CN109037173A - 一种led线性驱动芯片的贴片式封装结构 - Google Patents
一种led线性驱动芯片的贴片式封装结构 Download PDFInfo
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Abstract
本发明公开了一种LED线性驱动芯片的贴片式封装结构,涉及LED线性驱动芯片封装技术,包括顶部开设有容纳槽的支架、及设置于容纳槽内的LED线性驱动芯片、封装管脚、引线、填充树脂层;LED线性驱动芯片固定连接于容纳槽的底部,且LED线性驱动芯片的顶部设置有若干个引脚接口;封装管脚设置在所述支架的左右两侧,一端从支架的左右两侧伸入容纳槽且紧贴于容纳槽的底部,封装管脚的另一端向下弯折呈C型且紧贴支架的外表面;引线一端固定连接封装管脚位于容纳槽内的一侧,另一端固定连接于引脚接口;填充树脂层填满容纳槽;本发明LED线性驱动芯片的贴片式封装结构散热性能好,生产效率高,生产成本低,有利于LED灯具及光源的进一步推广和普及。
Description
技术领域
本发明涉及LED线性驱动芯片封装技术,具体为一种LED线性驱动芯片的贴片式封装结构。
背景技术
LED电压与电流是非线性的,不可以用恒压源控制。当恒压源电压超过LED导通电压时,流经LED的电流会迅速增大,使LED烧坏。最简单的解决方法是串联电阻限流,但是这种方法中电流会随着电压源电压的变化而变化,不稳定。另一种解决方法是使用LED线性恒流驱动芯片进行驱动,由于恒流源电流不随供电电压的变化而改变,LED照明大多使用LED线性恒流驱动芯片进行驱动。
现有的LED线性恒流驱动芯片采用的是传统集成电路封装形式,管脚采用弯脚成型,同时为了增加散热效果,采用了金属框架背露的方式。但这种散热方式使得框架制造工艺和封装工艺十分复杂,同时也增加了成本。传统封装的不同尺寸也导致了同一电路芯片散热性能产生差异,影响了LED照明电路的能量转换效率。
发明内容
本发明的目的在于提供一种LED线性驱动芯片的贴片式封装结构,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:一种LED线性驱动芯片的贴片式封装结构,包括支架、LED线性驱动芯片、封装管脚、引线、填充树脂层;
所述支架顶部开设有容纳槽;
所述LED线性驱动芯片位于所述容纳槽内,且所述LED线性驱动芯片固定连接于所述容纳槽的底部;所述LED线性驱动芯片的顶部设置有若干个引脚接口;
若干个封装管脚设置在所述支架的左右两侧,所述封装管脚数量与所述引脚接口的数量相同且一一对应;所述封装管脚的一端从所述支架的左右两侧伸入所述容纳槽且紧贴于所述容纳槽的底部,所述封装管脚的另一端向下弯折呈C型且紧贴所述支架的外表面;
所述引线一端固定连接所述封装管脚位于所述容纳槽内的一侧,另一端固定连接于所述引脚接口;所述填充树脂层填满所述容纳槽。
进一步的,所述LED线性驱动芯片与所述容纳槽的底部之间设置有固晶胶层。
进一步的,所述容纳槽开口面积大于底部面积。呈扩口状。
进一步的,所述支架顶部的边缘处开设有定位槽。
进一步的,所述LED线性驱动芯片的贴片式封装结构的尺寸标准与LED贴片式封装结构的尺寸标准相同。
与现有技术相比,本发明的有益效果是:
1.本发明LED线性驱动芯片的贴片式封装结构散热性能好,从而有效地扩大了LED的设计应用空间。
2.本发明LED线性驱动芯片的贴片式封装结构能够提高LED线性恒流驱动芯片的生产效率,扩大生产规模,降低LED线性恒流驱动芯片的生产成本,有利于LED灯具及光源的进一步推广和普及。
附图说明
图1是本发明LED线性驱动芯片的贴片式封装结构的结构示意图;
图2是本发明LED线性驱动芯片的贴片式封装结构的剖视图。
附图标记中:1、支架;11、容纳槽;12、定位槽;2、LED线性驱动芯片;21、引脚接口;3、封装管脚;4、引线;5、填充树脂层;6、固晶胶层。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明提出了一种LED线性驱动芯片的贴片式封装结构,如图1及图2所示,包括支架1、LED线性驱动芯片2、封装管脚3、引线4、填充树脂层5及固晶胶层6。
支架1为方形块状,顶部开设有容纳槽11。容纳槽11为圆台状,且容纳槽11呈扩口状,容纳槽11的顶部开口面积比容纳槽11的底部面积大,使得向容纳槽11内安装元件更加容易。
LED线性驱动芯片2安装在容纳槽11内,且LED线性驱动芯片2的底部设置有固晶胶层6,LED线性驱动芯片2通过固晶胶层6与容纳槽11的底部固定连接。固晶胶具有良好的导热性,能够有效提高LED线性驱动芯片2的散热性能。
支架1的两侧均设置有封装管脚3,封装管脚3紧贴于支架1的左右两侧且封装管脚3的顶部向内翻折,使封装管脚3的顶部贯穿支架1并深入容纳槽11中,封装管脚3的顶部紧贴于容纳槽11的底部;封装管脚3的底部向内翻折,使封装管脚3的底部紧贴支架1的底部,用于贴片式焊接。LED线性驱动芯片2具有引脚接口21,将LED线性驱动芯片2的内部电路的接口从LED线性驱动芯片2的顶部引出。引线4连接引脚接口21及封装管脚3伸入容纳槽11内的顶部。在本发明LED线性驱动芯片的贴片式封装结构中,封装管脚3为封装背露方式,既增加了封装管脚3的面积,又改善了贴片效果及散热效率,又由于减小了封装体贴片面积,从而大大改善了工程设计时的自由度,也大大提高了产品设计的集成度
填充树脂层5填满容纳槽11的其余部分,对LED线性驱动芯片2及引线4起到保护作用,且填充树脂层5的导热性良好,LED线性驱动芯片2工作产生的热量可以从填充树脂层5顶部散失。现有的LED线性恒流驱动芯片为了增加散热效果,采用了金属框架背露的方式,但这种散热方式使得框架制造工艺和封装工艺十分复杂,同时也增加了成本。本发明LED线性驱动芯片的贴片式封装结构在保证LED线性驱动芯片2的前提下,大大简化了生产过程,降低了成本。
由于现有的LED贴片式封装结构已经拥有了详细的尺寸标准,本发明LED线性驱动芯片的贴片式封装结构采用和LED贴片式封装结构相同的尺寸标准。在与贴片式LED共同使用时,由于本发明LED线性驱动芯片的贴片式封装结构可以选用和LED贴片式封装结构相同的尺寸,使得同一电路中各芯片的散热性能不存在差异,既方便设计LED照明电路,同时也使LED照明电路的能量转换效率更高。本发明LED线性驱动芯片的贴片式封装结构的主要尺寸标准如下表所示:
不限于表中所列出的尺寸,本发明LED线性驱动芯片的贴片式封装结构仍具有其他尺寸。
如图1所示,仅在支架1的顶部的其中一个顶角处开设有定位槽12,用来标注贴片式LED线性驱动芯片的安装方向。由于支架1两侧的封装管脚3相互对称,对称的封装管脚3虽然具有不同的作用,但容易混淆。通过辨别对称的封装管脚3相对于定位槽12的位置,使用者可以轻松分辨对称的封装管脚3的作用,不至于混淆。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (5)
1.一种LED线性驱动芯片的贴片式封装结构,其特征在于:包括支架、LED线性驱动芯片、封装管脚、引线、填充树脂层;
所述支架顶部开设有容纳槽;
所述LED线性驱动芯片位于所述容纳槽内,且所述LED线性驱动芯片固定连接于所述容纳槽的底部;所述LED线性驱动芯片的顶部设置有若干个引脚接口;
若干个封装管脚设置在所述支架的左右两侧,所述封装管脚数量与所述引脚接口的数量相同且一一对应;所述封装管脚的一端从所述支架的左右两侧伸入所述容纳槽且紧贴于所述容纳槽的底部,所述封装管脚的另一端向下弯折呈C型且紧贴所述支架的外表面;
所述引线一端固定连接所述封装管脚位于所述容纳槽内的一侧,另一端固定连接于所述引脚接口;所述填充树脂层填满所述容纳槽。
2.根据权利要求1所述的一种LED线性驱动芯片的贴片式封装结构,其特征在于:所述LED线性驱动芯片与所述容纳槽的底部之间设置有固晶胶层。
3.根据权利要求1所述的一种LED线性驱动芯片的贴片式封装结构,其特征在于:所述容纳槽开口面积大于底部面积。呈扩口状。
4.根据权利要求1所述的一种LED线性驱动芯片的贴片式封装结构,其特征在于;所述支架顶部的边缘处开设有定位槽。
5.根据权利要求1所述的一种LED线性驱动芯片的贴片式封装结构,其特征在于:所述LED线性驱动芯片的贴片式封装结构的尺寸标准与LED贴片式封装结构的尺寸标准相同。
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