CN109239815A - Cover board and forming method thereof, cover board motherboard, electronic equipment - Google Patents

Cover board and forming method thereof, cover board motherboard, electronic equipment Download PDF

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Publication number
CN109239815A
CN109239815A CN201710556368.XA CN201710556368A CN109239815A CN 109239815 A CN109239815 A CN 109239815A CN 201710556368 A CN201710556368 A CN 201710556368A CN 109239815 A CN109239815 A CN 109239815A
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China
Prior art keywords
layer
cover board
texture
substrate
face
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CN201710556368.XA
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Chinese (zh)
Inventor
陆震生
朱虹
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Shanghai Oxi Technology Co Ltd
Shanghai Luoji Technology Co Ltd
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Shanghai Luoji Technology Co Ltd
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Priority to CN201710556368.XA priority Critical patent/CN109239815A/en
Publication of CN109239815A publication Critical patent/CN109239815A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

A kind of cover board and forming method thereof, cover board motherboard, electronic equipment, the forming method of the cover board include: to provide motherboard substrate, and the motherboard substrate includes base and the sacrificial layer in the base；The sacrificial layer is patterned, figure sacrificial layer is formed；Using the figure sacrificial layer as exposure mask, the base is etched, form substrate and is raised in the texture of the substrate.By being performed etching to base to form the substrate and the texture, compared with the glass cover-plate for including UV glue material matter graph layer, eliminate the use of UV glue material matter graph layer, the problems caused by UV glue material matter graph layer and its formation process can effectively be avoided, be conducive to improve performance, reliability and the manufacturing yield of formed cover board, be conducive to simplify covering plate structure, improve cover board light transmittance, is conducive to the performance and aesthetics that improve constituted electronic equipment.

Description

Cover board and forming method thereof, cover board motherboard, electronic equipment
Technical field
The present invention relates to fingerprint imaging field, in particular to a kind of cover board and forming method thereof, cover board motherboard, electronics are set It is standby.
Background technique
In the portable electronic device using smart phone, tablet computer as representative, in order to protect liquid crystal display panel etc. to show Transparent protection board is usually arranged in device in the outermost layer of display device.As protection board, acrylic acid etc. was mostly used to set greatly originally Rouge material.But since the protection board of resin material is easily bent, thus the corresponding larger or protection board of the thickness of protection board with Gap between display device is relatively large, to prevent display device caused by the formation of protection board from damaging.
In order to improve the defencive function of protection board, the rigidity of protection board is improved, the possibility of protection board deformation is reduced, by glass Protection board as raw material starts to popularize.Glass cover-plate can effectively be realized to liquid since its hardness, rigidity are relatively high The defencive function of the display devices such as crystal panel.
On the other hand, a part as portable electronic device appearance, can by forming pattern on glass cover-plate, Glass cover-plate with texture is constituted, to achieve the purpose that improve electronic equipment aesthetics.It is made on glass cover-plate at present The general technology of pattern are as follows: the pattern-making on organic film, then will have figuratum organic film and fit with glass cover-plate, To form glass cover-plate with texture.
But to form glass cover-plate performance with texture poor for prior art, it is difficult to meet product needs.
Summary of the invention
Problems solved by the invention is to provide a kind of cover board and forming method thereof, cover board motherboard, electronic equipment, to improve lid The effect of texture is presented in plate, improves the performance of fingerprint imaging mould group.
To solve the above problems, the present invention provides a kind of forming method of cover board, comprising:
Motherboard substrate is provided, the motherboard substrate includes base and the sacrificial layer in the base；To the sacrifice Layer is patterned, and forms figure sacrificial layer；Using the figure sacrificial layer as exposure mask, the base is etched, form substrate and convex Arise from the texture of the substrate.
Correspondingly, the present invention provides a kind of cover board, comprising:
Substrate；Texture is raised in the substrate surface.
The present invention also provides a kind of cover board templates, comprising: multiple cover boards, the cover board are cover board of the invention.
In addition, the present invention also provides a kind of electronic equipment, comprising: cover board, the cover board are cover board of the invention.
Compared with prior art, technical solution of the present invention has the advantage that
By being patterned to the sacrificial layer in the base, figure sacrificial layer is formed；It is with the figure sacrificial layer Exposure mask etches the base, to form substrate and the texture for being raised in the substrate；Since the texture and the substrate are It etches the base and is formed, therefore compared with the glass cover-plate for including UV glue material matter graph layer, eliminate UV glue texture map The use of shape layer, can effectively avoid figure caused by UV glue material matter graph layer and its formation process limited, technology stability, The problems such as film layer reliability, color developing effect, is conducive to the performance for improving formed cover board, is conducive to improve constituted electronic equipment Performance and aesthetics；And UV glue material matter graph layer saves, and can effectively avoid related to the UV glue material matter graph layer Security risk, be conducive to the reliability and manufacturing yield that improve formed cover board, additionally it is possible to effectively reduce formed cover board Film layer quantity, be conducive to simplify covering plate structure, be conducive to improve cover board light transmittance.
It is described using the ito glass including glassy layer and ITO layer as the motherboard substrate in optinal plan of the present invention Glassy layer is the base, and the ITO layer is the sacrificial layer；The thickness of ITO layer is smaller, can effectively improve formed figure The pattern precision of sacrificial layer is conducive to the craft precision for improving base's etching, is conducive to formed texture after improvement etching And the smoothness at texture edge, it help to obtain the texture of high quality.
In optinal plan of the present invention, the base material passes through HF wet process using the figure sacrificial layer as exposure mask for glass The mode of etching etches the base to form the texture；The portion without etching can be effectively protected in the figure sacrificial layer Divide base, can effectively improve the precision of formed texture；With the graph layer phase for forming UV glue material matter by UV imprint process Than, without demoulding, limitation is managed without special radian, the limitation of formed texture relief height can be broken through, it being capable of shape At the texture with horn structure, is conducive to expand the range that the texture shows optical effect, is conducive to improve the cover board The effect of texture is presented.
In optinal plan of the present invention, figure can be carried out to the sacrificial layer by way of laser ablation or wet etching Shape, graphical precision are higher；Therefore the texture precision for etching the base according to the figure sacrificial layer and obtaining is higher, Line width and the minimum value of line-spacing can achieve 3 μm, can effectively limitation of the breakthrough process to formed texture line width, line-spacing, The fineness for being conducive to improve formed texture is conducive to the effect for improving formed cover board texture.
In optinal plan of the present invention, it can form what substrate was connected by the way that motherboard substrate is patterned and is etched Multiple cover boards；Single cover board is obtained by the cutting to connected substrate later；That is, the lining can be formed before cutting Bottom and the texture, therefore the processing step after cutting can be effectively reduced, the degree of automation of manufacturing process is improved, is conducive to The realization of large automatic production, is conducive to the raising of production efficiency.
In optinal plan of the present invention, cutting is formed after the cover board, can also carry out hot bending processing to the cover board, from And form 3D cover board with texture；The aesthetics of formed 3D cover board can be effectively improved, guarantees the good of formed 3D cover board Rate is conducive to improve cover board performance, improves the performance and aesthetics of electronic equipment.
In optinal plan of the present invention, cutting is formed after the cover board, and the forming method can also be in the third face With optical functional layer, color layers and base are sequentially formed in the fourth face at least one face.Since the texture is to pass through It etches the base and is formed, can also directly form optical functional layer and its subsequent film in the lid surface handled through hot bending Layer, without being bent film layer, and the texture and the base all have certain rigidity, therefore the optical functional layer and institute State that the intensity connected between cover board is higher, the optical functional layer falls off or phenomenon of rupture goes out so can effectively reduce It is existing, be conducive to the reliability for improving formed cover board, be conducive to improve the manufacturing yield for forming the cover board.
In optinal plan of the present invention, the color layers are formed directly on the cover board, and without fitting, film layer will not be curved Song, thus it is smaller to color layers thickness limitation, so the color developing effect of the color layers can be effectively improved, can protect Under the premise of demonstrate,proving yield, reducing security risk, improve the color developing effect of the color layers, being conducive to the formed cover board of raising is in The effect of existing texture.
