of the first straight beam and one end of the second straight beam are connected to the assembly area, the other end of the first straight beam and one end of the second straight beam are connected to the mass block, the metal electrodes are arranged on the first straight beam and the second straight beam, and the polarities of the metal electrodes on the first straight beam and the second straight beam are opposite;
the flexible beam comprises two connecting beams, the two connecting beams are positioned on two sides of the vibrating beam, one end of the flexible beam is connected to the assembly area, and the other end of the flexible beam is connected to the mass block;
wherein the thickness of the flexible Liang Jizhen beams is less than the thickness of the mounting region and the mass; the distance between the upper surface of the flexible beam and the upper surface of the mass block is equal to the distance between the lower surface of the flexible beam and the lower surface of the mass block, one end of the vibration beam is connected to the upper surface of the assembly area, and the other end of the vibration beam is connected to the upper surface of the mass block.
Preferably, the assembly area and the mass block are in a concave shape, the notch of the concave shape is a concave area, the mass block is positioned in the concave area of the assembly area, and the concave area of the mass block faces to the concave area of the mass block.
Preferably, the assembly area and the center line of the mass block are in the same straight line, so that the integrated quartz double-vibration beam accelerometer is in an axisymmetric structure.
Preferably, one end of the vibration beam is connected to the concave area of the mass block, the other end of the vibration beam is connected to the assembly area, and the first straight beam and the second straight beam are symmetrically arranged by taking the central line of the mass block as an axis.
Preferably, one end of the flexible beam is connected to the protruding portion of the concave mass block, the other end of the flexible beam is connected to the assembly area, and the two connecting beams are symmetrically arranged on two sides of the vibration beam by taking the central line of the assembly area as an axis.
Preferably, the mounting region is the same thickness as the mass.
Preferably, the metal electrode comprises a first electrode, a second electrode and a lead;
the first electrode comprises a first left electrode, a first middle electrode and a first right electrode; the second electrode comprises a second left electrode, a second middle electrode and a second right electrode; the lead comprises a first lead and a second lead;
the first electrode is arranged on the first straight beam, and the second electrode is arranged on the second straight beam;
the first left electrode is positioned at the left side of the first middle electrode, and the first right electrode is positioned at the right side of the first middle electrode; the second left electrode is positioned at the left side of the second middle electrode, and the second right electrode is positioned at the right side of the second middle electrode;
the first left electrode is connected with the first right electrode and then connected with the second middle electrode, and the second left electrode is connected with the second right electrode and then connected with the first middle electrode;
the first lead is connected to the first left electrode, and the second lead is connected to the first middle electrode and the second right electrode.
According to another aspect of the invention, there is provided a method for manufacturing an integrated quartz dual-vibrating-beam accelerometer, the method comprising:
1) Cutting to obtain a quartz substrate;
2) Sputtering masks on the upper and lower surfaces of the quartz substrate;
3) Removing crystal edges of the vibration beam, the mass block and the side wall of the flexible beam through penetrating corrosion by calibrating a mask removing area;
4) Removing the area through a calibration mask, and partially corroding one side of the area to reduce the thickness of the vibration beam;
5) Through calibrating the mask removing area, the thickness of the flexible beam is reduced by double-sided partial corrosion, and the thickness of the vibration beam is continuously reduced by single-sided partial corrosion;
6) And paving a metal electrode on the vibration beam to obtain the integrated quartz double-vibration-beam accelerometer.
