CN109095170B - Quick conveying equipment for manipulator auxiliary chip - Google Patents
Quick conveying equipment for manipulator auxiliary chip Download PDFInfo
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- CN109095170B CN109095170B CN201811017489.8A CN201811017489A CN109095170B CN 109095170 B CN109095170 B CN 109095170B CN 201811017489 A CN201811017489 A CN 201811017489A CN 109095170 B CN109095170 B CN 109095170B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The present invention relates to industrial automation equipment, and more particularly, to an automated transport and storage device for chips. Quick conveying of manipulator auxiliary chip is equipped, includes: the automatic chip blank feeding device comprises a workbench, a lower die fixedly connected to the workbench, a chip lifting feeding mechanism used for pushing a chip blank to move upwards, and a blank feeding manipulator used for grabbing the chip blank from the chip lifting feeding mechanism and placing the chip blank on the lower die. The invention relates to a quick conveying device for a manipulator auxiliary chip, which is used for realizing automatic conveying and positioning of the chip.
Description
Technical Field
The present invention relates to industrial automation equipment, and more particularly, to an automated transport and storage device for chips.
Background
Industrial automation is a trend of widely adopting automatic control and automatic adjustment devices in industrial production to replace manual operation machines and machine systems for processing production. Under industrial production automation conditions, humans only take care and supervise machines indirectly to produce. The industrial automation can be divided into the following stages according to the development stages: (1) semi-automatic. I.e. partly by automatic control and automation, and partly by manually operated machines. (2) The method is full-automatic. The whole process in the production process, including feeding, blanking, loading and unloading, does not need a person to directly carry out production operation (the person only indirectly supervises and supervises the operation of the machine), and the machine continuously and repeatedly produces one or a batch of products automatically.
The industrial automation technology is a comprehensive high technology which applies control theory, instruments, computers and other information technologies to realize detection, control, optimization, scheduling, management and decision-making on an industrial production process, and achieves the purposes of increasing yield, improving quality, reducing consumption, ensuring safety and the like, and comprises three major parts of industrial automation software, hardware and a system. Industrial automation technology, which is one of the most important technologies in the field of modern manufacturing in the 20 th century, mainly solves the problems of production efficiency and consistency. Whether high-speed mass manufacturing enterprises or those seeking flexibility, flexibility and customization must rely on the application of automation technology. The automation system itself does not directly create benefits, but it plays an obvious role in improving the production process of enterprises:
(1) the safety of the production process is improved;
(2) the production efficiency is improved;
(3) the product quality is improved;
(4) the raw material and energy consumption in the production process are reduced.
In the production process, the traditional chip is carried and conveyed manually, so that the consistency of products is low, and the automatic production of chip conveying operation is realized by utilizing an industrial automation technology, so that the method has important practical significance.
Disclosure of Invention
The invention aims to provide quick conveying equipment for a manipulator auxiliary chip, which is applied to the manufacturing process of chips; the invention relates to a quick conveying device for a manipulator auxiliary chip, which is used for realizing automatic conveying and positioning of the chip.
A fast conveying device of a manipulator auxiliary chip comprises: the chip blank lifting and feeding device comprises a workbench, a lower die fixedly connected to the workbench, a chip lifting and feeding mechanism for pushing a chip blank to move upwards, and a blank feeding manipulator for grabbing the chip blank from the chip lifting and feeding mechanism and placing the chip blank on the lower die;
the chip lifting and feeding mechanism comprises: the chip material clamp is used for storing a chip blank, the material clamp transposition mechanism is used for fixing the chip material clamp, and the thrust ascending mechanism is used for pushing the chip blank to ascend; the chip blanks are stacked in the chip material clamps, the chip blanks are positioned at the upper parts of the lifting push plates, the material clamp transposition mechanism fixes the two chip material clamps through material clamp locks, and the chip blanks are continuously lifted by pushing the lifting push plates through the thrust lifting mechanism; a working table notch is formed in the material clamp transposition mechanism, and a lifting sliding plate and a thrust working table of the thrust lifting mechanism can pass through the working table notch;
blank material loading manipulator includes: blank manipulator support, blank horizontal cylinder, blank connecting plate, the vertical cylinder of blank, vacuum chuck, blank manipulator support link firmly in the workstation, the cylinder block of blank horizontal cylinder link firmly in blank manipulator support, the blank connecting plate link firmly in the end of the piston rod of blank horizontal cylinder, the cylinder block of the vertical cylinder of blank link firmly in the blank connecting plate, vacuum chuck link firmly in the end of the piston rod of the vertical cylinder of blank.