In optinal plan of the present invention, pass through the semiconductor fabrication process shape such as laser ablation, exposure development or wet etching At the substrate and the texture, technical maturity is high, and it is strong to be made stability, can improve craft precision, improve grain effect Under the premise of, guarantee higher manufacturing yield, is conducive to control cost, improves performance.
Detailed description of the invention
Fig. 1 is a kind of the schematic diagram of the section structure of glass cover-plate；
Fig. 2 is the schematic diagram of the section structure of another glass cover-plate；
Fig. 3 to Figure 11 is the corresponding the schematic diagram of the section structure of each step of cover board forming method first embodiment of the present invention；
Figure 12 to Figure 14 is the corresponding the schematic diagram of the section structure of each step of cover board forming method second embodiment of the present invention；
Figure 15 to Figure 16 is the corresponding the schematic diagram of the section structure of each step of cover board forming method 3rd embodiment of the present invention.
Specific embodiment
It can be seen from background technology that in the prior art often there is the undesirable problem of performance in glass cover-plate with texture.It is existing The reason of problem bad in conjunction with the structural analysis of glass cover-plate with texture its performance:
With reference to Fig. 1, a kind of the schematic diagram of the section structure of glass cover-plate is shown.
Make glass cover-plate that texture be presented, there are two types of modes for mainstream, and one is explosion-proof membrane technologies as shown in Figure 1.Such as Fig. 1 institute Show, being formed by glass cover-plate by explosion-proof membrane technology includes: glass-base 11；Cover the optics on 11 surface of glass-base Glue-line 12；Cover the resin layer 13 on 12 surface of optical adhesive layer；Cover the graph layer 14 on 13 surface of resin layer；Positioned at institute State the black matrix layer 17 on graph layer 14.
Wherein, the material of optical adhesive layer 12 is transparent optical cement (Optically Clear Adhesive, OCA), mainly For the binder of cementing transparent optical element (such as camera lens etc.), have excellent transparency, light transmission rate high (90% or more), Cementing strength is good, can solidify under room temperature or medium temperature and have the features such as cure shrinkage is small；The material of resin layer 13 is predominantly poly- Ethylene glycol terephthalate (Polyethylene Terephthalate, PET), with physical mechanical property is excellent, it is compacted to resist Denaturation, fatigue durability, the preferable feature of rub resistance, dimensional stability.
14 surface of the graph layer height rises and falls, and has certain pattern, for making the glass cover-plate form texture.Institute The material for stating graph layer 14 is UV glue, is usually formed by UV drawing process, i.e., makes in template in such a way that UV is imprinted In pattern transfer to UV glue, to make to be formed by glass cover-plate presentation texture corresponding with UV glue pattern.
In general, forming glass cover-plate in UV drawing process used by texture, micron-sized transfer is generallyd use Technique, therefore the line width d1 and line-spacing d2 of formed graph layer 14 cannot be too small.It is limited by UV imprint mold, UV glue material matter 14 line width d1 minimum of graph layer is only 20 μm, and minimum 7 μm of line-spacing d2；And the relief height h1 of the graph layer 14 can not Too big, relief height h1 maximum is no more than 8 μm, otherwise in the knockout course of UV coining, is easy to appear showing for UV glue fracture As to will affect manufacturing yield.
The limitation of the 14 line width d1 of graph layer, line-spacing d2 and relief height h1 will affect the shape of 14 figure of graph layer At effect, to limit the depth-to-width ratio of the formed texture of the graph layer 14；Moreover, because the knockout course of UV imprint process The wedge angle of texture can be scraped, therefore the yield in order to guarantee manufacture, can only UV imprint process be formed by texture and can only use The biggish circular shape of radian (as shown in figure 1 shown in 18 circles), so the forming process in the graph layer 14 needs to take spy Different radian control.The limitation and special radian control of line width d1, line-spacing d2 and depth-to-width ratio, can all influence glass cover-plate institute The effect that texture is presented, show some special optical effects can not by the graph layer 14 of UV glue material matter.
Moreover, making the glass cover-plate that the way of texture be presented by the graph layer 14 of UV glue material matter, UV glue-line is coated More demanding with cured technique: within the scope of entire glass cover-plate, the uniformity of the UV glue-line coating will affect subsequent UV pressure The quality for printing figure formed in technique, influences the integrity degree and clarity of the formed figure of the graph layer 14；The UV glue Hardness after solidification cannot be too high, and the UV glue internal stress for crossing high rigidity is larger, and the biggish graph layer 14 of internal stress is easy disconnected It splits, influences its stability, and internal excessive stress, can also make cohesive force between the graph layer 14 and glass-base 12 inclined It is weak, influence its reliability.
In addition, in line width d1, the lesser situation of line-spacing d2, the bonding that is limited by between the curing degree of UV and mold Power, releasing process needs to carry out stripping rate, direction, force the control of degree of precision during UV shifting process, to protect The formed graph layer 14 of card is injury-free, and otherwise manufacturing yield will receive large effect.
In addition, the thickness of the graph layer 14 of UV glue material matter cannot be too big.The graph layer 14 is to be fitted in PET material The resin layer 13 on.The graph layer 14 can bend after being fitted on the resin layer 13；Later again with glass Glass or transparent plastic fit.If the thickness of the graph layer 14 is too big, the graph layer 14 and the resin layer 13 Between adhesive force it is smaller, will affect bonding strength between the graph layer 14 and the resin layer 13；And the graph layer 14 thickness is bigger, then the shrinkage of the graph layer 14 will increase；The decline of bonding strength, the increase of shrinkage, all can shadow Ring the reliability of the graph layer 14.Further, 14 layers of the graph layer can occur when encountering boiling cracking, removing show As to will also result in security risk.
It continues to refer to figure 1, in order to make the glass cover-plate carry out certain modulation to transmitted ray, and makes the glass cover Certain color is presented in plate, to meet the design of electronic equipment, between the graph layer 14 and the black matrix layer 17, and institute State glass cover-plate further include: cover the optical functional layer 15 and covering 15 table of optical functional layer on 14 surface of graph layer The color layers 16 in face.
The optical functional layer 15 is a series of Jie of the high layering of the small uniformity of thickness that is formed by way of plated film Matter plated film is modulated light by characteristics such as the reflection of different medium plated film, refraction, transmission and polarizations, reaches increasing Thoroughly, the purpose of increasing anti-perhaps polarization separation is so that obtaining transmits the light within the scope of some or multiple specific bands all Or all reflections；Or light is made to realize polarization separation and other effects.
The soft characteristic of limitation and UV glue due to UV glue material, the optical functional layer 15 and the graph layer 14 Between the intensity that connects it is weaker, fall off so being easy to appear between the optical functional layer 15 and the graph layer 14 of UV glue material matter Phenomenon, to affect the stability and reliability of the glass cover-plate.
And in order to prolong the service life, prevent the optical functional layer 15 impaired, the graph layer 14 and the optics Functional layer 15 can only cover a surface of the glass-base 11, another surface is then towards external environment, that is to say, that makes The optical functional layer 15 prevents from being damaged towards the inside of electronic equipment.
In addition, with the rise that 3D cover board is applied, when being bonded the graph layer 14 on 3D glass to obtain 3D cover board, by It is that needs are curved, therefore have the UV glue-line of the optical functional layer 15 and UV glue material matter of certain rigidity curved simultaneously in film layer Qu Shi, the optical functional layer 15 may be broken, to cause the loss of manufacturing yield.
The color layers 16 can make the glass cover-plate that corresponding color be presented, so as to enrich the glass cover-plate The effect of presented texture improves aesthetics.
The a kind of of the color layers 16 is achieved in that through the collocation of high two kinds of materials of low-refraction, utilizes thicknesses of layers With the characteristic of refractive index, display color.But the color developing effect and reliability of the color layers 16 are difficult to take into account: the color layers 16 thickness are bigger, develop the color deeper, brighter, color developing effect is better, but the increase of 16 thickness of color layers can improve the color layers 16 security risk, influences manufacturing yield；And in order to guarantee yield, risk is reduced, then needs to reduce the color layers 16 Thickness, and will affect the effect that texture is presented in the glass cover-plate.
In addition, the color developing effect of the color layers 16 also will receive the influence of formation process: identical plating conditions, not It is not identical with the color performance on the formed graph layer 14 of producer, and to certain special colors (for example, close to white Gold etc.), the color layers 16 can not show.
