JP2008034680A - Resin hollow package for housing semiconductor device, method of manufacturing the same, and semiconductor apparatus using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin hollow package for housing a semiconductor device and a method of manufacturing the same where sufficient heat radiating property can be ensured, even when it is miniaturized or thinned. <P>SOLUTION: In a resin hollow package for housing a semiconductor device 5, such as a solid-state imaging device, method of manufacturing the same, and semiconductor apparatus by using the resin hollow package; a first frame, having a lead 3 and a second frame, having a metal sheet 4 are set at predetermined positions within a resin molding metal die, the lead 3; and the metal sheet 4 are then inserted into a package body 1 by injection molding or transfer molding. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a resin hollow package for housing a semiconductor element such as a solid-state imaging element, a method for manufacturing the resin hollow package, and a semiconductor device using the resin hollow package.

  It is known that the functional characteristics of a semiconductor element are greatly affected by changes in the temperature and humidity of the outside air, or minute dust, and are easily deteriorated by receiving mechanical vibrations and impacts. In order to protect the semiconductor element from these external factors, a package sealed with a resin or the like is used.

  A semiconductor element such as a solid-state imaging device requires a light path with the outside of the package, and cannot be surrounded by a resin unlike a general LSI element that does not require a light path. Accordingly, these semiconductor elements are generally packaged by being mounted in a hollow type package in which one side is open and hermetically sealing the hollow portion with a transparent lid such as glass.

  Conventionally, ceramic hollow packages have been widely used as this hollow type package. According to this ceramic hollow package, since the thermal conductivity of the ceramic, which is the package material, is high, most of the heat generated during the operation of the semiconductor element can be radiated from the back of the package to the atmosphere. However, the ceramic hollow package has the disadvantage that the material cost and the manufacturing cost are high, which is one of the factors that hinder the reduction of the manufacturing cost of the semiconductor device. For this reason, replacement of a ceramic hollow package with a resin hollow package with lower material cost and manufacturing cost is under study.

  In this resin hollow package, a semiconductor element such as a solid-state imaging element is fixed to the bottom surface of the hollow portion provided in the package body with an adhesive or the like, and then a gold wire is connected between the inner lead exposed in the hollow portion and the semiconductor element electrode. In addition, the hollow portion is hermetically sealed by installing a lid such as light transmissive transparent glass on the upper surface of the package body via an adhesive. However, since the resin hollow package has a low thermal conductivity, there is a problem that heat generated by the operation of the semiconductor element cannot be effectively discharged outside the package.

  Therefore, conventionally, various techniques for improving the heat dissipation of the resin hollow package have been studied.

  For example, Patent Document 1 discloses that 0.01 cal / cm · sec. Insert-mold a tab made of a material selected from the group consisting of aluminum, copper, iron, oxides thereof or alloys thereof having a thermal conductivity of ℃ or higher, and expose only the upper surface of the tab to the hollow portion. Thus, a technique for improving heat dissipation is disclosed.

  In Patent Document 2, the resin inside the bottom of the package body is selected from the group consisting of aluminum, copper, iron metals and alloys thereof having a thermal conductivity of 0.5 cal / cm · sec ° C. or higher. There has been disclosed a technique for improving heat dissipation by insert molding a layer of a heat radiation and moisture resistant plate made of a vapor impermeable plate.

Further, Patent Document 3 discloses a technique for improving heat dissipation by rolling the plate material of the lead frame to make the inner lead part and the die pad part have different thicknesses, that is, by making the die pad part thick. ing.
JP-A-4-162462 JP-A-4-79256 JP 2001-148456 A

  All of the above conventional techniques improve heat dissipation by inserting a metal plate with high thermal conductivity such as a tab, a heat dissipation / moisture-resistant plate, and a die spat part below the bottom surface of the hollow portion where the semiconductor element is mounted. To do. The metal plate is integrally provided in the same frame as the frame having the leads. After setting the frame at a predetermined position in the resin molding die, the lead and the metal plate are formed by injection molding or transfer molding. Is inserted. That is, in the conventional technique, a lead and a metal plate are inserted by insert-molding one frame having a lead and a metal plate.

  However, in such a conventional technique, since the lead and the metal plate are formed in one frame, the metal plate must be formed inside the lead by design, and the area of the metal plate is limited. End up. Therefore, necessary heat dissipation may not be ensured. In particular, in recent years, the integration of semiconductor elements has increased, the amount of heat generated from the semiconductor elements has increased, and the packages themselves that contain semiconductor elements have also become smaller and thinner. With the area of the obtained metal plate, heat cannot be efficiently radiated to the outside of the package.

  Further, in the above-described conventional technology, the metal plate is formed by processing the same frame as the frame having the leads, so that the thickness of the metal plate is the same as that of the leads. In general, a lead thickness of about 0.10 to 0.30 mm is often used. For example, in the case of a thin package having a resin thickness of 0.20 mm below the hollow portion of the package, if a 0.10 mm metal plate is inserted, the resin The thickness becomes extremely thin, such as 0.10 mm, and problems such as frequent resin filling failures and reduced strength occur at the time of molding, so that it is not practical as a thin package.

  On the other hand, when trying to form a thin metal plate with a thickness of less than 0.10 mm by reducing the thickness of the lead, it can withstand the resin injection pressure and the mold clamping pressure during insert molding due to the decrease in strength. However, there is a problem that the frame is deformed.

  In addition, as described above, Patent Document 3 discloses a technique for changing the thickness of a lead (inner lead portion) and a metal plate (die spat portion) by rolling, but by rolling, This leads to an increase in the cost of the frame material itself, and there is a problem that the cost of the frame material rises in an inexpensive resin hollow package.

  Accordingly, the problem to be solved by the present invention is to provide a resin-made hollow package for housing a semiconductor element and a method for manufacturing the same that can ensure sufficient heat dissipation even when the device is reduced in size and thickness. It is in.

  The resin hollow package for housing a semiconductor element according to the present invention provides an electrical continuity between the semiconductor element mounted on the bottom surface of the hollow part and the outside of the resin package body having a hollow part for housing the semiconductor element. In a resin-made hollow package for housing a semiconductor element in which a lead and a metal plate to be realized are inserted, the metal plate is composed of a frame member different from the lead, and is inserted below the bottom surface of the hollow portion. It is characterized by being.

  That is, in the present invention, the heat generated from the semiconductor element is transferred to the resin layer on the bottom surface of the package body through the metal plate, and the heat is radiated to the outside of the package body and further to the atmosphere, thereby This prevents malfunctions such as malfunctions. In the present invention, by configuring the metal plate from a frame member different from the lead, the size, shape, thickness, material, etc. of the metal plate can be freely determined regardless of the lead, and the package Even when the main body is reduced in size and thickness, sufficient heat dissipation can be ensured. For example, it is easy to make the size of the metal plate larger than the size of the bottom surface of the hollow portion, and this makes it possible to dissipate heat from the semiconductor element into the atmosphere more efficiently than in the prior art. More preferably, the size of the metal plate is equal to or larger than the size of the opening of the hollow portion. Further, as the material of the metal plate, a material having high thermal conductivity can be selected regardless of the material of the lead. In addition, the thickness of the metal plate can be reduced regardless of the thickness of the lead, and even if the package body is reduced in size and thickness, the fluidity of the resin is not hindered during resin molding. The package can be easily provided, and at the same time, the heat dissipation can be improved.

  In such a resin-made hollow package for housing a semiconductor element of the present invention, a first frame having leads and a second frame having metal plates are set at predetermined positions in a resin mold, and then injection molded. Or it can obtain by the manufacturing method including the process of inserting the said lead and the said metal plate in a package main body by transfer molding. Alternatively, the metal plate is connected to and integrated with a first frame having leads, and after the first frame is set at a predetermined position in a resin molding die, the leads and the molding are performed by injection molding or transfer molding. It can be obtained by a manufacturing method including a step of inserting the metal plate into a package body.

  And a semiconductor device can be obtained by mounting a semiconductor element on the bottom surface of the hollow part of the resin-made hollow package for housing a semiconductor element thus obtained, and sealing the hollow part with a lid.

  According to the present invention, it is possible to obtain a resin-made hollow package having high heat conductivity, low thermal resistivity, and even a small and thin hollow package structure with no problem in filling properties and improved heat dissipation. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a sectional view showing an example of a resin-made hollow package for housing semiconductor elements (hereinafter simply referred to as “hollow package”) according to the present invention.

  The package body 1 is made of resin and has a hollow portion 2 for mounting a semiconductor element. The package body 1 is inserted with a lead 3 and a metal plate 4 that realize electrical continuity between the semiconductor element mounted on the bottom surface 2a of the hollow portion 2 and the outside. The metal plate 4 is composed of a frame member different from the lead 3 and is inserted below the bottom surface 2 a of the hollow portion 2.

  In the example of FIG. 1, the thickness of the metal plate 4 is made larger than the thickness of the lead 3, and the size thereof is larger than the sizes of the bottom surface 2 and the opening of the hollow portion 2. Further, the metal plate 4 is arranged so that the upper surface thereof is exposed to the hollow portion 2. As a result, heat from the semiconductor element can be efficiently radiated to the outside of the hollow package. That is, the heat from the semiconductor element is transmitted to the resin portion of the bottom surface 1a of the package body 1 through the metal plate 4, and is radiated to the outside of the hollow package.