Preferably, the preparation method comprises the following steps:
1) The original material adopts double-throw Z-cut quartz single crystal to obtain a quartz substrate with the thickness of 400-600 mu m;
2) Sputtering chromium and gold on the surface of the quartz substrate in sequence, and forming quartz corrosion metal masks with the thickness of 2000 Ǻ -4000 Ǻ on the upper and lower surfaces of the quartz substrate;
3) Exposing a first mask removal area on the chrome mask by double-sided gumming and exposure;
4) Removing the chromium-gold mask on the first mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
5) Double-sided corrosion penetrating through the quartz substrate is carried out on the first mask removing area through saturated ammonium bifluoride solution, and crystal edges of the vibrating beam, the mass block and the side wall of the flexible beam are removed;
6) Exposing a second mask removal area on the chromium metal mask by double-sided adhesive spraying and one-sided exposure;
7) Removing the chromium-gold mask on the second mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
8) Etching the quartz substrate on one side of the second mask removing area through saturated ammonium bifluoride solution etching solution to reduce the thickness of the vibrating beam, wherein the reduced thickness is determined according to the thickness of the substrate and the thickness of the required flexible beam;
9) Exposing a third mask removal area on the chrome mask through double-sided adhesive spraying and exposure;
10 Removing the chrome-gold mask on the third mask removing area by etching with gold and chrome etching solution, and removing the photoresist;
11 Double-sided partial etching on the third mask removing area and single-sided partial etching on the second mask removing area by saturated ammonium bifluoride solution etching solution, so that the flexible beam and the vibrating beam obtain the required thickness;
12 A quartz etching metal mask on the quartz substrate is removed, and a metal electrode is sputtered on the vibration beam, wherein the thickness of the metal electrode is 2000 Ǻ -4000 Ǻ.
The invention has the beneficial effects that:
1) The integrated quartz double-vibration beam accelerometer is integrally formed, and has the characteristics of compact structure, no assembly and easy processing compared with a split type accelerometer.
2) The integrated quartz double-vibration beam accelerometer adopts double vibration beams, so that vacuum packaging can be avoided, and the quartz double-vibration beam accelerometer is more stable and reliable in use.
3) The preparation method can accurately control the specification of the integrated quartz double-vibration beam accelerometer, and the integrated quartz double-vibration beam accelerometer is more convenient to use and more accurate to measure.
4) The flexible beam is positioned in the middle of the upper surface and the lower surface of the mass block, the sensitivity of the device is improved, the thickness of the flexible beam is inconsistent with that of the vibration beam, and the degree of freedom of design is increased.
Drawings
FIG. 1 shows a schematic block diagram of an integrated quartz dual-vibrating beam accelerometer according to an embodiment of the invention;
FIG. 2 shows a schematic diagram of motor distribution of an integrated quartz dual-vibrating beam accelerometer according to an embodiment of the invention;
FIG. 3 shows a schematic block diagram of a metal electrode according to one embodiment of the invention;
FIGS. 4 a-4 k illustrate a process flow diagram for the fabrication of an integrated quartz dual beam accelerometer according to one embodiment of the invention;
FIG. 5 illustrates a schematic view of quartz substrate penetration etching in accordance with one embodiment of the present invention;
FIG. 6 illustrates a partial etch schematic of a quartz substrate in accordance with one embodiment of the invention.
Wherein:
1-assembly area, 2-flexible beam, 3-vibration beam, 4-mass block, 5-first electrode, 6-second electrode and 7-lead wire;
501-first middle electrode, 502-first left electrode, 503-first right electrode, 601-second middle electrode, 602-second left electrode, 603-second right electrode, 701-first lead, 702-second lead.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention. The embodiments of the present invention and the features of the embodiments may be combined with each other arbitrarily without any conflict.
According to an aspect of the present invention, there is provided an integrated quartz dual-vibrating beam accelerometer, comprising: the vibration beam comprises an assembly area, a flexible beam, a vibration beam, a mass block and a metal electrode which are integrally formed, wherein the mass block is connected to the assembly area through the flexible beam and the vibration beam;
the vibration beam comprises a first straight beam and a second straight beam, wherein the first straight beam and the second straight beam are arranged in parallel, one end of the first straight beam and one end of the second straight beam are connected to the assembly area, the other end of the first straight beam and one end of the second straight beam are connected to the mass block, the metal electrodes are arranged on the first straight beam and the second straight beam, and the polarities of the metal electrodes on the first straight beam and the second straight beam are opposite;
the flexible beam comprises two connecting beams, the two connecting beams are positioned on two sides of the vibrating beam, one end of the flexible beam is connected to the assembly area, and the other end of the flexible beam is connected to the mass block;
wherein the thickness of the flexible Liang Jizhen beams is less than the thickness of the mounting region and the mass; the distance between the upper surface of the flexible beam and the upper surface of the mass block is equal to the distance between the lower surface of the flexible beam and the lower surface of the mass block, one end of the vibration beam is connected to the upper surface of the assembly area, and the other end of the vibration beam is connected to the upper surface of the mass block.
