CN109192681B - Rapid flexible manufacturing system of chip - Google Patents
Rapid flexible manufacturing system of chip Download PDFInfo
- Publication number
- CN109192681B CN109192681B CN201811016041.4A CN201811016041A CN109192681B CN 109192681 B CN109192681 B CN 109192681B CN 201811016041 A CN201811016041 A CN 201811016041A CN 109192681 B CN109192681 B CN 109192681B
- Authority
- CN
- China
- Prior art keywords
- chip
- plate
- lock
- blank
- lifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The present invention relates to industrial automation equipment, and more particularly, to an automated transport and storage device for chips. A system for rapid flexible manufacturing of chips, comprising: the workstation, link firmly in bed die on the workstation, be used for promoting the chip that chip blank rising movement rises feeding mechanism, be used for following chip rises on the feeding mechanism grabs the chip blank and places it blank material loading manipulator on the bed die, be used for making the extrusion mechanism of processing to the chip blank. The invention relates to a rapid flexible manufacturing system of a chip, which is used for realizing automatic conveying and positioning of the chip.
Description
Technical Field
The present invention relates to industrial automation equipment, and more particularly, to automated manufacturing equipment for chips.
Background
Industrial automation is a trend of widely adopting automatic control and automatic adjustment devices in industrial production to replace manual operation machines and machine systems for processing production. Under industrial production automation conditions, humans only take care and supervise machines indirectly to produce. The industrial automation can be divided into the following stages according to the development stages: (1) semi-automatic. I.e. partly by automatic control and automation, and partly by manually operated machines. (2) The method is full-automatic. The whole process in the production process, including feeding, blanking, loading and unloading, does not need a person to directly carry out production operation (the person only indirectly supervises and supervises the operation of the machine), and the machine continuously and repeatedly produces one or a batch of products automatically.
The industrial automation technology is a comprehensive high technology which applies control theory, instruments, computers and other information technologies to realize detection, control, optimization, scheduling, management and decision-making on an industrial production process, and achieves the purposes of increasing yield, improving quality, reducing consumption, ensuring safety and the like, and comprises three major parts of industrial automation software, hardware and a system. Industrial automation technology, one of the most important technologies in the 20 th century modern manufacturing field, mainly solves the problems of production efficiency and consistency. Whether high-speed mass manufacturing enterprises or enterprises seeking flexibility, flexibility and customization, must rely on the application of automation technology. The automation system does not directly create benefits, but plays an obvious role in promoting the production process of enterprises:
(1) the safety of the production process is improved;
(2) the production efficiency is improved;
(3) the product quality is improved;
(4) the raw material and energy consumption in the production process are reduced.
In the production process, the traditional chip is carried and conveyed manually, so that the consistency of products is low, and the automatic production of chip manufacturing operation is realized by utilizing an industrial automation technology, so that the method has important practical significance.
Disclosure of Invention
The invention aims to provide a rapid flexible manufacturing system of a chip, which is applied to the manufacturing process of the chip; the invention relates to a rapid flexible manufacturing system of a chip, which is used for realizing automatic conveying and manufacturing of the chip.
A system for rapid flexible manufacturing of chips, comprising: the device comprises a workbench, a lower die fixedly connected to the workbench, a chip lifting feeding mechanism for pushing a chip blank to move upwards, a blank feeding manipulator for grabbing the chip blank from the chip lifting feeding mechanism and placing the chip blank on the lower die, and an extrusion forming mechanism for manufacturing and processing the chip blank;
the extrusion forming mechanism comprises: the forming device comprises a lower die, a forming bottom plate, a forming upright post, a forming moving plate, a forming fixed plate, a forming large cylinder, a push-out cylinder in the die, a push-out connecting plate, a push plate in the die, two bending plates, a bending linear guide rail, a bending push plate, a cutting knife edge, a driving roller, a flattening block, an alignment pin and a chip channel, wherein the forming bottom plate is fixedly connected with a workbench; the lower die is fixedly connected with the forming bottom plate, a chip descending channel and a chip pushing channel are arranged on the lower die, the chip descending channel is used for descending a chip body from the vertical direction and reaching the chip pushing channel, and the chip pushing channel is used for moving the chip body from the horizontal direction; the die push plate is fixedly connected to a die push cylinder through the push connecting plate, the die push cylinder is used for driving the die push plate to do linear motion, and the die push plate is movably connected to the chip push channel; the two bending plates are movably connected to the bending linear guide rail, the two bending plates are positioned on two sides of the chip channel, and the two bending plates are provided with driving inclined planes and bending surfaces for bending pins; the lower portion of the forming moving plate is fixedly connected with the first bending push plate, the cutting knife edge, the driving roller, the leveling block and the aligning pin, the first bending push plate is matched with the chip descending channel, the cutting knife edge is used for cutting the connecting sheet, the driving roller is matched with the driving inclined plane and pushes the second bending plate to move towards the direction of the chip slideway, the leveling block is used for leveling a pin located in the chip chute, and the aligning pin is matched with the aligning cylindrical hole in the lower die and used for improving the moving precision of the forming moving plate.