With reference to Fig. 2, the schematic diagram of the section structure of another glass cover-plate is shown.
Making glass cover-plate that another method of texture be presented is exactly glass directly at mould technology (Glass Direct UV Molding, GDM).As shown in Fig. 2, being directly formed by glass cover-plate at mould technology by glass includes: glass-base 21；It covers Cover the graph layer 24 on 21 surface of glass-base；Cover the optical functional layer 25 on 24 surface of graph layer；Cover the light Learn the ink layer 26 on 25 surface of functional layer, and the black matrix layer 17 of the covering ink layer 26.
In conjunction with reference Fig. 1 and Fig. 2, compared with explosion-proof membrane technology is formed by glass cover-plate, glass directly exists at mould technology Graph layer 24 is directly formed on the glass-base 21, eliminates the optical adhesive layer 12 between glass-base 21 and graph layer 24 (as shown in Figure 1) and resin layer 13, thus reach reduce glass cover-plate thickness, simplify production process, improve glass reuse rate, Reduce the purpose of production cost.
But either explosion-proof membrane technology or glass are directly at mould technology, are all to pass through UV in formed glass cover-plate The graph layer of glue material matter forms figure, to achieve the effect that make glass cover-plate that texture be presented；Therefore figure caused by UV glue The problems such as shape is limited, technology stability, film layer reliability, color developing effect will appear in two kinds of glass cover-plates, so UV glue It is formed by the effect that graph layer affects the presented texture of glass cover-plate, affects the performance and beauty of formed electronic equipment Degree.
To solve the technical problem, the present invention provides a kind of forming method of glass cover-plate, by carving to base Erosion compared with the glass cover-plate for including UV glue material matter graph layer, eliminates UV glue material matter to form the substrate and the texture The use of graph layer, the problems caused by capable of effectively avoiding UV glue material matter graph layer and its formation process, are conducive to improve institute Performance, reliability and the manufacturing yield for forming cover board are conducive to simplify covering plate structure, improve cover board light transmittance, be conducive to improve The performance and aesthetics of constituted electronic equipment.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention Specific embodiment be described in detail.
With reference to Fig. 3 to Figure 11, the corresponding section knot of each step of cover board forming method first embodiment of the present invention is shown Structure schematic diagram.
Motherboard substrate 100 is provided in conjunction with reference Fig. 4 and Fig. 5 with reference to Fig. 3, the motherboard substrate 100 includes 110 He of base Sacrificial layer 120 in the base 110.Wherein, Fig. 4 is the schematic diagram of the section structure of the embodiment illustrated in fig. 3 along A1A2 line； Fig. 5 is the enlarged structure schematic diagram of structure in box 101 in embodiment illustrated in fig. 4.
The motherboard substrate 100 is used to provide Process ba- sis and operating platform for subsequent technique.The base 110 is for being Subsequent technique provides basis, is used to form substrate and texture；The sacrificial layer 120 is used to provide base for the formation of figure sacrificial layer Plinth.
In the present embodiment, the motherboard substrate 100 is to open substrate greatly, for forming multiple cover boards after capable of cutting.Specifically , the motherboard substrate 100 has the dicing lane for cutting for forming 4 × 4 cover boards after cutting between the cover board (not indicated in figure).
As shown in Figure 4 and Figure 5, in the present embodiment, the motherboard substrate 100 be ito glass, including glassy layer and be located at institute State the ITO layer on glassy layer；The glassy layer is the base 110, and the ITO layer is the sacrificial layer 120, i.e., the described base 110 material is glass, and the material of the sacrificial layer 120 is tin indium oxide (Indium Tin Oxide, ITO).Due to ITO glass The thickness of ITO layer is relatively small in glass, i.e., the thickness of the described sacrificial layer 120 is smaller, is conducive to improve 120 figure of sacrificial layer The precision of change is conducive to the smoothness at formed texture and texture edge after improvement etching, to obtain the texture of high quality.
As shown in figure 5, the base 110 includes the first face 113 and the second face 114 being disposed opposite to each other；The sacrificial layer 120 On at least one face in first face 113 and second face 114.Specifically, in the present embodiment, the sacrificial layer 120 are located on the first face 113 of the base 110.
Ito glass is to plate one layer of ito film using the method for magnetron sputtering on the basis of sodium calcium base or silicon boryl glass It manufactures.In the present embodiment, the ITO layer covers the surface of the glassy layer, i.e., the described sacrificial layer 120 covers described The surface of base 110.Since ito glass is a kind of semiconductor substrate, so directlying adopt ito glass as the motherboard substrate 100 way can effectively reduce processing step, reduce process costs.
It should be noted that in some cases, ito glass can also include the barrier layer between glassy layer and ITO layer, with Prevent the diffusion of the sodium ion in glassy layer；So the sacrificial layer can also make to include stopping in other embodiments of the invention The lamination of layer and ITO layer.
In the present embodiment, the thickness of the sacrificial layer 120 is in 300nm to 2 μ ms.
The thickness of the sacrificial layer 120 should not it is too big also should not be too small.If the thickness of the sacrificial layer 120 is too big, It is difficult to improve graphical precision, formed texture edge may be made burr occur, texture edge-smoothing degree is influenced, influences institute Form the quality of texture；If the thickness of the sacrificial layer 120 is too small, the thickness of graphical rear formed figure sacrificial layer It is corresponding to reduce, it will affect the exposure mask effect of the figure sacrificial layer, influence the defencive function of the figure sacrificial layer, will affect institute State the formation and quality of texture.
In conjunction with reference Fig. 6, the sacrificial layer 120 (as shown in Figure 5) is patterned, forms figure sacrificial layer 121.
The figure sacrificial layer 121, as etch mask, is determined during being subsequently formed the substrate and the texture The size of the justice texture and position.
Since the figure sacrificial layer 121 is graphically formed by the sacrificial layer 120, so the figure sacrificial layer 121 Material it is identical as 120 material of sacrificial layer, be all tin indium oxide in the present embodiment.In the patterning process, removal portion Divide the sacrificial layer 120, expose the surface of the base 110, the remaining sacrificial layer 120 is used as the figure sacrificial layer 121, to protect the base 110 of non-exposed portion.
It should be noted that since the figure sacrificial layer 121 is used as etch mask in the subsequent process, to define institute Size and the position of texture are formed, therefore the shape of subsequent formed texture is consistent with the shape of the figure sacrificial layer 121, this In embodiment, the shape of the figure sacrificial layer 121 is strip, and corresponding subsequent formed texture is wire drawing texture.This hair In bright other embodiments, the shape of the figure sacrificial layer can also be other regularly or irregularly shapes, such as pattern Or logo etc..
In addition, the motherboard substrate 100 is to open substrate greatly, and the motherboard substrate 100 further includes for cutting in the present embodiment The dicing lane cut, so the figure sacrificial layer 121 also exposes the dicing lane.
Specifically, being patterned by way of laser ablation 122 to the sacrificial layer 120 in the present embodiment.Pass through The way that laser ablation 122 is patterned the sacrificial layer 120, with low cost, low pollution, yield easy to operate, high Advantage.
Laser ablation 122 is the focal position by adjusting high energy laser beam, directly acts on high energy laser beam described Sacrificial layer 120, and the 120 material transient evaporation of sacrificial layer is enabled, to achieve the effect that etching；Simultaneously because laser energy can The property of tune carries out the patterned way of the sacrificial layer 120 by laser ablation 122, can be effectively reduced the base 110 Impaired risk is conducive to the raising of yield.
And laser ablation 122 is controlled by computer software, and the figure completed is imported, and establishes laser ablation map file It can carry out, therefore laser ablation 122 is capable of forming a variety of patterns, so being capable of forming multiple patterns by laser ablation 122 The figure sacrificial layer, can effectively expand the shape of formed texture, reduce process costs.
Specifically, the laser ablation 122 forms the process of the figure sacrificial layer 121, can be carved by visible laser The mode of erosion or infrared laser etching carries out.Used laser can be pulse and swash during the laser ablation 122 Light is also possible to continuous laser.
In the present embodiment, according to the thickness of the sacrificial layer 120, laser wave employed in patterned process is rationally set The technological parameters such as length, laser power, pulse frequency, so that the smooth of the edge is formed, the figure sacrificial layer 121 of clear patterns, And reduce the impaired possibility of the base 110.
