TWI510820B - Electronic device with micro-gratings,light splitter device and method for manufacturing the same - Google Patents

Description

Electronic device with micro-grating, spectroscopic device and manufacturing method thereof

The present invention relates to a manufacturing method, and more particularly to a method of manufacturing a micro-grating.

The peace pigeon laser tag on the credit card utilizes the special characteristics of its optical imaging. For example, the laser tag can produce a certain degree of anti-counterfeiting function when the image changes at different viewing angles, thus becoming a more common anti-counterfeiting technology.

However, the design of such a laser tag has its drawbacks, resulting in a reduction in its anti-counterfeiting function. The disadvantages are as follows:

1. The small area of the laser tag will increase the difficulty of the user's discernment, and the user is less willing to study the authenticity of the user.

2. Anti-counterfeit laser labels are easily copied and mass-produced, thus reducing their anti-counterfeiting functions.

3. The laser label has low wear resistance. When the credit card is used for a long time, it is easy to damage the laser label due to the friction between the card and the leather bag, resulting in insufficient durability.

Therefore, it is necessary to develop a technology and apparatus that can solve the aforementioned problems and can produce changes in images from different viewing angles.

Accordingly, it is an object of the present invention to provide a method of fabricating a micrograting.

Thus, the manufacturing method of the present invention comprises the following steps: (a) coating a polymer layer on a transparent substrate; (b) compressing the polymer layer through a precision mold having a microstructure, and forming a plurality of concaves corresponding to the microstructure in the polymer layer a groove; (c) removing the precision mold; (d) shielding the polymer layer through an etch mask having a hollow specific pattern, and the hollow specific pattern of the etch mask reveals a portion of the grooves; </ RTI> etching a plurality of micro-gratings in the exposed grooves, the micro-gratings presenting the hollow specific pattern; and (f) removing the etch mask and the polymer layer.

Preferably, the polymer layer in the step (a) is a photoresist layer.

Preferably, in step (e), the micro-gratings are etched through the plasma.

Preferably, the transparent substrate of the step (a) is a sapphire substrate.

Preferably, the transparent substrate of the step (a) is a glass substrate.

Preferably, the manufacturing method further comprises a step (g) of bonding a transparent plate to the transparent substrate to form a first surface of the micro-gratings, and the transparent plate body does not contact the micro-grating.

Preferably, the manufacturing method further comprises a step (g) after the step (f): (g) respectively plating a reflective layer on the surface of the micro-gratings.

Preferably, the polymer layer of the step (a) is a negative photoresist layer, and the manufacturing method further comprises the following steps before the step (d): (d-1) coating the polymer layer a positive photoresist layer; (d-2) an optical mask having the hollow specific pattern disposed on the positive photoresist layer; and (d-3) an exposure and development through the optical mask Corresponding to the 镂 A pattern of empty specific patterns is on the positive photoresist layer.

Another object of the invention is to provide a spectroscopic device with micro-gratings and to be suitable for use in an external source.

The spectroscopic device with micro-grating of the present invention comprises a transparent plate body and a transparent substrate produced by the above manufacturing method. The transparent plate body includes a first plate surface and a second plate surface opposite to the first plate surface. The transparent substrate includes a front surface, a back surface opposite to the front surface, and a micro-grating etched on the back surface. The transparent substrate is disposed on the second surface of the transparent board through the back surface; when the external light source is sequentially transmitted through When the first plate surface and the second plate surface of the transparent plate body are refracted into the micro grating, the external light source is split by the diffraction generated by the micro grating reflection.

Preferably, the second plate surface of the transparent plate body forms an opening, and the micro-grating of the transparent substrate faces the opening without contacting the transparent plate body.

Preferably, the spectroscopic device further comprises a reflective layer plated on the micrograting.

Preferably, the transparent substrate further forms another micro-grating, and the total length of the width of each micro-grating itself and the spacing between the micro-gratings is preferably in the range of 0.1 to 5 μm.

It is still another object of the present invention to provide an electronic device having a micro-grating.

The electronic device with micro-grating of the present invention comprises a casing, a backlight unit disposed in the casing, and a transparent substrate fabricated by the above manufacturing method. The housing includes an opening that communicates with the exterior. The transparent substrate includes a front surface, a back surface opposite to the front surface, and an etched surface formed on the back surface a micro-grating, the transparent substrate covers the opening of the casing, and the back surface faces the backlight unit and exposes the front surface toward the outside of the opening; when the external light source is refracted into the micro-grating through the front surface of the transparent substrate, The external light source is split by diffraction generated by the reflection of the micro-grating.

Preferably, the electronic device further comprises a reflective layer plated on the micro-grating.

Preferably, the transparent substrate further forms another micro-grating, and the total length of the width of each micro-grating itself and the spacing between the micro-gratings is preferably in the range of 0.1 to 5 μm.

The effect of the present invention is that after the precision mold is printed on the polymer laminate, the etching mask and the etching mask can be etched on the transparent substrate to cooperate with each other to exhibit the hollow specific pattern. The grating effectively simplifies the steps of the process and reduces the manufacturing cost, and achieves the effect of splitting by the diffraction after the reflection of the micro-gratings.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 and FIG. 2, a spectroscopic device 100 having a micrograting 13 according to a first preferred embodiment of the present invention comprises a transparent substrate 1 and a transparent plate 2. The transparent substrate 1 includes a front surface 11, a back surface 12 opposite to the front surface 11, and a plurality of micro-gratings 13 etched into the back surface 12. The transparent plate body 2 includes a first A plate surface 21 and a second plate surface 22 opposite to the first plate surface 21. The transparent substrate 1 is disposed on the second plate surface 22 of the transparent plate body 2 through the back surface 12, and the micro grating 13 of the transparent substrate 1 does not contact the second plate surface 22 of the transparent plate body 2. When an external light source (not shown) is sequentially refracted into the micro-grating 13 through the first plate surface 21 and the second plate surface 22 of the transparent plate body 2, or is refracted into the micro-grating 13 from the front surface 11 of the transparent substrate 1, the external light source is The micro-grating 13 is reflected by the diffraction and split. In this embodiment, the transparent substrate 1 is a sapphire substrate, but may be a glass substrate. The above description is not limited to the present invention, and the transparent substrate 1 is adhered to the transparent plate 2 through the back surface 12 The plate surface 22 achieves the effect of combining and fixing the transparent substrate 1 and the transparent plate body 2. Of course, the manner in which the transparent substrate 1 and the transparent plate body 2 are combined and fixed is not limited to the foregoing.

The method of manufacturing the spectroscopic device 100 having the micrograting 13 described above will be described in detail below.

Referring to FIG. 2 and FIG. 3, first, step S10 is performed to apply a polymer layer 3 to the transparent substrate 1. In this embodiment, the transparent substrate 1 (sapphire substrate) can be polished by a polishing machine and a polishing liquid, and then deionized water or the like can be used for cleaning. The polymer layer 3 is preferably a negative photoresist layer having an ultraviolet curable resin, and the ultraviolet curable resin is usually an acrylic or vinyl organic compound. The polymer layer 3 can be applied by a spin coating method, a blade coating method, a spray coating method or a roll coating method.

Next, step S20 - heating of the polymer layer 3 is performed and the process proceeds to step S30. Of course, this step depends on the solvent material of the polymer layer 3 to determine whether heat treatment is required.

Referring to FIG. 2, FIG. 4 and FIG. 5, step S30 is further performed by pressing a precision mold core 4 having a microstructure 41 onto the polymer layer 3, so that the polymer layer 3 forms a plurality of concave portions corresponding to the microstructure 41. Slot 31 (shown in Figure 6). In this step, the microstructures 41 of the precision mold cores 4 may be in the shape of a cylinder or a triangular pyramid, respectively, and the grooves 31 which are embossed through the microstructure 41 of the precision mold core 4 are also cylindrical or triangular. Cone shape, of course, the shape of the microstructure 41 is not limited thereto. It is to be noted that before or during the pressing of the precision mold core 4, the polymer layer 3 is heated to a temperature higher than a glass transition temperature (T _g ) to be softened and uniformly applied to the transparent substrate 1 and maintained. The shape of the polymer layer 3.

Referring to FIG. 2 and FIG. 5, step S40 - curing of the polymer layer 3 is performed. In the present invention, the polymer layer 3 is cured by exposure to ultraviolet light (not shown) or extreme ultraviolet light. Of course, depending on the material of the polymer layer 3, a light source suitable for the corresponding wavelength can be selected to achieve the curing effect of the polymer layer 3.

Referring to Figures 2 and 6, proceeding to step S50 - the precision mold core 4 is removed. In the present invention, in order to enter the next etching step, it is necessary to remove the precision mold core 4 first, and proceed to the next step S60.

Referring to FIG. 2, FIG. 7, and FIG. 8, step S60-masks the polymer layer 3 through an etch mask 5 having a hollow hollow specific pattern 51, and the exposed portion of the hollow mask specific pattern 51 of the etch mask 5 is exposed. Groove 31. In this embodiment, the etch mask 5 is preferably designed as a hollow hollow specific pattern 51. The hollow specific pattern may be a geometric shape or a brand pattern or the like (as shown in FIG. 7 , the hollow specific pattern of the etch mask is square) a non-hollowed partially etched mask 5 shields the recess 31 that does not need to be etched (as shown in FIG. 8), hollowed out The partially etched mask 5 exposes the recess 31 to be etched. The advantage of such a design is that the hollow specific pattern 51 is designed to be formed by the etching mask 5 regardless of whether the pattern is complicated or simple, and the area is large or small, so that the design pattern through the etching mask 5 is not only elastic, but also The cost of manufacturing the invention is more effectively reduced.

Referring to FIGS. 2, 8, and 9, then, step S70 is performed to etch a plurality of micro-gratings 13 on the transparent substrate 1 corresponding to the recess 31 of the hollow specific pattern 51, and the micro-gratings 13 cooperate to present a hollow specific pattern. In this embodiment, the etching method is preferably performed by introducing a plasma source gas such as oxygen, argon, chlorine, and/or boron trichloride gas (BCl ₃ ), and positioning the transparent substrate 1 on a cathode. The plasma source gas is ionized by an RF power source applied between the anode and the cathode, and a plasma containing electrons and positive ions is formed, so that the positive ions are directed toward the bombardment and etch the polymer layer due to the action of the electric field. The grooves 31 to be etched form the micro-gratings 13. This has the advantage of achieving the purpose of etching in a relatively low temperature environment by means of plasma etching. It is further explained that since the groove 31 defines a hollow specific pattern, the micro-grating 13 etched through the groove 31 also cooperates to present a hollow specific pattern (as shown in FIG. 10, the micro-grating 13 itself is cylindrical). And the mutual matching hollow specific pattern 51 is defined as a square shape. Of course, the technique of dry etching is extremely diverse and belongs to the conventional art. Therefore, the present invention does not use plasma etching as a limitation of the etching step of the present invention. Referring to FIG. 9, it should be noted that the micro-grating 13 itself has a width d ₁ , and when the micro-gratings 13 are spaced apart from each other by a distance d ₂ , they become a pitch d. In the present invention, the pitch d preferably has a length ranging from 0.1 to 5 micrometers (um) to completely cover the wavelength range of visible light. The length of the micro-grating 13 pitch d ranges from 0.1 to 5 microns, which is particularly suitable for making lower cost imprint techniques.

Step S80 - removing the etching mask 5 and the polymer layer 3. In the present invention, the residual polymer layer 3 is removed through a wet stripping process or an oxygen plasma stripping process.

Referring to FIG. 1, FIG. 2 and FIG. 9, finally, the process proceeds to step S90 - a transparent plate 2 is bonded to the transparent substrate 1 to form the back surface 12 of the micro-grating 13, and the transparent plate 2 does not contact the micro-grating 13. The purpose of this step is to avoid the damage of the micro-grating 13 and to adhere to the transparent substrate 1 through the transparent plate 2, thereby avoiding the damage caused by the micro-grating 13 being exposed to the outside and directly rubbing against the foreign object.

Further, in order to enhance the effect of splitting the external light source by the diffraction generated by the reflection of the micro-grating 13, the spectroscopic device 100 of the present invention may also be disposed on the back micro-grating 13 of the transparent substrate 1 between step S80 and step S90. The surface is plated with a reflective layer. Thereby, the intensity of the reflected light of the external light source is increased, and the effect of the splitting is enhanced. In addition, the second plate surface 22 of the transparent plate body 2 can also form an opening (not shown), so that the micro-grating 13 of the transparent substrate 1 faces the opening without contacting the transparent plate body 2, avoiding micro Wear of the grating 13.

Referring to FIG. 9, FIG. 11, and FIG. 12, a second preferred embodiment of the present invention is an electronic device 200 having a micro-grating 13 fabricated by using the technology of the first embodiment. The electronic device 200 includes a casing 6, a The backlight unit 7 and the transparent substrate 1 are disposed inside the casing 6. The casing 6 includes an accommodating space 61 and an opening 62 that communicates with the outer and accommodating spaces 61. The transparent substrate 1 includes the micro-grating 13 which is formed in the foregoing first embodiment, and the transparent substrate 1 covers the casing 6 The opening 62, and the back surface 12 faces the backlight unit 7, and exposes the front surface 11 toward the outside of the opening 62. In this embodiment, the electronic device 200 with the micro-grating 13 can be a smart phone, a tablet computer or a notebook computer with a touch screen. The electronic device 200 has an advantage in that a micro-grating 13 exhibiting a brand pattern is formed on the transparent substrate 1 to not only highlight the value of the brand, but also to achieve the effect of splitting the incident light by the diffraction caused by the reflection of the micro-grating 13 . Further enhance the visual perception of brand patterns. In addition, by designing the micro-grating 13 on the back surface 12 of the transparent substrate 1, damage caused by the frictional contact between the micro-grating 13 and the outside can be effectively prevented, and the aging effect of use can be improved.

Referring to FIG. 1, FIG. 12 and FIG. 13, a difference between the third preferred embodiment of the present invention and the second preferred embodiment is that the spectroscopic device 100 having the micrograting 13 or the manufacturing method of the electronic device 200 is in steps S50 and S70. The following steps are also included:

Referring to FIG. 13 and FIG. 14, step S61- applies a positive photoresist layer 8 to the polymer layer 3 and proceeds to step S62. In this step, the positive photoresist layer 8 is usually made of a phenol resin or an acrylate resin.

Step S62 - baking the positive photoresist layer 8 to form a specific thickness. In this step, the coated positive-type photoresist layer 8 is baked at 80 to 110 ° C for 80 to 110 seconds to form a positive-type photoresist layer 8 having a film thickness of about 1 to 4 μm. In this step, the actual parameters of the process will vary depending on the characteristics of the photoresist, and are not limited to the foregoing.

An optical mask 9 having the hollow specific pattern 51' is also disposed on the S63-positive photoresist layer 8 for exposure processing. In this step, the positive photoresist layer The process of 8 is to arrange an optical mask 9 having the hollow specific pattern 51' on the positive resist layer 8. The positive-type photoresist layer 8 removes the exposed portion of the positive-type photoresist layer 8 by exposure and development of the light 91 by the hollow specific pattern 51' of the optical mask 9, so that the positive-type photoresist layer 8 is removed. The microstructure associated with the original imprint process steps S10 to S50 is revealed in conjunction with the specific pattern 51'.

Referring to FIGS. 2, 9, and 15, then, returning to step S70, the polymer layer 3 and the transparent substrate 1 are etched by the plasma 92 to form the microgratings 13.

The third preferred embodiment differs from the first preferred embodiment in that the spectroscopic device 100 or the method of fabricating the electronic device 200 forms the positive photoresist layer 8 on the polymer layer 3. The positive-type photoresist layer 8 is exposed and developed through the specific pattern 51' of the optical mask 9 to remove a portion of the positive-type photoresist layer 8 corresponding to the specific pattern 51'. This has the advantage that the negative photoresist type polymer layer 3 is not removed during the exposure and development of the positive photoresist layer 8. That is, the developing pattern on the positive resist layer 8 does not remove the negative resist type polymer layer 3. Furthermore, when the polymer layer 3 and the transparent substrate 1 are dry-etched, since the positive-type photoresist layer 8 is formed on the polymer layer 3, the dry-type etching of the transparent substrate 1 can be controlled more precisely through the positive-type photoresist layer 8. A region to form a micrograting 13 that is hollowed out in a specific pattern. Thereby, the gap between the etching mask 5 and the polymer layer 3 is prevented from affecting the etching formation of the micro grating 13. In summary, the design of the spectroscopic device 100 or the electronic device 200 with the micro-grating 13 of the present invention through the etching mask 5 or the optical mask 9 can synchronously align the micro-gratings 13 in the step of etching the micro-gratings 13 Defined to present a hollow specific pattern 51, thereby simplifying the production steps and reducing production costs The optical grating 13 can also exhibit an optical splitting effect through the micro-grating 13, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

100‧‧‧Splitting device

41‧‧‧Microstructure

200‧‧‧Electronic devices

5‧‧‧ etching mask

1‧‧‧Transparent substrate

51, 51'‧‧‧ hollow specific patterns

11‧‧‧ positive

6‧‧‧Chassis

12‧‧‧ Back

61‧‧‧ accommodating space

13‧‧‧micro-grating

62‧‧‧ openings

2‧‧‧Transparent plate

7‧‧‧Backlight unit

21‧‧‧ first board

8‧‧‧positive photoresist layer

22‧‧‧ second board

9‧‧‧Optical mask

3‧‧‧ polymer layer

91‧‧‧Light

31‧‧‧ Groove

92‧‧‧ Plasma

4‧‧‧Precision mold

1 is a side elevational view showing a first preferred embodiment of the present invention; FIG. 2 is a flow block diagram showing a method of manufacturing a spectroscopic device having a micrograting according to the present embodiment; and FIGS. 3 to 6 are respectively a side FIG. 7 is a top plan view showing the design of the etching mask of the embodiment; FIG. 8 to FIG. 9 are respectively side views showing the manufacturing method of the embodiment; FIG. Is a top view showing the design of the micro-grating of the embodiment; FIG. 11 to FIG. 12 are a perspective view showing a second preferred embodiment of the present invention; FIG. 13 is a block diagram showing the third embodiment of the present invention. Preferred Embodiments; and FIGS. 14 to 15 are respectively side views showing the present embodiment. Process steps.

200‧‧‧Electronic devices

13‧‧‧micro-grating

1‧‧‧Transparent substrate

6‧‧‧Chassis

11‧‧‧ positive

7‧‧‧Backlight unit

Claims (12)

A method for manufacturing a micro-grating, comprising the steps of: (a) coating a polymer layer on a transparent substrate, the polymer layer being a negative photoresist layer; and (b) transmitting a precision mold core having a microstructure Pressing the polymer layer, and forming a plurality of grooves corresponding to the microstructure in the polymer layer; (c) removing the precision mold; (d-1) coating a positive layer on the polymer layer a type of photoresist layer; (d-2) disposing an optical mask having the hollow specific pattern on the positive resist layer; (d-3) exposing and developing through the optical mask to transfer corresponding to the hollow a pattern of the specific pattern on the positive photoresist layer; (d) shielding the polymer layer through an etch mask having a hollow specific pattern, and the hollow specific pattern of the etch mask reveals a portion of the grooves; (e) etching a plurality of micro-gratings in the exposed grooves, the micro-gratings presenting the hollow specific pattern; and (f) removing the etch mask and the polymer layer. The manufacturing method according to claim 1, wherein the step (e) is to etch the micro-gratings through a plasma. The manufacturing method according to claim 1, wherein the transparent substrate of the step (a) is a sapphire substrate. According to the manufacturing method of claim 1, wherein the step The transparent substrate of the step (a) is a glass substrate. The manufacturing method according to claim 1, further comprising a step (g) of bonding a transparent plate to the transparent substrate to form a back surface of the micro-gratings, and the transparent plate body does not contact the micro-gratings . The manufacturing method according to claim 1, further comprising a step (g) after the step (f): (g) plating a reflective layer on the surfaces of the micro-gratings. A spectroscopic device with a micro-grating, suitable for use in an external light source, and comprising: a transparent plate body, comprising a first plate surface and a second plate surface opposite to the first plate surface, the second plate surface forming And a transparent substrate, which is manufactured by the manufacturing method described in claim 1 above, and includes a front surface, a back surface opposite to the front surface, and a micro-grating etched on the back surface, The transparent substrate is disposed on the second surface of the transparent plate through the back surface, and the micro-grating of the transparent substrate faces the opening without contacting the transparent plate; and when the external light source sequentially passes through the transparent plate When the first plate surface and the second plate surface are refracted into the micro-grating, the external light source is split by diffraction generated by the micro-grating reflection. The spectroscopic device with micro-gratings according to claim 7 of the patent application, further comprising a reflective layer plated on the micro-grating. The micro-grating spectroscopic device according to claim 7, wherein the transparent substrate further forms another micro-grating, the width of each micro-grating itself and the sum of the lengths of the intervals between the micro-gratings More Good is 0.1-5 microns. An electronic device with a micro-grating suitable for use in an external light source, comprising: a casing including an opening communicating with the outside; a backlight unit disposed within the casing; and a transparent substrate, the patent application The manufacturing method of the first aspect, comprising: a front surface, a back surface opposite to the front surface, and a micro-grating etched on the back surface, the transparent substrate covering the opening of the casing, and the The back side faces the backlight unit and exposes the front surface toward the outside of the opening; when the external light source is refracted into the micro-grating through the front surface of the transparent substrate, the external light source is split by the diffraction generated by the micro-grating reflection. The electronic device with micro-gratings according to claim 10, further comprising a reflective layer plated on the micro-grating. The electronic device with micro-gratings according to claim 10, wherein the transparent substrate further forms another micro-grating, the width of each micro-grating itself and the total length of the interval between the micro-gratings It is preferably from 0.1 to 5 μm.