Preferably, the chip lifting and feeding mechanism includes: the chip material clamp is used for storing a chip blank, the material clamp transposition mechanism is used for fixing the chip material clamp, and the thrust ascending mechanism is used for pushing the chip blank to ascend; the chip blanks are stacked in the chip material clamps, the chip blanks are positioned at the upper parts of the lifting push plates, the material clamp transposition mechanism fixes the two chip material clamps through material clamp locks, and the chip blanks are continuously lifted by pushing the lifting push plates through the thrust lifting mechanism; a working table notch is formed in the material clamp transposition mechanism, and a lifting sliding plate and a thrust working table of the thrust lifting mechanism can pass through the working table notch;
blank material loading manipulator includes: blank manipulator support, blank horizontal cylinder, blank connecting plate, the vertical cylinder of blank, vacuum chuck, blank manipulator support link firmly in the workstation, the cylinder block of blank horizontal cylinder link firmly in blank manipulator support, the blank connecting plate link firmly in the end of the piston rod of blank horizontal cylinder, the cylinder block of the vertical cylinder of blank link firmly in the blank connecting plate, vacuum chuck link firmly in the end of the piston rod of the vertical cylinder of blank.
Preferably, the material clamp transposition mechanism comprises: the cylinder bodies of the transposition guide rail and the transposition rodless cylinder are fixedly connected to the transposition base plate, the transposition sliding plate is movably connected to the transposition guide rail, and the transposition rodless cylinder drives the transposition sliding plate to slide along the transposition guide rail; the transposition support is fixedly connected to the transposition sliding plate, a containing cavity used for containing the chip material clamp is arranged on the transposition support, the material clamp lock is connected to the transposition support, and the chip material clamp is fixedly connected to the transposition support through the material clamp lock.
Preferably, the clip lock includes: the lock comprises a lock base, a lock handle, a lock pressing plate, a lock connecting rod, a lock middle connecting rod, a lock swinging rod, a first hinge, a second hinge, a third hinge, a fourth hinge and a lock bolt, wherein the lock base is fixedly connected with the transposition bracket, the lock handle is fixedly connected with the lock middle connecting rod, and the lock pressing plate is fixedly connected with the lock swinging rod; the lock connecting rod is movably connected to the lock base through the first hinge, the lock swinging rod is movably connected to the lock base through the fourth hinge, one end of the lock middle connecting rod is movably connected to the lock connecting rod through the second hinge, and the other end of the lock middle connecting rod is movably connected to the lock swinging rod through the third hinge; the tail end of the locking pressing plate is fixedly connected with the locking bolt, and the head of the locking bolt is used for pressing the chip material clamp.
Preferably, when the material clamp lock is in a locking state, the brain head is pressed on the chip material clamp, and the first hinge, the second hinge and the third hinge are positioned on the same straight line.
Preferably, the chip clip includes: the material clamping device comprises a material clamping body, a lifting push plate, a vertical guide pillar and a protection plate, wherein two ends of the vertical guide pillar are fixedly connected with the material clamping body, the lifting push plate is movably connected to the vertical guide pillar, and the protection plate is arranged in front of the lifting push plate.
The chip blank is placed on the rising push plate, the connecting piece is located between the material clamp body and the protective plate, and the chip body is fixedly connected to the connecting piece through pins.