Specifically, when the device is used, the polarities of the first straight beam electrode and the second straight beam electrode are opposite, the vibration Liang Qizhen is caused under the action of driving voltage, the vibration beams are bent and vibrated in the X-axis direction, the vibration directions of the two straight beams of each pair of vibration beams are opposite when the vibration beams vibrate, the force acting on the adapter plate of the assembly area can be counteracted, a high Q value is obtained, and vacuum packaging is not needed. When acceleration acts, the integrated quartz double-vibration-beam accelerometer disclosed by the invention is sensitive to the acceleration change in the Z-axis direction, the acceleration is converted into inertia force through the mass block, the natural frequency of the vibration beam can change due to the force-frequency characteristic of the quartz crystal, when the vibration beam is subjected to compressive stress, the natural frequency is increased, and when the vibration beam is subjected to tensile stress, the natural frequency is reduced, so that the acceleration is obtained according to the frequency change. In addition, two accelerometers can be combined into a differential accelerometer, namely, a pair of vibration beams of one accelerometer are subjected to compressive stress, and a vibration beam of the other accelerometer is subjected to tensile stress, so that the detection of the acceleration of the sensitive axis direction of the accelerometer can be realized by detecting the frequency difference signals of the two accelerometers.
In particular, the invention adopts the double vibration beams which are made of the same material and are integrally formed, compared with the current split quartz double vibration beam accelerometer, the invention does not need to be precisely assembled, has the characteristics of compact structure, no assembly and easy processing, can avoid the defects of thermal mismatch effect and glue aging among different materials, and can avoid the problem of vacuum encapsulation by adopting the double vibration beams compared with the current integral structure, thereby being more stable and reliable in use.
Further, the assembly area and the mass block are in a concave shape, the notch of the concave shape is a concave area, the mass block is located in the concave area of the assembly area, and the concave area of the mass block faces to the concave area of the mass block.
Further, the assembly area and the center line of the mass block are positioned on the same straight line, so that the integrated quartz double-vibration beam accelerometer is in an axisymmetric structure.
Further, one end of the vibration beam is connected to the concave area of the mass block, the other end of the vibration beam is connected to the assembly area, and the first straight beam and the second straight beam are symmetrically arranged by taking the central line of the mass block as an axis.
Further, one end of the flexible beam is connected to the protruding portion of the concave mass block, the other end of the flexible beam is connected to the assembly area, and the two connecting beams are symmetrically arranged on two sides of the vibration beam by taking the central line of the assembly area as an axis.
Further, the thickness of the flexible beam may be different from the thickness of the vibration beam.
Further, the mounting region is the same thickness as the mass.
Further, the metal electrode comprises a first electrode, a second electrode and a lead;
the first electrode comprises a first left electrode, a first middle electrode and a first right electrode; the second electrode comprises a second left electrode, a second middle electrode and a second right electrode; the lead comprises a first lead and a second lead;
the first electrode is arranged on the first straight beam, and the second electrode is arranged on the second straight beam;
the first left electrode is positioned at the left side of the first middle electrode, and the first right electrode is positioned at the right side of the first middle electrode; the second left electrode is positioned at the left side of the second middle electrode, and the second right electrode is positioned at the right side of the second middle electrode;
the first left electrode is connected with the first right electrode and then connected with the second middle electrode, and the second left electrode is connected with the second right electrode and then connected with the first middle electrode;
the first lead is connected to the first left electrode, and the second lead is connected to the first middle electrode and the second right electrode.
