CN109246924A - A kind of fit body for chip mounter - Google Patents
A kind of fit body for chip mounter Download PDFInfo
- Publication number
- CN109246924A CN109246924A CN201811198123.5A CN201811198123A CN109246924A CN 109246924 A CN109246924 A CN 109246924A CN 201811198123 A CN201811198123 A CN 201811198123A CN 109246924 A CN109246924 A CN 109246924A
- Authority
- CN
- China
- Prior art keywords
- suction nozzle
- actuator
- bottom plate
- chip mounter
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000005619 thermoelectricity Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000010792 warming Methods 0.000 abstract description 4
- 238000001035 drying Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The present invention relates to chip mounter technical fields, in particular disclose a kind of fit body for chip mounter, including pasting head assembly, pasting head assembly includes bottom plate, it is slideably positioned in the slide plate of bottom plate, it is set to bottom plate and the first actuator for driving slide plate to slidably reciprocate, it is slideably positioned in the support plate of slide plate, for driving the buffer spring of support sheet reset, it is set to the second actuator of support plate, the suction nozzle being connect with the output end of the second actuator, it is set to the heat generating member of suction nozzle, the glide direction of slide plate and the glide direction of support plate are arranged in parallel, second actuator is for driving suction nozzle to rotate, suction nozzle is equipped with the sucker through suction nozzle；In actual use, suction nozzle is heated first with heat generating member, after being warming up to required temperature after suction nozzle, reinforcing chip is sucked using suction nozzle, then reinforcing chip is pasted on substrate again, the heat of suction nozzle is transferred to substrate via reinforcing chip, it is ensured that reinforcing chip links together with substrate rapid curing, promotes patch efficiency and patch yield.
Description
Technical field
The present invention relates to chip mounter technical fields, in particular disclose a kind of fit body for chip mounter.
Background technique
With social progress and development, along with the rapid development of electronic product, the demand of flexible circuit board is also more next
More, with the development trend that flexible circuit board is lightening, the intensity of flexible circuit board itself is also lower and lower, soft in order to meet
The needs of property wiring board intensity, need to paste reinforcing chip in flexible circuit board.
Reinforcing chip is mainly pasted on substrate via glue in the prior art, during patch, is needed reinforcement first
Piece is placed on substrate, then holds the solidification glue between roaster drying reinforcing chip and substrate, operation via operating personnel again
Complexity is unfavorable for the promotion of patch efficiency；In addition, operating personnel toasts manually and relies primarily on the experience of operating personnel and determine whether
Drying, it is uncontrollable also to will lead to patch yield.
Summary of the invention
In order to overcome shortcoming and defect existing in the prior art, the purpose of the present invention is to provide one kind to be used for chip mounter
Fit body, first with heat generating member heat suction nozzle, after required temperature is warming up to after suction nozzle, reinforcing chip is sucked using suction nozzle,
Then reinforcing chip is pasted on substrate again, the heat of suction nozzle is transferred to substrate via reinforcing chip, it is ensured that reinforcing chip is fast with substrate
Speed solidification links together, and promotes patch efficiency and patch yield.
To achieve the above object, a kind of fit body for chip mounter of the invention, including patch head assembly, paste head assembly
Including bottom plate, the slide plate that is slideably positioned in bottom plate, it is set to bottom plate and the first actuator for driving slide plate to slidably reciprocate, cunning
The dynamic support plate for being set to slide plate, the buffer spring for drive support sheet reset, the second actuator for being set to support plate and
The suction nozzle of the output end connection of second actuator, the heat generating member for being set to suction nozzle, the sliding of the glide direction and support plate of slide plate
Direction is arranged in parallel, and the second actuator is for driving suction nozzle to rotate, and suction nozzle is equipped with the sucker through suction nozzle, and heat generating member is for heating
Suction nozzle, sucker are used to draw extraneous reinforcing chip and paste reinforcing chip in substrate.
Preferably, the patch head assembly further includes the vacuum generator and pressure vacuum gauge for being set to bottom plate, and vacuum occurs
Device is for being connected to sucker, and pressure vacuum gauge is for measuring negative pressure value caused by vacuum generator.
Preferably, the patch head assembly further includes thermoelectricity couple, and thermoelectricity couple is used to measure the temperature value of suction nozzle.
Preferably, the patch head assembly further includes the axis body for being rotatably dispose in support plate, the thermal insulator for being set to axis body, is inhaled
Head is arranged on axis body via thermal insulator, and the second actuator is for driving axis body to rotate.
