CN109149101A - A kind of satellite antenna outer cover - Google Patents
A kind of satellite antenna outer cover Download PDFInfo
- Publication number
- CN109149101A CN109149101A CN201811010102.6A CN201811010102A CN109149101A CN 109149101 A CN109149101 A CN 109149101A CN 201811010102 A CN201811010102 A CN 201811010102A CN 109149101 A CN109149101 A CN 109149101A
- Authority
- CN
- China
- Prior art keywords
- satellite antenna
- layer
- bottom case
- upper cover
- outer cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
Landscapes
- Details Of Aerials (AREA)
Abstract
The present invention provides a kind of satellite antenna outer cover, including upper cover and bottom case, the upper cover is fastened on the bottom case, the accommodating chamber for installing satellite antenna is formed between the upper cover and the bottom case, the upper cover connects sealing with the bottom case, the satellite antenna is in the accommodating chamber, terminals are additionally provided on the bottom case, the satellite antenna passes through the terminals and external energization, piezoelectric energy collector is provided on the inner wall of the upper cover, the energy for generating upper cover vibration is converted into electric energy.Satellite antenna outer cover of the invention, piezoelectric energy collection is provided in the upper cover of outer cover, by upper lid surface because being influenced by wind blows or the environmental factors such as rain, and the vibration of generation is converted to electric energy and is collected, the waste for avoiding energy, has saved resource.
Description
Technical field
The present invention relates to satellite antenna technical field more particularly to a kind of satellite antenna outer covers.
Background technique
The main body of satellite antenna is exactly the cauldron often said, is a metal paraboloid structure, for reflecting satellite-signal
To being located in the feed of focal point, the main function of satellite antenna is that the small-signal for transmitting satellite is collected, and to the greatest extent may be used
Noise therein can be removed.What satellite antenna usually required that an antenna cover is connected by antenna and with antenna a series of connects
Line apparatus and element protection get up, and antenna cover is other than having the function of protectiveness, conductibility, reliability and decorative thread etc., also
It is required to the damaging influence for protecting satellite antenna from natural causes such as high wind, acid rain, heavy snow, burning sun, extends entire system
The service life of system and various pieces, while needing to guarantee that wave transmission rate is sufficiently large to reduce to the greatest extent on the received influence of signal.
The position that antenna cover is installed is mostly eminence, and surrounding has no other shelters, along in order to guarantee thin rate
It is sufficiently large, the thickness of antenna cover can not prevent it from keeping stablizing in exposing to wind and rain, therefore the surface meeting of antenna cover
Duration generates vibration, however the energy that current antenna cover can not generate vibration converts, and causes the waste of energy.
In view of the above drawbacks, creator of the present invention obtains the present invention by prolonged research and practice finally.
Summary of the invention
To solve the above problems, the technical solution adopted by the present invention is, a kind of satellite antenna outer cover, including upper cover are provided
And bottom case, the upper cover are fastened on the bottom case, are formed between the upper cover and the bottom case for installing satellite antenna
Accommodating chamber, the upper cover and the bottom case connect sealing, and the satellite antenna is in the accommodating chamber, also sets on the bottom case
There are terminals, the satellite antenna is provided with piezoelectricity energy by the terminals and external energization on the inner wall of the upper cover
Collector is measured, the energy for generating upper cover vibration is converted into electric energy.
Further, the piezoelectric energy collector includes piezoelectric layer and substrate, between the piezoelectric layer and the substrate
Equipped with the first adhesive layer.
Further, the material of first adhesive layer is the epoxide resin conductive adhesive for being doped with silver-colored clast.
Further, the substrate includes the first pedestal, and first pedestal is equipped with the second adhesive layer, and described second is viscous
It closes layer and is equipped with the first conductive layer.
Further, first conductive layer is interdigital electrode.
Further, the piezoelectric layer includes the second pedestal, and the lower surface of second pedestal is equipped with seed layer, and described kind
Sublayer is equipped with the second conductive layer, and first adhesive layer is between first conductive layer and second conductive layer.