According to another aspect of the invention, there is provided a method for manufacturing an integrated quartz dual-vibrating-beam accelerometer, the method comprising:
1) Cutting to obtain a quartz substrate;
2) Sputtering masks on the upper and lower surfaces of the quartz substrate;
3) Removing crystal edges of the vibration beam, the mass block and the side wall of the flexible beam through penetrating corrosion by calibrating a mask removing area;
4) Removing the area through a calibration mask, and partially corroding one side of the area to reduce the thickness of the vibration beam;
5) Through calibrating the mask removing area, the thickness of the flexible beam is reduced by double-sided partial corrosion, and the thickness of the vibration beam is continuously reduced by single-sided partial corrosion;
6) And paving a metal electrode on the vibration beam to obtain the integrated quartz double-vibration-beam accelerometer.
Further, the preparation method comprises the following steps:
1) The original material adopts double-throw Z-cut quartz single crystal to obtain a quartz substrate with the thickness of 400-600 mu m;
2) Sputtering chromium and gold on the surface of the quartz substrate in sequence, and forming quartz corrosion metal masks with the thickness of 2000 Ǻ -4000 Ǻ on the upper and lower surfaces of the quartz substrate;
3) Exposing a first mask removal area on the chrome mask by double-sided gumming and exposure;
4) Removing the chromium-gold mask on the first mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
5) Double-sided corrosion penetrating through the quartz substrate is carried out on the first mask removing area through saturated ammonium bifluoride solution, and crystal edges of the vibrating beam, the mass block and the side wall of the flexible beam are removed;
6) Exposing a second mask removal area on the chromium metal mask by double-sided adhesive spraying and one-sided exposure;
7) Removing the chromium-gold mask on the second mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
8) Etching the quartz substrate on one side of the second mask removing area through saturated ammonium bifluoride solution etching solution to reduce the thickness of the vibrating beam, wherein the reduced thickness is determined according to the thickness of the substrate and the thickness of the required flexible beam;
9) Exposing a third mask removal area on the chrome mask through double-sided adhesive spraying and exposure;
10 Removing the chrome-gold mask on the third mask removing area by etching with gold and chrome etching solution, and removing the photoresist;
11 Double-sided partial etching on the third mask removing area and single-sided partial etching on the second mask removing area by saturated ammonium bifluoride solution etching solution, so that the flexible beam and the vibrating beam obtain the required thickness;
12 A quartz etching metal mask on the quartz substrate is removed, and a metal electrode is sputtered on the vibration beam, wherein the thickness of the metal electrode is 2000 Ǻ -4000 Ǻ.
Examples
FIG. 1 shows a schematic block diagram of an integrated quartz dual-vibrating beam accelerometer according to an embodiment of the invention; FIG. 2 shows a schematic diagram of motor distribution of an integrated quartz dual-vibrating beam accelerometer according to an embodiment of the invention; FIG. 3 shows a schematic block diagram of a metal electrode according to one embodiment of the invention; FIGS. 4 a-4 h illustrate a process flow diagram for the fabrication of an integrated quartz dual beam accelerometer according to one embodiment of the invention; FIG. 5 illustrates a schematic view of quartz substrate penetration etching in accordance with one embodiment of the present invention; FIG. 6 illustrates a partial etch schematic of a quartz substrate in accordance with one embodiment of the invention.