Preferably, the first stomata that the support plate is equipped with shrinkage pool and is connected to shrinkage pool, axis body rotation are located in shrinkage pool,
Axis body is equipped with annular blind hole and the second stomata, and the second stomata is for being connected to annular blind hole and suction nozzle, the first stomata and annular blind hole
Connection.
Preferably, the axis body outer sheath is set there are two sealing ring, and sealing ring is used to seal between axis body and support plate
Gap, annular blind hole, the first stomata are respectively positioned between two sealing rings.
Preferably, the grating scale that the bottom plate is equipped with reading head, is set to support plate or suction nozzle, reading head is for reading light
The moving distance value of grid ruler.
Preferably, the quantity of the patch head assembly is two, and two patch head assemblies are arranged in parallel, and two patch head assemblies are all provided with
It is placed in bottom plate.
Preferably, the fit body further includes rack, the third actuator for being set to rack, and bottom plate is slideably positioned in machine
Frame, for third actuator for driving bottom plate to slidably reciprocate, the glide direction of bottom plate and the glide direction of slide plate are arranged in a crossed manner.
Preferably, the rack is additionally provided with fourth drive member, and housing slide is provided with industrial camera, and fourth drive member is used
It slidably reciprocates in driving industrial camera, industrial camera is used to shoot image to the reinforcing chip that substrate or suction nozzle are drawn.
Beneficial effects of the present invention: in actual use, suction nozzle is heated first with heat generating member, required temperature is warming up to suction nozzle
After degree, the first actuator driving suction nozzle is moved to the position where reinforcing chip, and reinforcing chip is sucked using suction nozzle, utilizes buffer spring
Absorb the impact force between suction nozzle and reinforcing chip；It is rotated using the related reinforcing chip of the second actuator driving suction nozzle, adjusts reinforcing chip
Relative position between substrate, then again pastes reinforcing chip on substrate, and the heat of suction nozzle is transferred to base via reinforcing chip
Plate, it is ensured that reinforcing chip links together with substrate rapid curing, patch efficiency is promoted, since suction nozzle is heated to making a reservation for by heat generating member
Temperature, can also greatly promote the patch yield of reinforcing chip.
Detailed description of the invention
Fig. 1 is main view of the invention；
Fig. 2 is right view of the invention；
Fig. 3 is the partial enlargement structural representation of part A in Fig. 1；
Fig. 4 is the structural schematic diagram of axis body and sealing ring of the invention.
Appended drawing reference includes:
1-patch 2-bottom plate of head assembly, 3-slide plate
4-the first actuator 5-support plate, 6-buffer spring
7-the second actuator 8-suction nozzle, 9-heat generating member
11-vacuum generator 12-pressure vacuum gauge, 13-thermoelectricity couples
14-the 16-the first stomatas of 15-thermal insulator of axis body
17-annular blind hole 19-sealing rings of the 18-the second stomata
21-reading head 22-grating scale, 23-racks
24-industrial cameras.
Specific embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further below with reference to examples and drawings
Bright, the content that embodiment refers to not is limitation of the invention.
Shown in please referring to Fig.1 to Fig.4, a kind of fit body for chip mounter of the invention, including patch head assembly 1, patch
Head assembly 1 includes bottom plate 2, the slide plate 3 being slidably arranged on bottom plate 2, setting on a base plate 2 and for driving slide plate 3 to slide back and forth
Dynamic the first actuator 4, the buffer spring 6 for driving support plate 5 to reset, is set the support plate 5 being slidably arranged on slide plate 3
Set the second actuator 7 in support plate 5, the suction nozzle 8 that connect with the output end of the second actuator 7, the hair being arranged on suction nozzle 8
The glide direction of warmware 9, the glide direction and support plate 5 of slide plate 3 is arranged in parallel, in the present embodiment, slide plate 3, the equal edge of support plate 5
Vertical direction slides up and down, and the second actuator 7 is provided with the sucker (figure through suction nozzle 8 for driving suction nozzle 8 to rotate on suction nozzle 8
In be not shown), for heating suction nozzle 8, sucker is used to draw extraneous reinforcing chip and pastes reinforcing chip in substrate heat generating member 9
On (such as flexible circuit board).