Preferably, the thrust raising mechanism includes: the lifting mechanism comprises a lifting bottom plate, a lifting top plate, a lifting guide pillar, a lifting guide sleeve, a lifting sliding plate, a thrust workbench, a lifting driving motor, a synchronous belt transmission mechanism, a ball screw and a ball nut, wherein the lifting bottom plate and the lifting top plate are fixedly connected through the lifting guide pillar; the ball nut is fixedly connected to the ascending sliding plate, the ball screw is movably connected to the ascending bottom plate and the ascending top plate, an output shaft of the driving motor is connected to the ball screw through the synchronous belt transmission mechanism, and the ball nut is movably connected to the ball screw; and the upper part of the ascending sliding plate is provided with a thrust workbench for pushing the ascending push plate.
Drawings
FIG. 1 is a schematic diagram of the general architecture of a rapid flexible manufacturing system for chips of the present invention;
FIG. 2 is a schematic view of a partial structure of a rapid flexible manufacturing system for chips according to the present invention;
FIGS. 3, 4 and 5 are schematic structural views of a chip lifting and feeding mechanism of the system for rapid flexible manufacturing of chips according to the present invention;
FIG. 6 is a schematic structural diagram of a chip lifting and feeding mechanism of the rapid flexible chip manufacturing system according to the present invention in a top view;
FIGS. 7 and 8 are schematic structural views of a chip material clamp of the system for rapidly and flexibly manufacturing chips according to the present invention;
FIG. 9 is a schematic diagram of the construction of the thrust lift mechanism of the rapid flexible manufacturing system for chips of the present invention;
FIG. 10 is a schematic diagram of a blank loading robot for a rapid flexible manufacturing system for chips in accordance with the present invention;
FIGS. 11 and 12 are schematic structural views of an extrusion molding mechanism of the rapid flexible manufacturing system for chips according to the present invention;
FIG. 13 is a schematic view of the lower mold of the rapid flexible manufacturing system for chips of the present invention in full cross-section;
FIG. 14 is a schematic view of a portion of the extrusion molding mechanism of the rapid flexible manufacturing system for chips according to the present invention at A.
1 chip lifting and feeding mechanism, 2 chip material clamps, 3 material clamp transposition mechanisms, 4 thrust lifting mechanisms, 6 chip blanks, 7 chip bodies, 8 pins, 9 connecting sheets, 20 material clamp bodies, 21 lifting push plates, 22 vertical guide columns, 23 guard plates, 28 transposition bottom plates, 29 transposition guide rails, 30 transposition rodless cylinders, 31 transposition sliding plates, 32 material clamp locks, 33 transposition supports, 35 lock bases, 36 lock handles, 37 lock pressing plates, 38 lock connecting rods, 39 lock intermediate connecting rods, 40 lock swinging rods, 41 first hinges, 42 second hinges, 43 third hinges, 44 fourth hinges, 45 lock bolts, 46 heads, 50 lifting bottom plates, 51 lifting top plates, 52 lifting guide columns, 53 lifting guide sleeves, 54 lifting sliding plates, 55 thrust working tables, 56 lifting driving motors, 57 synchronous belt transmission mechanism, 58 ball screw, 59 ball nut, 60 working table gap, 65 working table, 66 lower die, 67 blank feeding mechanical arm, 70 blank mechanical arm support, 71 blank horizontal cylinder, 72 blank connecting plate, 73 blank vertical cylinder, 74 vacuum chuck, 76 extrusion forming mechanism, 80 forming bottom plate, 81 forming upright post, 82 forming moving plate, 83 forming fixing plate, 84 molding large air cylinder, 85 mold push-out air cylinder, 86 push-out connecting plate, 87 mold push plate, 88 chip descending channel, 89 chip push-out channel, 90 two bending plates, 91 bending linear guide rail, 92 driving inclined plane, 93 bending surface, 94 one bending push plate, 95 cutting edge, 96 driving roller, 97 clapping block, 98 aligning pin and 99 aligning cylindrical hole.
