CN109065469A - 一种带激光切割功能的ic芯片光学抽检机 - Google Patents
一种带激光切割功能的ic芯片光学抽检机 Download PDFInfo
- Publication number
- CN109065469A CN109065469A CN201810585880.1A CN201810585880A CN109065469A CN 109065469 A CN109065469 A CN 109065469A CN 201810585880 A CN201810585880 A CN 201810585880A CN 109065469 A CN109065469 A CN 109065469A
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- Prior art keywords
- chip
- laser cutting
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- motor
- platform
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 31
- 238000005070 sampling Methods 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 93
- 239000000463 material Substances 0.000 claims abstract description 39
- 230000001105 regulatory effect Effects 0.000 claims description 14
- 238000012544 monitoring process Methods 0.000 claims description 10
- 239000013307 optical fiber Substances 0.000 claims description 10
- 230000003028 elevating effect Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 230000006378 damage Effects 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 206010016256 fatigue Diseases 0.000 description 2
- 210000003734 kidney Anatomy 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810585880.1A CN109065469B (zh) | 2018-06-08 | 2018-06-08 | 一种带激光切割功能的ic芯片光学抽检机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810585880.1A CN109065469B (zh) | 2018-06-08 | 2018-06-08 | 一种带激光切割功能的ic芯片光学抽检机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109065469A true CN109065469A (zh) | 2018-12-21 |
CN109065469B CN109065469B (zh) | 2020-10-16 |
Family
ID=64819989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810585880.1A Active CN109065469B (zh) | 2018-06-08 | 2018-06-08 | 一种带激光切割功能的ic芯片光学抽检机 |
Country Status (1)
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CN (1) | CN109065469B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110837039A (zh) * | 2019-11-28 | 2020-02-25 | 湖南凯通电子有限公司 | 一种阻值测定探针设备 |
CN114260589A (zh) * | 2022-01-24 | 2022-04-01 | 铜陵三佳山田科技股份有限公司 | 用于ic芯片条带的激光打标检测工艺及其设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201084717Y (zh) * | 2007-09-20 | 2008-07-09 | 格兰达技术(深圳)有限公司 | Ic料条激光打标机的上料装置 |
CN201084716Y (zh) * | 2007-09-20 | 2008-07-09 | 格兰达技术(深圳)有限公司 | Ic料条激光打标机的输送装置 |
CN102101217A (zh) * | 2011-02-28 | 2011-06-22 | 深圳市大族激光科技股份有限公司 | 一种激光切割装置 |
CN104101377A (zh) * | 2014-06-30 | 2014-10-15 | 格兰达技术(深圳)有限公司 | 一种ic料条次品芯片自动检录机 |
CN205905562U (zh) * | 2016-07-05 | 2017-01-25 | 宣利峰 | 一种激光打标机 |
-
2018
- 2018-06-08 CN CN201810585880.1A patent/CN109065469B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201084717Y (zh) * | 2007-09-20 | 2008-07-09 | 格兰达技术(深圳)有限公司 | Ic料条激光打标机的上料装置 |
CN201084716Y (zh) * | 2007-09-20 | 2008-07-09 | 格兰达技术(深圳)有限公司 | Ic料条激光打标机的输送装置 |
CN102101217A (zh) * | 2011-02-28 | 2011-06-22 | 深圳市大族激光科技股份有限公司 | 一种激光切割装置 |
CN104101377A (zh) * | 2014-06-30 | 2014-10-15 | 格兰达技术(深圳)有限公司 | 一种ic料条次品芯片自动检录机 |
CN205905562U (zh) * | 2016-07-05 | 2017-01-25 | 宣利峰 | 一种激光打标机 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110837039A (zh) * | 2019-11-28 | 2020-02-25 | 湖南凯通电子有限公司 | 一种阻值测定探针设备 |
CN114260589A (zh) * | 2022-01-24 | 2022-04-01 | 铜陵三佳山田科技股份有限公司 | 用于ic芯片条带的激光打标检测工艺及其设备 |
Also Published As
Publication number | Publication date |
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CN109065469B (zh) | 2020-10-16 |
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Address after: 610000 floors 1-3, plant 9, No. 66, Antai seventh Road, high tech Zone, Chengdu, Sichuan Patentee after: Chengdu Laipu Technology Co.,Ltd. Address before: No. 11 high tech Zone Gaopeng road in Chengdu city of Sichuan Province in 610041 Patentee before: CHENGDU LAIPU TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An IC chip optical sampling machine with laser cutting function Effective date of registration: 20220812 Granted publication date: 20201016 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: Chengdu Laipu Technology Co.,Ltd. Registration number: Y2022980012370 |
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Date of cancellation: 20230508 Granted publication date: 20201016 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: Chengdu Laipu Technology Co.,Ltd. Registration number: Y2022980012370 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An IC chip optical sampling machine with laser cutting function Granted publication date: 20201016 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: Chengdu Laipu Technology Co.,Ltd. Registration number: Y2024980001080 |