As shown in figures 1-6 of the drawings,
this quartzy two beam accelerometer that shakes of integral type includes: the assembly area 1, the flexible beam 2, the vibration beam 3, the mass block 4 and the metal electrode are integrally formed, and the mass block 4 is connected with the assembly area 4 through the flexible beam 2 and the vibration beam 3;
the vibration beam 3 comprises a first straight beam and a second straight beam, wherein the first straight beam and the second straight beam are arranged in parallel, one end of the first straight beam and one end of the second straight beam are connected with the assembly area 1, the other end of the first straight beam and one end of the second straight beam are connected with the mass block 4, the metal electrodes are arranged on the first straight beam and the second straight beam, and the polarities of the metal electrodes on the first straight beam and the second straight beam are opposite;
the flexible beam 2 comprises two connecting beams, the two connecting beams are positioned on two sides of the vibration beam 3, one end of the flexible beam is connected with the assembly area 1, and the other end of the flexible beam is connected with the mass block 4;
wherein the thickness of the flexible beam 2 and the vibration beam 3 is smaller than the thickness of the assembly area 1 and the mass block 4; the distance between the upper surface of the flexible beam 2 and the upper surface of the mass block 4 is equal to the distance between the lower surface of the flexible beam 2 and the lower surface of the mass block 4, one end of the vibration beam 3 is connected to the upper surface of the assembly area 1, and the other end is connected to the upper surface of the mass block 4.
Further, the assembly area 1 and the mass block 4 are in a concave shape, the notch of the concave shape is a concave area, the mass block 4 is located in the concave area of the assembly area 1, and the concave area of the mass block 4 faces to the concave area of the assembly area 1.
Further, the assembly area 1 and the center line of the mass block 4 are positioned on the same straight line, so that the integrated quartz dual-vibration beam accelerometer is in an axisymmetric structure.
Further, one end of the vibration beam 3 is connected to the concave area of the mass block 4, the other end is connected to the assembly area 1, and the first straight beam and the second straight beam are symmetrically arranged with the center line of the mass block 4 as an axis.
Further, one end of the flexible beam 2 is connected to a protruding portion of the concave-shaped mass block 4, the other end of the flexible beam is connected to the assembly area 1, and the two connecting beams are symmetrically arranged on two sides of the vibration beam 3 by taking a center line 1 of the assembly area as an axis.
Further, the thickness of the flexible beam 2 is 50 μm to 70 μm, and the thickness of the vibration beam 3 is 80 μm to 120 μm.
Further, the mounting area 1 is the same thickness as the mass 4.
Further, the metal electrode comprises a first electrode 5, a second electrode 6 and a lead 7;
wherein the first electrode 5 includes a first left electrode 502, a first middle electrode 501, and a first right electrode 503; the second electrode 6 includes a second left electrode 602, a second middle electrode 601, and a second right electrode 603; the lead 7 includes a first lead 701 and a second lead 702;
wherein the first electrode 5 is arranged on the first straight beam, and the second electrode 6 is arranged on the second straight beam;
wherein the first left electrode 502 is located at the left side of the first middle electrode 501, and the first right electrode 503 is located at the right side of the first middle electrode 501; the second left electrode 602 is located at the left side of the second middle electrode 601, and the second right electrode 603 is located at the right side of the second middle electrode 601;
wherein the first left electrode 502 is connected to the first right electrode 503 and then to the second middle electrode 601, and the second left electrode 602 is connected to the second right electrode 603 and then to the first middle electrode 501;
the first lead 701 is connected to the first left electrode 502, and the second lead 702 is connected to the first middle electrode 501 and the second right electrode 603.
