CN109111895A - 一种pesd功能的有机硅胶粘剂 - Google Patents

一种pesd功能的有机硅胶粘剂 Download PDF

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CN109111895A
CN109111895A CN201810755215.2A CN201810755215A CN109111895A CN 109111895 A CN109111895 A CN 109111895A CN 201810755215 A CN201810755215 A CN 201810755215A CN 109111895 A CN109111895 A CN 109111895A
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electronic component
parts
organic silicon
pesd
adhesive
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汪元元
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New Mstar Technology Ltd In Hefei
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New Mstar Technology Ltd In Hefei
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本发明提出一种PESD功能的有机硅胶粘剂，为将硅树脂、甲乙基硅橡胶、ATO粉体在捏合机中捏合均匀后，加入其他组分，搅拌混合均匀，PESD功能的有机硅高温胶粘剂用于电子元件在线路板上的绝缘粘接，与电子元件的输入输出引脚均有接触，电路上与电子元件内部电路并联，ESD功能有机硅胶呈高阻绝缘状态，当电子元件过压状态时，ESD有机硅胶渗流导通，保护电子元件。

Description

一种PESD功能的有机硅胶粘剂
技术领域
本发明属于电子材料和胶粘剂合成领域，涉及一种PESD功能的有机硅胶粘剂。
背景技术
静电和静电放电(ESD)问题是各类电子产品面对的重要危害，需要采用一定的方式将多余电荷耗散放出。专用抗静电元件需要挤占线路板上的宝贵面积，另外分立元件的焊接、线路设计等因素也会增加整体器件的制造成本。有机硅材料具有卓越的抗冷热冲击、耐老化特性，将其与无机半导体材料结合制成ESD保护功能粘结剂，可以有效的节约线路板面积，降低制造成本。
发明内容
本发明提出一种PESD功能的有机硅胶粘剂，其特征在于，各成分重量比为：
硅树脂 100份
甲乙基硅橡胶 20-30份
ATO粉体 700-900份
正硅酸乙酯 10-15份
硼酸正丁酯 0.5-1份
有机锡 1-2份
PESD功能的有机硅高温胶粘剂用于电子元件在线路板上的绝缘粘接，与电子元件的输入输出引脚均有接触，电路上与电子元件内部电路并联，ESD功能有机硅胶呈高阻绝缘状态，当电子元件过压状态时，ESD有机硅胶渗流导通，保护电子元件。
所述硅树脂固含量75-95％。
所述ATO粉体颗粒粒径在0.02微米到2微米之间。
所述有机锡包括二甲基锡、二辛基锡、三丁基锡、二月桂酸二乙基锡中的一种。
制备方法为将硅树脂、甲乙基硅橡胶、ATO粉体在捏合机中捏合均匀后，加入其他组分，搅拌混合均匀。
本发明将ESD保护功能的介质作为电子元件在线路板上绝缘粘接体，有效的节约线路板面积，提升器件线路可靠性。
本发明的内容和特点已揭示如上，然而前面叙述的本发明仅仅简要地或只涉及本发明的特定部分，本发明的特征可能比在此公开的内容涉及的更多。因此，本发明的保护范围应不限于实施例所揭示的内容，而应该包括在不同部分中所体现的所有内容的组合，以及各种不背离本发明的替换和修饰，并为本发明的权利要求书所涵盖。
具体实施方式
实施例1：
为将100份硅树脂、20份甲乙基硅橡胶、900份ATO粉在捏合机中捏合均匀后，加入15份正硅酸乙酯、1份硼酸正丁酯、1份二月桂酸二乙基锡，搅拌混合均匀，得到ESD功能的有机硅胶粘剂，90摄氏度条件下固化粘结，胶粘剂拉伸强度：19Mpa，ESD性能达到IEC6100-4-2。
实施例2：
为将100份硅树脂、20份甲乙基硅橡胶、900份ATO粉在捏合机中捏合均匀后，加入10份正硅酸乙酯、0.5份硼酸正丁酯、1份二辛基锡，搅拌混合均匀，得到ESD功能的有机硅胶粘剂，100摄氏度条件下固化粘结，胶粘剂拉伸强度：21Mpa，ESD性能达到IEC6100-4-2。
实施例3：
为将100份硅树脂、25份甲乙基硅橡胶、800份ATO粉在捏合机中捏合均匀后，加入15份正硅酸乙酯、1份硼酸正丁酯、2份二月桂酸二乙基锡，搅拌混合均匀，得到ESD功能的有机硅胶粘剂，120摄氏度条件下固化粘结，胶粘剂拉伸强度：20Mpa，ESD性能达到IEC6100-4-2。
实施例4：
为将100份硅树脂、30份甲乙基硅橡胶、700份ATO粉在捏合机中捏合均匀后，加入15份正硅酸乙酯、0.5份硼酸正丁酯、1份三丁基锡，搅拌混合均匀，得到ESD功能的有机硅胶粘剂，120摄氏度条件下固化粘结，胶粘剂拉伸强度：17Mpa，ESD性能达到IEC6100-4-2。

Claims (5)

1.一种PESD功能的有机硅胶粘剂，其特征在于，各成分重量比为：
硅树脂100份
甲乙基硅橡胶20-30份
ATO粉体700-900份
正硅酸乙酯10-15份
硼酸正丁酯0.5-1份
有机锡1-2份
PESD功能的有机硅高温胶粘剂用于电子元件在线路板上的绝缘粘接，与电子元件的输入输出引脚均有接触，电路上与电子元件内部电路并联，ESD功能有机硅胶呈高阻绝缘状态，当电子元件过压状态时，ESD有机硅胶渗流导通，保护电子元件。
2.根据权利要求1所述一种PESD功能的有机硅胶粘剂，其特征在于，所述硅树脂固含量75-95％。
3.根据权利要求1所述一种PESD功能的有机硅胶粘剂，其特征在于，所述ATO粉体颗粒粒径在0.02微米到2微米之间。
4.根据权利要求1所述一种PESD功能的有机硅胶粘剂，其特征在于，所述有机锡包括二甲基锡、二辛基锡、三丁基锡、二月桂酸二乙基锡中的一种。
5.根据权利要求1所述一种PESD功能的有机硅胶粘剂，其特征在于，其制备方法为将硅树脂、甲乙基硅橡胶、ATO粉体在捏合机中捏合均匀后，加入其他组分，搅拌混合均匀。
CN201810755215.2A 2018-07-05 2018-07-05 一种pesd功能的有机硅胶粘剂 Withdrawn CN109111895A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112708391A (zh) * 2020-12-10 2021-04-27 晟大科技(南通)有限公司 柔性线路板fpc专用胶黏剂及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101496113A (zh) * 2006-07-29 2009-07-29 肖克科技有限公司 具有高纵横比粒子的电压可切换介电材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101496113A (zh) * 2006-07-29 2009-07-29 肖克科技有限公司 具有高纵横比粒子的电压可切换介电材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112708391A (zh) * 2020-12-10 2021-04-27 晟大科技(南通)有限公司 柔性线路板fpc专用胶黏剂及其制备方法

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