In actual use, suction nozzle 8 is heated first with heat generating member 9, after required temperature is warming up to after suction nozzle 8, the first driving
Part 4 drives suction nozzle 8 to be moved to the position where reinforcing chip, and reinforcing chip is sucked using suction nozzle 8, absorbs suction nozzle 8 using buffer spring 6
Impact force between reinforcing chip prevents suction nozzle 8 from damaging reinforcing chip；Turned using the second actuator 7 driving related reinforcing chip of suction nozzle 8
It is dynamic, the relative position between reinforcing chip and substrate is adjusted, then again pastes reinforcing chip on substrate, since heat generating member 9 will be inhaled
First 8 have been heated to predetermined temperature, and the heat of suction nozzle 8 is transferred to substrate via reinforcing chip, and cooperation suction nozzle 8 is transferred to via reinforcing chip
The press force of substrate, it is ensured that reinforcing chip links together with substrate rapid curing, promotes the patch efficiency of reinforcing chip；Due to fever
Suction nozzle 8 is heated to scheduled temperature by part 9, it is ensured that reinforcing chip is pasted on substrate in scheduled temperature value, can also be greatly promoted
The patch yield of reinforcing chip.
The patch head assembly 1 further includes the vacuum generator 11 and pressure vacuum gauge 12 of setting on a base plate 2, and vacuum occurs
Device 11 is for being connected to sucker, and in actual use, vacuum generator 11 is connected to extraneous air compressor, and vacuum generator 11 makes
It obtains sucker and generates suction, so that reinforcing chip can be sucked in suction nozzle 8；Pressure vacuum gauge 12 is for measuring 11 institute of vacuum generator
The negative pressure value of generation monitors negative pressure value caused by vacuum generator 11 using pressure vacuum gauge 12 in actual use, prevents true
Negative pressure value caused by empty generator 11 is excessive and reinforcing chip is caused to be attracted deformation, on the other hand prevents 11 institute of vacuum generator
The negative pressure value of generation is too small and causes suction nozzle 8 that cannot consolidate and reinforcing chip is sucked；Promote the absorption yield that suction nozzle 8 draws reinforcing chip.
The patch head assembly 1 further includes thermoelectricity couple 13, and thermoelectricity couple 13 is used to measure the temperature value of suction nozzle 8；Actually make
Used time monitors the heating temperature of suction nozzle 8 using thermoelectricity couple 13, it is ensured that the drawn reinforcing chip of suction nozzle 8 is in mutually synthermal, auxiliary
Promote patch yield.
The patch head assembly 1 further includes the axis body 14 being rotatably arranged in support plate 5, the thermal insulator being arranged on axis body 14
15, suction nozzle 8 is arranged on axis body 14 via thermal insulator 15, and the second actuator 7 is for driving axis body 14 to rotate, when axis body 14 rotates
Related suction nozzle 8 rotates together, it is preferable that the second actuator 7 is servo motor.Via thermal insulator 15 is added, the heat of suction nozzle 8 is prevented
Amount is transmitted on axis body 14, to avoid expanding with heat and contract with cold caused by 14 temperature change of axis body due to influencing axis body 14 and support plate
Normal rotation and positioning accuracy between 5.
The first stomata 16 for being provided with shrinkage pool (not shown) in the support plate 5 and being connected to shrinkage pool, 14 turns of axis body
It is visibly moved to be located in shrinkage pool, annular blind hole 17 and the second stomata 18, appearance of the annular blind hole 17 from axis body 14 are provided on axis body 14
Face is recessed to be formed, and annular blind slot is arranged around the central axis of axis body 14, and the second stomata 18 is for being connected to annular blind hole 17 and inhaling
First 8, the first stomata 16 is connected to annular blind hole 17, and in actual use, vacuum generator 11 is blind via the first stomata 16 and annular
Hole 17 is connected to.During axis body 14 rotates, it is ensured that the first stomata 16 connects with the second stomata 18 always via annular blind hole 17
It is logical, guarantee that reinforcing chip is firmly sucked in suction nozzle 8.
14 outer sheath of axis body is set there are two sealing ring 19, and two sealing rings 19 are respectively positioned in shrinkage pool, and sealing ring 19 supports
Touching is on the outer surface of axis body 14 and on the inner surface of shrinkage pool, and sealing ring 19 is between sealing between axis body 14 and support plate 5
Gap, annular blind hole 17, the first stomata 16 are respectively positioned between two sealing rings 19.It prevents because of gas leakage between axis body 14 and support plate 5
And cause suction nozzle 8 that reinforcing chip cannot normally be sucked.
It is provided with reading head 21 on the bottom plate 2, the grating scale 22 in support plate 5 or on suction nozzle 8, reading head 21 are set
For the moving distance value for reading grating scale 22, in actual use, the first actuator 4 drives the related suction nozzle 8 of support plate 5 to move
It is dynamic, when support plate 5 and mobile suction nozzle 8 can related grating scale 22 it is mobile, when grating scale 22 is mobile, reading head 21 be can be read
Graduation mark on grating scale 22, and then learn the moving distance value of grating scale 22, those skilled in the art can have no
Learn to doubt, when the same position in substrate is sticked a reinforcing chip or multiple reinforcing chips, the moving distance value of suction nozzle 8
It is unequal, and then same position is prevented on substrate to be repeatedly sticked reinforcing chip, promote patch yield.