The preparation method of the integrated quartz double-vibration beam accelerometer comprises the following steps:
1) The original material adopts double-polishing Z-cut quartz single crystal to obtain a quartz substrate with the thickness of 500 mu m;
2) Sputtering chromium and gold on the surface of the quartz substrate in sequence, and forming quartz corrosion metal masks with the thickness of 2000 Ǻ on the upper surface and the lower surface of the quartz substrate;
3) Exposing a first mask removal area on the chrome mask by double-sided gumming and exposure;
4) Removing the chromium-gold mask on the first mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
5) Double-sided corrosion penetrating through the quartz substrate is carried out on the first mask removing area through saturated ammonium bifluoride solution, and crystal edges of the vibrating beam, the mass block and the side wall of the flexible beam are removed;
6) Exposing a second mask removal area on the chromium metal mask by double-sided adhesive spraying and single-sided exposure;
7) Removing the chromium-gold mask on the second mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
8) Partially etching the quartz substrate on one side of the second mask removal region by using a saturated ammonium bifluoride solution etching solution to an etching depth of 180 mu m, so that the thickness of the vibration beam is 320 mu m;
9) Exposing a third mask removal area on the chrome mask through double-sided adhesive spraying and exposure;
10 Removing the chrome-gold mask on the third mask removing area by etching with gold and chrome etching solution, and removing the photoresist;
11 Double-sided partial etching of the quartz substrate on the third mask removal region and continuous single-sided partial etching of the quartz substrate on the second mask removal region by means of a saturated ammonium bifluoride solution etching solution, the etching depth being 220 μm such that the thickness of the flexible beam is 60 μm, such that the thickness of the vibration beam is 100 μm;
12 A quartz etching metal mask on the quartz substrate is removed, and a metal electrode is sputtered on the vibration beam, wherein the thickness of the metal electrode is 2000 Ǻ.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that the above-mentioned preferred embodiment should not be construed as limiting the invention, and the scope of the invention should be defined by the appended claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and such modifications and adaptations are intended to be comprehended within the scope of the invention.
Claims (7)
1. The utility model provides a quartzy two beam accelerometer that shakes of integral type which characterized in that, this quartzy two beam accelerometer that shakes of integral type includes: the vibration beam comprises an assembly area, a flexible beam, a vibration beam, a mass block and a metal electrode which are integrally formed, wherein the mass block is connected to the assembly area through the flexible beam and the vibration beam;
the vibration beam comprises a first straight beam and a second straight beam, wherein the first straight beam and the second straight beam are arranged in parallel, one end of the first straight beam and one end of the second straight beam are connected to the assembly area, the other end of the first straight beam and one end of the second straight beam are connected to the mass block, the metal electrodes are arranged on the first straight beam and the second straight beam, and the polarities of the metal electrodes on the first straight beam and the second straight beam are opposite;
the flexible beam comprises two connecting beams, the two connecting beams are positioned on two sides of the vibrating beam, one end of the flexible beam is connected to the assembly area, and the other end of the flexible beam is connected to the mass block;
wherein the thickness of the flexible Liang Jizhen beams is less than the thickness of the mounting region and the mass; the distance between the upper surface of the flexible beam and the upper surface of the mass block is equal to the distance between the lower surface of the flexible beam and the lower surface of the mass block, one end of the vibration beam is connected to the upper surface of the assembly area, and the other end of the vibration beam is connected to the upper surface of the mass block;
the assembly area and the mass block are in a concave shape, the notch of the concave shape is a concave area, the mass block is positioned in the concave area of the assembly area, and the concave area of the mass block faces to the concave area of the assembly area;
the mounting region is the same thickness as the mass.
2. The integrated quartz dual-vibrating beam accelerometer of claim 1, wherein the assembly area is in line with the centerline of the mass, such that the integrated quartz dual-vibrating beam accelerometer is in an axisymmetric structure.
3. The integrated quartz dual-vibration beam accelerometer of claim 1, wherein one end of the vibration beam is connected to the concave region of the mass block, the other end is connected to the assembly region, and the first straight beam and the second straight beam are symmetrically arranged with a center line of the mass block as an axis.
4. The integrated quartz dual-vibration beam accelerometer of claim 1, wherein one end of the flexible beam is connected to the protruding portion of the concave mass block, the other end of the flexible beam is connected to the assembly area, and the two connecting beams are symmetrically arranged on two sides of the vibration beam by taking a central line of the assembly area as an axis.
