CN109155244A - Adhesive film and cutting chip engage one-piece type film - Google Patents
Adhesive film and cutting chip engage one-piece type film Download PDFInfo
- Publication number
- CN109155244A CN109155244A CN201780024601.8A CN201780024601A CN109155244A CN 109155244 A CN109155244 A CN 109155244A CN 201780024601 A CN201780024601 A CN 201780024601A CN 109155244 A CN109155244 A CN 109155244A
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- film
- polymer
- epoxy resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 77
- 238000005520 cutting process Methods 0.000 title claims description 28
- 238000001723 curing Methods 0.000 claims abstract description 73
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 59
- 239000003822 epoxy resin Substances 0.000 claims abstract description 54
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 52
- 229920000642 polymer Polymers 0.000 claims abstract description 50
- 239000000945 filler Substances 0.000 claims abstract description 41
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 14
- 238000013007 heat curing Methods 0.000 claims abstract description 11
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 11
- 229920006287 phenoxy resin Polymers 0.000 claims description 10
- 239000013034 phenoxy resin Substances 0.000 claims description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 110
- -1 esters ester Chemical class 0.000 description 62
- 229920005989 resin Polymers 0.000 description 33
- 239000011347 resin Substances 0.000 description 33
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 25
- 239000000126 substance Substances 0.000 description 21
- 239000002253 acid Substances 0.000 description 19
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 18
- 229920001568 phenolic resin Polymers 0.000 description 18
- 239000005011 phenolic resin Substances 0.000 description 18
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 17
- 239000002966 varnish Substances 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 239000004615 ingredient Substances 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 150000002989 phenols Chemical class 0.000 description 11
- 238000007711 solidification Methods 0.000 description 11
- 230000008023 solidification Effects 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 239000007822 coupling agent Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 150000002148 esters Chemical class 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 7
- 239000011324 bead Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 229910000077 silane Inorganic materials 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 6
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229930003836 cresol Natural products 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 150000002460 imidazoles Chemical class 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 238000005040 ion trap Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- KZNRNQGTVRTDPN-UHFFFAOYSA-N 2-chloro-1,4-dimethylbenzene Chemical group CC1=CC=C(C)C(Cl)=C1 KZNRNQGTVRTDPN-UHFFFAOYSA-N 0.000 description 3
- LCHYEKKJCUJAKN-UHFFFAOYSA-N 2-propylphenol Chemical group CCCC1=CC=CC=C1O LCHYEKKJCUJAKN-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- 229920000800 acrylic rubber Polymers 0.000 description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000003456 ion exchange resin Substances 0.000 description 3
- 229920003303 ion-exchange polymer Polymers 0.000 description 3
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 239000000347 magnesium hydroxide Substances 0.000 description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 2
- VDXLAYAQGYCQEO-UHFFFAOYSA-N 2-chloro-1,3-dimethylbenzene Chemical group CC1=CC=CC(C)=C1Cl VDXLAYAQGYCQEO-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- VLJSLTNSFSOYQR-UHFFFAOYSA-N 3-propan-2-ylphenol Chemical compound CC(C)C1=CC=CC(O)=C1 VLJSLTNSFSOYQR-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Natural products CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Natural products CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- RGIBXDHONMXTLI-UHFFFAOYSA-N chavicol Chemical compound OC1=CC=C(CC=C)C=C1 RGIBXDHONMXTLI-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229940113088 dimethylacetamide Drugs 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical class CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 2
- 229960005082 etohexadiol Drugs 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000004693 imidazolium salts Chemical class 0.000 description 2
- 229910001410 inorganic ion Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- 229910052919 magnesium silicate Inorganic materials 0.000 description 2
- 235000019792 magnesium silicate Nutrition 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- GVYLCNUFSHDAAW-UHFFFAOYSA-N mirex Chemical compound ClC12C(Cl)(Cl)C3(Cl)C4(Cl)C1(Cl)C1(Cl)C2(Cl)C3(Cl)C4(Cl)C1(Cl)Cl GVYLCNUFSHDAAW-UHFFFAOYSA-N 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 description 2
- 229940031826 phenolate Drugs 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000037452 priming Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical group 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 150000003512 tertiary amines Chemical group 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RLLPVAHGXHCWKJ-IEBWSBKVSA-N (3-phenoxyphenyl)methyl (1s,3s)-3-(2,2-dichloroethenyl)-2,2-dimethylcyclopropane-1-carboxylate Chemical compound CC1(C)[C@H](C=C(Cl)Cl)[C@@H]1C(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 RLLPVAHGXHCWKJ-IEBWSBKVSA-N 0.000 description 1
- KILURZWTCGSYRE-LNTINUHCSA-K (z)-4-bis[[(z)-4-oxopent-2-en-2-yl]oxy]alumanyloxypent-3-en-2-one Chemical compound CC(=O)\C=C(\C)O[Al](O\C(C)=C/C(C)=O)O\C(C)=C/C(C)=O KILURZWTCGSYRE-LNTINUHCSA-K 0.000 description 1
- JRQJLSWAMYZFGP-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical class OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JRQJLSWAMYZFGP-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- FMGGHNGKHRCJLL-UHFFFAOYSA-N 1,2-bis(chloromethyl)benzene Chemical group ClCC1=CC=CC=C1CCl FMGGHNGKHRCJLL-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- ORWYJYFTKGSHEU-UHFFFAOYSA-N 1,3-dimethyl-2-propoxybenzene Chemical group CCCOC1=C(C)C=CC=C1C ORWYJYFTKGSHEU-UHFFFAOYSA-N 0.000 description 1
- CGRUPNTVEKXSMJ-UHFFFAOYSA-N 1,4-dimethylpiperazine piperazine Chemical compound CN1CCN(CC1)C.N1CCNCC1 CGRUPNTVEKXSMJ-UHFFFAOYSA-N 0.000 description 1
- NIOYEYDJTAEDFH-UHFFFAOYSA-N 1-(2-hydroxyethoxy)-2-methylpropan-2-ol Chemical compound CC(C)(O)COCCO NIOYEYDJTAEDFH-UHFFFAOYSA-N 0.000 description 1
- VEGNIXCUDMQGFZ-UHFFFAOYSA-N 1-[3-[3-[2,3-bis(oxiran-2-ylmethoxy)propoxy]-2-hydroxypropoxy]-2-(oxiran-2-ylmethoxy)propoxy]-3-(oxiran-2-ylmethoxy)propan-2-ol Chemical compound C1OC1COCC(OCC1OC1)COCC(O)COCC(OCC1OC1)COCC(O)COCC1CO1 VEGNIXCUDMQGFZ-UHFFFAOYSA-N 0.000 description 1
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 1
- WLPXNBYWDDYJTN-UHFFFAOYSA-N 1-bromo-2,3-dimethylbenzene Chemical group CC1=CC=CC(Br)=C1C WLPXNBYWDDYJTN-UHFFFAOYSA-N 0.000 description 1
- WVUYYXUATWMVIT-UHFFFAOYSA-N 1-bromo-4-ethoxybenzene Chemical compound CCOC1=CC=C(Br)C=C1 WVUYYXUATWMVIT-UHFFFAOYSA-N 0.000 description 1
- NVLHGZIXTRYOKT-UHFFFAOYSA-N 1-chloro-2,3-dimethylbenzene Chemical group CC1=CC=CC(Cl)=C1C NVLHGZIXTRYOKT-UHFFFAOYSA-N 0.000 description 1
- DANMWBNOPFBJSZ-UHFFFAOYSA-N 1-iodo-2,3-dimethylbenzene Chemical class CC1=CC=CC(I)=C1C DANMWBNOPFBJSZ-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- CDMGNVWZXRKJNS-UHFFFAOYSA-N 2-benzylphenol Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1 CDMGNVWZXRKJNS-UHFFFAOYSA-N 0.000 description 1
- MYMYVYZLMUEVED-UHFFFAOYSA-N 2-bromo-1,3-dimethylbenzene Chemical class CC1=CC=CC(C)=C1Br MYMYVYZLMUEVED-UHFFFAOYSA-N 0.000 description 1
- QXISTPDUYKNPLU-UHFFFAOYSA-N 2-bromo-1,4-dimethylbenzene Chemical group CC1=CC=C(C)C(Br)=C1 QXISTPDUYKNPLU-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical group OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- IAGCDJZAYOZMCS-UHFFFAOYSA-N 2-hydroxypropanoic acid;titanium Chemical compound [Ti].CC(O)C(O)=O IAGCDJZAYOZMCS-UHFFFAOYSA-N 0.000 description 1
- QTUGGVBKWIYQSS-UHFFFAOYSA-N 2-iodo-1,3-dimethylbenzene Chemical group CC1=CC=CC(C)=C1I QTUGGVBKWIYQSS-UHFFFAOYSA-N 0.000 description 1
- WYZVNUSNUCABRF-UHFFFAOYSA-N 2-iodo-1,4-dimethylbenzene Chemical group CC1=CC=C(C)C(I)=C1 WYZVNUSNUCABRF-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- NJBCRXCAPCODGX-UHFFFAOYSA-N 2-methyl-n-(2-methylpropyl)propan-1-amine Chemical compound CC(C)CNCC(C)C NJBCRXCAPCODGX-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- JBUAEPKXUUMQKW-UHFFFAOYSA-N 2-silyloxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCO[SiH3] JBUAEPKXUUMQKW-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- LXWLHXNRALVRSL-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)propylsilane Chemical compound [SiH3]CCCOCC1CO1 LXWLHXNRALVRSL-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- SJTBRFHBXDZMPS-UHFFFAOYSA-N 3-fluorophenol Chemical group OC1=CC=CC(F)=C1 SJTBRFHBXDZMPS-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- OAHMVZYHIJQTQC-UHFFFAOYSA-N 4-cyclohexylphenol Chemical compound C1=CC(O)=CC=C1C1CCCCC1 OAHMVZYHIJQTQC-UHFFFAOYSA-N 0.000 description 1
- RHMPLDJJXGPMEX-UHFFFAOYSA-N 4-fluorophenol Chemical group OC1=CC=C(F)C=C1 RHMPLDJJXGPMEX-UHFFFAOYSA-N 0.000 description 1
- YQUQWHNMBPIWGK-UHFFFAOYSA-N 4-isopropylphenol Chemical compound CC(C)C1=CC=C(O)C=C1 YQUQWHNMBPIWGK-UHFFFAOYSA-N 0.000 description 1
- XDKUKGIJDNUFGK-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CN=C[N]1 XDKUKGIJDNUFGK-UHFFFAOYSA-N 0.000 description 1
- VGIURMCNTDVGJM-UHFFFAOYSA-N 4-triethoxysilylbutanenitrile Chemical compound CCO[Si](OCC)(OCC)CCCC#N VGIURMCNTDVGJM-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- KLQSRTKDOLFPQJ-UHFFFAOYSA-M CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O Chemical compound CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O KLQSRTKDOLFPQJ-UHFFFAOYSA-M 0.000 description 1