Preferably, the material clamp transposition mechanism comprises: the cylinder bodies of the transposition guide rail and the transposition rodless cylinder are fixedly connected to the transposition base plate, the transposition sliding plate is movably connected to the transposition guide rail, and the transposition rodless cylinder drives the transposition sliding plate to slide along the transposition guide rail; the transposition support is fixedly connected to the transposition sliding plate, a containing cavity used for containing the chip material clamp is arranged on the transposition support, the material clamp lock is connected to the transposition support, and the chip material clamp is fixedly connected to the transposition support through the material clamp lock.
Preferably, the clip lock includes: the lock comprises a lock base, a lock handle, a lock pressing plate, a lock connecting rod, a lock middle connecting rod, a lock swinging rod, a first hinge, a second hinge, a third hinge, a fourth hinge and a lock bolt, wherein the lock base is fixedly connected with the transposition bracket, the lock handle is fixedly connected with the lock middle connecting rod, and the lock pressing plate is fixedly connected with the lock swinging rod; the lock connecting rod is movably connected to the lock base through the first hinge, the lock swinging rod is movably connected to the lock base through a fourth hinge, one end of the lock middle connecting rod is movably connected to the lock connecting rod through the second hinge, and the other end of the lock middle connecting rod is movably connected to the lock swinging rod through the third hinge; the tail end of the locking pressing plate is fixedly connected with the locking bolt, and the head of the locking bolt is used for pressing the chip material clamp.
Preferably, when the material clamp lock is in a locking state, the brain head is pressed on the chip material clamp, and the first hinge, the second hinge and the third hinge are positioned on the same straight line.
Preferably, the chip clip includes: the material clamping device comprises a material clamping body, a lifting push plate, a vertical guide pillar and a protection plate, wherein two ends of the vertical guide pillar are fixedly connected with the material clamping body, the lifting push plate is movably connected to the vertical guide pillar, and the protection plate is arranged in front of the lifting push plate.
The chip blank is placed on the rising push plate, the connecting piece is located between the material clamp body and the protective plate, and the chip body is fixedly connected to the connecting piece through pins.
Preferably, the thrust raising mechanism includes: the lifting mechanism comprises a lifting bottom plate, a lifting top plate, a lifting guide pillar, a lifting guide sleeve, a lifting sliding plate, a thrust workbench, a lifting driving motor, a synchronous belt transmission mechanism, a ball screw and a ball nut, wherein the lifting bottom plate and the lifting top plate are fixedly connected through the lifting guide pillar; the ball nut is fixedly connected to the ascending sliding plate, the ball screw is movably connected to the ascending bottom plate and the ascending top plate, an output shaft of the driving motor is connected to the ball screw through the synchronous belt transmission mechanism, and the ball nut is movably connected to the ball screw; and the upper part of the ascending sliding plate is provided with a thrust workbench for pushing the ascending push plate.
Drawings
FIG. 1 is a schematic diagram of the general structure of the fast conveying equipment of the manipulator auxiliary chip of the invention;
FIGS. 2, 3 and 4 are schematic structural views of a chip lifting and feeding mechanism of the rapid chip conveying device of the manipulator auxiliary chip of the invention;
FIG. 5 is a schematic structural diagram of a chip lifting and feeding mechanism of the rapid chip conveying equipment of the manipulator of the present invention in a state of a top view;
FIGS. 6 and 7 are schematic structural views of a chip clamp of the rapid chip conveying device of the manipulator of the invention;
FIG. 8 is a schematic structural view of a thrust raising mechanism of the rapid chip transfer apparatus of the robot auxiliary chip according to the present invention;
fig. 9 is a schematic structural diagram of a blank loading manipulator of the rapid chip conveying equipment assisted by the manipulator of the invention.
1 chip lifting and feeding mechanism, 2 chip material clamps, 3 material clamp transposition mechanisms, 4 thrust lifting mechanisms, 6 chip blanks, 7 chip bodies, 8 pins, 9 connecting sheets, 20 material clamp bodies, 21 lifting push plates, 22 vertical guide columns, 23 guard plates, 28 transposition bottom plates, 29 transposition guide rails, 30 transposition rodless cylinders, 31 transposition sliding plates, 32 material clamp locks, 33 transposition supports, 35 lock bases, 36 lock handles, 37 lock pressing plates, 38 lock connecting rods, 39 lock intermediate connecting rods, 40 lock swinging rods, 41 first hinges, 42 second hinges, 43 third hinges, 44 fourth hinges, 45 lock bolts, 46 heads, 50 lifting bottom plates, 51 lifting top plates, 52 lifting guide columns, 53 lifting guide sleeves, 54 lifting sliding plates, 55 thrust working tables, 56 lifting driving motors, 57 synchronous belt transmission mechanism, 58 ball screw, 59 ball nut, 60 workbench gap, 65 workbench, 66 lower die, 67 blank feeding manipulator, 70 blank manipulator bracket, 71 blank horizontal cylinder, 72 blank connecting plate, 73 blank vertical cylinder and 74 vacuum chuck.
Detailed Description
The present invention will be described in further detail below, but without limiting the invention in any way, with reference to the following figures, wherein like reference numerals represent like elements. As described above, the present invention provides a fast conveying device for a manipulator to assist chips, which is applied in the manufacturing process of chips; the invention relates to a quick conveying device for a manipulator auxiliary chip, which is used for realizing automatic conveying and positioning of the chip.
Fig. 1 is a general structural schematic diagram of a rapid conveying device of a manipulator auxiliary chip of the present invention, fig. 2, 3 and 4 are structural schematic diagrams of a chip lifting and feeding mechanism of the rapid conveying device of the manipulator auxiliary chip of the present invention, fig. 5 is a structural schematic diagram of the chip lifting and feeding mechanism of the rapid conveying device of the manipulator auxiliary chip of the present invention in a top view state, fig. 6 and 7 are structural schematic diagrams of a chip clamp of the rapid conveying device of the manipulator auxiliary chip of the present invention, fig. 8 is a structural schematic diagram of a thrust lifting mechanism of the rapid conveying device of the manipulator auxiliary chip of the present invention, and fig. 9 is a structural schematic diagram of a blank feeding manipulator of the rapid conveying device of the manipulator auxiliary chip of the present invention.
A fast conveying device of a manipulator auxiliary chip comprises: the automatic chip lifting device comprises a workbench 65, a lower die 66 fixedly connected to the workbench 65, a chip lifting and feeding mechanism 1 for pushing a chip blank 6 to move upwards, and a blank feeding manipulator 67 for grabbing the chip blank 6 from the chip lifting and feeding mechanism 1 and placing the chip blank on the lower die 66;
the chip lifting and feeding mechanism 1 comprises: the chip material clamp comprises a chip material clamp 2 for storing a chip blank 6, a material clamp transposition mechanism 3 for fixing the chip material clamp 2, and a thrust ascending mechanism 4 for pushing the chip blank 6 to ascend; the chip blanks 6 are stacked in the chip material clamps 2, the chip blanks 6 are positioned at the upper parts of the lifting push plates 21, the material clamp transposition mechanism 3 fixes the two chip material clamps 2 through the material clamp locks 32, and the chip blanks 6 are continuously lifted by pushing the lifting push plates 21 through the thrust lifting mechanism 4; a workbench gap 60 is arranged on the material clamp transposition mechanism 3, and the lifting slide plate 54 and the thrust workbench 55 of the thrust lifting mechanism 4 can pass through the workbench gap 60;
blank material loading manipulator 67 includes: blank manipulator support 70, blank horizontal cylinder 71, blank connecting plate 72, the vertical cylinder 73 of blank, vacuum chuck 74, blank manipulator support 70 link firmly in workstation 65, the cylinder block of blank horizontal cylinder 71 link firmly in blank manipulator support 70, blank connecting plate 72 link firmly in the end of the piston rod of blank horizontal cylinder 71, the cylinder block of the vertical cylinder 73 of blank link firmly in blank connecting plate 72, vacuum chuck 74 link firmly in the end of the piston rod of the vertical cylinder 73 of blank.
More specifically, the material clamp transposition mechanism 3 includes: the material clamping device comprises a transposition bottom plate 28, a transposition guide rail 29, a transposition rodless cylinder 30, a transposition sliding plate 31, a material clamping lock 32 and a transposition support 33, wherein cylinder bodies of the transposition guide rail 29 and the transposition rodless cylinder 30 are fixedly connected to the transposition bottom plate 28, the transposition sliding plate 31 is movably connected to the transposition guide rail 29, and the transposition rodless cylinder 30 drives the transposition sliding plate 31 to slide along the transposition guide rail 29; the transposition support 33 is fixedly connected to the transposition sliding plate 31, a containing cavity for containing the chip material clamp 2 is formed in the transposition support 33, the material clamp lock 32 is fixedly connected to the transposition support 33, and the chip material clamp 2 is fixedly connected to the transposition support 33 through the material clamp lock 32.
More specifically, the clip lock 32 includes: the lock comprises a lock base 35, a lock handle 36, a lock pressing plate 37, a lock connecting rod 38, a lock middle connecting rod 39, a lock swinging rod 40, a first hinge 41, a second hinge 42, a third hinge 43, a fourth hinge 44 and a lock bolt 45, wherein the lock base 35 is fixedly connected to the transposition bracket 33, the lock handle 36 is fixedly connected to the lock middle connecting rod 39, and the lock pressing plate 37 is fixedly connected to the lock swinging rod 40; the lock connecting rod 38 is movably connected to the lock base 35 through the first hinge 41, the lock swinging rod 40 is movably connected to the lock base 35 through the fourth hinge 44, one end of the lock intermediate connecting rod 39 is movably connected to the lock connecting rod 38 through the second hinge 42, and the other end of the lock intermediate connecting rod 39 is movably connected to the lock swinging rod 40 through the third hinge 43; the tail end of the locking pressing plate 37 is fixedly connected with the locking bolt 45, and the head 46 of the locking bolt 45 is used for pressing the chip material clamp 2.
More specifically, when the clip lock 32 is in a locked state, the head 46 presses on the chip clip 2, and the three points of the first hinge 41, the second hinge 42, and the third hinge 43 are in the same straight line.
More specifically, the chip magazine 2 includes: the material clamping device comprises a material clamping body 20, a rising push plate 21, a vertical guide pillar 22 and a protection plate 23, wherein two ends of the vertical guide pillar 22 are fixedly connected to the material clamping body 20, the rising push plate 21 is movably connected to the vertical guide pillar 22, and the protection plate 23 is arranged in front of the rising push plate 21.
The chip blank 6 is placed on the rising push plate 21, the connecting sheet is positioned between the material clamp body 20 and the guard plate 23, and the chip body is fixedly connected with the connecting sheet 9 through pins 8.
More specifically, the thrust raising mechanism 4 includes: the lifting mechanism comprises a lifting bottom plate 50, a lifting top plate 51, a lifting guide post 52, a lifting guide sleeve 53, a lifting sliding plate 54, a thrust workbench 55, a lifting driving motor 56, a synchronous belt transmission mechanism 57, a ball screw 58 and a ball nut 59, wherein the lifting bottom plate 50 and the lifting top plate 51 are fixedly connected through the lifting guide post 52, the lifting guide sleeve 53 is fixedly connected to the lifting sliding plate 54, and the lifting guide sleeve 53 is movably connected to the lifting guide post 52; the ball nut 59 is fixedly connected to the ascending slide plate 54, the ball screw 58 is movably connected to the ascending bottom plate 50 and the ascending top plate 51, the output shaft of the driving motor 56 is connected to the ball screw 58 through the synchronous belt transmission mechanism 57, and the ball nut 59 is movably connected to the ball screw 58; the upper portion of the elevation slide plate 54 is provided with a thrust table 55 for pushing the elevation push plate 21.
Finally, it should be noted that the above embodiments are merely representative examples of the robot assisted chip rapid transfer apparatus of the present invention. Obviously, the robot-assisted chip rapid transfer apparatus of the present invention is not limited to the above-described embodiment, and many variations are possible. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the rapid transfer equipment for manipulator auxiliary chips of the present invention shall be considered to fall within the protection scope of the rapid transfer equipment for manipulator auxiliary chips of the present invention.
Claims (6)
1. The utility model provides a quick transport of manipulator auxiliary chip is equipped which characterized in that includes: the chip blank lifting and feeding device comprises a workbench, a lower die fixedly connected to the workbench, a chip lifting and feeding mechanism for pushing a chip blank to move upwards, and a blank feeding manipulator for grabbing the chip blank from the chip lifting and feeding mechanism and placing the chip blank on the lower die;
the chip lifting and feeding mechanism comprises: the chip material clamp is used for storing a chip blank, the material clamp transposition mechanism is used for fixing the chip material clamp, and the thrust ascending mechanism is used for pushing the chip blank to ascend; the chip blanks are stacked in the chip material clamps, the chip blanks are positioned at the upper parts of the lifting push plates, the material clamp transposition mechanism fixes the two chip material clamps through material clamp locks, and the chip blanks are continuously lifted by pushing the lifting push plates through the thrust lifting mechanism; a working table notch is formed in the material clamp transposition mechanism, and a lifting sliding plate and a thrust working table of the thrust lifting mechanism can pass through the working table notch;
blank material loading manipulator includes: blank manipulator support, blank horizontal cylinder, blank connecting plate, the vertical cylinder of blank, vacuum chuck, blank manipulator support link firmly in the workstation, the cylinder block of blank horizontal cylinder link firmly in blank manipulator support, the blank connecting plate link firmly in the end of the piston rod of blank horizontal cylinder, the cylinder block of the vertical cylinder of blank link firmly in the blank connecting plate, vacuum chuck link firmly in the end of the piston rod of the vertical cylinder of blank.
2. The robot assisted chip rapid transport apparatus of claim 1, wherein the gripper indexing mechanism comprises: the cylinder bodies of the transposition guide rail and the transposition rodless cylinder are fixedly connected to the transposition base plate, the transposition sliding plate is movably connected to the transposition guide rail, and the transposition rodless cylinder drives the transposition sliding plate to slide along the transposition guide rail; the transposition support is fixedly connected to the transposition sliding plate, a containing cavity used for containing the chip material clamp is arranged on the transposition support, the material clamp lock is connected to the transposition support, and the chip material clamp is fixedly connected to the transposition support through the material clamp lock.
3. The robot-assisted chip rapid transport apparatus according to claim 1, wherein the magazine lock comprises: the lock comprises a lock base, a lock handle, a lock pressing plate, a lock connecting rod, a lock middle connecting rod, a lock swinging rod, a first hinge, a second hinge, a third hinge, a fourth hinge and a lock bolt, wherein the lock base is fixedly connected with the transposition bracket, the lock handle is fixedly connected with the lock middle connecting rod, and the lock pressing plate is fixedly connected with the lock swinging rod; the lock connecting rod is movably connected to the lock base through the first hinge, the lock swinging rod is movably connected to the lock base through a fourth hinge, one end of the lock middle connecting rod is movably connected to the lock connecting rod through the second hinge, and the other end of the lock middle connecting rod is movably connected to the lock swinging rod through the third hinge; the tail end of the locking pressing plate is fixedly connected with the locking bolt, and the head of the locking bolt is used for pressing the chip material clamp.
4. The manipulator-assisted chip rapid conveying equipment according to claim 3, wherein when the collet lock is in a locked state, the brain head presses on the chip collet, and the three points of the first hinge, the second hinge and the third hinge are in the same straight line.
5. The robot-assisted chip rapid transport apparatus according to claim 1, wherein the chip gripper comprises: the material clamping device comprises a material clamping body, a lifting push plate, a vertical guide pillar and a protection plate, wherein two ends of the vertical guide pillar are fixedly connected with the material clamping body, the lifting push plate is movably connected to the vertical guide pillar, and the protection plate is arranged in front of the lifting push plate.
6. The robot-assisted chip rapid transfer apparatus according to claim 1, wherein the thrust-raising mechanism comprises: the lifting mechanism comprises a lifting bottom plate, a lifting top plate, a lifting guide pillar, a lifting guide sleeve, a lifting sliding plate, a thrust workbench, a lifting driving motor, a synchronous belt transmission mechanism, a ball screw and a ball nut, wherein the lifting bottom plate and the lifting top plate are fixedly connected through the lifting guide pillar; the ball nut is fixedly connected to the ascending sliding plate, the ball screw is movably connected to the ascending bottom plate and the ascending top plate, an output shaft of the driving motor is connected to the ball screw through the synchronous belt transmission mechanism, and the ball nut is movably connected to the ball screw; and the upper part of the ascending sliding plate is provided with a thrust workbench for pushing the ascending push plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811017489.8A CN109095170B (en) | 2018-09-01 | 2018-09-01 | Quick conveying equipment for manipulator auxiliary chip |
| CN202010011910.5A CN111180374A (en) | 2018-09-01 | 2018-09-01 | Intelligent conveying system of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811017489.8A CN109095170B (en) | 2018-09-01 | 2018-09-01 | Quick conveying equipment for manipulator auxiliary chip |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010011910.5A Division CN111180374A (en) | 2018-09-01 | 2018-09-01 | Intelligent conveying system of chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109095170A CN109095170A (en) | 2018-12-28 |
| CN109095170B true CN109095170B (en) | 2020-02-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811017489.8A Active CN109095170B (en) | 2018-09-01 | 2018-09-01 | Quick conveying equipment for manipulator auxiliary chip |
| CN202010011910.5A Withdrawn CN111180374A (en) | 2018-09-01 | 2018-09-01 | Intelligent conveying system of chip |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010011910.5A Withdrawn CN111180374A (en) | 2018-09-01 | 2018-09-01 | Intelligent conveying system of chip |
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| US4292116A (en) * | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
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| CN103381960A (en) * | 2012-05-02 | 2013-11-06 | 立晔科技股份有限公司 | Chip-casting transfer device |
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| CN104986684A (en) * | 2015-07-31 | 2015-10-21 | 李赞芬 | Lift |
| CN205023480U (en) * | 2015-10-12 | 2016-02-10 | 苏州达恩克精密机械有限公司 | Discharge apparatus of chip mounting machine |
| CN105304534B (en) * | 2015-11-10 | 2018-05-15 | 东莞市沃德精密机械有限公司 | Chip attachment machine |
| CN205739453U (en) * | 2016-05-16 | 2016-11-30 | 沈阳友联电子装备有限公司 | A kind of balance device of chip |
| CN206148408U (en) * | 2016-10-26 | 2017-05-03 | 东莞市锐祥智能卡科技有限公司 | Packaging hardware of two interfaces chip |
| CN207226442U (en) * | 2017-07-25 | 2018-04-13 | 东莞朗诚微电子设备有限公司 | A kind of chip material transfering device |
-
2018
- 2018-09-01 CN CN201811017489.8A patent/CN109095170B/en active Active
- 2018-09-01 CN CN202010011910.5A patent/CN111180374A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN109095170A (en) | 2018-12-28 |
| CN111180374A (en) | 2020-05-19 |
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Effective date of registration: 20211220 Address after: 276000 shuangyueyuan Road, high tech Industrial Development Zone, Linyi City, Shandong Province Patentee after: Linyi Industry Research Institute Co.,Ltd. Address before: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Patentee before: WENZHOU KEHONG ROBOT TECHNOLOGY Co.,Ltd. |