The quantity of the patch head assembly 1 is two, and two patch head assemblies 1 are spaced each other and are arranged in parallel, two patch head groups
Part 1 is respectively provided on a base plate 2.In actual use, two patch 1 synchronization jobs of head assembly, according to actual needs, two patch head assemblies
1 suction nozzle 8 can draw different reinforcing chips respectively or draw identical two reinforcing chips, and realization effectively improves production effect
Rate saves the time.
The fit body further includes rack 23, the third actuator being arranged in rack 23, and bottom plate 2 is slidably arranged in machine
On frame 23, third actuator is for driving bottom plate 2 to slidably reciprocate along rack 23, the glide direction of bottom plate 2 and the sliding side of slide plate 3
To arranged in a crossed manner, it is preferable that the glide direction of bottom plate 2 and the glide direction of slide plate 3 are vertically arranged, and bottom plate 2 is left in the horizontal direction
Right sliding, slide plate 3 slide up and down along the vertical direction.
The rack 23 is additionally provided with fourth drive member, and sliding is provided with industrial camera 24, fourth drive member in rack 23
For driving industrial camera 24 to slidably reciprocate with respect to rack 23, industrial camera 24 is used for the reinforcing chip drawn to substrate or suction nozzle 8
Shoot image.In actual use, reinforcing chip is shot using industrial camera 24, it is ensured that reinforcing chip is accurately sucked in suction nozzle 8；Utilize work
Industry camera 24 shoots substrate, it is ensured that suction nozzle 8 can accurately paste the reinforcing chip drawn on substrate, and it is good to promote patch
Rate.Preferably, the quantity of industrial camera 24 is two, and an industrial camera 24 is slidably arranged in rack 23, another industry
Camera 24 is arranged on extraneous board, and the industrial camera 24 in rack 23 is located above substrate, the industrial camera 24 in rack 23
For to substrate imaging image, the reinforcing chip that the industrial camera 24 on extraneous board is used to draw suction nozzle 8 to shoot image, the external world
Industrial camera 24 on board is located at the lower section of suction nozzle 8.
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (10)
1. a kind of fit body for chip mounter, it is characterised in that: including pasting head assembly, patch head assembly includes bottom plate, sliding
Be set to the slide plate of bottom plate, be set to bottom plate and for drive slide plate to slidably reciprocate the first actuator, be slideably positioned in slide plate
Support plate, the buffer spring for driving support sheet reset, the second actuator for being set to support plate, with the second actuator
The suction nozzle of output end connection, the heat generating member for being set to suction nozzle, the glide direction of slide plate and the glide direction of support plate are arranged in parallel,
Second actuator is for driving suction nozzle to rotate, and suction nozzle is equipped with the sucker through suction nozzle, and for heating suction nozzle, sucker is used for heat generating member
It draws extraneous reinforcing chip and pastes reinforcing chip on substrate.
2. the fit body according to claim 1 for chip mounter, it is characterised in that: the patch head assembly further includes setting
It is placed in the vacuum generator and pressure vacuum gauge of bottom plate, for vacuum generator for being connected to sucker, pressure vacuum gauge is true for measuring
Negative pressure value caused by empty generator.
3. the fit body according to claim 1 for chip mounter, it is characterised in that: the patch head assembly further includes heat
Galvanic couple part, thermoelectricity couple are used to measure the temperature value of suction nozzle.
4. the fit body according to claim 1 for chip mounter, it is characterised in that: the patch head assembly further includes turning
Dynamic to be set to the axis body of support plate, be set to the thermal insulator of axis body, suction nozzle is arranged on axis body via thermal insulator, the second actuator
For driving axis body to rotate.
5. the fit body according to claim 4 for chip mounter, it is characterised in that: the support plate be equipped with shrinkage pool and
The first stomata being connected to shrinkage pool, axis body rotation are located in shrinkage pool, and axis body is equipped with annular blind hole and the second stomata, the second stomata
For being connected to annular blind hole and suction nozzle, the first stomata is connected to annular blind hole.
6. the fit body according to claim 5 for chip mounter, it is characterised in that: the axis body outer sheath is equipped with two
A sealing ring, sealing ring are used to seal the gap between axis body and support plate, and annular blind hole, the first stomata are respectively positioned on two sealings
Between circle.
7. the fit body according to claim 1 for chip mounter, it is characterised in that: the bottom plate be equipped with reading head,
It is set to the grating scale of support plate or suction nozzle, reading head is used to read the moving distance value of grating scale.