5. The integrated quartz dual beam accelerometer of claim 1, wherein the metal electrode comprises a first electrode, a second electrode, and a lead;
the first electrode comprises a first left electrode, a first middle electrode and a first right electrode; the second electrode comprises a second left electrode, a second middle electrode and a second right electrode; the lead comprises a first lead and a second lead;
the first electrode is arranged on the first straight beam, and the second electrode is arranged on the second straight beam;
the first left electrode is positioned at the left side of the first middle electrode, and the first right electrode is positioned at the right side of the first middle electrode; the second left electrode is positioned at the left side of the second middle electrode, and the second right electrode is positioned at the right side of the second middle electrode;
the first left electrode is connected with the first right electrode and then connected with the second middle electrode, and the second left electrode is connected with the second right electrode and then connected with the first middle electrode;
the first lead is connected to the first left electrode, and the second lead is connected to the first middle electrode and the second right electrode.
6. A method for manufacturing the integrated quartz dual-vibrating beam accelerometer of any of claims 1-5, comprising:
1) Cutting to obtain a quartz substrate;
2) Sputtering masks on the upper and lower surfaces of the quartz substrate;
3) Removing crystal edges of the vibration beam, the mass block and the side wall of the flexible beam through penetrating corrosion by calibrating a mask removing area;
4) Removing the area through a calibration mask, and partially corroding one side of the area to reduce the thickness of the vibration beam;
5) Through calibrating the mask removing area, the thickness of the flexible beam is reduced by double-sided partial corrosion, and the thickness of the vibration beam is continuously reduced by single-sided partial corrosion;
6) And paving a metal electrode on the vibration beam to obtain the integrated quartz double-vibration-beam accelerometer.
7. The method of manufacturing according to claim 6, characterized in that the method of manufacturing comprises:
1) The original material adopts double-throw Z-cut quartz single crystal to obtain a quartz substrate with the thickness of 400-600 mu m;
2) Sputtering chromium and gold on the surface of the quartz substrate in sequence, forming a thickness of the upper and lower surfaces of the quartz substrateIs etched into the metal mask;
3) Exposing a first mask removal region on the quartz etched metal mask by double-sided gumming and exposure;
4) Removing the quartz corrosion metal mask on the first mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
5) Double-sided corrosion penetrating through the quartz substrate is carried out on the first mask removing area through saturated ammonium bifluoride solution, and crystal edges of the vibrating beam, the mass block and the side wall of the flexible beam are removed;
6) Exposing a second mask removing area on the quartz corrosion metal mask through double-sided adhesive spraying and one-sided exposure;
7) Removing the quartz corrosion metal mask on the second mask removing area through corrosion of gold and chromium corrosive liquid, and removing the photoresist;
8) Etching the quartz substrate on one side of the second mask removing area through saturated ammonium bifluoride solution etching solution to reduce the thickness of the vibrating beam, wherein the reduced thickness is determined according to the thickness of the substrate and the thickness of the required flexible beam;
9) Exposing a third mask removal area on the quartz corrosion metal mask through double-sided adhesive spraying and exposure;
10 Etching to remove the quartz etched metal mask on the third mask removing area by using gold and chromium etching solution, and removing the photoresist;
11 Double-sided partial etching on the third mask removing area and single-sided partial etching on the second mask removing area by saturated ammonium bifluoride solution etching solution, so that the flexible beam and the vibrating beam obtain the required thickness;
12 Removing the quartz corrosion metal mask on the quartz substrate, sputtering a metal electrode on the vibration beam, wherein the thickness of the metal electrode is
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| CN114543778B (en) * | 2020-11-24 | 2023-04-28 | 北京晨晶电子有限公司 | Method for assembling vibration reduction structure in chip |
| CN113791241B (en) * | 2021-08-10 | 2023-04-07 | 北京自动化控制设备研究所 | Sensitive assembly stress relieving structure and vibration beam accelerometer with same |
| CN117607489B (en) * | 2024-01-17 | 2024-04-09 | 中国工程物理研究院电子工程研究所 | Sensitive structure of piezoresistive acceleration sensor and acceleration sensor |
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