CN109149101B - Satellite antenna outer cover - Google Patents
Satellite antenna outer cover Download PDFInfo
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- CN109149101B CN109149101B CN201811010102.6A CN201811010102A CN109149101B CN 109149101 B CN109149101 B CN 109149101B CN 201811010102 A CN201811010102 A CN 201811010102A CN 109149101 B CN109149101 B CN 109149101B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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Abstract
The invention provides a satellite antenna outer cover which comprises an upper cover and a bottom shell, wherein the upper cover is buckled on the bottom shell, an accommodating cavity for installing a satellite antenna is formed between the upper cover and the bottom shell, the upper cover and the bottom shell are connected and sealed, the satellite antenna is positioned in the accommodating cavity, a wiring terminal is further arranged on the bottom shell, the satellite antenna is electrified with the outside through the wiring terminal, and a piezoelectric energy collector is arranged on the inner wall of the upper cover and used for converting energy generated by the vibration of the upper cover into electric energy. According to the satellite antenna outer cover, the piezoelectric energy collection is arranged in the upper cover of the outer cover, so that the vibration generated on the surface of the upper cover due to the influence of environmental factors such as wind blowing or rain is converted into electric energy to be collected, the waste of energy is avoided, and the resources are saved.
Description
Technical Field
The invention relates to the technical field of satellite antennas, in particular to a satellite antenna outer cover.
Background
The main body of the satellite antenna is a pot which is usually called as a metal paraboloid structure and is used for reflecting satellite signals to a feed source positioned at a focus, and the satellite antenna is mainly used for collecting weak signals transmitted by satellites and removing noise in the weak signals as far as possible. A satellite antenna generally requires an antenna housing to protect the antenna and a series of wiring devices and elements connected to the antenna, and the antenna housing has functions of protection, conductivity, reliability, decorative lines, etc., and also needs to protect the satellite antenna from the destructive influence of natural factors such as strong wind, acid rain, snow, burning sun, etc., to prolong the life of the whole system and various parts, and to ensure that the wave-transmitting rate is large enough to minimize the influence on signal reception.
The position that the antenna dustcoat was installed is mostly the eminence, does not have other shelters from the thing all around, in addition in order to guarantee to pass through the thickness of thin rate big enough, the thickness of antenna dustcoat can not prevent that it from keeping steady in the weather, consequently the surface of antenna dustcoat can the continuation produce the vibration, however present antenna dustcoat can not convert the energy that the vibration produced, causes the waste of energy.
In view of the above-mentioned drawbacks, the inventors of the present invention have finally obtained the present invention through a long period of research and practice.
Disclosure of Invention
In order to solve the above problems, the technical solution adopted by the present invention is to provide a satellite antenna housing, which includes an upper cover and a bottom case, wherein the upper cover is fastened on the bottom case, an accommodating cavity for installing a satellite antenna is formed between the upper cover and the bottom case, the upper cover and the bottom case are connected and sealed, the satellite antenna is located in the accommodating cavity, the bottom case is further provided with a connection terminal, the satellite antenna is electrified with the outside through the connection terminal, and a piezoelectric energy collector is arranged on an inner wall of the upper cover and is used for converting energy generated by vibration of the upper cover into electric energy.
Further, the piezoelectric energy collector comprises a piezoelectric layer and a substrate, and a first adhesive layer is arranged between the piezoelectric layer and the substrate.
Further, the material of the first bonding layer is epoxy resin conductive adhesive doped with silver debris.
Further, the substrate comprises a first base, a second bonding layer is arranged on the first base, and a first conductive layer is arranged on the second bonding layer.
Further, the first conductive layer is an interdigital electrode.
Furthermore, the piezoelectric layer comprises a second base, a seed layer is arranged on the lower surface of the second base, a second conductive layer is arranged on the seed layer, and the first bonding layer is located between the first conductive layer and the second conductive layer.
Further, the thickness of the first conductive layer and the second conductive layer is between 10nm and 200 nm.
Further, the thickness of the first adhesive layer and the second adhesive layer is between 700nm and 5 um.
Further, the thickness of the seed layer is between 20nm and 200 nm.
Furthermore, a wiring end is arranged on the bottom shell, and the satellite antenna is electrified with the outside through the wiring end.
Compared with the prior art, the invention has the beneficial effects that: 1. according to the satellite antenna outer cover, the piezoelectric energy collection is arranged in the upper cover of the outer cover, so that the vibration generated on the surface of the upper cover due to the influence of environmental factors such as wind blowing or rain is converted into electric energy to be collected, the waste of energy is avoided, and resources are saved; 2. the first bonding layer is the epoxy resin conductive adhesive doped with silver scraps, so that the conductivity of the first bonding layer is greatly improved, and the circulation of charges in the piezoelectric energy collector is smoother. 3. The first conducting layer in the piezoelectric energy collector is an interdigital electrode, charges can be led out only by one conducting layer, the thickness of the piezoelectric energy collector is reduced, and the piezoelectric energy collector is suitable for satellite antennas.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic diagram of the overall construction of the satellite antenna enclosure of the present invention;
FIG. 2 is a schematic structural view of the upper cover of the present invention;
FIG. 3 is a schematic view of the satellite antenna mounting structure of the present invention;
FIG. 4 is a right side cross-sectional view of the piezoelectric energy harvester of the present invention;
FIG. 5 is a front cross-sectional view of a piezoelectric energy harvester of the present invention in preparation;
FIG. 6 is a top cross-sectional view of a piezoelectric energy harvester of the present invention;
FIG. 7 is a right side sectional view of a piezoelectric energy harvester of the invention in preparation;
FIG. 8 is a dicing diagram of a piezoelectric energy harvester of the invention;
FIG. 9 is a schematic view of the bottom case structure of the present invention;
fig. 10 is a schematic view of the bottom structure of the satellite antenna housing of the present invention.
The figures in the drawings represent:
1-upper cover, 2-bottom shell, 3-containing cavity, 4-satellite antenna, 5-terminal, 6-piezoelectric energy collection, 7-first adhesive layer, 8-first base, 9-second adhesive layer, 10-first conductive layer, 11-first protruding end, 12-second protruding end, 13-second conductive layer, 14-seed layer, 15-second base, 16-protective layer, 17-piezoelectric layer, 18-substrate, 19-connecting edge, 20-mounting plate, 21-reinforcing plate and 22-backing plate.
Detailed Description
The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
Example one
The invention provides a satellite antenna outer cover which is shown in combined figures 1-3 and comprises an upper cover 1 and a bottom shell 2, wherein the upper cover 1 is buckled on the bottom shell 2, an accommodating cavity 3 for installing a satellite antenna 4 is formed between the upper cover 1 and the bottom shell 2, the upper cover 1 and the bottom shell 2 are connected and sealed, the satellite antenna 4 is positioned in the accommodating cavity 3, a wiring terminal 5 is further arranged on the bottom shell 2, the satellite antenna 4 is electrified with the outside through the wiring terminal 5, and a piezoelectric energy collector 6 is arranged on the inner wall of the upper cover 1 and used for converting energy generated by the vibration of the upper cover 1 into electric energy.
According to the satellite antenna outer cover, the piezoelectric energy collector 6 is arranged in the upper cover 1 of the outer cover, so that vibration generated by the influence of environmental factors such as wind blowing or rain on the surface of the upper cover 1 is converted into electric energy to be collected, the waste of energy is avoided, and resources are saved.
Example two
The satellite antenna enclosure according to the first embodiment is different from the satellite antenna enclosure according to the first embodiment in that, as shown in fig. 4 to 6, the piezoelectric energy collector 6 includes the piezoelectric layer 17 and the substrate 18, the first adhesive layer 7 is applied between the piezoelectric layer 17 and the substrate 18, and the piezoelectric layer 17 and the substrate 18 are bonded together through a bonding process with a certain temperature and pressure, so that the thickness of the compression energy collector 6 is effectively controlled to be as small as possible.
The substrate 18 comprises a first base 8, a second adhesive layer 9, a first conductive layer 10.
The first base 8 is made of silicon materials, a front groove is formed in the front surface of the first base 8, a back groove is formed in the back surface of the first base 8, the cross sections of the front groove and the back groove are L-shaped, the front groove comprises a front groove bottom and a first protruding end 11, and the first protruding end 11 is used for serving as a reference for the height of the piezoelectric layer 17; the back groove comprises a back groove bottom and a second raised end 12, the second raised end 12 forming a mass of the entire device for sensing environmental vibrations, thereby expanding the vibration range of the piezoelectric energy harvester 6.
The first conducting layer 10 is arranged on the bottom of the front groove, the first conducting layer 10 forms an interdigital electrode, the interdigital electrode is connected with an external energy storage device through a lead, the energy storage device is a storage battery, accordingly, output of charges is achieved, the first conducting layer 10 is made of gold materials, the thickness of the first conducting layer 10 is usually 10 nm-200 nm, but the thickness of the first conducting layer 10 is not smaller than 10nm, and the conducting efficiency of the first conducting layer 10 below 10nm is low.
The second adhesive layer 9 is a conductive paste, which is located between the bottom of the front groove and the first conductive layer 10, and is preferably applied to a thickness of 1um to 7um, but should not exceed 7um, which would affect the output of charges. Since the lattice constants of silicon and gold are close to each other, it is difficult for the first conductive layer 10 to form a thin film on the first base 8 smoothly, which requires the second adhesive layer 9 to be provided between the first base 8 and the first conductive layer 10 for adhesion.
Preferably, the second adhesive layer 9 is made of epoxy resin conductive adhesive, and the silver debris is doped in the second adhesive layer, so that the adhesive property and the conductive property are provided, and the first base 8 and the first conductive layer 10 can be well adhered.
Wherein, the thickness of the second adhesive layer 9 and the thickness of the piezoelectric layer 17 have a direct relation, and the two have an inverse relation, when the thickness of the second adhesive layer 9 is larger, the thickness of the piezoelectric layer 17 is smaller; when the thickness of the second adhesive layer 9 is small, the thickness of the piezoelectric layer 17 is large, ensuring that the thickness of the piezoelectric energy collector 6 as a whole is as small as possible.
The piezoelectric layer 17 includes the second conductive layer 13, the seed layer 14, and the second base 15.
The PZT (lead zirconate titanate piezoelectric ceramic) sheet is used as a second base 15, a second conductive layer 13 is arranged on the lower surface of the second base 15, the second conductive layer 13 is made of gold materials, the thickness of the second conductive layer 13 is 10 nm-200 nm, but the thickness is not lower than 10nm, and the PZT sheet is used for increasing the collection efficiency of electric charges. The upper surface of the piezoelectric layer 17 is flush with the upper surface of said first raised end 11, avoiding an excessive thickness of the piezoelectric layer 17.
A seed layer 14 is arranged between the second conductive layer 13 and the second pedestal 15, the seed layer 14 is made of a chromium material to ensure that the second conductive layer 13 can be smoothly formed on the second pedestal 15, and the seed layer 14 has a thickness of 20nm to 200nm, but should not be lower than 20nm, so that the seed layer 14 fails; the second conductive layer 13 and the first conductive layer 10 are connected through a first adhesive layer 7, the first adhesive layer 7 is an epoxy resin conductive adhesive, and the coating thickness of the epoxy resin conductive adhesive is usually preferably 1um to 7um, but should not exceed 7 um; preferably, the epoxy resin conductive paste is doped with silver debris to have adhesive and conductive properties, so that the piezoelectric layer 17 and the substrate 18 can be well bonded.
The parts of the whole device except the mass block form a cantilever beam, the piezoelectric layer 17 is arranged on the cantilever beam, when the device works, the mass block receives the vibration of the environment to drive the cantilever beam to vibrate, the PZT sheet of the second base 15 continuously deforms to generate electric charges on the upper surface and the lower surface of the PZT sheet, and finally the electric charges are led out through the interdigital electrode of the first conductive layer 10.
EXAMPLE III
The satellite antenna housing according to the second embodiment is different from the satellite antenna housing according to the second embodiment in that, with reference to fig. 7 and 8, the processing method of the piezoelectric energy collector 6 includes:
the substrate 18 is fabricated by using a silicon wafer with a <110> crystal orientation as the first base 8, and in other embodiments, materials such as germanium, silicon carbide, and the like may be used for the first base 8. After the first base 8 is subjected to a double-side polishing (e.g., CMP) planarization process to reduce surface defects and roughness, a patterned protective layer 16 is prepared on the upper and lower surfaces of the first base, the protective layer 16 is silicon nitride and can be formed by depositing silicon oxide (preferably by a low-temperature CVD process), the deposition temperature is 600-900 ℃, and is preferably 780 ℃, the patterned shape of the protective layer 16 prepared on the first base 8 is rectangular, the area of the rectangular structure on the front surface is larger than that of the rectangular structure on the back surface, and the thickness of the silicon nitride is between 200nm and 500 nm.
Put first base 8 into potassium hydroxide solution and corrode, make first base 8 positive and negative all corrode out the recess, the concentration of potassium hydroxide solution is 30%, and its operating environment is 70 degrees centigrade, and rate of corrosion 1um/min, and the potassium hydroxide solution can corrode the silicon of <110> crystal orientation under above-mentioned condition to form vertically recess, the shape of recess is the rectangle.
And preparing the epoxy resin conductive adhesive on the front surface of the second base 15 to form a second bonding layer 9, and semi-curing the second bonding layer 9. The second bonding layer 9 is prepared in a glue throwing mode, the second base 15 is placed on the glue throwing machine, epoxy resin conductive glue is uniformly prepared in a front groove of the first base 8 through high-speed rotation, and meanwhile, the epoxy resin conductive glue is inevitably prepared on the protective layer 16.
And (3) evaporating gold on the second bonding layer 9 to form a first conductive layer 10, scratching the first conductive layer 10 with low power by a laser cutting machine, and meanwhile, inevitably evaporating gold on the protective layer 16 in the preparation process, wherein the gold is positioned on the epoxy resin conductive adhesive.
Manufacturing a piezoelectric layer 17, using a PZT (lead zirconate titanate piezoelectric ceramic) sheet as a second base 15, sputtering chromium on the second base to form a seed layer 14, evaporating gold on the seed layer 14 to form a second conductive layer 13, coating epoxy resin conductive adhesive on the second conductive layer 13 to form a first adhesive layer 7, and obtaining the piezoelectric layer 17;
the first adhesive layer 7 side of the piezoelectric layer 17 is placed on the corresponding position of the substrate 18, and then the two are bonded together by a bonding process, which is conventionally performed at a temperature of 120 degrees celsius for 3 hours, or at a temperature of 140 degrees celsius for 2 hours, or at a temperature of 160 degrees celsius for 50 minutes. In this embodiment, the second adhesive layer 9 has been subjected to a semi-curing process, and the parameters of the bonding process are continued to cause the second adhesive layer 9 to overheat, which makes it brittle and unfavorable for the piezoelectric energy collector 6 to be used, so that a two-step bonding method is adopted to bond the adhesive layer and other layers, the first step is to semi-cure the second adhesive layer 9, the semi-curing is to 80% of the curing temperature and 60% of the curing time of the bonding process, namely 108 minutes at a temperature of 100 ℃, or 72 minutes at a temperature of 110 ℃, or 30 minutes at a temperature of 130 ℃, and the second step is to 75% of the curing temperature and 70% of the curing time of the bonding process, namely if the first step is to use 110 ℃ for 72 minutes, the second step is to use 105 ℃ for 80 minutes to achieve curing.
Under the second processing condition of the two-step bonding process, the first conductive layer 10 is properly extended and broken away along the scratches to form the interdigital electrode, and the conductive wires are welded at the two poles of the interdigital electrode to conduct out the electric energy, preferably, the interdigital electrode is connected with an energy storage device through the conductive wires, the energy storage device is a storage battery, and the electric energy converted by the piezoelectric energy collector 6 flows into the storage battery through the interdigital electrode.
Because the first adhesive layer 7 and the second adhesive layer 9 are epoxy conductive adhesives, after a bonding process of heating and pressurizing is used, the epoxy conductive adhesives are compressed, the thickness of the bonded epoxy conductive adhesives is generally between 700nm and 5um, and a tight connection is formed between the piezoelectric layer 17 and the substrate 18; some epoxy resin conductive adhesive will be squeezed into the gap between the PZT sheet and the groove, and if the epoxy resin conductive adhesive is too much, it will be separated from the groove 13 and squeezed above the substrate.
This process requires attention to: the piezoelectric layer 17 should be slightly smaller than the front groove of the first base 8 to prevent the piezoelectric layer 17 from being placed in the groove, but during the bonding process, the piezoelectric layer should be tightly bonded at a position close to the tail end, i.e., the end far from the first protruding end 11, without leaving a gap to prevent short circuit.
After bonding is completed, thinning the piezoelectric layer 17 until the piezoelectric layer 17 is flush with the first protruding end 11 on the front surface of the first base 8, in other embodiments, the material inevitably prepared on the first protruding end 11 does not need to be removed, and the height of the piezoelectric layer 17 after the material is prepared on the first protruding end 11 is flush with the height of the first protruding end 11;
specifically, the first base 8, i.e., the PZT sheet, is thinned by CMP (chemical mechanical polishing) and/or wet etching to be flush with the first bump ends 11 to obtain a desired thickness.
In this process, the thickness of the PZT sheet is controlled by the thickness of the first and second adhesive layers 7 and 9 and the depth of the front groove.
Scribing on the front surface of the first base 8 according to the structural shape of the front surface groove of the first base, and releasing the cantilever beam arm and the mass block;
specifically, a scribing instrument is adopted, 100um is reserved in a scribing channel, and the scribing channel is penetrated to release a mass block.
Example four
As shown in fig. 9, the upper half of the upper cover 1 is a hollow semi-sphere, the lower half of the upper cover is a hollow cylinder, a space formed in the upper half and the lower half is a receiving cavity 3, the receiving cavity 3 is used for placing a satellite antenna 4, and the satellite antenna 4 can freely rotate in the receiving cavity 3 and does not collide with the upper cover 1. The piezoelectric energy collector on the inner wall of the upper cover 1 is set to be at least one, the piezoelectric energy collector can be arranged on the inner wall of the upper half part of the upper cover 1 and also can be arranged on the inner wall of the lower half part of the upper cover 1, a power supply generated by the piezoelectric energy collector is led into the storage battery through a wire, the storage battery is arranged on the bottom shell 2, and when the satellite antenna is unexpectedly powered off, the storage battery supplies power to the satellite antenna, so that the continuous work of the satellite antenna is guaranteed.
Preferably, the bottom case 2 is further provided with an alarm, and when the storage battery is full of electricity or the satellite antenna stops working, the worker sends a signal to inform the worker to replace the storage battery or maintain the satellite antenna.
The upper cover 1 is mounted on the bottom shell 2, and a connecting edge 19 with a diameter slightly narrower than that of the upper cover 1 is arranged on the bottom shell 2. The connecting edge 19 is provided with bolt holes, and the corresponding positions of the upper cover 1 are provided with matched bolt holes, so that the upper cover 1 and the bottom shell 2 are connected through bolts, the upper cover 1 and the bottom shell 2 are sealed at the joints of the upper cover 1 and the bottom shell 2, the transition is smooth, no obvious protruding part exists, and the integral attractiveness of the antenna outer cover is ensured.
Install wiring end 5 on the side of drain pan 2, satellite antenna 4 passes through wiring end 5 and external circular telegram, wiring end 5 is including inner joint and external tapping, the inner joint sets up the inboard at drain pan 2, the external tapping sets up the outside at drain pan 2, the inner joint matches with satellite antenna's circular telegram plug, satellite antenna's circular telegram plug can directly meet with the inner joint, the external tapping passes through the outside power of electric wire direct intercommunication, the operating current of satellite antenna is provided, whole antenna dustcoat is muddy an organic whole simultaneously, can not expose any part of satellite antenna outside, satellite antenna has been protected, prevent that satellite antenna from exposing outside damaging, perhaps corrosion.
EXAMPLE five
As described in the fourth embodiment, the present embodiment is different from the fourth embodiment in that the upper surface of the bottom plate of the bottom case 2 is configured to have a structure matched with the bottom of the satellite antenna 4, so as to ensure that the satellite antenna can be installed on the bottom case 2, in the present embodiment, the bottom case 2 is provided with the mounting plate 20, the mounting plate 20 is provided with a plurality of bolt holes for installing the satellite antenna 4, the mounting plate 20 is a circular plate, and is a protruding structure formed by stamping on the bottom case 2 and is a certain distance higher than the bottom plate of the bottom case 2, so as to ensure that the satellite antenna 4 does not contact and collide with the bottom plate of the bottom case 2 when.
The periphery of the mounting plate 20 is also provided with at least one reinforcing plate 21 for ensuring the structural strength of the mounting plate 20 and simultaneously reinforcing the structure of the whole bottom plate of the bottom shell 2, and the reinforcing plate 21 is also a protruding structure formed by stamping on the bottom shell 2 and is in a slope shape and is connected with the upper surface edge of the mounting plate 20 and the bottom plate of the bottom shell 2.
EXAMPLE six
As shown in fig. 10, a backing plate 22 is further disposed below the bottom plate 2, and the backing plate 22 has the same shape as the bottom plate of the bottom plate 2 and covers the bottom plate of the bottom plate 2. Be provided with a plurality of bolt holes on backing plate 22, be provided with assorted bolt hole with it in the corresponding position department of drain pan 2, drain pan 2 passes through bolt fixed connection with backing plate 22, and backing plate 22 is used for bed hedgehopping antenna dustcoat, avoids the direct and ground contact of antenna house, is soaked the corruption by ponding easily.
The center of the backing plate 22 is hollowed out, so that materials are saved.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and additions can be made without departing from the method of the present invention, and these modifications and additions should also be regarded as the protection scope of the present invention.
Claims (7)
1. The satellite antenna outer cover is characterized by comprising an upper cover and a bottom shell, wherein the upper cover is buckled on the bottom shell, an accommodating cavity for mounting a satellite antenna is formed between the upper cover and the bottom shell, the upper cover and the bottom shell are connected and sealed, the satellite antenna is positioned in the accommodating cavity, a wiring end is further arranged on the bottom shell, the satellite antenna is electrified with the outside through the wiring end, and a piezoelectric energy collector is arranged on the inner wall of the upper cover and used for converting energy generated by the vibration of the upper cover into electric energy; the piezoelectric energy collector comprises a piezoelectric layer and a substrate, wherein a first adhesive layer is arranged between the piezoelectric layer and the substrate; the substrate comprises a first base, graphical protective layers are prepared on the upper surface and the lower surface of the first base, a second bonding layer is arranged on the first base, and a first conductive layer is arranged on the second bonding layer; the piezoelectric layer comprises a second base, a seed layer is arranged on the lower surface of the second base, a second conductive layer is arranged below the seed layer, and the first bonding layer is located between the first conductive layer and the second conductive layer.
2. The satellite antenna enclosure of claim 1, wherein the first adhesive layer is an epoxy conductive adhesive doped with silver debris.
3. The satellite antenna enclosure of claim 1, wherein the first conductive layer is an interdigitated electrode.
4. The satellite antenna enclosure of claim 1, wherein the first conductive layer and the second conductive layer have a thickness between 10nm and 200 nm.
5. The satellite antenna enclosure of claim 1, wherein the first adhesive layer and the second adhesive layer have a thickness between 700nm and 5 um.
6. The satellite antenna enclosure of claim 1, wherein the seed layer has a thickness of between 20nm and 200 nm.
7. The satellite antenna enclosure of any one of claims 1-6, wherein the bottom shell is provided with a terminal, and the satellite antenna is powered with the outside through the terminal.
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| CN201811010102.6A CN109149101B (en) | 2018-08-31 | 2018-08-31 | Satellite antenna outer cover |
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| CN201811010102.6A CN109149101B (en) | 2018-08-31 | 2018-08-31 | Satellite antenna outer cover |
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| CN109149101A CN109149101A (en) | 2019-01-04 |
| CN109149101B true CN109149101B (en) | 2020-10-13 |
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| CN102332529A (en) * | 2011-09-20 | 2012-01-25 | 上海交通大学 | Piezoelectric energy collector with flexible substrate and manufacturing method thereof |
| KR101332008B1 (en) * | 2012-07-24 | 2013-11-25 | 광운대학교 산학협력단 | Energy harvester |
| CN203481396U (en) * | 2013-09-26 | 2014-03-12 | 宁波迪泰电子科技有限公司 | Marine satellite antenna |
| CN103840075A (en) * | 2012-11-27 | 2014-06-04 | 中国科学院微电子研究所 | Miniature piezoelectric vibration energy collector and manufacturing method thereof |
| CN207409654U (en) * | 2017-12-31 | 2018-05-25 | 宁波迪泰电子科技有限公司 | Marine satellite antenna outer cover |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101243868B1 (en) * | 2009-12-14 | 2013-03-20 | 한국전자통신연구원 | The active piezoelectric energy harvester having embedded variable capacitance layer and manufacturing method thereof |
| CN103523737B (en) * | 2013-10-25 | 2015-12-30 | 黑龙江大学 | Based on the interdigital gap girder construction energy harvester and preparation method thereof of MEMS |
| CN107170959B (en) * | 2016-03-07 | 2019-06-04 | 东南大学 | A kind of MEMS vibration energy harvesting and the single-chip integration device of storage and preparation method thereof |
| CN106301071A (en) * | 2016-08-10 | 2017-01-04 | 上海交通大学 | Low frequency piezoelectric type MEMS vibration energy collector and preparation method thereof |
| CN207304406U (en) * | 2017-08-03 | 2018-05-01 | 安徽理工大学 | Equal strength beam type piezoelectric vibration energy collector |
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- 2018-08-31 CN CN201811010102.6A patent/CN109149101B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332529A (en) * | 2011-09-20 | 2012-01-25 | 上海交通大学 | Piezoelectric energy collector with flexible substrate and manufacturing method thereof |
| KR101332008B1 (en) * | 2012-07-24 | 2013-11-25 | 광운대학교 산학협력단 | Energy harvester |
| CN103840075A (en) * | 2012-11-27 | 2014-06-04 | 中国科学院微电子研究所 | Miniature piezoelectric vibration energy collector and manufacturing method thereof |
| CN203481396U (en) * | 2013-09-26 | 2014-03-12 | 宁波迪泰电子科技有限公司 | Marine satellite antenna |
| CN207409654U (en) * | 2017-12-31 | 2018-05-25 | 宁波迪泰电子科技有限公司 | Marine satellite antenna outer cover |
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