8. the fit body according to claim 1 for chip mounter, it is characterised in that: it is described patch head assembly quantity be
Two, two patch head assemblies are arranged in parallel, and two patch head assemblies are all set in bottom plate.
9. the fit body according to claim 1 for chip mounter, it is characterised in that: the fit body further includes machine
Frame, the third actuator for being set to rack, bottom plate are slideably positioned in rack, and third actuator is used to that bottom plate to be driven to slidably reciprocate,
The glide direction of bottom plate and the glide direction of slide plate are arranged in a crossed manner.
10. the fit body according to claim 9 for chip mounter, it is characterised in that: the rack is additionally provided with
Four actuators, housing slide are provided with industrial camera, and fourth drive member for driving industrial camera to slidably reciprocate, use by industrial camera
Image is shot in the reinforcing chip to substrate or suction nozzle absorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811198123.5A CN109246924A (en) | 2018-10-15 | 2018-10-15 | A kind of fit body for chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811198123.5A CN109246924A (en) | 2018-10-15 | 2018-10-15 | A kind of fit body for chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109246924A true CN109246924A (en) | 2019-01-18 |
Family
ID=65053050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811198123.5A Pending CN109246924A (en) | 2018-10-15 | 2018-10-15 | A kind of fit body for chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109246924A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958763A (en) * | 2019-11-22 | 2020-04-03 | 盐城维信电子有限公司 | Reinforcing automatic laminating method |
| CN114963880A (en) * | 2022-07-12 | 2022-08-30 | 福建正扬科技股份有限公司 | Good shooting training device of stability |
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|---|---|---|---|---|
| CN103929888A (en) * | 2014-04-28 | 2014-07-16 | 广州超音速自动化科技有限公司 | Reinforcing panel sucking mechanism |
| CN103929889A (en) * | 2014-04-28 | 2014-07-16 | 广州超音速自动化科技有限公司 | Reinforcing laminating device for flexible printed circuit board |
| CN104202908A (en) * | 2014-08-28 | 2014-12-10 | 珠海市运泰利自动化设备有限公司 | FPC (Flexible Printed Circuit) reinforcing sheet pasting head device |
| CN204272488U (en) * | 2014-12-12 | 2015-04-15 | 深圳市鹰眼在线电子科技有限公司 | FPC soft board and the installation of reinforcing chip intelligent plaster |
| CN206024271U (en) * | 2016-08-24 | 2017-03-15 | 惠州市永信利自动化设备有限公司 | A kind of heating mounting head |
| CN207543409U (en) * | 2017-09-30 | 2018-06-26 | 深圳市宇道机电技术有限公司 | It is a kind of to move material mounting device |
| CN209448969U (en) * | 2018-10-15 | 2019-09-27 | 广东鼎泰机器人科技有限公司 | A kind of fit body for chip mounter |
-
2018
- 2018-10-15 CN CN201811198123.5A patent/CN109246924A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929888A (en) * | 2014-04-28 | 2014-07-16 | 广州超音速自动化科技有限公司 | Reinforcing panel sucking mechanism |
| CN103929889A (en) * | 2014-04-28 | 2014-07-16 | 广州超音速自动化科技有限公司 | Reinforcing laminating device for flexible printed circuit board |
| CN104202908A (en) * | 2014-08-28 | 2014-12-10 | 珠海市运泰利自动化设备有限公司 | FPC (Flexible Printed Circuit) reinforcing sheet pasting head device |
| CN204272488U (en) * | 2014-12-12 | 2015-04-15 | 深圳市鹰眼在线电子科技有限公司 | FPC soft board and the installation of reinforcing chip intelligent plaster |
| CN206024271U (en) * | 2016-08-24 | 2017-03-15 | 惠州市永信利自动化设备有限公司 | A kind of heating mounting head |
| CN207543409U (en) * | 2017-09-30 | 2018-06-26 | 深圳市宇道机电技术有限公司 | It is a kind of to move material mounting device |
| CN209448969U (en) * | 2018-10-15 | 2019-09-27 | 广东鼎泰机器人科技有限公司 | A kind of fit body for chip mounter |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958763A (en) * | 2019-11-22 | 2020-04-03 | 盐城维信电子有限公司 | Reinforcing automatic laminating method |
| CN114963880A (en) * | 2022-07-12 | 2022-08-30 | 福建正扬科技股份有限公司 | Good shooting training device of stability |
| CN114963880B (en) * | 2022-07-12 | 2023-12-29 | 福建正扬科技股份有限公司 | Shooting training device with good stability |
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