It is exposure mask with the figure sacrificial layer 121 with reference to Fig. 7, etches the base 110 (as shown in Figure 6), forms substrate 111 and it is raised in the texture 112 of the substrate 111.
The base 110 is etched, the segment thickness of base 110 is exposed in removal by the figure sacrificial layer 121, to make institute The shape for stating figure sacrificial layer 121 is transferred in the base 110, to form the substrate 110 and the texture 112.
It is formed since the texture 112 and the substrate 111 are the etching base 110 (as shown in Figure 6), so The texture 112 and the substrate 111 are structure as a whole, and bonding strength is larger between the texture 112 and the substrate 111, The performance of the cover board can be effectively improved；And compared with the glass cover-plate for including UV glue material matter graph layer, UV glue is eliminated The use of material graph layer can effectively avoid figure caused by UV glue material matter graph layer and its formation process from being limited, technique The problems such as stability, film layer reliability, color developing effect, is conducive to the performance for improving formed cover board, is conducive to improve being constituted The performance and aesthetics of electronic equipment；In addition, UV glue material matter graph layer saves, can effectively avoid and the UV glue texture map The relevant security risk of shape layer is conducive to the reliability and manufacturing yield that improve formed cover board, additionally it is possible to effectively reduce institute The film layer quantity for forming cover board is conducive to simplify covering plate structure, is conducive to improve cover board light transmittance.
The substrate 111 carries the texture 112, to provide mechanical support；In the present embodiment, the cover board is for portable The touch display screen of formula electronic equipment, so the substrate 110 also acts as the effect for protecting the touch screen；The texture 112 Shape it is consistent with the shape of the figure sacrificial layer 121, for making the cover board that texture be presented, improve the beauty of the cover board Degree.In other embodiments of the invention, the texture of different shapes can also play collimation, refraction, reflection to the light of transmission Or the optical effects such as polarization separation, make the cover board that certain special optical effect be presented.
In the present embodiment, by base 110 described in wet etching, the substrate 111 and the texture 112 are formed, with drop Damage of the low etching process to 112 surface of formed substrate 111 and the texture improves etching precision, improves formed texture 112 precision and quality.In other embodiments of the invention, dry etching or dry etching and wet etching phase can also be passed through In conjunction with mode form the substrate and the texture.
Specifically, the motherboard substrate 100 is ito glass in the present embodiment, i.e., the material of the described base 110 is glass, The material of the figure sacrificial layer 121 is tin indium oxide；So the etching solution of the wet etching includes HF.
The substrate 111 and the texture 112 are formed by way of etching；The figure sacrificial layer 121 can be effective Protection without etching part base 110, can effectively improve the precision of formed texture；And etching is capable of forming tool There is the texture 112 of horn structure (as shown in circle 160), i.e., the described texture 112 includes at least the first joint face 161 and second and connects Junction 162, first joint face 161 and the intersection of the second joint face 162, i.e., described first joint face 161 and the second joint face 162 intersect at straight line or curve.Compared with the graph layer for forming UV glue material matter by UV imprint process, the mode of etching is without de- Mould manages limitation without special radian, can break through the limitation of formed texture relief height, be capable of forming with wedge angle The texture of structure is conducive to expand the range that the texture 112 shows optical effect, is conducive to improve the cover board presentation texture Effect.
And during HF wet etching, the etching selection of tin indium oxide is smaller, and the etching selection of glass is bigger, because This described figure sacrificial layer 121 can effective protection without etching part base 110, to reach to form the substrate 111 With the purpose of the texture 112.
It should be noted that the ratio for etching the etch amount H and the 110 thickness D of base of the base 110 is less than 1:2, The etch amount H of the i.e. described wet etching is accounted within the 50% of the 110 thickness D of base, thus the texture 112 be raised in it is described The ratio of 111 apparent height H of the substrate and 111 thickness M of substrate is less than 1:1.
The ratio for etching the etch amount H and the 110 thickness D of base of the base 110 should not be too big.Etch the base If the ratio of 110 etch amount H and the 110 thickness D of base are too big, it will cause the 111 thickness M of substrate is too small, meeting The intensity for influencing the substrate 111 is unfavorable for the realization of 111 defencive function of substrate, is unfavorable for the function of the cover board.
Specifically, etching the etch amount H of the base 110 within the scope of 2 μm to 0.4mm in the present embodiment.
Etch the base 110 etch amount H should not it is too small also should not be too big.Etch the etch amount H of the base 110 such as Fruit is too small, then it is unobvious to be raised in 111 surface of substrate for the texture 112, is unfavorable for the improvement of the cover board aesthetics, no Conducive to the realization of the certain optical functions of the texture 112, the effect of blast cannot achieve；Etch the etch amount H of the base 110 If too big, in order to guarantee the defencive function of the cover board, it is excessive to be likely to result in the cover sheet thickness, is unfavorable for the electricity The control of sub- device thickness is unfavorable for the raising of integrated level.
In the present embodiment, the thickness of the remaining base 110 is greater than 0.25mm, i.e., the thickness M of the described substrate 111 is greater than 0.25mm.If the thickness M of the substrate 111 is too small, the intensity of the cover board may be will affect, formed cover board is caused to protect Protective function is degenerated.
It should be noted that since the graphical precision of the figure sacrificial layer 121 is higher, it is sacrificial according to the figure The precision that domestic animal layer 121 etches and forms texture 112 also increases accordingly, and the line width L1 of the texture 112 can be realized less than 20 μm, The line-spacing L2 of the texture 112 also can be realized less than 7 μm, that is to say, that the minimum dimension of formed texture 112 can be less than 20 μm, the distance between adjacent texture 112 can be less than 7 μm.So the texture 112 is formed by way of etching, it can Effective limitation of the breakthrough process to formed texture line width, line-spacing, is conducive to the fineness for improving formed texture, is conducive to change The effect of kind formed cover board texture.
In the present embodiment, it is contemplated that technology difficulty and process costs, the line width L1 of the texture 112 are greater than 5 μm and are less than 20 μm, the line-spacing L2 of the texture 112 is greater than 5 μm and less than 7 μm.If the line width L1 of the texture 112 is too small or described The line-spacing L2 of texture 112 is too small, then the 112 formation process difficulty of texture can be made to increase, and process costs increase, it is possible that The problems such as yield declines；If the line width L1 of the texture 112 is too big or the line-spacing L2 of the texture 112 is too big, improve The effect of the fineness of formed texture is limited, may will affect the effect of formed cover board texture.
It should be noted that the motherboard substrate 100 is that substrate, the figure sacrificial layer 121 are gone back greatly in the present embodiment Expose the dicing lane, so base corresponding to the dicing lane position also will receive during etching the base 110 Etching；But the substrate 111 of formed cover board is connected in the dicing lane.
With reference to Fig. 8 and Fig. 9, the forming method further include: after etching the base 110 (as shown in Figure 6), remove institute State sacrificial layer 121 (as shown in Figure 7).Wherein, Fig. 9 is in embodiment illustrated in fig. 8, along the schematic diagram of the section structure of B1B2 line.
The purpose for removing the sacrificial layer 121 is to remove the different film layer of material, to prevent the sacrificial layer 121 right The influence of subsequent technique prevents 121 pairs of sacrificial layer formed cover board performances from interfering.
Specifically, the material of the sacrificial layer 121 is tin indium oxide, the texture 112 and the substrate in the present embodiment 111 material is glass.The conductive energy of tin indium oxide, the presence of the sacrificial layer 121 may will affect integrated institute State the performance of the electronic equipment of cover board；And the refractive index of tin indium oxide and the refractive index of glass be not identical, the sacrificial layer 121 presence may will affect the light-bleed effect of the cover board；Furthermore the subsequent lid surface also will form other films Layer, the surface tension of tin indium oxide and the surface tension of glass are different, and removing the sacrificial layer 121 can also mention for subsequent technique For good artistic face, film quality is provided, improves cover board performance.
The material of the figure sacrificial layer 121 is tin indium oxide, and the figure sacrifice is removed by way of wet-cleaning Layer, the mill solution of the wet-cleaning are alkaline solution.Carrying out wet-cleaning using alkaline solution can be effectively reduced removal Loss of the technique to 112 surface of the substrate 111 and the texture is conducive to improve 112 table of the substrate 111 and the texture The smooth degree in face is conducive to the performance for improving formed cover board.
As shown in Figure 8 and Figure 9, it is formed after the substrate 111 and the texture 112, the substrate 111 is cut, to obtain Obtain the cover board.
Since the motherboard substrate 100 is to open substrate greatly, multiple cover boards are used to form, so etching forms the substrate 111 and the texture 112 after, form multiple prefabricated cover boards being made of substrate 111 and the texture 112 and (do not marked in figure Show).The substrate 111 of the multiple prefabricated cover board is connected in the dicing lane position；The dicing lane is used to be isolated different pre- Cover board processed, to provide state space for the subsequent cutting substrate 111.
Specifically, etching is formed after the substrate 111 and the texture 112 in the present embodiment, form described prefabricated The quantity of cover board is 16, is in 4 × 4 array arrangements.But the present invention to the quantity of formed prefabricated cover board without limitation.This hair In bright other embodiments, the quantity of the prefabricated cover board may be other values.
As shown in figure 8, the substrate 111 of different prefabricated cover boards is connected in the street area, so along the dicing lane Cutting the substrate 111 separates the substrate 111 of different prefabricated cover boards, to obtain independent single prefabricated cover board (in figure not Mark).Specifically, can be cut by diamond blade or laser cutting technique to the substrate 111 of dicing lane.Cutting The technology of the substrate 111 is similar to the prior art, and the present invention repeats no more this.
Due to having formed the substrate 111 and the texture 112 before cutting, after cutting can be effectively reduced Processing step improves the degree of automation of manufacturing process, is conducive to the realization of large automatic production, is conducive to production efficiency It improves.
In conjunction with reference Fig. 9 to Figure 11, in the present embodiment, the forming method further include: carry out hot bending processing 141.Wherein, Figure 11 is the enlarged diagram of structure in box 102 in embodiment illustrated in fig. 10.
In the present embodiment, the cover board is used for the touch display screen of portable electronic device, and the hot bending processing 141 is used for So that the prefabricated cover board is formed 3D structure, for being formed as 3D cover board, thus enhance the display three-dimensional sense of formed cover board, Increase display area, improves the grip sense of electronic equipment.
Hot bending processing 141 makes the prefabricated cover board form 3D structure, that is to say, that the addition of hot bending processing 141 being capable of shape At 3D cover board with texture, the aesthetics of formed 3D cover board can be effectively improved；And the substrate 111 and the texture 112 be the integral structure that etching is formed, therefore bonding strength is larger between the substrate 111 and the substrate 112, can be effective Guarantee forms the yield of 3D cover board, is conducive to improve cover board performance, improves the performance and aesthetics of electronic equipment.
The hot bending processing 141 can make the prefabricated cover board integrally bending, i.e., the described substrate 111 and the texture 112 Entirety bends.Specifically, as shown in figure 9, the substrate 111 has the third face 115 being disposed opposite to each other and fourth face 116； As shown in Figure 10, after hot bending processing 141, the 111 third face 115 of substrate and fourth face 116 are towards same direction protrusion Or the curved surface of recess, i.e., the described third face 115 and the fourth face 116 are curved surface, and the substrate 111 has thickness one Cause property, distance is equal or roughly equal everywhere between the third face 115 and the fourth face 116；With the third face 115 and the fourth face 116 bending, the texture 112 on the fourth face 116 is also bent therewith.
In the present embodiment, it is contemplated that technology difficulty and manufacturing yield, after the hot bending processing 141, the third face 115 For convex surface, the fourth face 116 is the concave surface being recessed towards 115 protrusion direction of third face.In other embodiments of the invention, The hot bending processing can also make the third face in concave surface, the fourth face be presented convex towards third face recess direction The convex surface risen.
It should be noted that the prefabricated cover board can also carry out after hot bending processing in other embodiments of the invention Strengthen, to enhance the intensity of formed 3D cover board, enhances the protective capability of formed cover board.
In conjunction with reference Figure 11, in the present embodiment, the forming method further include: after hot bending processing 141, in the substrate 111 and the texture 112 surface on formed optical functional layer 131；Color layers 132 are formed on the optical functional layer 131； Base 133 is formed in the color layers 132.
Since the technological temperature of hot bending processing 141 is higher, in some cases, the technological temperature of hot bending processing may be more than 600 DEG C, therefore after hot bending processing 141, form the optical functional layer 131, the color layers 132 and the base 135, it can be effectively reduced hot bending and handle the influence that 141 pairs of film layers are formed, be conducive to improve formed optical functional layer 131, face The quality of chromatograph 132 and base 133.
It should be noted that the prefabricated cover board is also possible to without hot bending processing in other embodiments of the invention The treated 2.5D cover board of 2D cover board or edge.
It should also be noted that, the substrate 111 has the third face 115 being oppositely arranged and fourth face 116, the optics Functional layer 131 is formed on the third face 115 and at least one face of the fourth face 116.In the present embodiment, the optics function Ergosphere 131 is formed on the fourth face 116 with the texture 112.
The optical functional layer 131 transmits the cover board light for modulating.The optical functional layer 131 generally comprises number Numerous dielectric layers is measured, by characteristics such as reflection, refraction, transmission and polarization of the light at different medium bed boundary, to saturating Light is penetrated to be modulated.By to the 131 inner medium layer material of optical functional layer, medium layer number and thickness of dielectric layers etc. The setting of parameter can make the cover board in a certain specific band or multiple wavelength bands light realize it is wholly transmissive or Person is fully reflective, or carries out the spe-cial optical effects such as polarization separation to transmitted ray.
Since the optical functional layer 131 is formed directly on the substrate 111 and the texture 112, the light The formation for learning functional layer 131 is not necessarily to pad pasting, without being bent film layer, is broken so as to effectively reduce the optical functional layer 131 The appearance of phenomenon, without the manufacturing process of film coating process, can effectively improve institute's shape especially when the cover board is 3D cover board At the reliability of cover board, yield loss is effectively reduced, is conducive to the performance and yield that improve formed cover board.
And it is formed, the texture since the texture 112 and the substrate 111 are the etching base 110 112 and the material of the substrate 111 there is certain rigidity, therefore the optical functional layer 131 and the texture 112 and described The intensity connected between substrate 111 is higher, the less appearance of 131 obscission of optical functional layer, is conducive to raising and is formed The reliability of cover board.
The color layers 132 are for making the cover board that certain color be presented, to adapt to the design of electronic equipment.This reality It applies in example, the color layers 132 include color medium layer 132a and ink layer 132b, and the color medium layer 132a passes through to saturating It penetrates the mode that light is modulated and realizes that color is shown, the ink layer 132 realizes color by way of adding colored dyes Display.
Since the color layers 132 are directly formed on the substrate 111 and the texture 112, the face The forming process of chromatograph 132 is not necessarily to pad pasting, without being bent film layer, so limitation of the formation process to 132 thickness of color layers Smaller, the especially described color medium layer 132a can be under the premise of guaranteeing yield, reducing security risk, by increasing film The mode of thickness degree makes the color layers 132 that deeper, brighter color be presented, and improves color developing effect, expands colour developing type, thus Reach improvement color developing effect, improves the effect that texture is presented in formed cover board.
The base 133 prevents cover board covering part internal structure from exposing for shutting out the light.
It should be noted that the optical functional layer 131, the color layers 132 and the particular technique of the base 133 Scheme, same as the prior art, details are not described herein by the present invention.
Referring to figs 12 to Figure 14, the corresponding section knot of each step of cover board forming method second embodiment of the present invention is shown Structure schematic diagram.
The present embodiment is identical with the first embodiment place, and details are not described herein by the present invention.The present embodiment and previous embodiment The difference is that firstly, as shown in figure 12, in the present embodiment, on the first face 213 and the second face 214 of the base 210 It is covered with the sacrificial layer 220, therefore as shown in figure 14, it is raised on the third face 215 of the substrate 211 and fourth face 216 There is the texture 212；Secondly, the figure sacrificial layer 221 and the texture 212 are by way of photoetching in the present embodiment It is formed.
With reference to Figure 12, in the present embodiment, the base 210 includes the first face 213 and the second face 214 being disposed opposite to each other；Institute Sacrificial layer 220 is stated to be located at least one face in first face 213 and second face 214.Specifically, the sacrificial layer 220 are located on first face 213 and second face 214.
The step of being patterned to the sacrificial layer 220 includes: the formation graphic material layer on the sacrificial layer 220； The graphic material layer is patterned, graph layer 222 is formed；It is sacrificial layer described in mask etching with the graph layer 222 220, form the figure sacrificial layer 221.
The sacrificial layer 220 is patterned by graph layer 222, to form the figure sacrificial layer 221, Neng Gouyou Effect improves the graphical precision of the sacrificial layer 220, improves the smooth of the edge degree of the figure sacrificial layer 221 and fine, thus Be conducive to improve the precision that subsequent texture is formed, improve the quality of formed texture；And it is patterned by graph layer 222 Mode, and semiconductor fabrication process compatibility with higher, and technical maturity is high, it is strong to be made stability, Neng Gougai Kind craft precision guarantees higher manufacturing yield under the premise of improving grain effect, is conducive to control cost, improves performance.
The graphic material layer is used to provide base for the formation of the graph layer 222；The graph layer 222 is in etching institute Exposure mask is served as during stating sacrificial layer 220, to define shape, size and the position of the graph layer 222.
In the present embodiment, the material of the graph layer 222 is organic matter, such as photoresist, bottom anti-reflection layer or is had Machine dielectric layer etc.；So the step of forming the graphic material layer includes: by spin coating or flat painting (slit coating) Mode forms the graphic material layer；Being patterned the step of forming graph layer 222 to the graphic material layer includes: The graphic material layer is patterned by way of exposure development, to form the graph layer 222.
As shown in Figure 12 and Figure 13, the step of etching sacrificial layer 220 is used to remove the part sacrificial layer 220, from And expose the part of the surface of the base 210, technique base is provided for the etching of subsequent base layer 210；Remaining sacrificial layer 220 is made For the figure sacrificial layer 221, the surface of base 210 described in covering part, in the etching process of subsequent base layer 210, protection The part base 210 prevents the base 210 impaired, to form the substrate 211 and the texture 212.
In the present embodiment, institute is reduced to reduce the risk of the etching technics by sacrificial layer 220 described in wet etching State the impaired possibility of base 210.Specifically, the sacrificial layer 220 is ITO layer；The etching solution of the wet etching includes grass Acid.In other embodiments of the invention, the etching of the sacrificial layer 220 can also pass through dry etching or dry etching and wet process The mode that etching combines carries out；Etching solution used by sacrificial layer described in wet etching can also be include: HCl and HNO3's Solution.
With reference to Figure 15 to Figure 16, the corresponding section knot of each step of cover board forming method 3rd embodiment of the present invention is shown Structure schematic diagram.
The present embodiment and previous embodiment something in common, details are not described herein by the present invention.The present embodiment and previous embodiment The difference is that the graph layer 324 (as shown in figure 16) is hard mask layer (Hard Mask), in the present embodiment to reduce Figure deviation makes formed figure sacrificial layer closer to former design, improves the graphical precision of the sacrificial layer 320, improves institute The formation quality for stating texture reduces line width, the line-spacing of the texture, increases relief height.
Specifically, including: described in the step of forming graphic material layer 322 on the sacrificial layer 320 as shown in figure 15 Graphic material layer 322 is deposited on sacrificial layer 320；As shown in figure 16, the step of etching sacrificial layer 320 includes: to pass through exposure The mode of development and etching is patterned the graphic material layer 322, to form the graph layer 324.
The material of the graphic material layer 322 can be silicon nitride, silicon oxynitride or carbonitride of silicium, can pass through chemical gas Mutually the modes such as deposition, physical vapour deposition (PVD) or atomic layer deposition are formed.
The step of graphical graphic material layer 322 includes: the spin coating photoresist layer on the graphic material layer 322 323；As shown in figure 15, development is exposed to the photoresist layer 323, to form patterned photoresist layer 323；Such as Figure 16 It is shown, pass through one in dry etching and wet etching so that the patterned photoresist layer 323 is (as shown in figure 15) for exposure mask Kind or two ways perform etching the graphic material layer 322 exposed, until exposing the sacrificial layer 320, thus shape At the figure sacrificial layer.
It should be noted that the photoresist layer 323 forms the process of the figure sacrificial layer in etching in the present embodiment In it is depleted therefore subsequent without removing photoresist.In other embodiments of the invention, etching is formed after the figure sacrificial layer, institute It states when also remaining photoresist on figure sacrificial layer, can also remove photoresist after forming the figure sacrificial layer.
Correspondingly, the present invention also provides a kind of cover boards.
The schematic diagram of the section structure of cover board first embodiment of the present invention is shown in conjunction with reference Figure 11 with reference to Figure 10；Wherein Figure 11 is the enlarged structure schematic diagram of structure in interior box 102 in embodiment illustrated in fig. 10.
The cover board includes: substrate 111；Texture 112 is raised in 111 surface of substrate.
The substrate 111 carries the texture 112, to provide mechanical support；In the present embodiment, the cover board is for portable The touch display screen of formula electronic equipment, so the substrate 110 also acts as the effect for protecting the touch screen；The texture 112 For making the cover board that texture be presented, improve the aesthetics of the cover board.It is of different shapes described in other embodiments of the invention Texture can also play the optical effects such as collimation, refraction, reflection or polarization separation to the light of transmission, and the cover board is presented Certain special optical effect.
It should be noted that the texture 112 is the wire drawing texture of strip in the present embodiment.But the texture is in The way of strip is only an example, and in other embodiments of the invention, the shape of the figure sacrificial layer can also be other rule Then perhaps irregular shape such as pattern or logo etc..
In the present embodiment, the texture 112 is structure as a whole with the substrate 111, i.e., the described substrate 111 and the texture Without apparent boundary between 112, therefore the bonding strength between the texture 112 and the substrate 111 is larger, can be effective Improve the reliability of the cover board.
Specifically, the substrate 111 is identical with 112 material of texture.In the present embodiment, the texture 111 and described Substrate 112 is formed by the base of etching glass material, that is to say, that 112 material of the substrate 111 and the texture It is glass.
Compared with the glass cover-plate for including UV glue material matter graph layer, the use of UV glue material matter graph layer, Neng Gouyou are eliminated Effect avoids limited figure caused by UV glue material matter graph layer and its formation process, technology stability, film layer reliability, colour developing effect The problems such as fruit, is conducive to the performance for improving formed cover board, is conducive to the performance and aesthetics that improve constituted electronic equipment；This Outside, UV glue material matter graph layer saves, and can effectively avoid security risk relevant to the UV glue material matter graph layer, favorably In the reliability and manufacturing yield that improve formed cover board, additionally it is possible to which the film layer quantity for effectively reducing formed cover board is conducive to Simplify covering plate structure, is conducive to improve cover board light transmittance.
As shown in figure 11, in the present embodiment, the substrate 111 includes the third face 115 being disposed opposite to each other and fourth face 116, The texture 112 is raised at least one face of the third face 115 and the fourth face 116.Specifically, in the present embodiment, The texture 111 is raised in the fourth face 116.
As shown in Figure 10, in the present embodiment, the cover board is 3D cover board, i.e., 112 structures of the described substrate 111 and the texture At prefabricated cover board (not indicated in figure) there is 3D structure, in the present embodiment, the cover board is used for the touching of portable electronic device Display screen is touched, sets 3D structure for the prefabricated cover board, the display three-dimensional sense of the cover board can be enhanced, increase display surface Product, improves the grip sense of electronic equipment.
Moreover, because the substrate 111 and the texture 112 are structure as a whole, the substrate 111 and the texture 112 Between bonding strength it is larger, after setting 3D structure for the prefabricated cover board, 3D cover board with texture can be formed；It can The aesthetics of formed 3D cover board is effectively improved, guarantees the yield of the formed prefabricated cover board of 3D structure, is conducive to improve cover board Can, improve the performance and aesthetics of electronic equipment.
The cover board is 3D cover board, i.e., the described prefabricated cover board integrally bending.Specifically, as shown in Figure 10, the substrate 111 Third face 115 and fourth face 116 be curved surface towards same direction protrusion or recess, i.e., the described third face 115 and described Fourth face 116 is curved surface, and the substrate 111 has a consistency of thickness, the third face 115 and the fourth face 116 it Between distance it is equal or roughly equal everywhere；With the bending in the third face 115 and the fourth face 116, it is located at described the The texture 112 on 116 is also bent therewith on four sides.
