CN109155298A - 功率模块和制造功率模块的方法 - Google Patents
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Abstract
本发明涉及功率模块,该功率模块包括:至少一个功率管芯,所述至少一个功率管芯被嵌入多层结构中,所述多层结构是至少两个子模块的组装件,各个子模块由绝缘层和导电层形成,并且所述功率模块还包括:嵌入所述多层结构中的至少一个电容器,所述至少一个电容器用于使嵌入所述多层结构中的所述至少一个功率管芯与电力供应解耦;以及所述至少一个功率管芯的至少一个驱动电路,所述至少一个驱动电路被设置在所述多层结构的表面上或者完全或部分嵌入所述多层结构中。
Description
技术领域
本发明总体上涉及功率模块和制造功率模块的方法。
背景技术
在电力应用中,尤其是对于利用宽带隙装置的应用来说,减少因封装和组装技术造成的寄生部件至关重要,以便在电源模块并联连接的情况下,减少因快速开关而造成的开关损耗,减少电磁辐射并获得更好的电流分布。
发明内容
为此,本发明涉及一种功率模块,所述功率模块包括:至少一个功率管芯,其特征在于,所述至少一个功率管芯被嵌入多层结构中,所述多层结构是至少两个子模块的组装件,各个子模块由绝缘层和导电层形成,并且所述功率模块还包括:嵌入所述多层结构中的至少一个电容器,以使嵌入所述多层结构中的所述至少一个功率管芯与电力供应解耦;以及所述至少一个功率管芯的至少一个驱动电路,所述至少一个驱动电路被设置在所述多层结构的表面上或者完全或部分嵌入所述多层结构中。
因此,本发明增加了功率模块的功率密度并减少了寄生组件,以便减少功率损耗和电磁发射。
根据特定特征,所述功率模块还包括电感器,所述电感器被嵌入所述多层结构中。
根据特定特征,所述功率模块还包括磁性材料,所述磁性材料被嵌入所述多层结构中,设置或模制在所述多层结构的表面上。
因此,所述功率模块紧凑并且具有较低的公差。
根据特定特征,仅所述多层结构的包括所述至少一个功率管芯的部分通过液冷系统冷却。
根据特定特征,提供给所述至少一个功率管芯的所述电力供应由液冷汇流条提供。
由此,功率模块的尺寸和成本可以因多功能汇流条而减小。
本发明还涉及一种制造包括至少一个功率管芯的功率模块的方法,其特征在于,该方法包括以下步骤:
-获取多个子模块,各个子模块由绝缘层和导电层形成;
-利用导热且导电材料组装所述子模块,以便形成多层结构;
-在所述多层结构中嵌入至少一个功率管芯;
-在所述多层结构中嵌入至少一个电容器,以使嵌入所述多层结构中的所述至少一个功率管芯与电力供应解耦;
-将所述至少一个功率管芯的至少一个驱动电路组装在所述多层结构的表面上。
因此,本发明增加了功率模块的功率密度并减少了寄生组件,以便减少功率损耗和电磁发射。
根据特定特征,通过执行以下连续步骤来获取各个子模块:
-在基础层中形成具有功率管芯的尺寸的至少一个腔体;
-将一个功率管芯放置在一个腔体中;
-在所述基础层上层叠绝缘层和导电层;
-进行钻孔和金属化,以便将所述至少一个功率管芯连接至所述导电层,
-蚀刻所述导电层,以便获取布局;
-在所述基础层的两侧上执行附加的薄绝缘层和厚导电层的至少一次层叠;
-进行钻孔和金属化,以便连接所述导电层和厚导电层,
-形成过孔。
因此,在所述模块内连接的功率管芯具有因封装而造成的低寄生电感。
根据特定特征,在组装所述子模块之后,将所述至少一个电容器放置在所组装的子模块中的孔中。
因此,所述电容器尽可能靠近所述开关功率装置放置,以便减小开关回路,由此减小回路电感。
根据特定特征,在组装所述子模块之后,所述至少一个电容器电连接在顶部子模块的顶层与底部子模块的底层之间。
因此,所述电容器被用作开关功率级的总线电容器。
通过阅读示例实施方式的下列描述,本发明的特征将更清楚地显现,所述描述结合附图生成,其中:
附图说明
图1是表示根据本发明的功率模块的电路的示例的图。
图2是表示根据本发明的由液冷汇流条冷却的功率模块的图。
图3是根据本发明的制造功率模块的方法。
图4A表示根据本发明的制造功率模块的不同阶段。
图4B表示根据本发明的制造功率模块的不同阶段。
图4C表示根据本发明的制造功率模块的不同阶段。
图4D表示根据本发明的制造功率模块的不同阶段。
图4E表示根据本发明的制造功率模块的不同阶段。
图4F表示根据本发明的制造功率模块的不同阶段。
图5表示根据本发明的功率模块的不同区域。
具体实施方式
图1是表示根据本发明的功率模块的电路的示例的图。
各个功率模块包括选通驱动器15,选通驱动器15向功率管芯D1和D2提供选通信号。
功率管芯D1的漏极连接至例如由液冷汇流条提供的正电源DC+。功率管芯D1的源极连接至功率管芯D2的漏极并连接至电感器L1的第一端子。
功率管芯D2的源极连接至例如由液冷汇流条提供的负电源DC-。
电感器L1的第二端子是功率模块的输出部。
图2是表示根据本发明的、由液冷汇流条冷却的功率模块的图。
电源模块是多个子模块的组装件,例如,具有如PCB的多层结构的两个子模块。各个子模块具有至少一个嵌入的半导体功率管芯,诸如SiC MOSFET、IGBT或其它。参照图3和图4A至图4F,对功率模块组装件进行更详细公开。
在非常接近形成功率模块的功率级的功率管芯处,将电容器嵌入由功率模块的子模块组成的多层结构内作为总线电容器,以便使总线电压平滑。
将各个电容器连接在顶部子模块的顶层与底部子模块的底层之间。在组装子模块之后,将各个电容器电连接。各个电容器放置在通过钻孔形成的铅直孔中并通过焊接连接。
包括功率管芯的部分可以通过由两个汇流条20a和20b组成的液冷汇流条冷却。汇流条20a被用于将负DC功率传送至功率模块的管芯,而汇流条20b被用于将正DC功率传送至功率模块的管芯。
在图2的示例中,各个汇流条20a和20b包括一个通道,该通道被分割成5个子通道,以便增加热交换。
如图2中示出的其它通道,汇流条20a的通道23a连接至汇流条20b的通道23b。
在该多层结构中,还可以嵌入附加组件,像标记为25的控制集成电路,标记为26的电感器、变压器、传感器、附加电容器或电阻器。
而且,被嵌入多层结构中或安装在多层结构的外表面上,附加组件可以通过焊接或其它方式附接,以包括针对功率模块的附加或补充功能。功率管芯上方和下方的多层结构表面由铜制成(经过或未经过精加工),以便使能实现功率模块的总线连接。
图3是根据本发明的制造功率模块的方法。
功率模块由两个子模块组成,这些子模块具有如PCB的多层结构,图4A至图4F的不同步骤表示制造子模块之一的不同阶段。
在步骤S30,例如通过激光切割来切割基础层,以便形成具有功率管芯的尺寸的腔体。然后,将功率管芯放置在该腔体中。图4A中给出了所形成的基础层的示例。
图4A至图4F表示根据本发明的制造功率模块的不同阶段。
图4A表示基础层400,基础层400是不导电但导热的材料。例如,基础层400由FR4制成。例如,通过激光切割来切割基础层400,以便形成具有功率管芯401的尺寸的腔体。然后,将功率管芯401放置在该腔体中。基础层可以分成两层或几层,所述层由至少一个高导热层402隔开(如铜之类的金属),以增加热扩散。
在步骤S31,在步骤S30形成的基础层上层叠绝缘层和导电层。图4B中给出了示例。
图4B表示基础层400和功率管芯401,在基础层400的顶部上层叠薄绝缘层403,并且在基础层400的底部上层叠薄绝缘层406。还在薄绝缘层403和406上层叠导电层404和405(例如,由铜制成)。绝缘层和导电层在单个步骤中层叠在一起。
这里,必须注意,对另一个子模块执行相同的操作。
在步骤S32,然后进行激光钻孔和金属化,以便将功率管芯401连接至导电层。图4C中给出了示例。
然后,进行激光钻孔和金属化407、409及410,以便将功率管芯401连接至导电层。功率管芯与导电层的接触可以完全覆盖功率管芯顶部表面和底部表面,或者利用多个过孔(via)连接或其它形状部分地覆盖。
在步骤S33,过孔以机械方式钻出并进一步进行金属化,以便根据布局(layout)在不同的点处连接不同的导电层。
在步骤S34,例如通过化学或机械工序对导电层进行蚀刻,以便获得所需布局,例如,在薄导电层上标记为408。
在步骤S35,如果未达到导电层的数量,则处理返回至步骤S31。否则,处理移动至步骤S36。
图4A至图4F是其中仅需要两个导电层的示例。根据该示例,处理移动至步骤S31并再次执行步骤S31至S34一次。
在两侧上层叠附加的薄绝缘层和厚导电层。图4D中给出了示例。
在如步骤S34获得的子模块的两侧上层叠附加的薄绝缘层411和412以及厚导电层413、414。
然后,进行激光钻孔和金属化,以便连接薄导电层和厚导电层。图4E中给出了示例。
然后,进行激光钻孔和金属化415和416,以便连接薄导电层404和405以及厚导电层413和414。该连接可以通过多个过孔连接或者通过其它形状(如金属化铜正方形)来进行。蚀刻导电层,以便获得层413和414上的希望布局,并且形成过孔。图4F中给出了示例。
通过钻孔然后金属化来制成过孔417。而且,执行板加工或钻孔,以便放置电容器418和磁性材料。
注意,在导电层413和414非常厚的一些特定情况下,可以在层叠之前对导电层进行预先蚀刻。
在步骤S36,执行机械加工和钻孔,以便为了适合最终应用的任何机械特征,获得模块上的任何所需模块形状或钻孔。也可以进行机械加工和钻孔,以便稍后组装诸如电容器、用于电感器的磁性材料或其它的附加组件。
在步骤S37,然后利用导热且导电材料组装这两个子模块,以便形成多层结构。
在步骤S38,执行外部组件焊接、附接以及磁性材料模制。
在非常接近形成功率模块的功率级的功率管芯处,将电容器嵌入功率模块的两个子模块内作为总线电容器,以便使总线电压平滑。
将各个电容器连接在顶部子模块的顶层与底部子模块的底层之间。在组装子模块之后,将各个电容器电连接。各个电容器放置在铅直的钻孔中并通过焊接连接。
而且,并不嵌入到所组装的子模块中或安装在所组装的子模块的外表面上,如控制集成电路电感器、变压器、传感器、磁性材料、附加电容器或电阻器的附加组件可以通过焊接或其它方式附接在多层结构的表面上,以包括针对功率模块的附加或补充功能。图5表示根据本发明的功率模块的不同区域。
根据本发明的功率模块被分为多个区域。
在标记为50的区域中,设置功率管芯的选通驱动器。
在标记为51的区域中,设置断开或总线电容器以及功率管芯,而在标记为53的区域中,设置外部电感器。
自然,在不脱离本发明的范围的情况下,可以对上述本发明的实施方式进行许多修改。
Claims (9)
1.一种功率模块,所述功率模块包括:至少一个功率管芯,其特征在于,所述至少一个功率管芯被嵌入多层结构中,所述多层结构是至少两个子模块的组装件,各个子模块由绝缘层和导电层形成,并且所述功率模块还包括:嵌入所述多层结构中的至少一个电容器,所述至少一个电容器用于使嵌入所述多层结构中的所述至少一个功率管芯与电力供应解耦;以及所述至少一个功率管芯的至少一个驱动电路,所述至少一个驱动电路被设置在所述多层结构的表面上或者完全或部分嵌入所述多层结构中。
2.根据权利要求1所述的功率模块,其特征在于,所述功率模块还包括嵌入所述多层结构中的电感器。
3.根据权利要求1或2所述的功率模块,其特征在于,所述功率模块还包括磁性材料,所述磁性材料被设置在所述多层结构的表面上,或者完全或部分嵌入所述多层结构中。
4.根据权利要求1至3中任一项所述的功率模块,其特征在于,仅所述多层结构的包括所述至少一个功率管芯的部分由液冷系统冷却。
5.根据权利要求4所述的功率模块,其特征在于,提供给所述至少一个功率管芯的所述电力供应由液冷汇流条提供。
6.一种制造包括至少一个功率管芯的功率模块的方法,其特征在于,所述方法包括以下步骤:
-获取多个子模块,各个子模块由绝缘层和导电层形成;
-利用导热且导电的材料组装所述子模块,以形成多层结构;
-在所述多层结构中嵌入至少一个功率管芯;
-在所述多层结构中嵌入至少一个电容器,所述至少一个电容器用于使所述至少一个功率管芯与电力供应解耦;
-将所述至少一个功率管芯的至少一个驱动电路组装在所述多层结构的表面上,或者将所述至少一个功率管芯的至少一个驱动电路完全或部分嵌入所述多层结构中。
7.根据权利要求6所述的方法,其特征在于,通过执行以下连续步骤来获取各个子模块:
-在基础层中形成具有功率管芯的尺寸的至少一个腔体;
-将一个功率管芯放置在一个腔体中;
-在所述基础层上层叠绝缘层和导电层;
-进行钻孔和金属化,以将所述至少一个功率管芯连接至所述导电层;
-蚀刻所述导电层,以获取布局;
-在所述基础层的两侧执行附加的薄绝缘层和厚导电层的至少一次层叠;
-进行钻孔和金属化,以连接所述导电层和所述厚导电层;
-形成过孔。
8.根据权利要求6至7中任一项所述的方法,其特征在于,在组装所述子模块之后,将所述至少一个电容器放置在所组装的子模块中的孔中。
9.根据权利要求6至8中任一项所述的方法,其特征在于,在组装所述子模块之后,把所述至少一个电容器电连接在顶部子模块的顶层与底部子模块的底层之间。
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