- RASBDVLERRNNLJ-UHFFFAOYSA-N CCCCO[Ti] Chemical compound CCCCO[Ti] RASBDVLERRNNLJ-UHFFFAOYSA-N 0.000 description 1
- IJAAVDUFBXLLQL-UHFFFAOYSA-N CCO[SiH](CCCCl)OCC Chemical compound CCO[SiH](CCCCl)OCC IJAAVDUFBXLLQL-UHFFFAOYSA-N 0.000 description 1
- SJTXQOFZBPAXOO-UHFFFAOYSA-N CCS(=O)(=O)O.C(F)(F)F Chemical compound CCS(=O)(=O)O.C(F)(F)F SJTXQOFZBPAXOO-UHFFFAOYSA-N 0.000 description 1
- YAGBAUUBKBTRNY-UHFFFAOYSA-N CO[SiH](OC)OC.C(C=C)(=O)OCCC[SiH2]OCC Chemical compound CO[SiH](OC)OC.C(C=C)(=O)OCCC[SiH2]OCC YAGBAUUBKBTRNY-UHFFFAOYSA-N 0.000 description 1
- SJIZILLCOZOPQO-UHFFFAOYSA-N CO[Si](OC)CCCCl Chemical compound CO[Si](OC)CCCCl SJIZILLCOZOPQO-UHFFFAOYSA-N 0.000 description 1
- IAZKGRRJAULWNS-UHFFFAOYSA-N Chavicol Natural products OC1=CC=C(CCC=C)C=C1 IAZKGRRJAULWNS-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 208000030984 MIRAGE syndrome Diseases 0.000 description 1
- 229910001051 Magnalium Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methylaniline Chemical compound CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 1
- JDUAPEUSDJYBLX-UHFFFAOYSA-N N1=CC=CC2=CC=CC=C12.C(CCCCCCCCCC)C=1NC=CN1 Chemical compound N1=CC=CC2=CC=CC=C12.C(CCCCCCCCCC)C=1NC=CN1 JDUAPEUSDJYBLX-UHFFFAOYSA-N 0.000 description 1
- CETNOLQDNWXORC-UHFFFAOYSA-N N1=CC=CC2=CC=CC=C12.C(CCCCCCCCCCCCCCCC)C=1NC=CN1 Chemical compound N1=CC=CC2=CC=CC=C12.C(CCCCCCCCCCCCCCCC)C=1NC=CN1 CETNOLQDNWXORC-UHFFFAOYSA-N 0.000 description 1
- FGTXJQVLLSVXQJ-UHFFFAOYSA-N N1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)C=1NC=C(N1)C Chemical compound N1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)C=1NC=C(N1)C FGTXJQVLLSVXQJ-UHFFFAOYSA-N 0.000 description 1
- GZKVWJAFXAUQFK-UHFFFAOYSA-N N1=CC=CC2=CC=CC=C12.CC=1NC=CN1 Chemical compound N1=CC=CC2=CC=CC=C12.CC=1NC=CN1 GZKVWJAFXAUQFK-UHFFFAOYSA-N 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- GTEPOPHYBLCZHI-UHFFFAOYSA-N OC(C(=O)O)CCCCCCCCCCCCCCCC.[Ti] Chemical compound OC(C(=O)O)CCCCCCCCCCCCCCCC.[Ti] GTEPOPHYBLCZHI-UHFFFAOYSA-N 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 235000019647 acidic taste Nutrition 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- PEEDYJQEMCKDDX-UHFFFAOYSA-N antimony bismuth Chemical compound [Sb].[Bi] PEEDYJQEMCKDDX-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- GDFLGQIOWFLLOC-UHFFFAOYSA-N azane;2-hydroxypropanoic acid;titanium Chemical compound [NH4+].[Ti].CC(O)C([O-])=O GDFLGQIOWFLLOC-UHFFFAOYSA-N 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- UFRQQBZAYHXOKS-UHFFFAOYSA-N cumene;phenol Chemical compound OC1=CC=CC=C1.CC(C)C1=CC=CC=C1 UFRQQBZAYHXOKS-UHFFFAOYSA-N 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WCOATMADISNSBV-UHFFFAOYSA-K diacetyloxyalumanyl acetate Chemical compound [Al+3].CC([O-])=O.CC([O-])=O.CC([O-])=O WCOATMADISNSBV-UHFFFAOYSA-K 0.000 description 1
- 125000005265 dialkylamine group Chemical group 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- CAXZYJLKQUXPBS-UHFFFAOYSA-N dichloro(3-chloropropyl)silane Chemical compound ClCCC[SiH](Cl)Cl CAXZYJLKQUXPBS-UHFFFAOYSA-N 0.000 description 1
- VLWUKSRKUMIQAX-UHFFFAOYSA-N diethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[SiH](OCC)CCCOCC1CO1 VLWUKSRKUMIQAX-UHFFFAOYSA-N 0.000 description 1
- DENRZWYUOJLTMF-UHFFFAOYSA-N diethyl sulfate Chemical compound CCOS(=O)(=O)OCC DENRZWYUOJLTMF-UHFFFAOYSA-N 0.000 description 1
- NFCHYERDRQUCGJ-UHFFFAOYSA-N dimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[SiH](OC)CCCOCC1CO1 NFCHYERDRQUCGJ-UHFFFAOYSA-N 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- MGHPNCMVUAKAIE-UHFFFAOYSA-N diphenylmethanamine Chemical compound C=1C=CC=CC=1C(N)C1=CC=CC=C1 MGHPNCMVUAKAIE-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 1
- 229940031098 ethanolamine Drugs 0.000 description 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- KQWWVLVLVYYYDT-UHFFFAOYSA-N ethyl 3-oxohexanoate Chemical compound CCCC(=O)CC(=O)OCC KQWWVLVLVYYYDT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000004442 gravimetric analysis Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- NIZHERJWXFHGGU-UHFFFAOYSA-N isocyanato(trimethyl)silane Chemical compound C[Si](C)(C)N=C=O NIZHERJWXFHGGU-UHFFFAOYSA-N 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical class O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000007886 mutagenicity Effects 0.000 description 1
- 231100000299 mutagenicity Toxicity 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000002811 oleoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 235000010292 orthophenyl phenol Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 229940090668 parachlorophenol Drugs 0.000 description 1
- GYUPBLLGIHQRGT-UHFFFAOYSA-N pentane-2,4-dione;titanium Chemical compound [Ti].CC(=O)CC(C)=O GYUPBLLGIHQRGT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- TVLSRXXIMLFWEO-UHFFFAOYSA-N prochloraz Chemical compound C1=CN=CN1C(=O)N(CCC)CCOC1=C(Cl)C=C(Cl)C=C1Cl TVLSRXXIMLFWEO-UHFFFAOYSA-N 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003235 pyrrolidines Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- LMHHRCOWPQNFTF-UHFFFAOYSA-N s-propan-2-yl azepane-1-carbothioate Chemical compound CC(C)SC(=O)N1CCCCCC1 LMHHRCOWPQNFTF-UHFFFAOYSA-N 0.000 description 1
- 150000003335 secondary amines Chemical group 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- RXMRGBVLCSYIBO-UHFFFAOYSA-M tetramethylazanium;iodide Chemical compound [I-].C[N+](C)(C)C RXMRGBVLCSYIBO-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium(IV) ethoxide Substances [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- JIVZKJJQOZQXQB-UHFFFAOYSA-N tolazoline Chemical compound C=1C=CC=CC=1CC1=NCCN1 JIVZKJJQOZQXQB-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- KWDQAHIRKOXFAV-UHFFFAOYSA-N trichloro(pentyl)silane Chemical compound CCCCC[Si](Cl)(Cl)Cl KWDQAHIRKOXFAV-UHFFFAOYSA-N 0.000 description 1
- BWPNIANVWARHPR-UHFFFAOYSA-N tridecyl dihydrogen phosphite Chemical class CCCCCCCCCCCCCOP(O)O BWPNIANVWARHPR-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Abstract
This disclosure relates to the adhesive film with Thermocurable.The adhesive film contains: (a) polymer;(b) be at 50 DEG C liquid epoxy resin;(c) at least one of curing agent and curing accelerator;(d) thermal conductivity is the filler of 10W/ (mK) or more, meets condition shown in following inequality (1), and the shear strength after heat cure is 1.5MPa or more.In formula, ma indicates to form the carbonaceous amount of the cyclic structure of (a) polymer, mb indicates to form the carbonaceous amount of the cyclic structure of (b) epoxy resin, mc indicates to form the carbonaceous amount of the cyclic structure of (c) curing agent and curing accelerator, M indicates (a) polymer, (b) epoxy resin and (c) gross mass of curing agent and curing accelerator.(ma+mb+mc)/M≥0.43(1).
Description
Technical field
This disclosure relates to which adhesive film and cutting chip engage one-piece type film.
Background technique
In the past, it proposes various for improving the technology of the heat dissipation effect of semiconductor device.Patent document 1, which discloses, to be passed through
Metallic substrates are set in the lower part of the cutting pad and wire portion that are placed with semiconductor element, to improve semiconductor element generation
The semiconductor device encapsulation of the heat dissipation effect of heat.Patent document 2 is disclosed by being 12W/ (mK) or more by thermal conductivity
Particle cooperates in thermosetting die junction film, so that the thermal conductivity after the heat cure of the chip junction film be made to reach 1W/
(mK) more than.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 5-198701 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2015-103573 bulletin
Summary of the invention
Technical problems to be solved by the inivention
But invention documented by patent document 1 still has room for improvement in the following areas.That is, described in Patent Document 1
Metallic substrates used by inventing are due to having the coefficient of thermal expansion different from semiconductor element and cutting pad, because of semiconductor element
Part generates heat repeatedly, has the removing of generation metallic substrates or semiconductor package to load onto the danger cracked.
Although patent document 2 discloses the film that the thermal conductivity after heat cure is 1W/ (mK) or more, expect film into one
Walk high thermal conductivity.By further increasing the use level of the filler with high-termal conductivity, adhesive film can be further improved
Electrical conductivity.But when the use level of filler is excessively increased, the use level of resin is relatively reduced.Adhesive film as a result,
Bonding force (shear strength after solidification) is easy to become inadequate, it becomes difficult to play should have as bonding agent
Effect.That is, being only to be difficult to take into account excellent cementability and heat dissipation by adjusting the use level of the filler with high thermal conductivity
Property.
The disclosure is made in view of the above subject, its purpose is to provide can with sufficiently high level realize cementability and
The adhesive film of both thermal diffusivities and has it as the cutting chip of chip junction film and engage one-piece type film.
For solving the means of technical problem
This disclosure relates to which a kind of adhesive film with Thermocurable, contains: (a) polymer;It (b) is liquid at 50 DEG C
Epoxy resin;(c) at least one of curing agent and curing accelerator;(d) thermal conductivity is the filling of 10W/ (mK) or more
Object.The adhesive film meets condition shown in following inequality (1), and the shear strength after heat cure is 1.5MPa or more.
(ma+mb+mc)/M≥0.43 (1)
[in formula, ma indicates to form the carbonaceous amount of the cyclic structure of (a) polymer, mb indicates to form the ring of (b) epoxy resin
The carbonaceous amount of shape structure, mc indicate to form the carbonaceous amount of the cyclic structure of (c) curing agent and curing accelerator, M expression (a) polymerization
Object, (b) epoxy resin and (c) gross mass of curing agent and curing accelerator.]
Composition below can be used in the disclosure.
The arithmetic average roughness Ra of film surface after heat cure is 0.25 μm or less.
(a) polymer contains the polymer for meeting condition shown in following inequality (2).
ma/MA≥0.40 (2)
[in formula, ma indicates to form the carbonaceous amount of the cyclic structure of (a) polymer, MAIndicate the gross mass of (a) polymer.]
(a) polymer contains phenoxy resin.
(d) filler is alpha-alumina particle.
Adhesive film with a thickness of 50 μm or less.
(d) content of filler by (a) polymer, (b) epoxy resin, (c) curing agent and curing accelerator and
(d) total amount of filler is set as when 100 mass parts being 60~95 mass parts.
The disclosure provides the one-piece type film of cutting chip engagement for having above-mentioned adhesive film as chip junction film.That is the cutting
Chip, which engages one-piece type film, to be had: the chip junction film formed by above-mentioned adhesive film;With the cutting being layered on chip junction film
Film.
Invention effect
According to the disclosure, the adhesive film that both cementability and thermal diffusivity can be realized with sufficiently high level can be provided
And has the adhesive film as the cutting chip of chip junction film and engage one-piece type film.
Detailed description of the invention
Fig. 1 is to show schematically that the cutting chip of the disclosure engages the sectional view of an embodiment of one-piece type film.
Specific embodiment
Embodiment of the present disclosure is described in detail below.The adhesive film of present embodiment has Thermocurable,
It contains by being at least one of epoxy resin, (c) curing agent and curing accelerator of liquid at (a) polymer, 50 DEG C of (b)
The resin component of formation and (d) filler being dispersed in the resin component (thermal conductivity is 10W/ (mK) or more).The bonding
Film, which is based upon, to be increased the amount of the cyclic structure (especially aromatic rings) in above-mentioned resin component, can make the bonding after solidifying
The thermal conductivity of film improves this new opinion and completes.Replace adjustment that there is high fever that is, the adhesive film of present embodiment passes through
This existing gimmick of the use level of the filler of conductance or while the existing gimmick also adjust resin component in ring-type
This novel gimmick of the amount of structure, realizes the raising of the thermal conductivity of the adhesive film after solidifying.
The adhesive film of present embodiment meets condition shown in following inequality (1) and the shear strength after heat cure is
More than 1.5MPa.
(ma+mb+mc)/M≥0.43 (1)
[in formula, ma indicates to form the carbonaceous amount of (a) polymer cyclic structure, mb indicates to form (b) epoxy resin ring-type knot
The carbonaceous amount of structure, mc indicate to form the carbonaceous amount of (c) curing agent and curing accelerator cyclic structure, M expression (a) polymer, (b)
The gross mass of epoxy resin and (c) curing agent and curing accelerator.]
Constitute the aromatic rings of the ingredient (polymer, epoxy resin and curing agent and/or curing accelerator) of resin component
Amount can use ring parameter and evaluated.The value of ring parameter is bigger, then means that the amount of aromatic rings is more.Ring parameter is to pass through
Form the value that the carbonaceous amount of the aromatic rings of compound is calculated divided by the gross mass of the compound.When preparing resin component, make
It can be increased above-mentioned for polymer, epoxy resin, curing agent or curing accelerator by the substance for selecting the value of ring parameter big
The value on the left side of inequality (1).
By using the resin component for meeting condition shown in inequality (1), even excessively increase matching for (d) filler
Resultant also can get the sufficiently high adhesive film of thermal conductivity after solidifying.The higher adhesive film of thermal conductivity after being solidified
Viewpoint is set out, and resin component preferably satisfies following inequality (1A), more preferably meets following inequality (1B).
(ma+mb+mc)/M≥0.45 (1A)
(ma+mb+mc)/M≥0.47 (1B)
The upper limit value of ((ma+mb+mc)/M) is, for example, 0.70 or so, can be hardened more than the film of the upper limit value, cementability it is easy
In becoming insufficient.
The thermal conductivity of adhesive film after heat cure be preferably 1.3W/ (mK) or more, more preferably 1.5W/ (mK) with
Above, further preferably more than 1.7W/ (mK).When the thermal conductivity of adhesive film after solidification is 1.3W/ (mK) or more, such as
The adhesive film is used as chip junction film can obtain sufficient heat dissipation effect when manufacturing semiconductor device.After solidification
The upper limit value of the thermal conductivity of adhesive film is, for example, 6.0W/ (mK), can also be 4.0W/ (mK).
The shear strength of adhesive film after heat cure is 1.5MPa or more, preferably 1.6MPa or more, is more preferably
More than 1.7MPa.When the shear strength of adhesive film after solidification is 1.5MPa or more, it can be ensured that sufficiently high bonding force.Solidification
The upper limit value of the shear strength of adhesive film afterwards is, for example, 10.0MPa.
The arithmetic average roughness Ra (below simply referred to as " surface roughness Ra ") of adhesive film after heat cure is preferably
0.25 μm or less, more preferably 0.20 μm or less, further preferably 0.16 μm or less.The rough surface of adhesive film after solidification
Spending Ra is 0.25 μm or less, it can be ensured that sufficiently high bonding force.The lower limit value of the surface roughness Ra of adhesive film after solidification
For example, 0.03 μm.
As long as the thickness of adhesive film is 50 μm or less, such as can be 5~50 μm, preferably 5~40 μm, more preferable
It is 8~40 μm.When the thickness of adhesive film is less than 5 μm, have the tendency that stress alleviation effects shortage, have landfill property also reduce incline
To, and when more than 50 μm, cost is easy to get higher.
Ingredient contained by adhesive film is illustrated below.
< (a) polymer >
As (a) polymer, from the viewpoint of obtaining film formative, heat resistance and cementability, preferred phenoxy resin, poly-
Imide resin, polyamide, polycarbodiimide resin, cyanate ester resin, acrylic resin, polyester resin, poly- second
Olefine resin, polyethersulfone resin, polyetherimide resin, polyvinyl acetal resin and polyurethane resin.Wherein, it is formed from film
From the perspective of property and excellent heat resistance, more preferable phenoxy resin, polyimide resin, polyamide, acrylic resin, cyanogen
Acid esters ester resin and polycarbodiimide resin, from the viewpoint of being easy the adjustment such as molecular weight, characteristic imparting, further preferably
Phenoxy resin.As (a) polymer, a kind in above-mentioned resin can be used alone, or be mixed with two or more, also
The copolymer of two or more monomer can be used.
From the viewpoint of the left side value ((ma+mb+mc)/M) for increasing above-mentioned inequality (1), (a) polymer is preferably comprised
The polymer for meeting condition shown in following inequality (2) more preferably meets following inequality (2A), further preferably meets following
Inequality (2B).
ma/MA≥0.40 (2)
ma/MA≥0.45 (2A)
ma/MA≥0.50 (2B)
[in formula, ma indicates to form the carbonaceous amount of the cyclic structure of polymer, MAIndicate the gross mass of polymer.]
In other words, (a) polymer is preferably made of one kind or two or more polymer, at least one kind of ring parameter
Preferably 0.40 or more, it is more preferably 0.45 or more, further preferably 0.50 or more.
When using phenoxy resin as (a) polymer, weight average molecular weight is preferably 20,000 or more, more preferably 30,000 with
On.As commercially available phenoxy resin, can enumerate YP-50, YP-55, YP-70, YPB-40PXM40, YPS-007A30, FX-280S,
FX-281S, FX-293 and ZX-1356-2 (the above are Toto Kasei KK's systems, trade name), 1256,4250,4256,
4275, YX7180, YX6954, YX8100, YX7200, YL7178, YL7290, YL7600, YL7734, YL7827 and YL7864
(the above are Japan Epoxy Resin Co. Ltd. systems, trade name) etc. can be used alone a kind therein or and with 2 kinds
More than.
The glass transition temperature (Tg) of phenoxy resin is preferably shorter than 85 DEG C, as the commercially available product for meeting the condition, such as
YP-50, YP-55, YP-70, ZX-1356-2 can be enumerated (the above are Toto Kasei KK's systems, trade name);4250,4256,
7275, YX7180 and YL7178 (the above are Japan Epoxy Resin Co. Ltd. systems, trade name).It can be used alone it
In a kind, or be used in combination of two or more.
When using acrylic resin as (a) polymer, preferably there is reactive group (functional group) and weight average molecular weight
For 100,000 or more persons.As reactive group, such as carboxylic acid group, amino, hydroxyl and epoxy group can be enumerated etc..Wherein, functional group
When monomer is the acrylic acid of carboxylic acid type, due to cross-linking reaction is easy to carry out, the gelation under varnish state, under B-stage state
Curing degree improves, and has the case where bonding force decline.Therefore, even if more preferably use will not occur these situations or occur, the phase
Between the also very long glycidyl acrylate or glycidyl methacrylate with epoxy group.In acrylic resin, more
It is preferable to use the acrylic acid series copolymers containing epoxy group that weight average molecular weight is 100,000 or more.(a) polymer can be by obtaining
It is polymerize in the polymerization reaction of sub- compound that secures satisfactory grades according to the remaining mode of unreacted monomer and is obtained, or can also be led to
It crosses after obtaining high-molecular compound and adds the monomer containing reactive group to obtain.In addition, weight average molecular weight is to utilize
It gel permeation chromatography (GPC), the polystyrene scaled value that is obtained using the standard curve obtained by standard polystyren.
As acrylic acid series copolymer, such as being total to as acrylate, methacrylate and acrylonitrile etc. can be enumerated
The acrylic rubber of polymers.In addition, it is high for cementability and heat resistance, contain 0.5~6 matter particularly preferable as functional group
Measure % glycidyl acrylate or glycidyl methacrylate, glass transition temperature (Tg) be -50 DEG C or more and
50 DEG C or less and then be -10 DEG C or more and 50 DEG C or less and acrylic acid series copolymer that weight average molecular weight is 100,000 or more.
As the glycidyl acrylate containing 0.5~6 mass % or glycidyl methacrylate, Tg be -10 DEG C or more and
Weight average molecular weight is 100,000 or more acrylic acid series copolymer, such as can enumerate HTR-860P-3 (Imperial Chemical Industries industry strain formula meeting
Society's system, trade name).
The amount of the glycidyl acrylate or glycidyl methacrylate that use as monomer is more preferable
For the copolymer ratio of 2~6 mass %.In order to obtain higher bonding force, preferably 2 mass % or more, there is hair when more than 6 mass %
The possibility of raw gelation.The alkane that methyl acrylate, methyl methacrylate etc. are 1~8 with carbon number can be used in remainder
The mixture of alkyl acrylate, alkyl methacrylate and the styrene of base, acrylonitrile etc..Wherein, particularly preferably
(methyl) ethyl acrylate and/or (methyl) butyl acrylate.From increase above-mentioned inequality (1) left side value ((ma+mb+mc)/
M from the perspective of), as monomer, it is preferable to use styrene, benzyl acrylate or benzyl methacrylates.Blending ratio
It is preferred that considering the Tg of copolymer to be adjusted.When Tg is less than -10 DEG C, there are adhesive layer under B-stage state or adhesive film
The tendency that adhesiveness increases, treatability can deteriorate sometimes.Polymerization is not particularly limited, such as can enumerate pearl polymerisation, molten
Liquid polymerization etc. obtains copolymer by these methods.
The weight average molecular weight of acrylic acid series copolymer containing epoxy group is preferably 300,000~3,000,000, more preferably 400,000~
2000000.When weight average molecular weight is less than 300,000, there is the intensity of adhesive film (or adhesive sheet) or flexible reduce or adhesiveness increases
Big possibility, and when more than 3,000,000 has the possibility that mobility is small, circuit fillibility of wiring reduces.
The content of (a) polymer in adhesive film is relative to (a) polymer, (b) epoxy resin, (c) curing agent and solidification
100 mass parts of total amount of promotor and (d) filler, preferably 3~40 mass parts, more preferably 3~30 mass parts, into one
Step is preferably 3~20 mass parts.(a) when the content of polymer is 3 mass parts or more, elasticity modulus can suitably reduced
Mobility when forming is assigned simultaneously, if it exceeds 40 mass parts, then have mobility to reduce, circuit fillibility when attaching loading less
Reduced possibility.
< (b) epoxy resin >
As (b) epoxy resin, two functional groups or more can be used, molecular weight is preferably smaller than 5000, more preferably less than
Two functional epoxy resins such as bisphenol A type epoxy resin, bisphenol f type epoxy resin, benzene can be used for example in 3000 epoxy resin
Phenolic resin varnish type epoxy resins such as phenol phenolic resin varnish type epoxy resin, cresol novolak type epoxy resin etc..Furthermore it is also possible to
Using commonly known epoxy resin such as polyfunctional epoxy resin, epoxy resin containing heterocycle.
As commercially available epoxy resin, for example, can enumerate Epikote 152, Epikote 154, Epikote 604,
Epikote 630、Epikote 630LSD、Epikote 807、Epikote 815、Epikote 825、Epikote827、
Epikote 828、Epikote 834、Epikote 1001、Epikote 1002、Epikote 1003、Epikote 1055、
Epikote 1004、Epikote 1004AF、Epikote 1007、Epikote 1009、Epikote 1003F、Epikote
1004F、Epikote 180S65、Epon 1031S、Epikote 1032H60、Epikote 157S70、1256、4250、
4256,4275, (the above are Japan by YX6954, YX8100, YL7178, YL7290, YL7175-500, YL7175-1000
Epoxy Resin Co. Ltd. system, trade name), DER-330, DER-301, DER-361, DER-661, DER-662, DER-
663U、DER-664、DER-664U、DER-667、DER-642U、DER-672U、DER-673MF、DER-668、DER-669、
DEN-438 (the above are Dow Chemical corporations, trade name), YDCN-700, YDCN-701, YDCN-702, YDCN-703,
(the above are Dongdu by YDCN-704, YD-8125, YDF-8170, YDF-8170C, YD-825, YDF-870, YDF-2004, YH-434
Be melted into Co. Ltd. system, trade name), the cresol novolak type epoxy resins such as ESCN-195X, ESCN-200L, ESCN-220,
The amine type such as ELM-120 epoxy resin (the above are Sumitomo Chemical Company Ltd's systems, trade name), EPPN-201, EPPN501H,
EPPN502H、RE-3035-L、RE-310S、EOCN-102S、EOCN-103S、EOCN-104S、EOCN-1012、EOCN-1020、
EOCN-1025, EOCN-1027 (the above are Nippon Kayaku K. K's systems, trade name), Araldit ECN1273, Araldit
(the above are Ciba Specialty by ECN1280, Araldit ECN1299, Araldit 0163, Araldit PT810
Chemicals corporation, trade name), Denacol EX-611, Denacol EX-614, Denacol EX-614B, Denacol
EX-622、Denacol EX-512、Denacol EX-521、Denacol EX-421、Denacol EX-411、Denacol
(the above are Mitsubishi GAS chemistry by EX-321 (the above are NAGASE to be melted into Co. Ltd. system, trade name), TETRAD-X, TETRAD-C
Co. Ltd. system, trade name), ERL4234, ERL4299, ERL4221, ERL4206 (the above are UCC corporations, trade name) etc.
(the above are Asahi Denka Co., Ltd.'s systems, commodity by alicyclic epoxy resin, EP-4000, EP-3950L, EP-3980S, EPR-4030
Name) etc., it can be used alone a kind therein, can also be used in combination of two or more.
It the use of at 50 DEG C of a kind or more is liquid person as (b) epoxy resin.The research of people according to the present invention, in order to
Manufacture can take into account the adhesive film of cementability and thermal diffusivity, and it is useful for meeting inequality (1) and keeping the flexibility of adhesive film.
For example, even if if adhesive film is excessively hard, cementability still becomes insufficient, and thus thermal conductivity is easy when meeting inequality (1)
In becoming insufficient.In order to keep the flexibility of adhesive film, the epoxy at 50 DEG C for liquid is used in present embodiment.In addition,
As long as being able to maintain the flexibility of adhesive film, can also use epoxy resin non-liquid at 50 DEG C (is the ring of solid at 50 DEG C
Oxygen resin).
As at 50 DEG C be liquid epoxy resin, can enumerate Epikote 807, Epikote 815, Epikote 825,
Epikote 827、Epikote 828、Epikote 834、Epikote 1001、Epikote 152、Epikote 630、
Epikote 630LSD (the above are Japan Epoxy Resin Co. Ltd. systems, trade name), YD-8125, YDF-8170, YD-
825, YDF-870 (the above are Toto Kasei KK's systems, trade name), (the above are Japanese chemical drugs by RE-3035-L, RE-310S
Co. Ltd. system, trade name), EP-4000, EP-3950L, EP-3980S, EPR-4030 (the above are Asahi Denka Co., Ltd.'s system,
Trade name) etc., it can be used alone a kind therein, can also be used in combination of two or more, can also be used in combination with solid-state person.From increase
From the perspective of the value ((ma+mb+mc)/M) for stating inequality (1) left side, (b) polymer, which particularly preferably contains also, has practical effect
The YDF-8170 (Toto Kasei KK's system, trade name) of fruit.
As (b) epoxy resin, when by epoxy resin more than two functional epoxy resins and trifunctional and used time, by them
Total amount when being set as 100 mass parts, preferably the amount of two functional epoxy resins is 50 mass parts or more (asphalt mixtures modified by epoxy resin more than trifunctional
The amount of rouge is less than 50 mass parts).From the viewpoint of high Tgization, the amount of more preferable two functional epoxy resins is 50~90 mass
The amount of epoxy resin more than part, trifunctional is 10~50 mass parts.
The content of (b) epoxy resin in adhesive film is relative to (a) polymer, (b) epoxy resin, (c) curing agent and consolidates
Change promotor and (d) 100 mass parts of total amount of filler, preferably 3~40 mass parts, more preferably 3~30 mass parts, into
One step is preferably 3~20 mass parts.
< (c) curing agent and curing accelerator >
As long as the adhesive film of present embodiment contains at least 1 conduct (c) ingredients in curing agent and curing accelerator i.e.
It can.Hereinafter, enumerating the specific example of curing agent and curing accelerator.
(curing agent)
As (c) curing agent, multifunctional phenols, amine, imidazolium compounds, acid anhydrides, organic phosphorus chemical combination can be used for example
Object and their halide, polyamide, polysulfide, boron trifluoride.As the example of multifunctional phenols, conduct can be enumerated
Quinhydrones, resorcinol, catechol, the bisphenol-A as polycyclic two functions phenol, Bisphenol F, the bisphenol S, naphthalene two of two function phenol of monocycle
Alcohols, biphenyl phenols and their halide, alkyl substituents etc..Furthermore it is also possible to used as these phenols and aldehydes
The phenol such as phenol resol resins, resol, bisphenol A novolac resin and the cresol novolac resin of condensation polymer
Urea formaldehyde etc..
As commercially available preferred phenolic resin curing agent, such as PHENOLITE LF2882, PHENOLITE can be enumerated
LF2822、PHENOLITE TD-2090、PHENOLITE TD-2149、PHENOLITE VH4150、PHENOLITE VH4170
(the above are Dainippon Ink. & Chemicals Inc's systems, trade name), XLC series (Mitsui Chemicals, Inc, trade name)
Deng.
As (c) curing agent, it is preferable to use hydroxyl equivalent is the phenolic resin of 150g/eq or more.As this phenolic aldehyde tree
Rouge, as long as there is above-mentioned value to be then not particularly limited, but electrocorrosion-resisting when for moisture absorption is excellent, it is preferable to use novolaks
The resin of type or solvable phenol aldehyde type.As the specific example of above-mentioned phenolic resin, such as phenolic aldehyde shown in following formula (I)s can be enumerated
Resin.
[chemical formula number 1]
[in formula, R1Identical also different, expression hydrogen atom, the linear or branched alkyl group that carbon number is 1~10, ring can be distinguished
Shape alkyl, aralkyl, alkenyl, hydroxyl, aryl or halogen atom, n indicate that 1~3 integer, m indicate 0~50 integer.]
It as this phenolic resin, is then not particularly limited as long as meeting formula (I), from the viewpoint of moisture-proof, preferably
Water absorption rate after putting into 48 hours in 85 DEG C, the constant temperature and humidity cabinet of 85%RH is 2 mass % or less.In addition, using heat is utilized
Heating weight reduction rates (heating rate: 5 DEG C/min, environmental gas: nitrogen) at 350 DEG C of gravimetric analysis meter (TGA) measurement
When phenolic resin less than 5 mass %, due to can inhibit volatile ingredient when heating processing etc., thus heat resistance, moisture-proof etc.
The reliability of many characteristics improves, and can reduce because of machine pollution caused by heating volatile ingredient when processing etc. operates,
Therefore preferably.Phenolic resin shown in formula (I) for example can be by making phenolate in the presence of no catalyst or acid catalyst
Object is closed to react and obtain with the penylene dimethyl compound as divalent linker.
As phenolic resin as described above, such as it can enumerate that Mirex XLC- series, (the above are three for Mirex XL series
Well Chemical Co., Ltd. system, trade name) etc..Use level when with epoxy composite using above-mentioned phenolic resin is to be respectively ring
The equivalent ratio of oxygen equivalent and hydroxyl equivalent, preferably reach 0.70/0.30~0.30/0.70, more preferably up to 0.65/0.35~
0.35/0.65, further preferably reach 0.60/0.30~0.30/0.60, particularly preferably reach 0.55/0.45~0.45/
0.55.If match ratio is more than above range, there is a possibility that curability deterioration when bonding agent is made.
Phenolic compounds used in phenolic resin as manufacture formula (I), can example go out phenol, o-cresol, metacresol, right
Cresols, o-ethyl phenol, paraethyl phenol, adjacent n-propyl phenol, n-propyl phenol, to n-propyl phenol, o-isopropyl benzene
Phenol, 3-Isopropylphenol, australol, adjacent normal-butyl phenol, normal-butyl phenol, to normal-butyl phenol, adjacent isobutyl group
Phenol, isobutyl group phenol, to isobutyl group phenol, octyl phenol, nonyl phenol, 2,4- dimethlbenzene, 2,6- dimethlbenzene, 3,
5- dimethlbenzene, 2,4,6- pseudocuminol, resorcinol, catechol, quinhydrones, 4- metoxyphenol, o-phenyl phenol,
Phenylphenol, p-phenyl phenol, p-cyclohexylphenol, o-allyl phenol, chavicol, 2- methane, to benzyl
Phenol, o-chlorphenol, parachlorophenol, o-bromophenol, p bromophenol, phenol o-iodine, to iodophenol, adjacent fluorophenol, m fluorophenol,
P-fluorophenol etc..These phenolic compounds can be used alone, and can also be mixed with two or more.Benzene can particularly preferably be enumerated
Phenol, o-cresol, metacresol, paracresol etc..
Penylene dimethyl compound as divalent linker used in phenolic resin as manufacture formula (I), can be with
Use penylene dimethyl dihalide, penylene dimethyl diethylene glycol (DEG) and its derivative described below.I.e., it is possible to α is enumerated, α '-
Two chloro- paraxylene, α, the chloro- meta-xylene of α '-two, α, α '-dichloro-o-xylene, α, the bromo- paraxylene of α '-two, α, α '-
Two bromo- meta-xylenes, α, the bromo- ortho-xylene of α '-two, α, the iodo- paraxylene of α '-two, α, the iodo- meta-xylene of α '-two, α, α '-
Two iodo- ortho-xylenes, α, α '-dihydroxy-paraxylene, α, α '-dihydroxy-meta-xylene, α, α '-dihydroxy-ortho-xylene,
α, α '-dimethoxy-paraxylene, α, α '-dimethoxy-meta-xylene, α, α '-dimethoxy-ortho-xylene, α, α '-two
Ethyoxyl-paraxylene, α, α '-diethoxy-meta-xylene, α, α '-diethoxy-ortho-xylene, α, positive third oxygen of α '-two
Base-paraxylene, α, α '-positive propoxy-meta-xylene, α ,-two positive propoxies of α '-ortho-xylene, α, α '-diisopropoxy-
Paraxylene, α, α '-diisopropoxy-meta-xylene, α, α '-diisopropoxy-ortho-xylene, α ,-two n-butoxy of α '-right
Dimethylbenzene, α ,-two n-butoxies of α '-meta-xylene, α ,-two n-butoxies of α '-ortho-xylene, α ,-two isobutoxy of α '-is to two
Toluene, α ,-two isobutoxies of α '-meta-xylene, α ,-two isobutoxies of α '-ortho-xylene, α ,-two tert-butoxy of α '-is to diformazan
Benzene, α ,-two tert-butoxies of α '-meta-xylene, α ,-two tert-butoxies of α '-ortho-xylene.It can be used alone a kind therein, or
Person is mixed with two or more.These, it is preferred to the chloro- paraxylene of α, α '-two, α, the chloro- meta-xylene of α '-two, α, α '-two
Chloro- ortho-xylene, α, α '-dihydroxy-paraxylene, α, α '-dihydroxy-meta-xylene, α, α '-dihydroxy-ortho-xylene, α,
α '-dimethoxy-paraxylene, α, α '-dimethoxy-meta-xylene, α, α '-dimethoxy-ortho-xylene.
When reacting above-mentioned phenolic compounds with penylene dimethyl compound, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid etc. are used
Mineral acids;The organic carboxyl acids classes such as dimethyl sulfate, diethyl sulfuric acid, p-methyl benzenesulfonic acid, methanesulfonic acid, ethanesulfonic acid;Fluoroform
The superpower acids such as sulfonic acid;The strong-acid ion exchange resins classes such as alkanesulfonic acid type ion exchange resin;Perfluoroalkanesulfonic acid type from
The superpower acidities such as sub-exchange resin Ion exchange resins (trade name: Nafion, Du Pont corporation);Natural and synthesis boiling
Stone class;The acidic catalysts such as atlapulgite (Emathlite) class, make its reaction at 50~250 DEG C, until essentially as original
The penylene dimethyl compound of material disappears and reaction composition reaches constant.Although reaction time also depends on raw material and reaction temperature
Degree, but about 1 hour~15 hours or so, actually formed on one side using following responses such as GPC (gel permeation chromatographies)
It determines on one side.Except that using α, when the halogenations parylene derivative such as chloro- paraxylene of α '-two, due to being in life
It is reacted under no catalyst at while corresponding hydrogen halide, therefore is not needed acid catalyst.In other situations
Under, reaction carries out in the presence of acid catalyst, generates corresponding water or alcohol.Phenolic compounds is anti-with penylene dimethyl compound
Molar ratio is answered usually excessively using phenolic compounds, after the reaction to recycle unreacted phenolic compounds.At this point, according to phenolate
The amount for closing object determines average molecular weight, and phenolic compounds is superfluous more, then can get the lower phenolic resin of average molecular weight.This
Outside, can for example be prepared by the following as the phenolic resin that phenolic compounds part is allyl phenol: manufacture is without allyl
The phenolic resin of change, reacts with it allyl halide, and by allyl ether, allyl occurs by Claisen rearangement
Change.
As the example of amine, aliphatic or aromatic primary amine, secondary amine, tertiary amine, quaternary ammonium salt and aliphatic ring can be enumerated
Shape amine, guanidine, urea derivative etc..As an example of these compounds, N, N- benzyldimethylamine, 2,4,2- (diformazan can be enumerated
Base amino methyl) phenol, 2,4,6- tri- (dimethylaminomethyl) phenol, tetramethylguanidine, triethanolamine, N, N '-dimethyl piperazine
Piperazine, 1,4- diazabicyclo [2.2.2] octane, 1,8- diazabicyclo [5.4.0] -7- endecatylene, 1,5- diazabicyclo
[4.4.0] -5- nonene, hexa, pyridine, picoline, piperidines, pyrrolidines, dimethylcyclohexylam,ne, dimethyl oneself
Base amine, cyclo-hexylamine, diisobutyl amine, di-n-butyl amine, diphenylamine, methylphenylamine, three n-propyl amine, three n-octyls
Amine, tri-n-butyl amine, triphenylamine, tetramethyl ammonium chloride, 4 bromide, tetramethyl-ammonium iodide, trien, two
Aminodiphenylmethane, diamino-diphenyl ether, dicyandiamide, tolylbigaunide, dicyandiamidines, dimethyl urea etc..
As the example of imidazolium compounds, imidazoles, 2- ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2- methyl miaow can be enumerated
Azoles, 2- phenylimidazole, 2- undecyl imidazole, 1 benzyl 2 methyl imidazole, 2- heptadecyl imidazole, 4,5- diphenyl-imidazole,
2-methylimidazole quinoline, 2- benzylimidazoline, 2- undecyl imidazole quinoline, 2- heptadecyl imidazole quinoline, 2 isopropyl imidazole, 2,4-
Methylimidazole, 2- phenyl -4-methylimidazole, 2- ethyl imidazol(e) quinoline, 2- phenyl -4-methylimidazole quinoline, benzimidazole, 1- cyano
Ethyl imidazol(e) etc..
As the example of acid anhydrides, there are phthalate anhydride, hexahydrophthalic acid anhydride, pyromellitic acid anhydride, benzophenone four
Carboxylic acid dianhydride etc..
As organic phosphorus compound, as long as with organic group phosphorus compound, then can be not particularly limited using,
Such as can enumerate hexamethylphosphoric triamide, tricresyl phosphate (two chloropropyls) ester, tricresyl phosphate (chloropropyl) ester, triphenyl phosphite,
Trimethyl phosphate, phenyl-phosphonic acid, triphenylphosphine, tri-n-butyl phosphine, diphenylphosphine etc..
It can be used alone a kind of these curing agent, or two or more kinds may be used.The use level of these curing agent is only
Want the curing reaction that can make epoxy group to carry out, then can be not particularly limited using, preferably with respect to 1 mole of epoxy group,
With the range of 0.0~5.0 equivalent, particularly preferably with the range of 0.0~1.2 equivalent carry out using.In addition, in epoxy resin and admittedly
In agent, compound without mutagenicity, for example without using the epoxy resin of bisphenol-A and curing agent due to environment and people
The influence of body is small and preferred.
(curing accelerator)
It is not particularly limited as curing accelerator, tertiary amine, imidazoles, quaternary ammonium salt etc. can be used for example.As imidazoles
Class, such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 1- cyano ethyl -2- phenylimidazole, 1- cyano ethyl -2- can be enumerated
Phenylimidazole trimellitate, 2,4- diamino -6- [2 '-methylimidazolyls-(1 ')]-ethyl-s-triazine isocyanuric acid add
At object etc., these substances also can be used a kind or be used in combination of two or more.Imidazoles are for example by Shikoku Chem
It is sold with the trade name of 2E4MZ, 2PZ-CN, 2PZ-CNS, 2MA-OK.
During the use of film it is extended in terms of for, preferably with the curing accelerator of potentiality.As its typical example,
The dihydrazide compounds such as dicyandiamide, adipic dihydrazide, guanamines acid, melamine amino acid, epoxide and imidazoles can be enumerated
Close the additive compound of object, the additive compound of epoxide and dialkyl amine, the additive compound of amine and thiocarbamide, amine with
The additive compound etc. of isocyanates.In addition, preferably taking adduct type knot in terms of can reduce at room temperature active
The substance of structure.
The use level of curing accelerator on the basis of the total amount of epoxy resin and curing agent, preferably 0~10.0 mass %,
More preferably 0.02~5.0 mass %, further preferably 0.03~4.0 mass %.The use level of curing accelerator is more than 4.0
When quality %, there are storage stability reduction, working life to become insufficient tendency.
The total content of (c) curing agent and curing accelerator in adhesive film relative to (a) polymer, (b) epoxy resin,
(c) curing agent and curing accelerator and (d) 100 mass parts of total amount of filler, preferably more than 0 mass parts and 5.0 mass
Part or less, more preferably 0.02~3.0 mass parts, further preferably 0.03~2.0 mass parts.In addition, " (c) curing agent and
The total content of curing accelerator " refers to the content of curing agent when (c) ingredient is only curing agent, is in only curing accelerator
Refer to the content of curing accelerator.
< (d) filler >
(d) filler has the thermal conductivity of 10W/ (mK) or more.As (d) filler, aluminium oxide particles, nitrogen can be enumerated
Change boron particles, aluminum nitride particle, silicon nitride particles, zinc oxide particles, magnesia particle, aluminum hydroxide particles, magnesium hydroxide grain
The electrical insulating properties person such as son and diamond.It can be used alone a kind therein, can also be used in combination of two or more.Wherein, aluminum shot is aoxidized
Son, boron nitride particles are high heat conductance, and dispersibility is also excellent, and water-proofing performance is also good, and from starting with, easy aspect is preferred.
In aluminium oxide, preferred Alpha-alumina, Al2O3Purity is preferably 99.90% or more, is more preferably 99.92% or more, is further
Preferably 99.95% or more.The upper limit of thermal conductivity is not particularly limited, and is more improved the purity of Alpha-alumina filler, can more be mentioned
High heat conductance.As the Alpha-alumina of purity is high, AA serial (the Sumitomo Chemical system, commodity of Sumicorundum can be enumerated
Name).
(d) average grain diameter (d50) of filler be preferably be bonded film thickness 1/2 or less, more preferably 1/3 or less, into
One step is preferably 1/4 or less.(d) when the average grain diameter of filler is more than the 1/2 of bonding film thickness, the concave-convex of film surface increases,
Adhesive strength, plyability, reliability etc. have the possibility of reduction.As (d) filler, the average grain diameter that can be used alone (d50) is
A kind of filler, can also and the two or more fillers different with average grain diameter (d50).
The content of (d) filler in adhesive film is relative to (a) polymer, (b) epoxy resin, (c) curing agent and solidification
100 mass parts of total amount of promotor and (d) filler, preferably 60~95 mass parts, more preferably 65~95 mass parts, into
One step is preferably 70~90 mass parts.If (d) content of filler is lower than 60 mass parts, there is the thermal conductivity of adhesive film to become
Insufficient possibility when more than 95 mass parts, there is the flexibility of adhesive film and the possibility of cementability reduction.
The other ingredient > of <
The adhesive composite of present embodiment adhesive film is constituted other than the ingredient of above-mentioned (a)~(d), such as may be used also
To contain curing accelerator, filler, coupling agent, ion trap agent, solder flux.
(filler)
For treatability, adjustment melt viscosity, imparting thixotropy, the raising moisture-proof etc. for improving adhesive composite, also
It can cooperate in resin combination each in addition to the filler of above-mentioned (d) filler (thermal conductivity is 10W/ (mK) or more)
Kind filler.As this filler, can enumerate aluminium hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicates, magnesium silicate,
Calcium oxide, magnesia, aluminium borate whisker, crystallinity silica, amorphism silica, sb oxide etc..Wherein, in order to mention
High-termal conductivity, preferably crystallinity silica, amorphism silica etc..It is excellent in order to adjust melt viscosity or assign thixotropy
Select aluminium hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicates, magnesium silicate, calcium oxide, magnesia, crystallinity silica,
Amorphism silica etc..In order to improve moisture-proof, preferably silica, aluminium hydroxide, sb oxide.These fillers contain
Amount is more preferably 0~20 mass parts, is more preferably relative to 100 mass parts of (d) filler, preferably 0~50 mass parts
0~10 mass parts.
(coupling agent)
In order to become the interface cohesion between dissimilar material well, various idols can also be added in adhesive composite
Join agent.As coupling agent, silane system, titanium system, aluminium system etc. can be enumerated, wherein it is preferred that silane series coupling agent.The additive amount of coupling agent
From its effect, heat resistance and cost aspect, relative to 100 mass parts of total amount of resin component, preferably 0~10 mass
Part.
It is not particularly limited as silane series coupling agent, the vinyl trichlorosilane, (β-first of vinyl three can be used for example
Oxygroup ethyoxyl) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyl three
Methoxy silane, γ-methacryloxypropylmethyl dimethoxysilane, β-(3,4- expoxycyclohexyl) ethyl front three
Oxysilane, γ-glycidoxypropyltrimewasxysilane, γ-glycidoxypropyl dimethoxysilane,
γ-glycidoxypropyl diethoxy silane, N- β-(amino-ethyl)-gamma-amino propyl trimethoxy silicane, N-
β-(amino-ethyl)-gamma-amino hydroxypropyl methyl dimethoxysilane, γ aminopropyltriethoxy silane, N- phenyl-γ-ammonia
Base propyl trimethoxy silicane, γ mercaptopropyitrimethoxy silane, γ-Mercaptopropyltriethoxysilane, 3- aminopropyl
Methyldiethoxysilane, 3- ureidopropyltriethoxysilane, 3- ureido-propyl trimethoxy silane, 3- aminopropyl front three
Oxysilane, 3- aminopropyl-three (2- Mehtoxy-ethoxy-ethyoxyl) silane, N- methyl -3- aminopropyl trimethoxy
Silane, triamido propyl-trimethoxysilane, 3- (4,5- dihydro) imidazoles -1- base-propyl trimethoxy silicane, 3- methyl-prop
Alkene acryloxypropylethoxysilane-trimethoxy silane, 3- mercaptopropyi-methyl dimethoxysilane, 3- chloropropyl-methyl dimethoxy oxygroup silicon
Alkane, 3- chloropropyl-dimethoxysilane, 3- cyanopropyl-triethoxysilane, hexamethyldisilazane, the bis- (trimethyls of N, O-
Silicyl) acetamide, methyltrimethoxysilane, methyltriethoxysilane, ethyl trichlorosilane, n-propyl trimethoxy
Silane, trimethoxysilane, amyl trichlorosilane, octyltri-ethoxysilane, phenyltrimethoxysila,e, phenyl three
Ethoxysilane, methyl three (methacroyloxyethoxy) silane, methyl three (glycidoxypropyl) silane, N- β-(N-
Vinylbenzylaminoethyl)-gamma-amino propyl trimethoxy silicane, octadecyldimethyl [3- (trimethyoxysilane
Base) propyl] ammonium chloride, γ-chloropropyl dichlorosilane, gamma-chloropropylmethyldimethoxysilane, γ-chloropropyl
Diethoxy silane, trimethylsilyl isocyanate, dimetylsilyl isocyanates, three isocyanide of methyl silicane base
Acid esters, vinyl silyl groups triisocyanate, phenyl silyl groups triisocyanate, tetraisocyanate silane, ethyoxyl silicon
Alkane isocyanates etc. can be used alone a kind therein, or be used in combination of two or more.
It is not particularly limited as titanium system coupling agent, three caprylyl titanate esters of isopropyl, isopropyl two can be used for example
(methylacryloyl) isostearoyl base titanate esters, isopropyl three (dodecyl benzenesulfonyl) titanate esters, isopropyl are stearic
Two acryloyl group titanate esters of acyl group, isopropyl three (dioctyl phosphate) titanate esters, three cumyl phenyl titanate esters of isopropyl, isopropyl
Base three (dioctylphyrophosphoric acid ester) titanate esters, isopropyl three (positive amino-ethyl) titanate esters, the bis- (dioctyl phosphitos of tetra isopropyl
Ester) titanate esters, bis- (two (tridecyl) phosphite esters) titanate esters of four octyls, four (2,2- diene propoxy methyl -1- butyl)
Bis- (two (tridecyl)) phosphite ester titanate esters, dicumylphenyl ethoxyacetic acid ester titanate esters, bis- (dioctylphyrophosphoric acid esters)
Ethoxyacetic acid ester titanate esters, tetra isopropyl titanate, tetra-n-butyl titanate esters, butyltitanate dimer, four (2- ethyl hexyls
Base) titanate esters, titanium acetylacetone, poly(titanium acetylacetonate), ethohexadiol acid titanium, lactic acid titanium ammonium salt, lactic acid titanium, lactic acid titanium ethyl ester, three
Ethanol amine titanium, poly- hydroxy stearic acid titanium, four methyl esters of ortho-titanic acid, tetraethyl orthotitanate, ortho-titanic acid orthocarbonate, four isobutyl of ortho-titanic acid
Bis- (2,4- pentanedione) titaniums of ester, metatitanic acid stearyl ester, metatitanic acid toluene ester monomer, metatitanic acid toluene ester polymer, diisopropoxy-
(IV), diisopropyl-it is bis--triethanolamine base titanate esters, ethohexadiol titanate esters, four n-butoxy titanium polymers, three n-butoxies
Titanium monostearate ester polymer, tri-n-butoxytitanium monostearate etc. can be used alone a kind therein, or and with 2 kinds
More than.
It is not particularly limited as aluminium system coupling agent, ethyl acetoacetate aluminium diisopropyl acid esters, three (second can be used for example
Ethyl acetoacetic acid ethyl ester) aluminium, Acetacetic acid alkyl ester aluminium diisopropyl acid esters, aluminium monoacylphosphine acetic acid esters bis- (ethyl acetoacetates), three
The mono- isopropoxy list oleoyl oxygroup ethyl acetoacetate of aluminium acetylacetonate, aluminium-,-two n-butanol salt of aluminium-mono- ethyl acetoacetate,
The aluminium chelate compounds such as aluminium-diiso propoxide-single acetyl ethyl acetate, aluminium isopropylate, single aluminium-sec-butylate diisopropyl acid esters, secondary butyric acid
Aluminum alcoholates such as aluminium, aluminium acetate etc. can be used alone a kind therein, or be used in combination of two or more.
(ion trap agent)
It, can also be in adhesive composite for adion impurity so that insulating reliability when moisture absorption becomes well
Middle cooperation ion trap agent.The use level of ion trap agent effect, heat resistance and cost aspect caused by add,
100 mass parts of total amount relative to resin component are preferably 1~10 mass parts.As ion trap agent, according to pair to be captured
As suitably selecting commercially available product use.It can be used due to preventing copper generation ionization and dissolving out as known to copper evil preventing agent
Compound, such as triazine thiol compound, bis-phenol system reducing agent, inorganic ions adsorbent etc..It is with triazine thiol compound
Preventing agent is commercially available three Pharmaceutical Co., Ltd of association systems, trade name: ZISNET DB for the copper evil of ingredient.It, can as bis-phenol system reducing agent
Enumerate 2,2 '-methylene-it is bis--(4- methyl-6-tert-butylphenol), 4,4 '-thio-bis--(3 methy 6 tert butyl phenols)
Deng commercially available to have Yoshitomi Pharmaceutical Industries Co., Ltd's system, trade name: YOSHINOX BB.As inorganic ions adsorbent, zirconium can be enumerated
Compound, antimony bismuth based compound, magnalium based compound etc., commercially available to have East Asia synthetic chemical industry Co. Ltd. system, trade name:
IXE。
The manufacture > of < varnish
The solvent used when making varnish is not particularly limited, and methyl ethyl ketone, acetone, methyl-isobutyl can be used for example
Ketone, cellosolvo, toluene, butyl cellosolve, methanol, ethyl alcohol, 2-methyl cellosolve, dimethyl acetamide, dimethyl methyl
Amide, methyl pyrrolidone, cyclohexanone etc..Wherein, film property etc., preferably methyl ethyl ketone, dimethyl acetamide, diformazan are applied in order to improve
The high boiling solvents such as base formamide, methyl pyrrolidone, cyclohexanone.These solvents can be used alone a kind or and with 2 kinds with
On.
The use level of solvent is not particularly limited, and nonvolatile component when preferred fabrication varnish is 40~90 mass %, more
Preferably 50~80 mass %.When nonvolatile component is less than 40 mass %, when the amount for the solvent that varnish volatilizees when making is more, dry
Heat need a large amount of, have the tendency that becoming unfavorable in terms of cost;When more than 90 mass %, the viscosity of varnish becomes excessively high,
Therefore there is a possibility that defect occurs for film.
When the manufacture of varnish is in view of the dispersibility of (d) filler and other fillers, grater, three can use
Roller, ball mill etc. carry out, or carry out after combining them.After filler ingredient and low molecular weight object are mixed in advance
Cooperate high molecular weight object again, the time required for mixing can also be shortened.In addition, after varnish is made, preferably by vacuum outgas
Bubble in varnish is removed.
The manufacture > of < adhesive film
After the coating on a carrier film of above-mentioned varnish, solvent is removed using heating, it is possible thereby to shape on a carrier film
At adhesive film.As long as the condition of heating is in the item that remove resin combination can fully by solvent in cured situation
Part is then not particularly limited, different according to the difference of the type of the ingredient of resin combination and solvent, but in general 80~
It is heated 5~60 minutes at 140 DEG C.It is preferred that making resin combination be cured to B-stage degree by heating.The residual solvent of adhesive film
Amount is preferably 3 mass % or less, more preferably 1.5 mass % or less.
As carrier film, polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, poly- third can be used
Alkene film, polymethylpentene film, polyimide film, poly (ethylene naphthalate) film, poly (ether sulfone) film, polyetheramides film, polyethers acyl
The plastic foils such as amine acid imide film, PA membrane, polyamidoimide film.In addition, can also carry out priming paint coating as needed, at UV
The surface treatments such as reason, Corona discharge Treatment, milled processed, etching processing, demoulding processing.As the commercially available product of carrier film, such as
There are DuPont-Toray Co. Ltd. system, trade name: Kapton (polyimide film), Kanegafuchi Chemical Industry Co., Ltd's system, quotient
The name of an article: Apical (polyimide film), DuPont-Toray Co. Ltd. system, trade name: Lumirror (poly terephthalic acid second
Diol ester film), Teijin Ltd's system, trade name: Purex (polyethylene terephthalate film) etc..
< cuts chip and engages one-piece type film >
The adhesive film of present embodiment for example can be applied to cutting chip and engage one-piece type film.As shown in Figure 1, this implementation
The cutting chip of mode, which engages one-piece type film 30 and has the chip junction film 10 formed by above-mentioned adhesive film and be layered in chip, to be connect
Close the cutting film 20 on film 10.
As cutting film 20, for example, can enumerate polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film,
The plastic foils such as polypropylene screen, polymethylpentene film, polyimide film.Cutting film 20 can also implement priming paint coating, UV as needed
The surface treatment such as processing, Corona discharge Treatment, milled processed, etching processing.Cutting film 20 preferably has adherence, such as can lift
Film obtained from adherence is assigned to above-mentioned plastic foil out and is arranged obtained from adhering agent layer on the single side of above-mentioned plastic foil
Film.Adhering agent layer is for example (viscous by the resin combination containing liquid parts and high molecular weight components and with appropriate adhesion strength
Oxidant layer formed use resin combination) formed.The cutting belt for having adhering agent layer can for example manufacture as follows: adhering agent layer is formed
It is coated on above-mentioned plastic foil and is dried with resin combination, or adhering agent layer formation is coated with by handle with resin combination
On the base material films such as PET film and adhering agent layer that is dry and being formed is pasted on above-mentioned plastic foil.Adhesion strength for example passes through tune
The ratios of whole liquid parts, high molecular weight components Tg be set as desired value.Chip junction film is above-mentioned embodiment party
The adhesive film of formula.Cutting film and chip junction film for example can be contacted directly, can also be laminated across other layers such as adhesion coating.
Cutting chip engages one-piece type film 30 and for example can replace base material film in the manufacturing method of above-mentioned adhesive film and make
It is made with cutting film 20.In addition, the one-piece type film 30 of cutting chip engagement for example can also be by preparing respectively by above-mentioned bonding
The chip junction film 10 and cutting film 20 that film is formed, they are laminated and integration manufactures.
Embodiment
The disclosure is illustrated in more detail below according to embodiment, but the present invention is not limited to these.
Ingredient below is used in Examples and Comparative Examples.
(a) polymer
Phenoxy resin: ZX-1356-2 (Toto Kasei KK's system, molecular weight 63000, ring parameter are 0.59)
Acrylic rubber containing epoxy group: (Teikoku Chemical Industries Co., Ltd's system, molecular weight are HTR-860P-3
1000000, Tg is -7 DEG C, 0.0) ring parameter is
(b) epoxy resin
Bisphenol f type epoxy resin: YDF-8170C (Toto Kasei KK's system, epoxide equivalent: 156, the ring of liquid
0.46) oxygen resin, ring parameter are
Cresol novolak type epoxy resin: YDCN-700-10 (Toto Kasei KK's system, ring parameter are 0.40)
Multi-functional epoxy: 1032H60 (Nippon Steel & Sumitomo Metal Corporation's system, ring parameter are 0.49)
YL7175-1000 (Japan Epoxy Resin Co. Ltd. system, ring parameter are 0.34)
(c) curing agent and curing accelerator
Phenolic resin (curing agent): XLC-LL (Mitsui Chemicals, Inc's system, ring parameter are 0.73)
Curing accelerator: Curezol 2PZ-CN (Shikoku Chem's system)
Curing accelerator: Curezol 2MA-OK (Shikoku Chem's system)
(d) filler
Spherical Alpha-alumina: alumina beads CB-P05 (Showa Denko K. K's system, Al2O3Purity be 99.89%,
Average grain diameter is 4 μm)
(e) other additives:
A-189 (Japan Unicar Co. Ltd. system, γ mercaptopropyitrimethoxy silane)
A-1160 (Japan Unicar Co. Ltd. system, γ-ureidopropyltriethoxysilane)
2- methylglutaric acid (Wako Pure Chemical Industries, Ltd.'s system)
(embodiment 1)
Firstly, the composition of preparation following component composition.
Bisphenol f type epoxy resin: YDF-8170C (Toto Kasei KK's system) 4.0 mass parts
Cresol novolak type epoxy resin: YDCN-700-10 (Toto Kasei KK's system) 1.0 mass parts
Phenolic resin: XLC-LL (Mitsui Chemicals, Inc's system) 5.5 mass parts
Curezol 2PZ-CN (Shikoku Chem's system) 0.01 mass parts
A-189 (Japan Unicar Co. Ltd. system, γ mercaptopropyitrimethoxy silane) 0.04 mass parts
A-1160 (Japan Unicar Co. Ltd. system, γ-ureidopropyltriethoxysilane) 0.08 mass parts
Cyclohexanone is added in above-mentioned composition in such a way that solid component reaches 80 mass % or so, and then adds ball
Shape Alpha-alumina: alumina beads CB-P05 (Showa Denko K. K's system) 85.0 mass parts.In the composition addition with
The zirconium oxide bead (1mm φ) of its isodose (quality), using ball mill with 600rpm mixing 30 minutes.Combination upon mixing
Phenoxy resin is added in object: ZX-1356-2 (Toto Kasei KK's system) 4.5 mass parts, reuse ball mill with
600rpm is mixed 30 minutes.After mixing, zirconium oxide bead is removed by filtering, obtains varnish.
As carrier film, prepare with a thickness of 38 μm of the progress polyethylene terephthalate film of demoulding processing: A53
(Supreme Being people Dupont Film Co. Ltd. system).It is coated with after varnish on the film, heat drying 5 minutes at 120 DEG C, thus
The adhesive film with a thickness of 25 μm has been made on a carrier film.
(embodiment 2~4)
Other than the use level for recording the use level table 1 of each ingredient, reality has been made respectively similarly to Example 1
Apply the adhesive film of example 2~4.
(comparative example 1)
Firstly, the composition of preparation following component composition.
Bisphenol f type epoxy resin: YDF-8170C (Toto Kasei KK's system) 4.0 mass parts
Cresol novolak type epoxy resin: YDCN-700-10 (Toto Kasei KK's system) 1.0 mass parts
Phenolic resin: XLC-LL (Mitsui Chemicals, Inc's system) 5.5 mass parts
Curing accelerator: Curezol 2PZ-CN (Shikoku Chem's system) 0.01 mass parts
Coupling agent: A-189 (Japan Unicar Co. Ltd. system) 0.04 mass parts
Coupling agent: A-1160 (Japan Unicar Co. Ltd. system) 0.08 mass parts
Cyclohexanone is added in above-mentioned composition in such a way that solid component reaches 57 mass % or so, and then adds ball
Shape Alpha-alumina: alumina beads CB-P05 (Showa Denko K. K's system) 85.0 mass parts.In the composition addition with
The zirconium oxide bead (1mm φ) of its isodose (quality), using ball mill with 600rpm mixing 30 minutes.Combination upon mixing
The acrylic rubber containing epoxy group: HTR-860P-3 (Teikoku Chemical Industries Co., Ltd's system) 4.5 mass parts is added in object, then
It is secondary to be mixed 30 minutes using ball mill with 600rpm.After mixing, zirconium oxide bead is removed by filtering, obtains varnish.
As carrier film, prepare with a thickness of 38 μm of the progress polyethylene terephthalate film of demoulding processing: A31
(Supreme Being people Dupont Film Co. Ltd. system).It is coated with after varnish on the film, heat drying 5 minutes at 120 DEG C, thus
The adhesive film with a thickness of 25 μm has been made on a carrier film.
(comparative example 2~4)
Other than the use level for recording the use level table 2 of each ingredient, ratio has been made respectively in the same manner as comparative example 1
Compared with the adhesive film of example 2~4.
[assessment item]
(thermal conductivity)
By pasting adhesive film, make with a thickness of 100 μm of samples more than and less than 600 μm.By the sample at 110 DEG C
Solidify 1 hour and solidifies 3 hours at 170 DEG C.
Thermal diffusivity α (mm2/ s):
By the way that the said sample after solidifying is cut into 10mm square, to obtain the sample of thermal diffusivity measurement.About
The thermal diffusivity (thickness direction of adhesive film) of the sample, utilizes laser flash method (NETZSCH system, LFA467HyperFlash)
It is measured at 25 DEG C.
Specific heat Cp (J/ (g DEG C)):
About the specific heat of the sample after above-mentioned solidification, using DSC method (Perkin Elmer system, DSC8500), in heating speed
Degree is 10 DEG C/min, temperature is measured under conditions of being 10~60 DEG C, acquires the value at 25 DEG C.
Specific gravity (g/cm3):
About the specific gravity of the sample after above-mentioned solidification, specific gravity is found out using electronic hydrometer SD-200L (Mirage system).
According to the value of the thermal diffusivity α, specific heat Cp and specific gravity that obtain by each measurement, thermal conductivity is calculated using following formula
(W/(m·K))。
Thermal conductivity (W/ (mK))=thermal diffusivity (mm2/ s) × specific heat (J/ (g DEG C)) × specific gravity (g/cm3)
(surface roughness Ra)
Adhesive film is pasted using heating roller laminating machine (80 DEG C, 0.3m/ minutes, 0.3MPa) and with a thickness of 300 μm of silicon wafer
After piece, solidify 1 hour at 110 DEG C, solidify 3 hours at 170 DEG C, obtains sample.Use fine shape measuring machine
SURFCORDER ET200 (Kosaka Laboratory Ltd.'s system) acquires the surface roughness of adhesive film in the range of 2.5mm
(Ra)。
(bonding force)
Adhesive film is pasted onto semiconductor chip using heating roller laminating machine (80 DEG C, 0.3m/ minutes, 0.3MPa), and (5mm is shown in
Side).In turn, which is crimped 5 seconds and is bonded with 120 DEG C, 250g on the substrate of 42 alloys, solidify 1 at 110 DEG C
Hour solidifies 3 hours at 170 DEG C.The sample is measured using omnipotent bonding strength-testing machine (Dage corporation, series 4000)
Shear strength.
Table 1
Table 2
Industrial availability
According to the disclosure, the adhesive film that both cementability and thermal diffusivity can be realized with sufficiently high level can be provided
And has the adhesive film as the cutting chip of chip junction film and engage one-piece type film.
Symbol description
10 chip junction films (adhesive film)
20 cutting films
30 cutting chips engage one-piece type film
Claims (8)
1. a kind of adhesive film with Thermocurable, contains:
(a) polymer;
(b) be at 50 DEG C liquid epoxy resin;
(c) at least one of curing agent and curing accelerator;With
(d) thermal conductivity is the filler of 10W/ (mK) or more,
The adhesive film meets condition shown in following inequality (1),
And the shear strength after heat cure is 1.5MPa or more,
(ma+mb+mc)/M≥0.43(1)
In formula, ma indicates to form the carbonaceous amount of the cyclic structure of (a) polymer, and mb indicates to form the cyclic annular knot of (b) epoxy resin
The carbonaceous amount of structure, mc indicate to be formed the carbonaceous amount of the cyclic structure of (c) curing agent and curing accelerator, M indicate (a) polymer,
(b) epoxy resin and (c) gross mass of curing agent and curing accelerator.
2. adhesive film according to claim 1, wherein the arithmetic average roughness Ra of the film surface after heat cure is 0.25
μm or less.
3. adhesive film according to claim 1 or 2, wherein (a) polymer, which contains, meets item shown in following inequality (2)
The polymer of part,
ma/MA≥0.40(2)
In formula, ma indicates to form the carbonaceous amount of the cyclic structure of polymer, MAIndicate the gross mass of polymer.
4. adhesive film described in any one of claim 1 to 3, wherein (a) polymer contains phenoxy resin.
5. adhesive film according to any one of claims 1 to 4, wherein (d) filler is alpha-alumina particle.
6. adhesive film according to any one of claims 1 to 5, with a thickness of 50 μm or less.
7. adhesive film described according to claim 1~any one of 6, wherein the content of (d) filler by (a) polymer,
(b) epoxy resin, (c) curing agent and curing accelerator and be 60~95 matter when (d) total amount of filler is set as 100 mass parts
Measure part.
8. a kind of cutting chip engages one-piece type film, have:
The chip junction film formed by adhesive film according to any one of claims 1 to 7;With
The cutting film being layered on the chip junction film.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016116225 | 2016-06-10 | ||
JP2016-116225 | 2016-06-10 | ||
PCT/JP2017/021454 WO2017213248A1 (en) | 2016-06-10 | 2017-06-09 | Adhesive film and dicing die-bonding integral film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109155244A true CN109155244A (en) | 2019-01-04 |
Family
ID=60577984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780024601.8A Pending CN109155244A (en) | 2016-06-10 | 2017-06-09 | Adhesive film and cutting chip engage one-piece type film |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6590068B2 (en) |
KR (1) | KR102257668B1 (en) |
CN (1) | CN109155244A (en) |
TW (1) | TWI724179B (en) |
WO (1) | WO2017213248A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI826621B (en) * | 2019-03-22 | 2023-12-21 | 日商帝人股份有限公司 | Insulating sheet and manufacturing method thereof |
JP6755421B1 (en) * | 2019-03-22 | 2020-09-16 | 帝人株式会社 | Insulating sheet |
JP7338413B2 (en) * | 2019-11-11 | 2023-09-05 | 味の素株式会社 | resin composition |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005303275A (en) * | 2004-03-15 | 2005-10-27 | Hitachi Chem Co Ltd | Dicing/die boding sheet |
JP2013006893A (en) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | High thermal conductivity resin composition, high thermal conductivity cured product, adhesive film, sealing film, and semiconductor device using them |
JP2013091680A (en) * | 2011-10-24 | 2013-05-16 | Shin-Etsu Chemical Co Ltd | Thermally conductive adhesive composition and adhesive sheet and thermally conductive dicing die-attach film using the same |
JP2014099439A (en) * | 2012-11-13 | 2014-05-29 | Shin Etsu Chem Co Ltd | Protective film for semiconductor wafer and production method of semiconductor chip |
KR20140142676A (en) * | 2013-06-04 | 2014-12-12 | 닛토덴코 가부시키가이샤 | Thermosetting die-bonding film, die-bonding film with dicing sheet, and process for producing semiconductor device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05198701A (en) | 1992-01-22 | 1993-08-06 | Mitsubishi Electric Corp | Package for semiconductor device |
JP4495768B2 (en) * | 2008-08-18 | 2010-07-07 | 積水化学工業株式会社 | Insulating sheet and laminated structure |
JP2010062338A (en) * | 2008-09-04 | 2010-03-18 | Sumitomo Electric Ind Ltd | Method of manufacturing heat dissipating sheet |
JP2011241245A (en) * | 2010-05-14 | 2011-12-01 | Mitsubishi Chemicals Corp | Epoxy resin composition and cured product |
KR101856557B1 (en) * | 2011-03-16 | 2018-05-10 | 후루카와 덴키 고교 가부시키가이샤 | Highly heat conductive film-shaped adhesive composition, highly heat conductive film-shaped adhesive and method for producing semiconductor package by using the highly heat conductive film-shaped adhesive |
JP2015103573A (en) | 2013-11-21 | 2015-06-04 | 日東電工株式会社 | Thermosetting die bond film, die bond film with dicing sheet and method for manufacturing semiconductor device |
JP2014234500A (en) * | 2013-06-05 | 2014-12-15 | 日本化薬株式会社 | Adhesive material for semiconductor manufacturing process |
WO2015059950A1 (en) * | 2013-10-23 | 2015-04-30 | 日本化薬株式会社 | Polyimide resin composition, and heat-conductive adhesive film produced using same |
JP2015218287A (en) * | 2014-05-19 | 2015-12-07 | 古河電気工業株式会社 | Adhesive film-integrated surface protection tape for use in grinding thin film, and method for manufacturing semiconductor chip |
-
2017
- 2017-06-09 CN CN201780024601.8A patent/CN109155244A/en active Pending
- 2017-06-09 TW TW106119283A patent/TWI724179B/en active
- 2017-06-09 KR KR1020187028538A patent/KR102257668B1/en active IP Right Grant
- 2017-06-09 WO PCT/JP2017/021454 patent/WO2017213248A1/en active Application Filing
- 2017-06-09 JP JP2018521788A patent/JP6590068B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005303275A (en) * | 2004-03-15 | 2005-10-27 | Hitachi Chem Co Ltd | Dicing/die boding sheet |
JP2013006893A (en) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | High thermal conductivity resin composition, high thermal conductivity cured product, adhesive film, sealing film, and semiconductor device using them |
JP2013091680A (en) * | 2011-10-24 | 2013-05-16 | Shin-Etsu Chemical Co Ltd | Thermally conductive adhesive composition and adhesive sheet and thermally conductive dicing die-attach film using the same |
JP2014099439A (en) * | 2012-11-13 | 2014-05-29 | Shin Etsu Chem Co Ltd | Protective film for semiconductor wafer and production method of semiconductor chip |
KR20140142676A (en) * | 2013-06-04 | 2014-12-12 | 닛토덴코 가부시키가이샤 | Thermosetting die-bonding film, die-bonding film with dicing sheet, and process for producing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWI724179B (en) | 2021-04-11 |
TW201742902A (en) | 2017-12-16 |
WO2017213248A1 (en) | 2017-12-14 |
JPWO2017213248A1 (en) | 2018-12-13 |
JP6590068B2 (en) | 2019-10-16 |
KR102257668B1 (en) | 2021-05-31 |
KR20180121581A (en) | 2018-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5549559B2 (en) | Adhesive composition, method for producing the same, adhesive film using the same, substrate for mounting semiconductor, and semiconductor device | |
TWI765071B (en) | Heat-dissipating die-bonding film and dicing-die-bonding film | |
JP2008103700A (en) | Multi-layered die bond sheet, semiconductor device with semiconductor adhesive film, semiconductor device, and method of manufacturing semiconductor device | |
JP7392706B2 (en) | adhesive film | |
CN102161875A (en) | Attach film composition for semiconductor assembly, attach film for semiconductor assembly using the same and attach belt | |
CN109155244A (en) | Adhesive film and cutting chip engage one-piece type film | |
TWI758489B (en) | Resin composition and resin sheet | |
KR102505321B1 (en) | Encapsulation film, encapsulation structure, and manufacturing method of the encapsulation structure | |
JPWO2019150445A1 (en) | Film-like adhesive and its manufacturing method, and semiconductor device and its manufacturing method | |
JP4839564B6 (en) | Adhesive film and method for producing the same | |
JP2008283083A (en) | Tape for wafer processing and its manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Tokyo Applicant after: Lishennoco Co.,Ltd. Address before: Tokyo Applicant before: HITACHI CHEMICAL Co.,Ltd. |
|
CB02 | Change of applicant information |