In the present embodiment, it is contemplated that technology difficulty and manufacturing yield, the third face 115 are set as convex surface, and the described 4th Face 116 is the concave surface being recessed towards 115 protrusion direction of third face.It, can also be by described in other embodiments of the invention Three faces are set as concave surface, and the fourth face is provided towards to the convex surface of the third face recess direction protrusion.
It should be noted that being only an example by the way that the prefabricated cover board is set as 3D cover board.Other realities of the invention It applies in example, the prefabricated cover board is also possible to 2D cover board or 2.5D cover board.
In the present embodiment, the thickness M of the substrate 111 is (as shown in Figure 7) to be greater than 0.25mm.
The thickness M of the substrate 111 should not be too small.If it is too small that the thickness M of the substrate 111 is greater than 0.25mm, can The intensity that the cover board can be will affect causes formed cover board defencive function to degenerate.
In the present embodiment, the texture 112 has horn structure (structure as shown in Figure 11 centre circle 16).The texture 112 include at least the first joint face 161 and the second joint face 162 (as shown in figure 11), first joint face 161 and described the The intersection of two joint faces 162, i.e., described first joint face 161 and the second joint face 162 intersect at straight line or curve, so the line The shape that reason 112 surrounds for multiple folding faces.Compared with the glass cover-plate for including UV glue material matter graph layer, the texture 112 can The limitation for breaking through radian control and relief height, is conducive to expand the range that the texture 112 shows optical effect, is conducive to mention The effect of texture is presented in the high cover board.
It should be noted that as shown in fig. 7, the texture 112 is raised in the 111 apparent height H of substrate and the lining The ratio of 111 thickness M of bottom is less than 1:2.
The texture 112 is raised in the 111 apparent height H of substrate and the ratio of the 111 thickness M of substrate should not be too Greatly.If the ratio that the texture 112 is raised in the 111 apparent height H of the substrate and 111 thickness M of substrate is too big, can It causes the 111 thickness M of substrate too small, will affect the intensity of the substrate 111, be unfavorable for 111 defencive function of substrate It realizes, is unfavorable for the function of the cover board.
Specifically, the texture 112 is raised in the height H on 111 surface of substrate at 2 μm to 0.4mm in the present embodiment In range.
The texture 112 be raised in 111 surface of substrate height H should not it is too small also should not be too big.The texture 112 If the height H for being raised in 111 surface of substrate is too small, it is unknown that the texture 112 is raised in 111 surface of substrate It is aobvious, it is unfavorable for the improvement of the cover board aesthetics, is unfavorable for the realization of the certain optical functions of the texture 111, is unfavorable for realizing The effect of blast；If the height H that the texture 112 is raised in 111 surface of substrate is too big, in order to guarantee the cover board Defencive function, be likely to result in that the cover sheet thickness is excessive, be unfavorable for the control of the electronic equipment thickness, be unfavorable for integrating The raising of degree.
In the present embodiment, the line width L1 of the texture 112 is less than 20 μm.
The line width L1 of the texture 112 should not be too big.If the line width L1 of the texture 112 is too big, institute's shape will affect At the fineness of the presented texture of cover board, it is unfavorable for improving the aesthetics of the cover board.
The line-spacing L2 of the texture 112 is less than 7 μm.If the line-spacing L2 of the texture 112 is too big, also it is unfavorable for improving institute The texture fine degree for stating cover board is unfavorable for improving the performance of obtained cover board.
Since the line width L1 of the texture 112 is less than 20 μm, line-spacing L2 is less than 7 μm, i.e., the minimum dimension of the described texture 112 Can be less than 20 μm, the distance between adjacent described texture 112 can be less than 7 μm；Therefore it is formed with by UV imprint process Graph layer compare, the texture 112 can effectively limitation of the breakthrough process to formed texture line width, line-spacing, be conducive to mention The fineness of high formed texture, is conducive to the effect for improving formed cover board texture.
It should be noted that in the present embodiment, it is contemplated that technology difficulty and process costs, the line width L1 of the texture 112 Greater than 5 μm and less than 20 μm, the line-spacing L2 of the texture 112 is greater than 5 μm and less than 7 μm.If the line width L1 of the texture 112 The line-spacing L2 of the too small or described texture 112 is too small, then the 112 formation process difficulty of texture can be made to increase, and process costs increase Add, it is possible that the problems such as yield declines；If the line width L1 of the texture 112 is too big or the line-spacing of the texture 112 L2 is too big, then the effect for improving the fineness of formed texture is limited, may will affect the effect of formed cover board texture.
In conjunction with reference Figure 10 and Figure 11, in the present embodiment, the cover board further include: be located at the substrate 111 and the line Manage the optical functional layer 131 on 112 surfaces；Color layers 132 on the optical functional layer 131；Positioned at the color layers 132 On base 133.
It should be noted that the substrate 111 has the third face 115 being oppositely arranged and fourth face 116, the optics function Ergosphere 131 is located on the third face 115 and at least one face of the fourth face 116.In the present embodiment, the optical functional layer 131 are located on the fourth face 116 with the texture 112.
The optical functional layer 131 transmits the cover board light for modulating.The optical functional layer 131 generally comprises number Numerous dielectric layers is measured, by characteristics such as reflection, refraction, transmission and polarization of the light at different medium bed boundary, to saturating Light is penetrated to be modulated.By to the 131 inner medium layer material of optical functional layer, medium layer number and thickness of dielectric layers etc. The setting of parameter can make the cover board in a certain specific band or multiple wavelength bands light realize it is wholly transmissive or Person is fully reflective, or carries out the spe-cial optical effects such as polarization separation to transmitted ray.
Since the optical functional layer 131 is formed directly on the substrate 111 and the texture 112, the light The formation for learning functional layer 131 is not necessarily to pad pasting, without being bent film layer, is broken so as to effectively reduce the optical functional layer 131 The appearance of phenomenon, without the manufacturing process of film coating process, can effectively improve institute's shape especially when the cover board is 3D cover board At the reliability of cover board, yield loss is effectively reduced, is conducive to the performance and yield that improve formed cover board.
And since the texture 112 is identical with the material of the substrate 111, certain rigidity is all had, therefore described The intensity connected between optical functional layer 131 and the texture 112 and the substrate 111 is higher, and the optical functional layer 131 is de- The less appearance of phenomenon is fallen, the reliability for improving formed cover board is conducive to.
The color layers 132 are for making the cover board that certain color be presented, to adapt to the design of electronic equipment.This reality It applies in example, the color layers 132 include color medium layer 132a and ink layer 132b, and the color medium layer 132a passes through to saturating It penetrates the mode that light is modulated and realizes that color is shown, the ink layer 132 realizes color by way of adding colored dyes Display.
Since the color layers 132 are directly formed on the substrate 111 and the texture 112, the color The forming process of layer 132 is not necessarily to pad pasting, without being bent film layer, so formation process to the limitation of 132 thickness of color layers compared with Small, the especially described color medium layer 132a can be under the premise of guaranteeing yield, reducing security risk, by increasing film layer The mode of thickness makes the color layers 132 that deeper, brighter color be presented, and improves color developing effect, colour developing type is expanded, to reach To color developing effect is improved, the effect that texture is presented in formed cover board is improved.
The base 133 prevents cover board covering part internal structure from exposing for shutting out the light.
It should be noted that the optical functional layer 131, the color layers 132 and the particular technique of the base 133 Scheme, same as the prior art, details are not described herein by the present invention.
With reference to Figure 14, the schematic diagram of the section structure of cover board second embodiment of the present invention is shown.
The present embodiment is identical with the first embodiment place, and details are not described herein by the present invention.The present embodiment and previous embodiment The difference is that as shown in figure 14, equal protrusion has the texture on the third face 215 of the substrate 111 and fourth face 216 212。
Specifically, the substrate 211 has the third face 215 being disposed opposite to each other and fourth face 216；212 protrusion of texture In the third face 215 and the fourth face 216 at least one face.In the present embodiment, the texture 212 is raised in described Third face 215 and the fourth face 216.