Detailed Description
The present invention will be described in further detail below, but without limiting the invention in any way, with reference to the following figures, wherein like reference numerals represent like elements. As described above, the present invention provides a system for rapidly and flexibly manufacturing a chip, which is applied in the manufacturing process of the chip; the invention relates to a rapid flexible manufacturing system of a chip, which is used for realizing automatic conveying and manufacturing of the chip.
Fig. 1 is a general structural diagram of a fast flexible manufacturing system of a chip according to the present invention, fig. 2 is a partial structural diagram of the fast flexible manufacturing system of the chip according to the present invention, fig. 3, 4, and 5 are structural diagrams of a chip lifting and feeding mechanism of the fast flexible manufacturing system of the chip according to the present invention, fig. 6 is a structural diagram of the chip lifting and feeding mechanism of the fast flexible manufacturing system of the chip according to the present invention in a top view state, fig. 7 and 8 are structural diagrams of a chip gripper of the fast flexible manufacturing system of the chip according to the present invention, fig. 9 is a structural diagram of a thrust lifting mechanism of the fast flexible manufacturing system of the chip according to the present invention, fig. 10 is a structural diagram of a blank feeding manipulator of the fast flexible manufacturing system of the chip according to the present invention, fig. 11 and 12 are structural diagrams of an extrusion molding mechanism of the fast flexible manufacturing system of the chip according to the present invention, fig. 13 is a structural diagram of a full section of a lower mold of the fast flexible manufacturing system of the chip according to the present invention, FIG. 14 is a schematic view of a portion of the extrusion molding mechanism of the rapid flexible manufacturing system for chips according to the present invention at A.
A system for rapid flexible manufacturing of chips, comprising: the device comprises a workbench 65, a lower die 66 fixedly connected to the workbench 65, a chip lifting and feeding mechanism 1 for pushing a chip blank 6 to move upwards, a blank feeding manipulator 67 for grabbing the chip blank 6 from the chip lifting and feeding mechanism 1 and placing the chip blank 6 on the lower die 66, and an extrusion forming mechanism 76 for manufacturing and processing the chip blank 6;
the extrusion forming mechanism 76 includes: the die comprises a lower die 66, a forming bottom plate 80, a forming upright column 81, a forming moving plate 82, a forming fixing plate 83, a forming large cylinder 84, a die middle push cylinder 85, a push connecting plate 86, a die middle push plate 87, two bending plates 90, a bending linear guide rail 91, a first bending push plate 94, a cutting knife edge 95, a driving roller 96, a patting block 97, an alignment pin 98 and a chip channel 100, wherein the forming bottom plate 80 is fixedly connected to the workbench 65, the forming upright column 81 is vertically fixedly connected to the forming bottom plate 80, the forming fixing plate 83 is fixedly connected to the top end of the forming upright column 81, the forming moving plate 82 is movably connected to the forming upright column 81, a cylinder body of the forming large cylinder 84 is fixedly connected to the forming fixing plate 83, and the tail end of a piston rod of the forming large cylinder 84 is fixedly connected to the forming moving plate 82; the lower die 66 is fixedly connected to the forming bottom plate 80, a chip descending channel 88 and a chip pushing channel 89 are arranged on the lower die 66, the chip descending channel 88 is used for descending the chip body 7 from the vertical direction and reaching the chip pushing channel 89, and the chip pushing channel 89 is used for moving the chip body 7 from the horizontal direction; the mold middle push plate 87 is fixedly connected to the mold middle push cylinder 85 through the push-out connecting plate 86, the mold middle push cylinder 85 is used for driving the mold middle push plate 87 to do linear motion, and the mold middle push plate 87 is movably connected to the chip push-out channel 89; the two bending plates 90 are movably connected to the bending linear guide rail 91, the two bending plates 90 are located on two sides of the chip channel 100, and the two bending plates 90 are provided with a driving inclined plane 92 and a bending surface 93 for bending the pins 8; the lower portion of the forming moving plate 82 is fixedly connected with the one-way bending push plate 94, the cutting knife edge 95, the driving roller 96, the leveling block 97 and the aligning pin 98, the one-way bending push plate 94 is matched with the chip descending channel 88, the cutting knife edge 95 is used for cutting the connecting sheet 9, the driving roller 96 is matched with the driving inclined plane 92 and pushes the two-way bending plate 90 to move towards the direction of the chip slideway 100, the leveling block 97 is used for leveling the pins 8 located in the chip slideway 100, and the aligning pin 98 is matched with the aligning cylindrical hole 99 on the lower die 66 and used for improving the moving precision of the forming moving plate 82.
