CN109247032A - 脉冲直流电源供应器 - Google Patents

脉冲直流电源供应器 Download PDF

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Publication number
CN109247032A
CN109247032A CN201780012398.2A CN201780012398A CN109247032A CN 109247032 A CN109247032 A CN 109247032A CN 201780012398 A CN201780012398 A CN 201780012398A CN 109247032 A CN109247032 A CN 109247032A
Authority
CN
China
Prior art keywords
period
pulse
power supply
nominal
supply unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780012398.2A
Other languages
English (en)
Chinese (zh)
Inventor
尤韦·赫尔曼斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN109247032A publication Critical patent/CN109247032A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32944—Arc detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
CN201780012398.2A 2017-05-10 2017-05-10 脉冲直流电源供应器 Pending CN109247032A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/061190 WO2018206100A1 (en) 2017-05-10 2017-05-10 Pulsed dc power supply

Publications (1)

Publication Number Publication Date
CN109247032A true CN109247032A (zh) 2019-01-18

Family

ID=58701624

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780012398.2A Pending CN109247032A (zh) 2017-05-10 2017-05-10 脉冲直流电源供应器

Country Status (5)

Country Link
JP (1) JP2019528369A (ko)
KR (1) KR20180135853A (ko)
CN (1) CN109247032A (ko)
TW (1) TW201909232A (ko)
WO (1) WO2018206100A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220285129A1 (en) * 2021-03-02 2022-09-08 Applied Materials, Inc. Pulsed DC Power For Deposition Of Film

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0639655A1 (en) * 1993-07-28 1995-02-22 Asahi Glass Company Ltd. Method and apparatus for sputtering
JP2010031359A (ja) * 2008-07-29 2010-02-12 Sulzer Metaplas Gmbh 大電力パルス化マグネトロンスパッタリング方法および大電力電気エネルギー源
CN102985996A (zh) * 2010-05-11 2013-03-20 先进能源工业公司 用于使用直流来施加周期性电压的方法和装置
US20140231243A1 (en) * 2012-11-01 2014-08-21 Advanced Energy Industries, Inc. Charge removal from electrodes in unipolar sputtering system
CN105264107A (zh) * 2013-02-20 2016-01-20 皮尔森西波西米亚大学 化学计量介电薄膜的高速反应溅射

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3684593B2 (ja) * 1993-07-28 2005-08-17 旭硝子株式会社 スパッタリング方法およびその装置
JPH08311645A (ja) * 1995-05-19 1996-11-26 Teijin Ltd Ｉｔｏ成膜装置
US8133359B2 (en) * 2007-11-16 2012-03-13 Advanced Energy Industries, Inc. Methods and apparatus for sputtering deposition using direct current
JP5623115B2 (ja) * 2010-04-09 2014-11-12 キヤノン株式会社 プラズマ放電用電源装置、およびプラズマ放電処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0639655A1 (en) * 1993-07-28 1995-02-22 Asahi Glass Company Ltd. Method and apparatus for sputtering
JP2010031359A (ja) * 2008-07-29 2010-02-12 Sulzer Metaplas Gmbh 大電力パルス化マグネトロンスパッタリング方法および大電力電気エネルギー源
CN102985996A (zh) * 2010-05-11 2013-03-20 先进能源工业公司 用于使用直流来施加周期性电压的方法和装置
US20140231243A1 (en) * 2012-11-01 2014-08-21 Advanced Energy Industries, Inc. Charge removal from electrodes in unipolar sputtering system
CN105264107A (zh) * 2013-02-20 2016-01-20 皮尔森西波西米亚大学 化学计量介电薄膜的高速反应溅射

Also Published As

Publication number Publication date
JP2019528369A (ja) 2019-10-10
WO2018206100A1 (en) 2018-11-15
TW201909232A (zh) 2019-03-01
KR20180135853A (ko) 2018-12-21

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Application publication date: 20190118