Further, the thickness of first conductive layer and second conductive layer is between 10nm~200nm.
Further, the thickness of first adhesive layer and second adhesive layer is between 700nm~5um.
Further, the thickness of the seed layer is between 20nm~200nm.
Further, the bottom case is equipped with terminals, and the satellite antenna passes through the terminals and external energization.
The beneficial effects of the present invention are 1, satellite antenna outer covers of the invention compared with the prior art, in the upper of outer cover
It is provided with piezoelectric energy collection in lid, by upper lid surface because by wind blows or the such environmental effects such as rainy, and generates
Vibration be converted to electric energy and be collected, avoid the waste of energy, saved resource；2, the first adhesive layer is broken to be doped with silver
The epoxide resin conductive adhesive of bits greatly improves the electric conductivity of the first adhesive layer, so that charge in piezoelectric energy collector
It circulates more smooth.3, the first conductive layer in piezoelectric energy collector is interdigital electrode, it is only necessary to which one layer of conductive layer can will be electric
Lotus export, reduces the thickness of piezoelectric energy collector, so that the piezoelectric energy collector is suitable for satellite antenna.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical solution in various embodiments of the present invention
The attached drawing used is briefly described.
Fig. 1 is the overall structure diagram of satellite antenna outer cover of the invention；
Fig. 2 is the structural schematic diagram of upper cover of the present invention；
Fig. 3 is satellite antenna mounting structure schematic diagram of the invention；
Fig. 4 is the right pseudosection of piezoelectric energy collector of the invention；
Fig. 5 is the main view sectional view in piezoelectric energy collector preparation of the invention；
Fig. 6 is the top cross-sectional view of piezoelectric energy collector of the invention；
Fig. 7 is the right pseudosection in piezoelectric energy collector preparation of the invention；
Fig. 8 is the scribing figure of piezoelectric energy collector of the invention；
Fig. 9 is bottom case structure schematic diagram of the invention；
Figure 10 is the bottom surface structure schematic diagram of satellite antenna outer cover of the invention.
Digital representation in figure:
1- upper cover, 2- bottom case, 3- accommodating chamber, 4- satellite antenna, 5- terminals, 6- piezoelectric energy are collected, 7- first is bonded
Layer, 8 first pedestals, the second adhesive layer of 9-, the first conductive layer of 10-, the first protruding end of 11-, the second protruding end of 12-, 13- second
Conductive layer, 14- seed layer, the second pedestal of 15-, 16- protective layer, 17- piezoelectric layer, 18- substrate, 19- connection side, 20- installation
Plate, 21- stiffening plate, 22- backing plate.
Specific embodiment
Below in conjunction with attached drawing, the forgoing and additional technical features and advantages are described in more detail.
Embodiment one
The present invention provides a kind of satellite antenna outer cover, and in conjunction with shown in Fig. 1 to Fig. 3, including upper cover 1 and bottom case 2, upper cover 1 are detained
The accommodating chamber 3 formed on bottom case 2, between upper cover 1 and bottom case 2 for installing satellite antenna 4 is closed, upper cover 1 and bottom case 2 connect
Sealing, satellite antenna 4 are in accommodating chamber 3, terminals 5 are additionally provided on bottom case 2, satellite antenna 4 is by terminals 5 and outside
Portion is powered, and piezoelectric energy collector 6 is provided on the inner wall of upper cover 1, and the energy for generating the vibration of upper cover 1 is converted into electricity
Energy.
Satellite antenna outer cover of the invention, be provided in the upper cover 1 of outer cover piezoelectric energy collect 6, by 1 surface of upper cover because
By wind blows or the such environmental effects such as rain, and the vibration generated is converted to electric energy and is collected, and avoids energy
Waste, saved resource.