More specifically, the chip lifting and feeding mechanism 1 includes: the chip material clamp comprises a chip material clamp 2 for storing a chip blank 6, a material clamp transposition mechanism 3 for fixing the chip material clamp 2, and a thrust ascending mechanism 4 for pushing the chip blank 6 to ascend; the chip blanks 6 are stacked in the chip material clamps 2, the chip blanks 6 are positioned at the upper parts of the lifting push plates 21, the material clamp transposition mechanism 3 fixes the two chip material clamps 2 through the material clamp locks 32, and the chip blanks 6 are continuously lifted by pushing the lifting push plates 21 through the thrust lifting mechanism 4; a workbench gap 60 is arranged on the material clamp transposition mechanism 3, and the lifting slide plate 54 and the thrust workbench 55 of the thrust lifting mechanism 4 can pass through the workbench gap 60;
blank material loading manipulator 67 includes: blank manipulator support 70, blank horizontal cylinder 71, blank connecting plate 72, the vertical cylinder 73 of blank, vacuum chuck 74, blank manipulator support 70 link firmly in workstation 65, the cylinder block of blank horizontal cylinder 71 link firmly in blank manipulator support 70, blank connecting plate 72 link firmly in the end of the piston rod of blank horizontal cylinder 71, the cylinder block of the vertical cylinder 73 of blank link firmly in blank connecting plate 72, vacuum chuck 74 link firmly in the end of the piston rod of the vertical cylinder 73 of blank.
More specifically, the material clamp transposition mechanism 3 includes: the material clamping device comprises a transposition bottom plate 28, a transposition guide rail 29, a transposition rodless cylinder 30, a transposition sliding plate 31, a material clamping lock 32 and a transposition support 33, wherein cylinder bodies of the transposition guide rail 29 and the transposition rodless cylinder 30 are fixedly connected to the transposition bottom plate 28, the transposition sliding plate 31 is movably connected to the transposition guide rail 29, and the transposition rodless cylinder 30 drives the transposition sliding plate 31 to slide along the transposition guide rail 29; the transposition support 33 is fixedly connected to the transposition sliding plate 31, a containing cavity for containing the chip material clamp 2 is formed in the transposition support 33, the material clamp lock 32 is fixedly connected to the transposition support 33, and the chip material clamp 2 is fixedly connected to the transposition support 33 through the material clamp lock 32.
More specifically, the clip lock 32 includes: the lock comprises a lock base 35, a lock handle 36, a lock pressing plate 37, a lock connecting rod 38, a lock middle connecting rod 39, a lock swinging rod 40, a first hinge 41, a second hinge 42, a third hinge 43, a fourth hinge 44 and a lock bolt 45, wherein the lock base 35 is fixedly connected to the transposition bracket 33, the lock handle 36 is fixedly connected to the lock middle connecting rod 39, and the lock pressing plate 37 is fixedly connected to the lock swinging rod 40; the lock connecting rod 38 is movably connected to the lock base 35 through the first hinge 41, the lock swinging rod 40 is movably connected to the lock base 35 through the fourth hinge 44, one end of the lock intermediate connecting rod 39 is movably connected to the lock connecting rod 38 through the second hinge 42, and the other end of the lock intermediate connecting rod 39 is movably connected to the lock swinging rod 40 through the third hinge 43; the tail end of the locking pressing plate 37 is fixedly connected with the locking bolt 45, and the head 46 of the locking bolt 45 is used for pressing the chip material clamp 2.
More specifically, when the clip lock 32 is in a locked state, the head 46 presses on the chip clip 2, and the three points of the first hinge 41, the second hinge 42, and the third hinge 43 are in the same straight line.
More specifically, the chip magazine 2 includes: the material clamping device comprises a material clamping body 20, a rising push plate 21, a vertical guide pillar 22 and a protection plate 23, wherein two ends of the vertical guide pillar 22 are fixedly connected to the material clamping body 20, the rising push plate 21 is movably connected to the vertical guide pillar 22, and the protection plate 23 is arranged in front of the rising push plate 21.
