M368898 五、新型說明： 【新型所屬之技術領域】 本創作係關於-種發光二極體基座總成，以及包含此基 座總成之發光二極體封漿結構。 5 【先前技術】 # 發光二極體（LED)具有耗電量低、元件壽命長、無須 暖燈時間、反應速度快等優點，再加上其體積小、耐震動、 適合量產，容易配合應用上的需求製成極小或陣列式的元 1〇 件’目月已普遍使用於資訊、通訊及消費性電子產品的指示 與顯不裝置上，成為日常生活中不可或缺的重要元件。 LED晶粒在㈣前需辆行封裝。現今封裝技術除著眼 於提高光汲取效率外，另一重要關鍵技術是降低封裝結構的 • 熱應力，才能使輸出之發光穩定、壽命增加和提高可靠度。M368898 V. New Description: [New Technology Field] This creation is about a kind of light-emitting diode base assembly and a light-emitting diode sealing structure including the base assembly. 5 [Prior Art] #Light-emitting diode (LED) has the advantages of low power consumption, long component life, no need for warm-up time, fast response, etc., plus its small size, vibration resistance, mass production, easy to match The application requirements are made into very small or arrayed elements. The target month has been widely used in the indications and display devices of information, communication and consumer electronics, and has become an indispensable important component in daily life. The LED die needs to be packaged before the (4). In addition to focusing on improving light extraction efficiency, another important key technology in today's packaging technology is to reduce the thermal stress of the package structure in order to stabilize the output of the light, increase the lifetime and improve the reliability.
15 雜的咖封裝結構’―般是用透师或轉將LED 晶片黏貼在導線架_ frame)的反射蓋中或勤基座上，再 . 岭、轉線機完成LED元件的正貞雜對導線架連接 後，再用膠體（-般為環氧樹脂）姐封裝而成。在洗注膝 體之後，導線架與膠體之間將形成—大面積之膠合面。然而， 2〇 因膠體與導線架的熱膨脹係數差異甚大，故在回焊或高溫運 作時，將導致膠體與導線架的膠合面因熱膨服所生熱應力而 3 M36889815 Miscellaneous coffee package structure 'Generally use the teacher or turn the LED chip to adhere to the reflective cover of the lead frame _ frame) or the pedestal base, and then the ridge and the rotary machine complete the positive and noisy pairs of the LED components. After the lead frame is connected, it is then encapsulated with a colloid (----- epoxy resin). After washing the knee, a large area of glued surface will be formed between the lead frame and the gel. However, due to the large difference in thermal expansion coefficient between the colloid and the lead frame, it will cause thermal stress caused by thermal expansion of the glued surface of the colloid and the lead frame during reflow or high temperature operation. 3 M368898
« I 業界所稱之「脫層」現象（即膠合面分離），因此導致發 光-極體無法工作，或是使發光二極體發絲現不佳。 為克服此缺點，美國專利第6,624,491號提出一解決方 案。亥專利揭露如圖i之封裝基座總成1〇，其中反射蓋 5 包含一凹陷部12a’凹陷部12a之底面12b設計為封閉形式， 僅留分開的兩孔以露出下方導線架13 _晶區l3a及焊線區 _ 13b，以分別供固定LED晶粒14及連接焊線18(示於圖3)β 士此在凹1½部12a中洗注膠體（圖未示）之後，主要膠合 面（圖未示）將形成於凹陷部底面12b及膠體之間（僅有少 1〇 部分膠合面軸於導驗13娜體之間 > 因導線架13與膠 間的膠合面積已被減少，且駐要膠合面而言，反射杯 底面及膠體二者材料之熱膨脹係數較為接近，所以較不易受 熱膨脹所生熱應力而產生前述「脫層」現象。 _ 圖2為封裝基座總成10之上視圖，圖3為圖2延3-3剖 15 面線之剖面圖，顯示led晶粒14固定於固晶區13a中之情 況，及進行焊線加工時，焊頭16拉著焊線18由固晶區13a . 上方移動至焊線區13b的進焊路徑A。在此，焊頭16在移動 過程中，容易撞擊分隔部12e而使焊接失敗。因此，此種封 裝基座總成10增加了焊線加工難度與成本。 另一方面’封裝基座總成10之反射蓋底面12b設有分開 的兩孔，因此增加基座射出模具加工的難度，亦提高了模具 4 20 M368898 1 ! 加工成本。 因此，業界極需一可以改善上述缺點之發光二極體封装 結構。 5 【新型内容】 — 本創作提出一種發光二極體基座總成，包含此種基座總 • 成之發光二極體封裝結構可減少發光二極體在經過回焊或是 在高溫下運作膠體與金屬支架接觸之脫層現象，且易於加工 射出基座模具及進行焊線加工。 10 依據本創作之發光二極體基座總成，係包含一基座及— 導線架。該基座包含-凹陷部，該凹陷部之底面設有單—個 開口。導線架有-部份區域露出於該基座凹陷部之單一個開 口下方’該-部份區域包括發光二極體晶片固定區鱗線連 接區。 15 雜糊叙敎二鋪龍結構，係包含上述基座總 叙-發光二極體晶片，該晶片固定於該晶片固定區上且以 導線而電性連接至該焊線連接區。 依據本創作之發光二鋪封裝結構，其發光二極體晶片 固定區與焊線連接區數目可各為—個或前者一個，後者兩個。 【實施方式】 5 20 M368898 以下參照圖式所示實施例更進一步說明本創作的發光二 極體基座總成’以及包含此基座總成的封裝結構及其優點。 參照圖4與5，依據本創作之實施例之發光二極體基座總成 20 ’主要包含一基座（實施為反射蓋22之型式）及一導線架 23。反射蓋22又包含由側壁22a及底面22b所定義之凹陷部 2卜 底面22b設有一由較寬孔22c及較窄孔22d組成之開 口。在此，較寬孔22c暴露出下方導線架23上之發光二極體 晶片固定區23a (下稱「固晶區」），較窄孔22d則暴露出下 方導線架23上之焊線連接區23b (下稱「焊線區」）。 圖6為圖5延6-6剖面線之剖面圖，顯示led晶粒24 固定於固晶區23a中之情況，及進行焊線加工時，焊頭％拉 著焊線28由固晶區23a上方移動至焊線區23b的進焊路徑 B。一般而言，在完成固晶及焊線作業後，會將填充材料（如 裱氧樹脂，圖未示）注入凹陷部21中以完成整個封裝作業。 明顯地，在整個焊接過程中，路徑上沒有類似圖3所示 刀隔部I2e般的阻擋物會妨礙焊頭26的移動。因此，與習知 技術相比’本創作之封裝基座總成2〇減少了焊線加工的難度 與成本。另一方面，封裝基座總成20之底面22b僅具有單— 孔’因此’與習知技術相比，減低了基座射出模具加工的難 度’亦減少了模具加工成本。 M368898 • l 【圖式簡單說明】 圖1係習知封裝基座總成10的立體圖； 圖2 係圖1的上視圖； 圖3 係圖2延3-3剖面線之剖面圖，再加入LED晶粒14及 5 焊線18等元件； ' 圖4係依據本創作之發光二極體基座總成20的實施例立體 • ®； 圖5 係圖4的上視圖； 圖6 為圖5延6-6剖面線之剖面圖，再加入LED晶粒24及 10 焊線28等元件；及 圖7為依據本創作另一實施例之發光二極體基座總成30的 立體圖。« I's what the industry calls "delamination" (that is, the separation of the glued surface), which causes the radiant-polar body to fail to work, or the light-emitting diode is not good. To overcome this shortcoming, U.S. Patent No. 6,624,491 proposes a solution. The invention discloses a package base assembly 1 of FIG. i, wherein the reflective cover 5 includes a recess 12a. The bottom surface 12b of the recess 12a is designed to be closed, leaving only two separate holes to expose the lower lead frame 13_ The region l3a and the bonding wire region _ 13b are respectively used for fixing the LED die 14 and the bonding bonding wire 18 (shown in FIG. 3). After the glue is sealed in the recess 11a portion 12a (not shown), the main bonding surface (not shown) will be formed between the bottom surface 12b of the depressed portion and the colloid (only one less part of the glued surface axis is between the guide 13 and the body)> because the bonding area between the lead frame 13 and the glue has been reduced, In the case of the cemented surface, the thermal expansion coefficients of the material of the bottom surface of the reflector cup and the colloid are relatively close, so that the above-mentioned "delamination" phenomenon is less likely to be caused by the thermal stress generated by the thermal expansion. _ Figure 2 is a package base assembly 10 The top view, FIG. 3 is a cross-sectional view of the face line of FIG. 2, which is shown in FIG. 3, and shows the case where the led die 14 is fixed in the die-bonding region 13a, and when the wire is processed, the horn 16 pulls the wire. 18 is moved from the solid crystal region 13a. to the advance welding path A of the bonding wire region 13b. Here, the welding head 16 is moved In this case, the separation portion 12e is easily broken to cause the welding to fail. Therefore, the package base assembly 10 increases the difficulty and cost of the wire bonding. On the other hand, the bottom surface 12b of the reflective cover of the package base assembly 10 is provided separately. Two holes, thus increasing the difficulty of the ejector injection mold processing, and also increasing the processing cost of the mold 4 20 M368898 1 . Therefore, the industry needs a light-emitting diode package structure which can improve the above disadvantages. 5 [New content] — Ben The invention proposes a light-emitting diode base assembly, which comprises the base assembly and the light-emitting diode package structure, which can reduce the contact of the light-emitting diode in the reflow or the high-temperature operation of the colloid and the metal bracket. The layer phenomenon is easy to process and shoot the susceptor mold and perform wire bonding processing. 10 According to the present invention, the illuminating diode pedestal assembly includes a pedestal and a lead frame. The pedestal includes a depressed portion. The bottom surface of the portion is provided with a single opening. A portion of the lead frame is exposed below a single opening of the recessed portion of the base. The portion of the lead portion includes a scale connection of the fixed portion of the LED chip. The embossed structure comprises a pedestal-semiconductor diode, and the wafer is fixed on the fixed area of the wafer and electrically connected to the bonding line by wires. According to the illuminating two-package structure of the present invention, the number of the light-emitting diode wafer fixing area and the bonding wire connection area may be one or the former, and the latter two. [Embodiment] 5 20 M368898 Referring to the following figure The embodiment further clarifies the LED submount assembly of the present invention and the package structure and the advantages thereof including the susceptor assembly. Referring to Figures 4 and 5, the illuminating diode pedestal according to the embodiment of the present invention is described. The assembly 20' mainly comprises a base (implemented as a type of reflective cover 22) and a lead frame 23. The reflective cover 22 further includes a recessed portion defined by the side wall 22a and the bottom surface 22b. The bottom surface 22b is provided with an opening formed by a wider hole 22c and a narrower hole 22d. Here, the wider hole 22c exposes the light-emitting diode wafer fixing region 23a (hereinafter referred to as "solid crystal region") on the lower lead frame 23, and the narrower hole 22d exposes the bonding wire connection region on the lower lead frame 23. 23b (hereinafter referred to as "weld wire area"). 6 is a cross-sectional view taken along line 6-6 of FIG. 5, showing the case where the LED die 24 is fixed in the die bonding region 23a, and when the wire bonding is performed, the welding head % pulls the bonding wire 28 from the die bonding region 23a. The upper side moves to the welding path B of the wire bonding zone 23b. In general, after the completion of the die bonding and wire bonding operations, a filling material (e.g., a silicone resin, not shown) is injected into the recess 21 to complete the entire packaging operation. Obviously, during the entire welding process, there is no obstacle on the path similar to the blade partition I2e shown in Fig. 3, which hinders the movement of the horn 26. Therefore, compared with the prior art, the package base assembly of the present invention reduces the difficulty and cost of wire bonding. On the other hand, the bottom surface 22b of the package base assembly 20 has only a single hole. Therefore, the difficulty of processing the base injection mold is reduced as compared with the prior art, and the mold processing cost is also reduced. M368898 • l [Simple diagram of the drawing] Fig. 1 is a perspective view of a conventional package base assembly 10; Fig. 2 is a top view of Fig. 1; Fig. 3 is a sectional view of the section 3-3 of Fig. 2, and then adding an LED The die 14 and the 5 bonding wires 18 and the like; ' Fig. 4 is a perspective view of the embodiment of the light emitting diode base assembly 20 according to the present invention; Fig. 5 is a top view of Fig. 4; Fig. 6 is a drawing of Fig. 5 6-6 is a cross-sectional view of the hatching, and further includes elements such as LED dies 24 and 10 bonding wires 28; and FIG. 7 is a perspective view of the illuminating diode base assembly 30 according to another embodiment of the present invention.
8 M3688988 M368898
I 【主要元件符號說明】I [Main component symbol description]
10 基座總成 12 反射盖（基座） 12a ‘凹陷部 12b 底面 12c 較寬孔 12d 較窄孔 12e 分隔部 13 導線架 13a 固晶區 13b 焊線區 14 晶粒 16 焊頭 18 焊線 20 基座總成 21 凹陷部 22 反射蓋（基座） 22a 側壁 22b 底面 22c 較寬孔 M36889810 Base assembly 12 Reflector cover (base) 12a 'Depression 12b Bottom surface 12c Wide hole 12d Narrow hole 12e Separation 13 Lead frame 13a Solid crystal region 13b Wire bond area 14 Grain 16 Weld head 18 Wire bond 20 Base assembly 21 recess 22 reflective cover (base) 22a side wall 22b bottom surface 22c wider hole M368898
22d 較窄孔 23 導線架 23a 固晶區 23b 焊線區 24 晶粒 26 焊頭 28 焊線 30 基座總成 31 凹陷部 32 反射蓋（基座） 32b 底面 32c 較寬孔 32d 較窄孔 33 導線架 33a 固晶區 33b 焊線區 A 進焊路徑 B 進焊路徑 1022d narrower hole 23 lead frame 23a solid crystal region 23b wire bond area 24 die 26 horn 28 bond wire 30 pedestal assembly 31 recessed portion 32 reflective cover (base) 32b bottom surface 32c wider hole 32d narrower hole 33 Lead frame 33a die bonding area 33b wire bonding area A feeding path B feeding path 10