Embodiment two
Satellite antenna outer cover as described in above-described embodiment one, the present embodiment are different from place and are, in conjunction with Fig. 4 to figure
Shown in 6, piezoelectric energy collector 6 includes piezoelectric layer 17 and substrate 18, and the first bonding is smeared between piezoelectric layer 17 and substrate 18
Layer 7, and the two is bonded together by the bonding technology of certain temperature and pressure, so that effectively control compression energy is collected
The thickness of device 6 keeps its thickness small as far as possible.
Substrate 18 includes the first pedestal 8, the second adhesive layer 9, the first conductive layer 10.
First pedestal 8 is fabricated from a silicon, and the front of the first pedestal 8 is equipped with front slot, and the back side of the first pedestal 8 is equipped with
Reverse groove, wherein the cross section of front slot and reverse groove is L-shaped, and front slot includes front slot bottom and the first protruding end 11,
First protruding end 11 is used to play reference for the height of piezoelectric layer 17；Reverse groove includes reverse groove bottom and the second protruding end 12, and
Two protruding ends 12 constitute the mass block of whole device, for experiencing ambient vibration, to be the vibration model of piezoelectric energy collector 6
Enclose expansion.
Wherein, front slot bottom is equipped with the first conductive layer 10, and the first conductive layer 10 forms interdigital electrode, and interdigital electrode passes through
Conducting wire connects external energy storage device, and energy storage device is battery, hereby it is achieved that the output of charge, the first conductive layer 10 is by gold
Material is made, and 10 thickness of the first conductive layer should not be lower than 10nm usually in 10nm~200nm, because in 10nm or less
The electrical efficiency of first conductive layer 10 is low.
Second adhesive layer 9 is conducting resinl, and between front slot bottom and the first conductive layer 10, smearing thickness usually exists
1um~7um is preferred, but should not be more than 7um, otherwise will affect the output of charge.Because the lattice constant of silicon and gold is more
It is close, cause the first conductive layer 10 to be difficult smoothly to form film on the first pedestal 8, this is just needed in the first pedestal 8 and first
Conductive layer 10 is arranged the second adhesive layer 9 and is bonded.
Preferably, the second adhesive layer 9 use epoxide resin conductive adhesive, inside be doped with silver-colored clast, have bonding spy
Property with conductive characteristic, therefore the first pedestal 8 and the first conductive layer 10 can be subjected to good bonding.
Wherein, the thickness of the second adhesive layer 9 and the thickness of piezoelectric layer 17 have a direct relation, and the two is in inverse relation, the
When two adhesive layers, 9 thickness is larger, the thickness of piezoelectric layer 17 is just smaller；When 9 thickness of the second adhesive layer is smaller, piezoelectric layer 17
Thickness is just larger, guarantees that the whole thickness of piezoelectric energy collector 6 is small as far as possible.
Piezoelectric layer 17 includes the second conductive layer 13, seed layer 14 and the second pedestal 15.
Wherein, with PZT (lead titanate piezoelectric ceramics) piece for the second pedestal 15, the is equipped in the lower surface of the second pedestal 15
Two conductive layers 13, the second conductive layer 13 of golden material by being made, and the thickness of the second conductive layer 13 is not in 10nm~200nm, but not
10nm should be lower than, for increasing the collection efficiency of charge.The upper table of the upper surface of piezoelectric layer 17 and first protruding end 11
Face is concordant, avoids piezoelectric layer 17 blocked up.
Wherein, seed layer 14 is set between the second conductive layer 13 and the second pedestal 15, seed layer 14 is made of chromium material,
With guarantee the second conductive layer 13 can smoothly be formed on the second pedestal 15, the common thickness of seed layer 14 20nm~
200nm, but 20nm should not be lower than, so that seed layer 14 fails；Pass through between second conductive layer 13 and the first conductive layer 10
The connection of first adhesive layer 7, the first adhesive layer 7 are epoxide resin conductive adhesive, and smearing thickness is usually preferred in 1um~7um, but
Being should not be more than 7um；Preferably, be doped with silver-colored clast inside epoxide resin conductive adhesive, make it have the characteristic of bonding with
Conductive characteristic, therefore piezoelectric layer 17 and substrate 18 can be subjected to good bonding.