The chip blank 6 is placed on the ascending push plate 21, the connecting sheet is positioned between the material clamp body 20 and the guard plate 23, and the chip body is fixedly connected with the connecting sheet 9 through the pins 8.
More specifically, the thrust raising mechanism 4 includes: the lifting mechanism comprises a lifting bottom plate 50, a lifting top plate 51, a lifting guide post 52, a lifting guide sleeve 53, a lifting sliding plate 54, a thrust workbench 55, a lifting driving motor 56, a synchronous belt transmission mechanism 57, a ball screw 58 and a ball nut 59, wherein the lifting bottom plate 50 and the lifting top plate 51 are fixedly connected through the lifting guide post 52, the lifting guide sleeve 53 is fixedly connected to the lifting sliding plate 54, and the lifting guide sleeve 53 is movably connected to the lifting guide post 52; the ball nut 59 is fixedly connected to the ascending slide plate 54, the ball screw 58 is movably connected to the ascending bottom plate 50 and the ascending top plate 51, the output shaft of the driving motor 56 is connected to the ball screw 58 through the synchronous belt transmission mechanism 57, and the ball nut 59 is movably connected to the ball screw 58; the upper portion of the elevation slide plate 54 is provided with a thrust table 55 for pushing the elevation push plate 21.
Finally, it should be noted that the above embodiments are merely representative examples of the fast flexible manufacturing system for chips of the present invention. It is clear that the fast flexible manufacturing system of chips according to the invention is not limited to the above described embodiments, but that many variations are possible. Any simple modification, equivalent changes and modifications of the above embodiments, which are made according to the technical essence of the rapid flexible manufacturing system of the chip of the present invention, should be considered to fall within the protection scope of the rapid flexible manufacturing system of the chip of the present invention.
Claims (8)
1. A system for rapid flexible manufacturing of chips, comprising: the device comprises a workbench, a lower die fixedly connected to the workbench, a chip lifting feeding mechanism for pushing a chip blank to move upwards, a blank feeding manipulator for grabbing the chip blank from the chip lifting feeding mechanism and placing the chip blank on the lower die, and an extrusion forming mechanism for manufacturing and processing the chip blank; the extrusion forming mechanism comprises: the forming device comprises a lower die, a forming bottom plate, a forming upright post, a forming moving plate, a forming fixed plate, a forming large air cylinder, a pushing-out air cylinder in the die, a pushing-out connecting plate, a push plate in the die, two bending plates, a bending linear guide rail, a bending push plate, a cutting knife edge, a driving roller, a patting block, an alignment pin and a chip channel, wherein the forming bottom plate is fixedly connected with a workbench, the forming upright post is vertically and fixedly connected with the forming bottom plate, the forming fixed plate is fixedly connected with the top end of the forming upright post, the forming moving plate is movably connected with the forming upright post, an air cylinder body of the forming large air cylinder is fixedly connected with the forming fixed plate, and the tail end of a piston rod of the forming large air cylinder is fixedly connected with the forming moving plate; the lower die is fixedly connected with the forming bottom plate, a chip descending channel and a chip pushing channel are arranged on the lower die, the chip descending channel is used for descending a chip body from the vertical direction and reaching the chip pushing channel, and the chip pushing channel is used for moving the chip body from the horizontal direction; the die push plate is fixedly connected to a die push cylinder through the push connecting plate, the die push cylinder is used for driving the die push plate to do linear motion, and the die push plate is movably connected to the chip push channel; the two bending plates are movably connected to the bending linear guide rail, the two bending plates are positioned on two sides of the chip channel, and the two bending plates are provided with driving inclined planes and bending surfaces for bending pins; the lower portion of the forming moving plate is fixedly connected with the one-bending push plate, the cutting knife edge, the driving roller, the leveling block and the aligning pin, the one-bending push plate is matched with the chip descending channel, the cutting knife edge is used for cutting the connecting sheet, the driving roller is matched with the driving inclined plane and pushes the two-bending plate to move towards the direction of the chip channel, the leveling block is used for leveling pins located in the chip channel, and the aligning pin is matched with the aligning cylindrical hole in the lower die and used for improving the moving precision of the forming moving plate.
2. The system for rapid flexible manufacturing of chips of claim 1, wherein said chip lift feed mechanism comprises: the chip material clamp is used for storing a chip blank, the material clamp transposition mechanism is used for fixing the chip material clamp, and the thrust ascending mechanism is used for pushing the chip blank to ascend; the chip blanks are stacked in the chip material clamps, the chip blanks are positioned at the upper parts of the lifting push plates, the material clamp transposition mechanism fixes the two chip material clamps through material clamp locks, and the chip blanks are continuously lifted by pushing the lifting push plates through the thrust lifting mechanism; the material clamp transposition mechanism is provided with a workbench gap, and a lifting sliding plate and a thrust workbench of the thrust lifting mechanism can pass through the workbench gap.
3. The system for rapid flexible manufacturing of chips of claim 1, wherein said blank loading robot comprises: blank manipulator support, blank horizontal cylinder, blank connecting plate, the vertical cylinder of blank, vacuum chuck, blank manipulator support link firmly in the workstation, the cylinder block of blank horizontal cylinder link firmly in blank manipulator support, the blank connecting plate link firmly in the end of the piston rod of blank horizontal cylinder, the cylinder block of the vertical cylinder of blank link firmly in the blank connecting plate, vacuum chuck link firmly in the end of the piston rod of the vertical cylinder of blank.
4. The system for rapid flexible manufacturing of chips of claim 2, wherein the collet indexing mechanism comprises: the cylinder bodies of the transposition guide rail and the transposition rodless cylinder are fixedly connected to the transposition base plate, the transposition sliding plate is movably connected to the transposition guide rail, and the transposition rodless cylinder drives the transposition sliding plate to slide along the transposition guide rail; the transposition support is fixedly connected to the transposition sliding plate, a containing cavity used for containing the chip material clamp is formed in the transposition support, the material clamp lock is connected to the transposition support, and the chip material clamp is fixedly connected to the transposition support through the material clamp lock.
5. The system for rapid flexible manufacturing of chips of claim 4, wherein the collet lock comprises: the lock comprises a lock base, a lock handle, a lock pressing plate, a lock connecting rod, a lock middle connecting rod, a lock swinging rod, a first hinge, a second hinge, a third hinge, a fourth hinge and a lock bolt, wherein the lock base is fixedly connected with the transposition bracket, the lock handle is fixedly connected with the lock middle connecting rod, and the lock pressing plate is fixedly connected with the lock swinging rod; the lock connecting rod is movably connected to the lock base through the first hinge, the lock swinging rod is movably connected to the lock base through a fourth hinge, one end of the lock middle connecting rod is movably connected to the lock connecting rod through the second hinge, and the other end of the lock middle connecting rod is movably connected to the lock swinging rod through the third hinge; the tail end of the locking pressing plate is fixedly connected with the locking bolt, and the head of the locking bolt is used for pressing the chip material clamp.
6. The system for rapidly and flexibly manufacturing chips according to claim 5, wherein when the clip lock is in a locked state, the brain head presses on the chip clip, and the three points of the first hinge, the second hinge and the third hinge are in the same straight line.
7. The system for rapid and flexible manufacturing of chips of claim 6, wherein said chip gripper comprises: the material clamping device comprises a material clamping body, a lifting push plate, a vertical guide pillar and a protection plate, wherein two ends of the vertical guide pillar are fixedly connected with the material clamping body, the lifting push plate is movably connected to the vertical guide pillar, and the protection plate is arranged in front of the lifting push plate.
8. The system for rapid flexible manufacturing of chips of claim 2, wherein said thrust lift mechanism comprises: the lifting mechanism comprises a lifting bottom plate, a lifting top plate, a lifting guide pillar, a lifting guide sleeve, a lifting sliding plate, a thrust workbench, a lifting driving motor, a synchronous belt transmission mechanism, a ball screw and a ball nut, wherein the lifting bottom plate and the lifting top plate are fixedly connected through the lifting guide pillar; the ball nut is fixedly connected to the ascending sliding plate, the ball screw is movably connected to the ascending bottom plate and the ascending top plate, an output shaft of the ascending driving motor is connected to the ball screw through the synchronous belt transmission mechanism, and the ball nut is movably connected to the ball screw; and the upper part of the ascending sliding plate is provided with a thrust workbench for pushing the ascending push plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811016041.4A CN109192681B (en) | 2018-09-01 | 2018-09-01 | Rapid flexible manufacturing system of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811016041.4A CN109192681B (en) | 2018-09-01 | 2018-09-01 | Rapid flexible manufacturing system of chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109192681A CN109192681A (en) | 2019-01-11 |
| CN109192681B true CN109192681B (en) | 2022-05-31 |
Family
ID=64917636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811016041.4A Active CN109192681B (en) | 2018-09-01 | 2018-09-01 | Rapid flexible manufacturing system of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109192681B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100639149B1 (en) * | 2006-06-23 | 2006-10-31 | 김성철 | Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same |
| CH706280B1 (en) * | 2012-03-30 | 2016-03-15 | Esec Ag | A method for detaching a semiconductor chip from a foil. |
| CN104377152A (en) * | 2014-11-17 | 2015-02-25 | 如皋市易达电子有限责任公司 | Plastic package scrap-edge removing die for patch-type diode |
| CN205739453U (en) * | 2016-05-16 | 2016-11-30 | 沈阳友联电子装备有限公司 | A kind of balance device of chip |
| CN206340522U (en) * | 2016-10-15 | 2017-07-18 | 广州明森科技股份有限公司 | A kind of chip package production line of multicore smart card |
| JP6862903B2 (en) * | 2017-02-23 | 2021-04-21 | 東京エレクトロン株式会社 | Board transfer device, board transfer method and storage medium |
| CN107324043A (en) * | 2017-06-12 | 2017-11-07 | 温州职业技术学院 | Robot assisted connector assembles flexible manufacturing production line |
-
2018
- 2018-09-01 CN CN201811016041.4A patent/CN109192681B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109192681A (en) | 2019-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109244008B (en) | Intelligent production line for manufacturing chips | |
| CN204135219U (en) | Automatic reversible table | |
| CN109244006B (en) | Chip manufacturing assembly line with intelligent sorting function | |
| CN109256347B (en) | Intelligent production line for manufacturing chips | |
| CN106826245B (en) | The full-automatic processing of chip pin is equipped | |
| CN109048375A (en) | The integrated intelligence manufacturing equipment and method of manufacturing technology of chip | |
| CN109192681B (en) | Rapid flexible manufacturing system of chip | |
| CN210476315U (en) | Guide rail carrying and clamping device | |
| CN109095170B (en) | Quick conveying equipment for manipulator auxiliary chip | |
| CN109230377B (en) | Distributed large-capacity conveying mechanism for chips | |
| CN202555716U (en) | Conveying mechanism of large-size three-dimensional manipulator | |
| CN210498042U (en) | Automatic manipulator for automatically transferring products | |
| CN211439102U (en) | Automatic material clamping and processing device with liftable platform | |
| CN208555763U (en) | Sheet material multi-process punching machine punching press automatic conveying device | |
| CN111421621A (en) | Automatic processing device for plate upper hole groove | |
| CN220029405U (en) | Automatic drilling machine for trimming die | |
| CN217551671U (en) | Manipulator automation equipment of automatic pressure equipment of automobile parts | |
| CN215786028U (en) | High-precision hardware mould | |
| CN217437081U (en) | Automatic transfer device | |
| CN212331717U (en) | Automatic mouth of a river device of cutting of injection molding | |
| CN212666297U (en) | Automatic processing device for plate upper hole groove | |
| CN219216313U (en) | Slideway feeding automatic line | |
| CN212421304U (en) | Double-end mechanical arm | |
| CN211337846U (en) | Material feeding system | |
| CN117116655B (en) | Magnetic ring twines foot tangent line all-in-one |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220506 Address after: No.2-3, Guangzhu Road, hefengwei, east of Guangzhu Road, changjiao, Lunjiao, Shunde District, Foshan City, Guangdong Province Applicant after: Foshan Meite Intelligent Technology Co.,Ltd. Address before: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Applicant before: WENZHOU KEHONG ROBOT TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |