CN109167189B

CN109167189B - Satellite antenna

Info

Publication number: CN109167189B
Application number: CN201811010104.5A
Authority: CN
Inventors: 邬富存; 贾建国; 章文才
Original assignee: Jiexin Zhejiang Communication Technology Co ltd
Current assignee: Jiexin Zhejiang Communication Technology Co ltd
Priority date: 2018-08-31
Filing date: 2018-08-31
Publication date: 2020-10-13
Anticipated expiration: 2038-08-31
Also published as: CN109167189A

Abstract

The invention provides a satellite antenna which comprises an antenna pot and a chassis, wherein the antenna pot is arranged on the chassis, the back of the chassis is provided with a motor for controlling the chassis and the antenna pot to rotate, and the motor or the antenna pot is provided with a piezoelectric energy collector for converting energy generated by the vibration of the antenna pot into electric energy. According to the satellite antenna, the piezoelectric energy collection is arranged on the back surface of the antenna pot or on the motor, vibration generated by blowing of the surface of the antenna pot by wind power is converted into electric energy for collection, waste of energy is avoided, meanwhile, the motor can vibrate continuously during working, the energy generated by vibration of the motor can be converted into the electric energy for recycling through the piezoelectric energy collection, and resources are saved.

Description

Satellite antenna

Technical Field

The invention relates to the technical field of satellite antennas, in particular to a satellite antenna.

Background

The main body of the satellite antenna is a pot which is usually called as a metal paraboloid structure and is used for reflecting satellite signals to a feed source positioned at a focus, and the satellite antenna is mainly used for collecting weak signals transmitted by satellites and removing noise in the weak signals as far as possible. Most satellite antennas have a parabolic body, but some multi-focus antennas are formed by combining a spherical surface and a parabolic surface, and the received satellite signals are concentrated to the focus point through the reflection of the parabolic antenna.

In the prior art, the satellite antenna provides power through an external power supply, the motor is arranged in the satellite antenna and used for controlling the antenna to rotate, the motor continuously generates vibration in work, meanwhile, the satellite antenna is mostly installed at a high place, other shielding objects are not arranged around the satellite antenna, the satellite antenna is easy to be blown by strong wind, and the vibration is generated on the surface of the satellite antenna, however, the current satellite antenna cannot convert energy generated by vibration, and energy waste is caused.

In view of the above-mentioned drawbacks, the inventors of the present invention have finally obtained the present invention through a long period of research and practice.

Disclosure of Invention

In order to solve the above problems, the technical solution of the present invention is to provide a satellite antenna, which includes an antenna pan and a chassis, wherein the antenna pan is mounted on the chassis, a motor is disposed on the back of the chassis for controlling the rotation of the chassis and the antenna pan, and a piezoelectric energy collector is disposed on the motor or the antenna pan for converting energy generated by the vibration of the antenna pan into electric energy.

Further, the piezoelectric energy collector comprises a piezoelectric layer and a substrate, a first adhesive layer is arranged between the piezoelectric layer and the substrate,

further, the material of the first bonding layer is epoxy resin conductive adhesive doped with silver debris.

Further, the substrate comprises a first base, a second bonding layer is arranged on the first base, and a first conductive layer is arranged on the second bonding layer.

Further, the first conductive layer is an interdigital electrode.

Furthermore, the piezoelectric layer comprises a second base, a seed layer is arranged on the lower surface of the second base, a second conductive layer is arranged on the seed layer, and the first bonding layer is located between the first conductive layer and the second conductive layer.

Further, the thickness of the first conductive layer and the second conductive layer is between 10nm and 200 nm.

Further, the thickness of the first adhesive layer and the second adhesive layer is between 700nm and 5 um.

Further, the thickness of the seed layer is between 20nm and 200 nm.

Further, still include signal enhancement mechanism, signal enhancement mechanism includes subreflector, waveguide dustcoat and waveguide pipe, the waveguide dustcoat includes macrostoma end and osculum end, be provided with subreflector in the macrostoma end osculum end is provided with the waveguide pipe, the waveguide pipe lower extreme is equipped with solid fixed ring, gu fixed ring with the antenna pot is connected, be provided with the feed under the chassis, the waveguide pipe with the feed intercommunication.

Compared with the prior art, the invention has the beneficial effects that: 1. according to the satellite antenna, the piezoelectric energy collection is arranged on the back surface of the antenna pot or the motor, so that the vibration generated by the surface of the antenna pot blown by wind power is converted into electric energy for collection, the waste of energy is avoided, meanwhile, the motor can vibrate continuously during working, the energy generated by the vibration can be converted into the electric energy for recovery through the piezoelectric energy collection, and resources are saved; 2. the first bonding layer is made of epoxy resin conductive adhesive doped with silver chips, so that the conductivity of the first bonding layer is greatly improved, and the charge in the piezoelectric energy collector can flow more smoothly; 3. the first conducting layer in the piezoelectric energy collector is an interdigital electrode, charges can be led out only by one conducting layer, the thickness of the piezoelectric energy collector is reduced, and the piezoelectric energy collector is suitable for satellite antennas.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.

FIG. 1 is a first schematic structural diagram of a satellite antenna according to the present invention;

FIG. 2 is a second schematic structural diagram of a satellite antenna according to the present invention;

FIG. 3 is a right side cross-sectional view of the piezoelectric energy harvester of the present invention;

FIG. 4 is a front cross-sectional view of a piezoelectric energy harvester of the present invention in preparation;

FIG. 5 is a top cross-sectional view of a piezoelectric energy harvester of the present invention;

FIG. 6 is a right side sectional view of a piezoelectric energy harvester of the present invention in preparation;

FIG. 7 is a dicing diagram of a piezoelectric energy harvester of the invention;

FIG. 8 is a schematic diagram of a partial structure of a satellite antenna according to the present invention;

FIG. 9 is an exploded view of the signal enhancement mechanism of the present invention;

fig. 10 is a schematic diagram of a partial structure of a satellite antenna according to the present invention.

The figures in the drawings represent:

1-antenna pan, 2-chassis, 3-signal enhancement mechanism, 4-first gear, 5-motor, 6-piezoelectric energy collection, 7-first adhesive layer, 8-first base, 9-second adhesive layer, 10-first conductive layer, 11-first protruding end, 12-second protruding end, 13-second conductive layer, 14-seed layer, 15-second base, 16-protective layer, 17-flanging, 18-mounting rack, 19-secondary reflector, 20-waveguide housing, 21-waveguide tube, 22-fixing ring, 23-secondary reflector, 24-baffle ring, 25-tuner, 26-piezoelectric layer, 27-substrate.

Detailed Description

The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.

Example one

The invention provides a satellite antenna, which is shown by combining a figure 1 and a figure 2 and comprises an antenna pot 1 and a chassis 2, wherein the antenna pot 1 is arranged on the chassis 2, a signal enhancing mechanism 3 is arranged in the antenna pot 1, a first gear 4 is arranged at the back of the chassis 2, a motor 5 provides power for rotation through gear transmission and is used for controlling the rotation of the chassis 2 and the antenna pot 1, the antenna pot 1 rotates along with the chassis 2, a piezoelectric energy collector 6 is arranged on the back of the motor 5 or the antenna pot 1 and is used for converting energy generated by vibration of the installation position of the piezoelectric energy collector into electric energy.

According to the satellite antenna, the piezoelectric energy collection 6 is arranged on the back surface of the antenna pot 1 or the motor 5, vibration generated by blowing of wind power on the surface of the antenna pot 1 is converted into electric energy for collection, waste of energy is avoided, meanwhile, the motor 5 can vibrate continuously during working, the piezoelectric energy collection 6 can convert the energy generated by vibration into electric energy for recycling, and resources are saved.

Example two

The satellite antenna according to the first embodiment is different from the satellite antenna according to the first embodiment in that, as shown in fig. 3 to 5, the piezoelectric energy collector 6 includes the piezoelectric layer 26 and the substrate 27, the first adhesive layer 7 is applied between the piezoelectric layer 26 and the substrate 27, and the piezoelectric layer 26 and the substrate 27 are bonded together through a bonding process with a certain temperature and pressure, so that the thickness of the compression energy collector 6 is effectively controlled and is as small as possible.

The substrate 27 comprises a first base 8, a second adhesive layer 9, a first conductive layer 10.

The first base 8 is made of silicon materials, a front groove is formed in the front surface of the first base 8, a back groove is formed in the back surface of the first base 8, the cross sections of the front groove and the back groove are L-shaped, the front groove comprises a front groove bottom and a first protruding end 11, and the first protruding end 11 is used for serving as a reference for the height of the piezoelectric layer 26; the back groove comprises a back groove bottom and a second raised end 12, the second raised end 12 forming a mass of the entire device for sensing environmental vibrations, thereby expanding the vibration range of the piezoelectric energy harvester 6.

The first conducting layer 10 is arranged on the bottom of the front groove, the first conducting layer 10 forms an interdigital electrode, the interdigital electrode is connected with external energy storage equipment through a conducting wire, and the energy storage equipment is a storage battery, so that the output of charges is realized. The first conductive layer 10 is made of a gold material, the thickness of the first conductive layer 10 is usually between 10nm and 200nm, and should not be lower than 10nm, and the efficiency of the first conductive layer 10 in the conduction below 10nm is low.

The second adhesive layer 9 is a conductive adhesive, which is located between the bottom of the front groove and the first conductive layer 10, and the coating thickness thereof is usually preferably between 1um and 7um, and should not exceed 7um, which is easy to affect the output of the charges. The lattice constants of silicon and gold are close to each other, and it is difficult for the first conductive layer 10 to form a thin film on the first base 8 smoothly, and the second adhesive layer 9 is required as an intermediate for adhering the first base 8 and the first conductive layer 10.

Preferably, the second adhesive layer 9 is made of epoxy conductive adhesive, and the inside of the epoxy conductive adhesive is doped with silver debris, so that the adhesive property and the conductive property are provided, and the first base 8 and the first conductive layer 10 can be well adhered without affecting the charge transfer.

Wherein, the thickness of the second adhesive layer 9 and the thickness of the piezoelectric layer 26 have a direct relation, and the two have an inverse relation, when the thickness of the second adhesive layer 9 is larger, the thickness of the piezoelectric layer 26 is smaller; when the thickness of the second adhesive layer 9 is small, the thickness of the piezoelectric layer 26 is large, and the thickness of the piezoelectric energy collector 6 as a whole is ensured to be in a small range.

The piezoelectric layer 26 includes the second conductive layer 13, the seed layer 14, and the second base 15.

The second base 15 is a PZT (lead zirconate titanate piezoelectric ceramic) sheet, the second conductive layer 13 is arranged on the lower surface of the second base 15, the second conductive layer 13 is made of gold material, the thickness of the second conductive layer 13 is 10 nm-200 nm, and should not be less than 10nm, so that the effect of improving the charge collection efficiency can be achieved. The upper surface of the piezoelectric layer 26 is flush with the upper surface of said first raised end 11, avoiding an excessive thickness of the piezoelectric layer 26.

The seed layer 14 is disposed between the second conductive layer 13 and the second pedestal 15, the seed layer 14 is made of a chromium material to ensure that the second conductive layer 13 can be smoothly formed on the second pedestal 15, and the seed layer 14 has a thickness of 20nm to 200nm, which is not lower than 20nm, and is easy to cause the seed layer 14 to fail. The second conductive layer 13 and the first conductive layer 10 are connected by a first adhesive layer 7, and the first adhesive layer 7 is an epoxy conductive adhesive, and the coating thickness thereof is usually preferably between 1um and 7um, but should not exceed 7 um. Preferably, the epoxy resin conductive paste is doped with silver debris to have adhesive and conductive properties, so that the piezoelectric layer 26 and the substrate 27 can be well adhered and the flow of electric charges can be ensured.

Except the mass block formed by the second protruding end 12, the other parts of the whole device form a cantilever beam, most of the positions where the piezoelectric layer 26 is installed are cantilever beams, when the device works, the mass block receives vibration of the environment to drive the cantilever beams to vibrate, the PZT sheet of the second base 15 continuously deforms to generate charges on the upper surface and the lower surface of the PZT sheet, and finally the charges are led out through the interdigital electrode of the first conductive layer 10.

EXAMPLE III

The satellite antenna according to the second embodiment is different from the satellite antenna according to the second embodiment in that, with reference to fig. 6 and 7, the processing method of the piezoelectric energy collector 6 includes:

the substrate 27 is formed by using a silicon wafer having a <110> crystal orientation as the first base 8, but in other embodiments, materials such as germanium, silicon germanium, and silicon carbide may be used for the first base 8. The first base 8 is subjected to a double-sided polishing planarization process to reduce surface defects, after roughness is reduced, a patterned protective layer 16 is prepared on the upper surface and the lower surface of the first base, the protective layer 16 is made of silicon nitride and can be formed by depositing silicon oxide, the deposition temperature is 600-900 ℃, 780 ℃ is preferred, the patterned shape of the protective layer 16 prepared on the first base 8 is rectangular, the area of the rectangular structure on the front side is larger than that of the rectangular structure on the back side, and the thickness of the silicon nitride is 200 nm-500 nm.

Put first base 8 into potassium hydroxide solution and corrode, make first base 8 positive and negative all corrode out the recess, the concentration of potassium hydroxide solution is 30%, and its operating environment is 70 degrees centigrade, and rate of corrosion 1um/min, and the potassium hydroxide solution can corrode the silicon of <110> crystal orientation under above-mentioned condition to form vertically recess, the shape of recess is the rectangle.

And preparing the epoxy resin conductive adhesive on the front surface of the second base 15 to form a second bonding layer 9, and performing semi-curing treatment on the second bonding layer 9. The second adhesive layer 9 is prepared by spin coating. The second base 15 is placed on a spin coater, epoxy resin conductive adhesive is uniformly prepared in a front groove of the first base 8 through high-speed rotation, and meanwhile, the epoxy resin conductive adhesive is inevitably prepared on the protective layer 16.

And (3) evaporating gold on the second bonding layer 9 to form a first conductive layer 10, scratching the first conductive layer 10 with low power by a laser cutting machine, and meanwhile, inevitably evaporating gold on the protective layer 16 in the preparation process, wherein the gold is positioned on the epoxy resin conductive adhesive.

The piezoelectric layer 26 is formed by sputtering chromium on a PZT (lead zirconate titanate piezoelectric ceramic) sheet as the second base 15 to form the seed layer 14, vapor-plating gold on the seed layer 14 to form the second conductive layer 13, and coating an epoxy resin conductive paste on the second conductive layer 13 to form the first adhesive layer 7, thereby obtaining the piezoelectric layer 26.

The first adhesive layer 7 side of the piezoelectric layer 26 is placed on the corresponding position of the substrate 27, and then the two are bonded together by a bonding process, which is conventionally performed at a temperature of 120 degrees celsius for 3 hours, or at a temperature of 140 degrees celsius for 2 hours, or at a temperature of 160 degrees celsius for 50 minutes. In this embodiment, the second adhesive layer 9 has been subjected to a semi-curing process, and the parameters of the bonding process are continued to cause the second adhesive layer 9 to overheat, which makes it brittle and unfavorable for the piezoelectric energy collector 6, so that a two-step bonding method is adopted to bond the adhesive layer and other layers, the first step is to semi-cure the second adhesive layer 9, the semi-curing is about 80% of the curing temperature and 60% of the curing time of the bonding process, i.e. 108 minutes at a temperature of 100 ℃, or 72 minutes at a temperature of 110 ℃, or 30 minutes at a temperature of 130 ℃, and the second step is about 75% of the curing temperature and 70% of the curing time of the bonding process, i.e. if the first step uses 72 minutes at 110 ℃, the second step uses 80 minutes at 105 ℃.

The first conductive layer 10 is properly extended under the second processing condition of the two-step bonding process, and is broken away along the scratches to form interdigital electrodes, and wires are welded to the two poles of the interdigital electrodes to lead out the electric energy, preferably, the interdigital electrodes are connected to an energy storage device through the wires, the energy storage device is a storage battery, and the electric energy converted by the piezoelectric energy collector 6 flows into the storage battery through the interdigital electrodes.

Since the first adhesive layer 7 and the second adhesive layer 9 are epoxy conductive adhesives, the epoxy conductive adhesives are compressed after the bonding process of heating and pressurizing is used, and the thickness of the bonded epoxy conductive adhesives is generally between 700nm and 5um, so that a tight connection is formed between the piezoelectric layer 26 and the substrate 27. After the bonding process, a part of the epoxy resin conductive adhesive can be squeezed into the gap between the PZT sheet and the groove, and if the epoxy resin conductive adhesive is too much, the epoxy resin conductive adhesive can be separated from the groove 13 and squeezed above the substrate.

This process requires attention to: the size of the piezoelectric layer 26 should be slightly smaller than the front surface groove of the first base 8 to prevent the piezoelectric layer 26 from being inserted, but during the bonding process, the piezoelectric layer should be tightly bonded at a position close to the tail end, i.e., the end far from the first protruding end 11, without leaving a gap to prevent short circuit.

After bonding is completed, thinning the piezoelectric layer 26, so that the piezoelectric layer 26 is flush with the first protruding end 11 on the front surface of the first base 8, in other embodiments, the material inevitably prepared on the first protruding end 11 does not need to be removed, and the height of the piezoelectric layer 26 after the material is prepared on the first protruding end 11 is flush with the height of the first protruding end 11;

specifically, the first base 8, i.e., the PZT sheet, is subjected to a thinning process by CMP (chemical mechanical polishing) and/or wet etching until it is flush with the first bump end 11 to obtain a desired thickness.

In the process, the thickness of the piezoelectric energy collector 6 is controlled by the thickness of the first adhesive layer 7 and the second adhesive layer 9 and the depth of the front groove.

Scribing on the front surface of the first base 8 according to the structural shape of the front surface groove of the first base, and releasing the cantilever beam arm and the mass block;

specifically, a scribing instrument is adopted, 100um is reserved in a scribing channel, and the scribing channel is penetrated to release a mass block.

Example four

The satellite antenna according to the first embodiment is different from the satellite antenna according to the first embodiment in that, as shown in fig. 8, the antenna pan 1 is a pan-shaped structure, a circular hole is formed in the center of the antenna pan, the signal enhancement mechanism 3 is disposed on the circular hole, a flange 17 is disposed at an outer edge of the back of the antenna pan 1, the flange 17 is thinner, the piezoelectric energy collector 6 is disposed on the inner side of the flange 17, and when the antenna pan 1 is blown by wind, vibration generated at a position far away from the center is the largest, in this embodiment, vibration generated at the flange 17 is the largest, and energy collected when the piezoelectric energy collector 6 is mounted at this position is the largest.

Antenna pot 1 is installed on chassis 2, chassis 2 below is provided with mounting bracket 18, chassis 2 is fixed on the installation face of mounting bracket 18, first gear 4 under chassis 2 is located the installation face top, be provided with the bearing on the installation face, make chassis 2 and first gear 4 can rotate, chassis 2 and first gear 4 are relatively fixed, be provided with motor 5 on the installation face, be provided with the second gear with chassis 2 below first gear 4 engaged with on motor 5's the transmission shaft, motor 5 provides power for chassis 2's rotation, be provided with on motor 5's surface piezoelectric energy collector 6, motor 5 can be continuous in the work and produce the vibration, convert the vibration on its surface into the electric energy and retrieve, can effectual energy saving.

Preferably, the piezoelectric energy collector 6 can be installed on the back of the antenna pan 1 and the motor 5 at the same time, or can be installed on only one of the two, the piezoelectric energy collector 6 stores the collected electric energy into the storage battery, and the storage battery is installed on the mounting rack 18, so that when the antenna is powered off accidentally, the storage battery outputs current to allow the antenna to continue to work, and the stability of the antenna is ensured.

Preferably, still be provided with the siren in antenna inside, when the antenna outage, perhaps the battery holds when full, will send signal to staff, remind the staff to carry out the change of maintenance or battery.

EXAMPLE five

The satellite antenna according to the fourth embodiment is different from the satellite antenna according to the fourth embodiment in that, as shown in fig. 9 and 10, the signal enhancement mechanism 3 includes a sub-reflector 19, a waveguide housing 20, a waveguide tube 21 and a fixing ring 22, the waveguide tube 21 is a hollow metal or metal-clad tube, the interior of the waveguide tube 21 is smooth and is used for transmitting the received satellite signals, a connector is disposed at the upper end of the waveguide tube 21 and is used for connecting the waveguide housing 20, and a connecting ring is disposed at the lower end of the waveguide tube 21 and is used for mounting the waveguide tube 21.

The waveguide housing 20 is in a horn structure and is provided with a small head end and a large head end, the small head end is fixed with a connector of the waveguide tube 21 through a screw, the waveguide housing 20 is in a hollow structure, the large head end of the waveguide housing 20 is provided with a secondary reflector 19, the secondary reflector 19 comprises a cylindrical body and a secondary reflecting plate 23, the secondary reflecting plate 23 is arranged at the bottom of the body of the secondary reflector 19, an annular concave belt is arranged in the secondary reflecting plate 23, a raised conical tip is arranged at the center of the annular concave belt, namely the center of the secondary reflecting plate 23, the secondary reflector 19 is positioned at the focus of the antenna pan 1, the antenna pan 1 converges received signals at the secondary reflector 19, the secondary reflecting plate 23 of the secondary reflector 19 has the function of secondary signal gathering, a feed source is arranged at the focus of the secondary reflector 19 and is communicated with the waveguide tube and then transmits the signals into the waveguide tube 21, the signals are received in a centralized manner, so that the strength of the signals is greatly enhanced.

The connecting ring at the lower end of the waveguide tube 21 is of a wafer-shaped structure, bolt holes are formed in the connecting ring, bolt holes matched with the bolt holes are formed in the fixing ring 22, the connecting ring is fixed on the fixing ring 22 through bolts, the fixing ring 22 is fixed on the chassis 2, the blocking ring 24 is sleeved on the outer side of the fixing ring 22, and the blocking ring 24 is located between the antenna pot and the signal enhancement mechanism and used for protecting the fixing ring 22 and avoiding abrasion of the fixing ring.

EXAMPLE six

The satellite antenna according to the fifth embodiment is different from the satellite antenna according to the fifth embodiment in that a tuner 25 is disposed under the chassis 2, the tuner 25 is communicated with the waveguide 21, the tuner 25 collects and processes signals transmitted from the waveguide 21, that is, the tuner 25 down-converts and amplifies the received satellite signals, and then transmits the satellite signals to a satellite receiver, and the satellite receiver demodulates the satellite signals transmitted from the tuner 25 to demodulate satellite television image signals and accompanying sound signals.

The tuner 25 is mounted below the mounting surface of the mounting frame 18, the mounting surface, the chassis 2 and the first gear 4 under the chassis 2 are all provided with consistent round holes, the tuner 25 and the waveguide tube 21 pass through the round holes to be connected, and the chassis 2 and the first gear 4 under the chassis 2 are not influenced by the tuner 25 and the waveguide tube 21 when rotating.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and additions can be made without departing from the method of the present invention, and these modifications and additions should also be regarded as the protection scope of the present invention.

Claims

1. A satellite antenna is characterized by comprising an antenna pan and a chassis, wherein the antenna pan is arranged on the chassis, the back of the chassis is provided with a motor for controlling the rotation of the chassis and the antenna pan, and the motor or the antenna pan is provided with a piezoelectric energy collector for converting energy generated by the vibration of the antenna pan into electric energy; the piezoelectric energy collector comprises a piezoelectric layer and a substrate, wherein a first adhesive layer is arranged between the piezoelectric layer and the substrate; the substrate comprises a first base, wherein a second bonding layer is arranged on the first base, and a first conductive layer is arranged on the second bonding layer; the piezoelectric layer comprises a second base, a seed layer is arranged on the lower surface of the second base, a second conducting layer is arranged on the surface of the other side of the seed layer, and the first bonding layer is located between the first conducting layer and the second conducting layer.

2. The satellite antenna of claim 1, wherein the material of the first adhesive layer is an epoxy conductive adhesive doped with silver debris.

3. The satellite antenna of claim 1, wherein the first conductive layer is an interdigitated electrode.

4. The satellite antenna of claim 1, wherein the first conductive layer and the second conductive layer have a thickness between 10nm and 200 nm.

5. The satellite antenna of claim 1, wherein the thickness of the first adhesive layer and the second adhesive layer is between 700nm and 5 um.

6. The satellite antenna of claim 1, wherein the seed layer has a thickness of between 20nm and 200 nm.

7. The satellite antenna according to any one of claims 1 to 6, further comprising a signal enhancement mechanism, wherein the signal enhancement mechanism comprises a sub-reflector, a waveguide outer cover and a waveguide tube, the waveguide outer cover comprises a large-opening end and a small-opening end, the large-opening end is internally provided with the sub-reflector, the small-opening end is provided with the waveguide tube, the lower end of the waveguide tube is provided with a fixing ring, the fixing ring is connected with the antenna pan, a feed source is arranged at a focus of the sub-reflector, and the waveguide tube is communicated with the feed source.