Part of the whole device other than mass block constitutes cantilever beam, and piezoelectric layer 17 is installed on a cantilever beam, when work,
Mass block receives the vibration of environment, drives cantilever beam vibration, the PZT piece of the second pedestal 15 constantly deform surface on it and under
Surface generates charge, exports charge eventually by the interdigital electrode of the first conductive layer 10.
Embodiment three
Satellite antenna outer cover as described in above-described embodiment two, the present embodiment is different from place and is, in conjunction with Fig. 7 and figure
Shown in 8, the processing method of piezoelectric energy collector 6 includes:
Substrate 18 is made, using<110>crystal orientation silicon wafer as the first pedestal 8, in other embodiments, the first pedestal 8 may be used also
To use, the materials such as germanium, germanium silicon, silicon carbide.Twin polishing (such as CMP) flatening process is carried out to the first pedestal 8 and reduces table
After planar defect, reduction roughness, lower surface prepares patterned protective layer 16 on it, and protective layer 16 is silicon nitride, can be used
Silicon oxide deposition (preferably low temperature CVD technique) is formed, and deposition temperature is 600~900 DEG C, and preferably 780 DEG C, is protected
The graphical shape that sheath 16 is prepared on the first pedestal 8 is rectangle, rectangle knot of the positive rectangular configuration area compared with the back side
Structure area is big, and the thickness of silicon nitride is between 200nm between 500nm.
First pedestal 8 is put into potassium hydroxide solution and is corroded, 8 front and back sides of the first pedestal is made to corrode groove out,
The concentration of potassium hydroxide solution is 30%, and operating environment is 70 degrees Celsius, and corrosion rate 1um/min, potassium hydroxide solution can
To corrode the silicon of<110>crystal orientation under the above conditions, and vertical groove is formed, the shape of the groove is rectangle.
By epoxide resin conductive adhesive preparation in 15 front of the second pedestal, the second adhesive layer 9 is formed, and to the second adhesive layer 9
Carry out semi-solid preparation.Second adhesive layer 9 is prepared by way of whirl coating, and the second pedestal 15 is placed on photoresist spinner, passes through high speed
Rotation is uniformly prepared epoxide resin conductive adhesive in the front groove of the first pedestal 8, while inevitably in protective layer
Also epoxide resin conductive adhesive can be prepared on 16.
Gold is deposited on the second adhesive layer 9, is allowed to form the first conductive layer 10, and machine is cut by laser, be led to first
Electric layer 10 carries out low power scratch, while during the preparation process, also can inevitably steam plated with gold, layer gold in protective layer 16
On epoxide resin conductive adhesive.
Production piezoelectric layer 17 sputters chromium on it, makes using PZT (lead titanate piezoelectric ceramics) piece as the second pedestal 15
Formation seed layer 14, in seed layer 14 be deposited gold, be allowed to form the second conductive layer 13, be smeared on the second conductive layer 13
Epoxide resin conductive adhesive is allowed to form the first adhesive layer 7, obtains piezoelectric layer 17；
First adhesive layer 7 of piezoelectric layer 17 is placed on to the corresponding position of substrate 18 on one side, it then will by bonding technology
The two is bonded together, conventional bonding technology be 120 degrees Celsius at a temperature of process 3 hours, or at 140 degrees Celsius
At a temperature of process 2 hours, or 160 degrees Celsius at a temperature of process 50 minutes.In the present embodiment, the second adhesive layer 9
More than half curing process have been carried out, has continued to will lead to the second adhesive layer 9 overheat with the parameter of bonding technology, its property is made to become fragile,
It is unfavorable for the use of the piezoelectric energy collector 6, therefore takes two step bonding methods to carrying out key between adhesive layer and other layers
It closes, the first step is that above-mentioned semi-solid preparation handles the second adhesive layer 9, and semi-solid preparation is that 80% solidification temperature of bonding technology and 60% are consolidated
Change the time, as 100 degrees Celsius at a temperature of 108 minutes, or 110 degrees Celsius at a temperature of 72 minutes, or it is Celsius 130
Degree at a temperature of 30 minutes, second step be bonding technology 75% solidification temperature and 70% curing time, if the i.e. first step
Using 110 degrees Celsius 72 minutes, then second step uses 105 degrees Celsius of realization in 80 minutes solidifications.
Under the second step processing conditions of above-mentioned two step method bonding technology, the first conductive layer 10 generates first conductive layer 10
Extension appropriate, and shake off along scratch, interdigital electrode is formed, and at the two poles of the earth of interdigital electrode be welded with conducting wire, thus will
Electric energy export, preferably, interdigital electrode is connected with energy storage device by conducting wire, which is battery, and piezoelectric energy is received
The electric energy that storage 6 converts flows into battery via interdigital electrode.
Since the first adhesive layer 7 and the second adhesive layer 9 are epoxide resin conductive adhesives, in the bonding work using heating, pressurization
After skill, epoxide resin conductive adhesive is compressed, and the usual thickness of the epoxide resin conductive adhesive after bonding is the pressure between 700nm~5um
Closely connection is formed between electric layer 17 and substrate 18；There is the epoxide resin conductive adhesive of part that can get into the seam of PZT piece and groove
In gap, if the situation that epoxide resin conductive adhesive is excessive, it can be detached from groove 13, be extruded into the top of substrate.
This process prevents piezoelectricity it is to be noted that 17 size of piezoelectric layer should be more smaller than the front slot on the first pedestal 8
Layer 17 can not be put into, but in bonding process, it, should in the position for leaning on caudal part, i.e. one end far from the first protruding end 11
It is closely to combine, there are gaps, prevent short circuit.
Bonding is completed, piezoelectric layer 17 is carried out it is thinned, until piezoelectric layer 17 and positive first protruding end 11 of the first pedestal 8
Concordantly, in other embodiments, the material unavoidably prepared on the first protruding end 11 does not need to reject, piezoelectric layer 17 and
Height after preparing material on one protruding end 11 is concordant；
Specifically, to the first pedestal 8, i.e. PZT piece is subtracted by CMP (chemically mechanical polishing) and/or wet etching
It is as thin as concordant with the first protruding end 11, obtains the thickness of needs.
This process realizes the thickness of PZT piece by the depth of the thickness and front slot of the first adhesive layer 7 and the second adhesive layer 9
The control of degree.
In 8 front of the first pedestal, and scribing is carried out with the planform of its front slot, releases overarm arm and mass block；
Specifically, dicing lane reserves 100um, scratches using scribing instrument, it is allowed to release mass block.
Example IV
Satellite antenna outer cover as described in above-described embodiment one, the present embodiment is different from place and is, in conjunction with Fig. 9 institute
Show, 1 upper half of upper cover is hollow semicircle sphere, and lower half is hollow cylinder, is constituted in the upper half and lower half
Space is accommodating chamber 3, and for placing satellite antenna 4, satellite antenna 4 can be freely rotated accommodating chamber 3 in the accommodating chamber 3,
And it does not collide with upper cover 1.Piezoelectric energy collector on 1 inner wall of upper cover is set as at least one, can be set upper
It also can be set on the upper half inner wall of lid 1 on the lower half inner wall of upper cover 1, the power supply generated imports electric power storage by conducting wire
Chi Zhong, battery are mounted on bottom case 2, and when unexpected power off occurs in satellite antenna, battery will carry out for satellite antenna
Power supply, guarantees continuing working for satellite antenna.
Preferably, be additionally provided with alarm on bottom case 2, full or satellite antenna is stored in accumulator electric-quantity and is stopped working phase
Staff sends signal, notifies staff to replace battery or repair to satellite antenna.
Upper cover 1 is mounted on bottom case 2, and the connection side 19 slightly narrow compared with 1 diameter of upper cover is provided on bottom case 2.Connect side 19
On be provided with bolt hole, matched bolt hole is provided at the corresponding position of upper cover 1, so that upper cover 1 and bottom case 2 pass through bolt
Connection, upper cover 1 and bottom case 2 are sealed in its junction, while transitions smooth, without obvious boss, guarantee that antenna cover is whole
An aesthetics.
Terminals 5 are installed on the side of bottom case 2, satellite antenna 4 is wrapped by terminals 5 and external energization, terminals 5
Included inner joint and external tapping, inner joint is arranged in the inside of bottom case 2, and external tapping is arranged in the outside of bottom case 2, inner joint with defend
The energization plug of star antenna is matched, and the energization plug of satellite antenna can directly connect with inner joint, and external tapping passes through electric wire
Power supply directly outside connection provides the operating current of satellite antenna, while entire antenna cover one integrated mass, will not be by satellite
Any component of antenna protects satellite antenna outside being exposed to, and satellite antenna is prevented to be exposed to outer damage, or corrosion.
Embodiment five
Satellite antenna outer cover as described in above-mentioned example IV, the present embodiment are different from place and are, the bottom plate of bottom case 2
Upper surface is arranged to the structure to match with 4 bottom of satellite antenna, guarantees that satellite antenna may be mounted on bottom case 2, in this reality
It applies in example, mounting plate 20 is provided on bottom case 2, multiple bolts hole are provided on mounting plate 20, for the installation of satellite antenna 4,
Mounting plate 20 is that circular slab is higher by the bottom plate certain distance of bottom case 2, guarantees to defend for the raised structures being stamped and formed out on bottom case 2
Star antenna 4 will not be in contact collision with the bottom plate of bottom case 2 when rotated.
The surrounding of mounting plate 20 is additionally provided at least one piece of stiffening plate 21, for guaranteeing the structural strength of mounting plate 20, together
When can also reinforce bottom case 2 entire bottom plate structure, stiffening plate 21 is similarly the raised structures being stamped and formed out on bottom case 2, is
Ramped shaped, the top surface edge of connection plate 20 and the bottom plate of bottom case 2.
Embodiment six
Satellite antenna outer cover as described in above-described embodiment five, the present embodiment is different from place and is, in conjunction with Figure 10 institute
Show, is additionally provided with backing plate 22 in the lower section of bottom case 2, backing plate 22 is identical as the base plate configuration of bottom case 2, and is covered on 2 bottom of bottom case
The lower section of plate.It is provided with multiple bolts hole on backing plate 22, is provided in the corresponding position of bottom case 2 matched
Bolt hole, bottom case 2 is bolted to connection with backing plate 22, and backing plate 22 is used for padded antenna cover, avoids antenna house direct
With ground face contact, it is easy by ponding immersion corrosion.
Hollow out is carried out at the center of backing plate 22, saves material.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, under the premise of not departing from the method for the present invention, can also make several improvement and supplement, these are improved and supplement also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of satellite antenna outer cover, which is characterized in that including upper cover and bottom case, the upper cover is fastened on the bottom case, institute
The accommodating chamber formed between upper cover and the bottom case for installing satellite antenna is stated, the upper cover connects sealing with the bottom case,
The satellite antenna is in the accommodating chamber, and terminals are additionally provided on the bottom case, and the satellite antenna passes through the wiring
End is powered with external, and piezoelectric energy collector is provided on the inner wall of the upper cover, for generate upper cover vibration
Energy is converted into electric energy.
2. satellite antenna outer cover position limiting structure according to claim 1, which is characterized in that the piezoelectric energy collector packet
Piezoelectric layer and substrate are included, the first adhesive layer is equipped between the piezoelectric layer and the substrate.
3. satellite antenna outer cover position limiting structure according to claim 2, which is characterized in that the material of first adhesive layer
For the epoxide resin conductive adhesive for being doped with silver-colored clast.
4. satellite antenna outer cover position limiting structure according to claim 2, which is characterized in that the substrate includes the first base
Seat, first pedestal are equipped with the second adhesive layer, and second adhesive layer is equipped with the first conductive layer.
5. satellite antenna outer cover position limiting structure according to claim 4, which is characterized in that first conductive layer is interdigital
Electrode.
6. satellite antenna outer cover position limiting structure according to claim 4, which is characterized in that the piezoelectric layer includes the second base
Seat, the lower surface of second pedestal are equipped with seed layer, and the seed layer is equipped with the second conductive layer, first adhesive layer position
Between first conductive layer and second conductive layer.
7. satellite antenna outer cover position limiting structure according to claim 6, which is characterized in that first conductive layer and described
The thickness of second conductive layer is between 10nm~200nm.
8. satellite antenna outer cover position limiting structure according to claim 4, which is characterized in that first adhesive layer and described
The thickness of second adhesive layer is between 700nm~5um.
9. satellite antenna outer cover position limiting structure according to claim 6, which is characterized in that the thickness of the seed layer between
Between 20nm~200nm.
10. -9 any satellite antenna outer cover according to claim 1, which is characterized in that the bottom case is equipped with terminals,
The satellite antenna passes through the terminals and external energization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811010102.6A CN109149101B (en) | 2018-08-31 | 2018-08-31 | Satellite antenna outer cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811010102.6A CN109149101B (en) | 2018-08-31 | 2018-08-31 | Satellite antenna outer cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109149101A true CN109149101A (en) | 2019-01-04 |
| CN109149101B CN109149101B (en) | 2020-10-13 |
Family
ID=64825858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811010102.6A Active CN109149101B (en) | 2018-08-31 | 2018-08-31 | Satellite antenna outer cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109149101B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110140579A1 (en) * | 2009-12-14 | 2011-06-16 | Electronics And Telecommunications Research Institute | Active piezoelectric energy harvester with embedded variable capacitance layer and method of manufacturing the same |
| CN102332529A (en) * | 2011-09-20 | 2012-01-25 | 上海交通大学 | Piezoelectric energy collector with flexible substrate and manufacturing method thereof |
| KR101332008B1 (en) * | 2012-07-24 | 2013-11-25 | 광운대학교 산학협력단 | Energy harvester |
| CN103523737A (en) * | 2013-10-25 | 2014-01-22 | 黑龙江大学 | MEMS-based interdigital gap beam structure energy collector and manufacturing method thereof |
| CN203481396U (en) * | 2013-09-26 | 2014-03-12 | 宁波迪泰电子科技有限公司 | Marine satellite antenna |
| CN103840075A (en) * | 2012-11-27 | 2014-06-04 | 中国科学院微电子研究所 | Miniature piezoelectric vibration energy harvester and manufacturing method thereof |
| CN106301071A (en) * | 2016-08-10 | 2017-01-04 | 上海交通大学 | Low frequency piezoelectric type MEMS vibration energy collector and preparation method thereof |
| CN107170959A (en) * | 2016-03-07 | 2017-09-15 | 东南大学 | A kind of MEMS vibration energy harvestings and the single-chip integration device of storage and preparation method thereof |
| CN207304406U (en) * | 2017-08-03 | 2018-05-01 | 安徽理工大学 | Equal strength beam type piezoelectric vibration energy collector |
| CN207409654U (en) * | 2017-12-31 | 2018-05-25 | 宁波迪泰电子科技有限公司 | Marine satellite antenna outer cover |
-
2018
- 2018-08-31 CN CN201811010102.6A patent/CN109149101B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110140579A1 (en) * | 2009-12-14 | 2011-06-16 | Electronics And Telecommunications Research Institute | Active piezoelectric energy harvester with embedded variable capacitance layer and method of manufacturing the same |
| CN102332529A (en) * | 2011-09-20 | 2012-01-25 | 上海交通大学 | Piezoelectric energy collector with flexible substrate and manufacturing method thereof |
| KR101332008B1 (en) * | 2012-07-24 | 2013-11-25 | 광운대학교 산학협력단 | Energy harvester |
| CN103840075A (en) * | 2012-11-27 | 2014-06-04 | 中国科学院微电子研究所 | Miniature piezoelectric vibration energy harvester and manufacturing method thereof |
| CN203481396U (en) * | 2013-09-26 | 2014-03-12 | 宁波迪泰电子科技有限公司 | Marine satellite antenna |
| CN103523737A (en) * | 2013-10-25 | 2014-01-22 | 黑龙江大学 | MEMS-based interdigital gap beam structure energy collector and manufacturing method thereof |
| CN107170959A (en) * | 2016-03-07 | 2017-09-15 | 东南大学 | A kind of MEMS vibration energy harvestings and the single-chip integration device of storage and preparation method thereof |
| CN106301071A (en) * | 2016-08-10 | 2017-01-04 | 上海交通大学 | Low frequency piezoelectric type MEMS vibration energy collector and preparation method thereof |
| CN207304406U (en) * | 2017-08-03 | 2018-05-01 | 安徽理工大学 | Equal strength beam type piezoelectric vibration energy collector |
| CN207409654U (en) * | 2017-12-31 | 2018-05-25 | 宁波迪泰电子科技有限公司 | Marine satellite antenna outer cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109149101B (en) | 2020-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101136444B (en) | Photovotic device, its manufacture method and solar cells incorporating same | |
| US8143514B2 (en) | Method and structure for hydrogenation of silicon substrates with shaped covers | |
| US20050115602A1 (en) | Photo-electric conversion cell and array, and photo-electric generation system | |
| JP2008135655A (en) | Solar battery module, manufacturing method therefor, and solar battery cell | |
| JP2013225712A (en) | Manufacturing method of thin film solar cell | |
| JPH08139354A (en) | Solar cell element group, solar cell module and manufacture thereof | |
| CN108155831B (en) | Piezoelectric-triboelectric composite energy collector for collecting wind energy | |
| KR102231314B1 (en) | Method manufacturing for solar cell string of shingled module structure and solar cell module | |
| WO2014185225A1 (en) | Solar cell module and method for producing same | |
| JP2011181966A (en) | Solar battery cell and solar battery module | |
| CN109428515A (en) | A kind of miniature complex vibration generator | |
| CN108352417A (en) | The manufacturing method of the manufacturing method and crystalline silicon solar cell module of crystalline silicon solar cell | |
| CN104883091A (en) | Micromachining technology-based piezoelectric electromagnetic integrated power generation device | |
| JPH0685301A (en) | Solar cell module | |
| CN208001241U (en) | A kind of piezoelectricity-friction thermoelectricity compound type energy collecting device for acquiring wind energy | |
| CN109149101A (en) | A kind of satellite antenna outer cover | |
| JP4854105B2 (en) | Thin film solar cell module and manufacturing method thereof | |
| CN102782875B (en) | Solar module II | |
| CN109167189A (en) | A kind of satellite antenna | |
| JP6937050B2 (en) | How to manufacture flexible solar cells | |
| KR102011804B1 (en) | MEMS piezoelectric sensor, Energy storage device using MEMS piezoelectric sensor, and manufacturing method thereof | |
| CN202608172U (en) | Rear panel applied to back-surface field passivation type solar cell | |
| JP5334895B2 (en) | Manufacturing method of solar cell module | |
| CN109103599A (en) | A kind of satellite antenna position limiting structure and satellite antenna | |
| WO2008033864A1 (en) | Method and structure for hydrogenation of silicon substrates with shaped covers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |