CN109231160A - 用作真空吸气剂的晶片级封装焊料阻挡物 - Google Patents

用作真空吸气剂的晶片级封装焊料阻挡物 Download PDF

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Publication number
CN109231160A
CN109231160A CN201811055306.1A CN201811055306A CN109231160A CN 109231160 A CN109231160 A CN 109231160A CN 201811055306 A CN201811055306 A CN 201811055306A CN 109231160 A CN109231160 A CN 109231160A
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CN
China
Prior art keywords
substrate
sealing structure
layer
solder
titanium material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811055306.1A
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English (en)
Chinese (zh)
Inventor
罗兰德·W·古奇
布欧·Q·迪普
亚当·M·肯尼迪
斯蒂芬·H·布莱克
托马斯·A·科西安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Sarcos LLC
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Filing date
Publication date
Application filed by Raytheon Sarcos LLC filed Critical Raytheon Sarcos LLC
Publication of CN109231160A publication Critical patent/CN109231160A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0207—Bolometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
CN201811055306.1A 2013-07-11 2014-07-08 用作真空吸气剂的晶片级封装焊料阻挡物 Pending CN109231160A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/939,400 US9093444B2 (en) 2013-07-11 2013-07-11 Wafer level package solder barrier used as vacuum getter
US13/939,400 2013-07-11
CN201480039124.9A CN105358473B (zh) 2013-07-11 2014-07-08 用作真空吸气剂的晶片级封装焊料阻挡物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480039124.9A Division CN105358473B (zh) 2013-07-11 2014-07-08 用作真空吸气剂的晶片级封装焊料阻挡物

Publications (1)

Publication Number Publication Date
CN109231160A true CN109231160A (zh) 2019-01-18

Family

ID=51293136

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811055306.1A Pending CN109231160A (zh) 2013-07-11 2014-07-08 用作真空吸气剂的晶片级封装焊料阻挡物
CN201480039124.9A Active CN105358473B (zh) 2013-07-11 2014-07-08 用作真空吸气剂的晶片级封装焊料阻挡物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201480039124.9A Active CN105358473B (zh) 2013-07-11 2014-07-08 用作真空吸气剂的晶片级封装焊料阻挡物

Country Status (9)

Country Link
US (4) US9093444B2 (enExample)
EP (1) EP3019441B1 (enExample)
JP (1) JP6122220B2 (enExample)
KR (1) KR101752107B1 (enExample)
CN (2) CN109231160A (enExample)
CA (1) CA2916672C (enExample)
IL (1) IL243086A (enExample)
NO (1) NO2944700T3 (enExample)
WO (1) WO2015006327A1 (enExample)

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US9893027B2 (en) * 2016-04-07 2018-02-13 Nxp Usa, Inc. Pre-plated substrate for die attachment
US9938134B2 (en) * 2016-04-14 2018-04-10 Taiwan Semiconductor Manufacturing Co., Ltd. Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device
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JP2018054496A (ja) * 2016-09-29 2018-04-05 セイコーインスツル株式会社 パッケージおよび赤外線センサ
KR101952368B1 (ko) * 2016-11-25 2019-02-26 오승래 환자 맞춤형 수술기구
US10457549B2 (en) * 2017-02-03 2019-10-29 Taiwan Semiconductor Manfacturing Company Ltd. Semiconductive structure and manufacturing method thereof
JP7408266B2 (ja) * 2017-06-14 2024-01-05 日亜化学工業株式会社 光源装置
CN109879240B (zh) * 2017-12-06 2021-11-09 有研工程技术研究院有限公司 一种厚膜吸气材料的制备方法
US20190202684A1 (en) * 2017-12-29 2019-07-04 Texas Instruments Incorporated Protective bondline control structure
FR3088319B1 (fr) * 2018-11-08 2020-10-30 Ulis Boitier hermetique comportant un getter, composant optoelectronique ou dispositif mems integrant un tel boitier hermetique et procede de fabrication associe
CN110148571B (zh) * 2018-12-10 2022-03-11 上海欧菲尔光电技术有限公司 一种八英寸红外探测器封装窗口及其制备方法
US10968099B2 (en) * 2018-12-28 2021-04-06 Texas Instruments Incorporated Package moisture control and leak mitigation for high vacuum sealed devices
CN111048472B (zh) * 2020-01-07 2021-12-03 深圳南信国际电子有限公司 一种带镀层的红外探测器真空封装结构
JP2021136413A (ja) * 2020-02-28 2021-09-13 国立研究開発法人産業技術総合研究所 封止構造体およびその製造方法
US11670616B2 (en) * 2020-06-22 2023-06-06 Epir, Inc. Modified direct bond interconnect for FPAs
JP7231118B1 (ja) * 2022-04-11 2023-03-01 三菱電機株式会社 中空パッケージ
WO2024090027A1 (ja) * 2022-10-26 2024-05-02 ソニーセミコンダクタソリューションズ株式会社 パッケージおよびパッケージの製造方法
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CN102666368A (zh) * 2009-11-13 2012-09-12 罗伯特·博世有限公司 用于半导体衬底接合的微机械方法和相应的装置以及相应的接合的半导体芯片
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Also Published As

Publication number Publication date
EP3019441B1 (en) 2017-08-23
IL243086A (en) 2017-05-29
KR101752107B1 (ko) 2017-06-28
CN105358473A (zh) 2016-02-24
CA2916672A1 (en) 2015-01-15
NO2944700T3 (enExample) 2018-03-17
KR20160018789A (ko) 2016-02-17
WO2015006327A1 (en) 2015-01-15
US9966320B2 (en) 2018-05-08
JP6122220B2 (ja) 2017-04-26
EP3019441A1 (en) 2016-05-18
US9093444B2 (en) 2015-07-28
US20150014854A1 (en) 2015-01-15
JP2016531421A (ja) 2016-10-06
CN105358473B (zh) 2020-02-14
CA2916672C (en) 2017-07-18
US10262913B2 (en) 2019-04-16
US20170011977A1 (en) 2017-01-12
US20180226309A1 (en) 2018-08-09
US9520332B2 (en) 2016-12-13
US20150279755A1 (en) 2015-10-01

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