In addition, the present invention also provides a kind of cover board motherboards.
With reference to Fig. 8, the overlooking structure diagram of one embodiment of cover board motherboard of the present invention is shown.
The cover board motherboard includes: multiple cover boards, and the cover board is cover board of the invention.
In the present embodiment, the cover board includes multiple prefabricated cover boards being made of substrate 111 and texture 112.The lid Plate is cover board of the invention, so the specific technical solution of the cover board, with reference to carrier board embodiment, the present invention is herein no longer It repeats.
As shown in figure 8, the substrate of the multiple prefabricated cover board is connected, there is interval between contiguous prefabricated cover board, it is adjacent pre- Interval between cover board processed is used to form dicing lane.The dicing lane is for being isolated different prefabricated cover boards, to cut to be subsequent The substrate 111 is cut to form single prefabricated cover board and then cover board offer state space is provided.
In the present embodiment, the cover board motherboard includes multiple prefabricated cover boards being arranged in array.Specifically, the preform lid The quantity of plate is 16, is in 4 × 4 array arrangements.But the present invention does not limit the quantity of prefabricated cover board included by cover board motherboard It is fixed.In other embodiments of the invention, the quantity of the prefabricated cover board may be other values in the cover board motherboard.
The prefabricated cover board constituted due to having formed the substrate 111 and the texture 112 before cutting, can have Effect reduces the processing step after cutting, improves the degree of automation of manufacturing process, is conducive to the realization of large automatic production, has Conducive to the raising of production efficiency.
In addition, the present invention also provides a kind of electronic equipment, comprising: cover board, the cover board are cover board of the invention.
The cover board is cover board of the invention, so the specific technical solution of the cover board, with reference to carrier board embodiment, Details are not described herein by the present invention.
Since the texture of the cover board is formed by etching, the texture is structure as a whole with the substrate. The reliability of the cover board is higher, and presentation grain effect is preferable, is conducive to the aesthetics for improving the electronic equipment, is conducive to increase Add the added value of the electronic equipment.
And the texture of etching formation can break through the limitation of structure and size, can expand the texture and show light The range for learning effect, expands the cover board to the ability to function of transmitted ray, is conducive to the display effect for enhancing the electronic equipment Fruit improves display capabilities.
To sum up, it is formed since the texture and the substrate etch the base, and includes UV glue material matter The glass cover-plate of graph layer is compared, and the use of UV glue material matter graph layer is eliminated, can effectively avoid UV glue material matter graph layer and The problems caused by its formation process, is conducive to the performance, reliability and the manufacturing yield that improve formed cover board, is conducive to simplify Covering plate structure improves cover board light transmittance, is conducive to the performance and aesthetics that improve constituted electronic equipment.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute Subject to the range of restriction.

Claims (34)

1. a kind of forming method of cover board characterized by comprising
Motherboard substrate is provided, the motherboard substrate includes base and the sacrificial layer in the base；
The sacrificial layer is patterned, figure sacrificial layer is formed；
Using the figure sacrificial layer as exposure mask, the base is etched, form substrate and is raised in the texture of the substrate.
2. forming method as described in claim 1, which is characterized in that the base includes the first face and second being disposed opposite to each other Face；
The sacrificial layer is located at least one face in first face and second face.
3. forming method as described in claim 1, which is characterized in that the motherboard substrate be ito glass, including glassy layer and ITO layer on the glassy layer；
The glassy layer is the base, and the ITO layer is the sacrificial layer.
4. forming method as claimed in claim 1 or 3, which is characterized in that the thickness of the sacrificial layer is in 300nm to 2 μm of model In enclosing.
5. forming method as claimed in claim 1 or 3, which is characterized in that the sacrificial layer by way of laser ablation It is patterned.
6. forming method as described in claim 1, which is characterized in that the step of being patterned to the sacrificial layer include:
Graphic material layer is formed on the sacrificial layer；
The graphic material layer is patterned, graph layer is formed；
Using the graph layer as sacrificial layer described in mask etching, the figure sacrificial layer is formed.
7. forming method as claimed in claim 6, which is characterized in that the material of the graph layer is organic material；
The graphic material layer is formed by way of spin coating or flat painting；
The graphic material layer is patterned by way of exposure development, to form the graph layer.
8. forming method as claimed in claim 6, which is characterized in that the graph layer is hard mask layer；
Graphic material layer is deposited on the sacrificial layer；
The graphic material layer is patterned by way of exposure development and etching, to form the graph layer.
9. forming method as claimed in claim 6, which is characterized in that pass through sacrificial layer described in wet etching.
10. forming method as claimed in claim 9, which is characterized in that the sacrificial layer is ITO layer；
The etching solution of sacrificial layer described in wet etching includes oxalic acid.
11. forming method as described in claim 1, which is characterized in that pass through base described in wet etching.
12. forming method as claimed in claim 11, which is characterized in that the base material is glass, described in wet etching The etching solution of base includes HF.
13. forming method as described in claim 1, which is characterized in that etch amount and the base for etching the base are thick The ratio of degree is less than 1:2.
14. the forming method as described in claim 1 or 13, which is characterized in that the etch amount for etching the base is arrived at 2 μm Within the scope of 0.4mm.
15. forming method as described in claim 1, which is characterized in that the forming method further include: etch the base it Afterwards, the sacrificial layer is removed.
16. forming method as claimed in claim 15, which is characterized in that the material of the figure sacrificial layer is tin indium oxide, The figure sacrificial layer is removed by way of wet-cleaning, the mill solution of the wet-cleaning is alkaline solution.
17. forming method as described in claim 1, which is characterized in that the forming method further include:
It is formed after the substrate and the texture, cuts the substrate, to obtain the cover board.
18. forming method as claimed in claim 17, which is characterized in that the forming method further include:
After cutting the substrate, hot bending processing is carried out.
19. forming method as claimed in claim 18, which is characterized in that the forming method further include:
After hot bending processing, optical functional layer is formed on the surface of the substrate and the texture；
Color layers are formed on the optical functional layer；
Base is formed in the color layers.
20. a kind of cover board characterized by comprising
Substrate；
Texture is raised in the substrate surface.
21. cover board as claimed in claim 20, which is characterized in that the texture is structure as a whole with the substrate.
22. cover board as claimed in claim 20, which is characterized in that the substrate is identical with the material of the texture.
23. the cover board as described in claim 20 or 22, which is characterized in that the material of the substrate and the texture is glass.
24. cover board as claimed in claim 20, which is characterized in that the substrate includes the third face and the 4th being disposed opposite to each other Face；
The texture is raised at least one face of the third face and the fourth face.
25. cover board as claimed in claim 24, which is characterized in that the third face and the fourth face are towards the same direction The curved surface of protrusion or recess.
26. cover board as claimed in claim 25, which is characterized in that the third face is concave surface, and the fourth face is towards institute State the convex surface of third face recess direction protrusion；Alternatively, the third face is convex surface, the fourth face is convex towards the third face Play the concave surface of direction recess.
27. cover board as claimed in claim 20, which is characterized in that the texture includes at least the first joint face and the second connection Face, first joint face and second joint face intersection.
28. cover board as claimed in claim 20, which is characterized in that the line width of the texture is greater than 5 μm and less than 20 μm.
29. cover board as claimed in claim 20, which is characterized in that the line-spacing of the texture is greater than 5 μm and less than 7 μm.
30. cover board as claimed in claim 20, which is characterized in that the texture be raised in the substrate surface height with it is described The ratio of substrate thickness is less than 1:1.
31. the cover board as described in claim 20 or 30, which is characterized in that the texture is raised in the height of the substrate surface Within the scope of 2 μm to 0.4mm.
32. cover board as claimed in claim 20, which is characterized in that the cover board further include:
Positioned at the optical functional layer of the substrate and the grain surface；
Color layers on the optical functional layer；
Base in the color layers.
33. a kind of cover board motherboard characterized by comprising multiple cover boards, the cover board such as claim 20 to claim 32 Described in any one claim.
34. a kind of electronic equipment characterized by comprising cover board, the cover board such as claim 20 are any to claim 32 Described in one claim.
CN201710556368.XA 2017-07-10 2017-07-10 Cover board and forming method thereof, cover board motherboard, electronic equipment Pending CN109239815A (en)

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Application publication date: 20190118