  2 and 3 are cross-sectional views showing other examples of the hollow package of the present invention. In the example of FIG. 1, the metal plate 4 is arranged so that the upper surface is exposed in the hollow portion 2, but in the example of FIG. 2, the metal plate 4 is embedded in the resin on the bottom surface 2 a of the hollow portion 2. Yes. In the example of FIG. 3, the metal plate 4 is arranged so that the lower surface thereof is exposed on the bottom surface 1 a of the package body 1.

  Thus, if the insert position of the metal plate 4 is below the bottom surface 2a of the hollow portion 2, it can be arbitrarily determined according to the shape of the package body 1 and the like. Further, since the metal plate 4 is composed of a frame member different from the lead 3, its size, shape, thickness, material, etc. can be freely determined regardless of the lead 3.

  FIG. 4 is a cross-sectional view showing still another example of the hollow package of the present invention. The hollow package shown in FIG. 4 is of a surface mount type in which the package body 1 is thinned.

  In the hollow package of FIG. 4, since the resin portion below the hollow portion 2 is thin, a metal plate 4 that is thinner than the lead 3 is selected.

  Here, in the conventional technique, as described above, since the metal plate is formed by processing the same frame as the frame having the leads, the thickness of the metal plate is the same as that of the leads. Therefore, in the thin hollow package as shown in FIG. 4, it is difficult to insert a metal plate into the thin portion below the hollow portion 2, and even if a metal plate is inserted, the metal plate is interposed in the thin portion. This causes problems such as hindering the flow of liquid and causing poor filling. On the other hand, even if the frame is thinned and a metal plate is inserted in the thin wall portion, in a hollow package having a hollow portion, the resin cover is generated on the lead (inner lead) surface exposed to the hollow portion. Since a technique such as removing the resin coating on the surface of the lead (inner lead) with high-pressure water or the like is used in the process, there is a possibility that the frame itself may be deformed if the frame itself is thinned.

  On the other hand, in the present invention, as described above, the thickness of the metal plate 4 can be freely selected regardless of the lead 3, so that the resin can be filled without causing a problem, Furthermore, a thin hollow package having a high heat dissipation effect can be provided.

  FIG. 5 is a sectional view showing a semiconductor device using the hollow package of the present invention. A hollow package of the type shown in FIG. 2 is used. The semiconductor element 5 is fixed to the bottom surface 2a of the hollow portion 2 of the hollow package with an adhesive or the like, the lead 3 and the semiconductor element 5 are electrically connected by an electrical bonding material 6, and the hollow portion 2 is a lid made of glass or the like. 7 is hermetically sealed to obtain a semiconductor device.

  Next, the manufacturing method of the hollow package of this invention is demonstrated.

  In an example of the manufacturing method, a first frame A having leads 3 as shown in FIG. 6 and a second frame B having a metal plate 4 as shown in FIG. 7 are used. In FIG. 7, the metal plate 4 is connected to the second frame B through the suspension pins 8 and is pushed down to a predetermined position by the pressing process.

  When the metal plate 4 is formed on the first frame A having the leads 3 as in the prior art, the metal plate 4 is located on the inner side of the leads 3. By using the frame A and the second frame B separately, it is possible to make the frame A larger than the inner portion of the lead 3 of the first frame A. The metal plate 4 can be freely selected in size and thickness in accordance with the specifications of the hollow package. In the case of a thin hollow package, a thin frame material can be selected. However, in order to more efficiently dissipate heat from the hollow package, it is preferable that the thickness of the second frame B (metal plate 4) is increased to a thickness that allows the resin to be filled with respect to the thickness of the hollow package. The heat dissipation can be further improved.

  The material of the first frame A (lead 3) and the second frame B (metal plate 4) is selected from the group consisting of copper, iron, stainless steel, nickel, aluminum and alloys containing these metals, for example, and is necessary. Depending on the case, plating of gold, silver, nickel, solder or the like may be performed. Further, as the material of the second frame B, a material having high thermal conductivity can be selected in consideration of heat dissipation. At this time, a material different from that of the first frame A (lead 3) can be selected.

  FIG. 8 shows another example of a frame used in the method for manufacturing a hollow package of the present invention. The frame shown in FIG. 8 is obtained by integrating the metal plate 4 with the first frame A shown in FIG. Also in this frame, the size, shape, thickness, material, etc. of the metal plate 4 can be freely determined regardless of the first frame A (lead 3). As shown in FIG. The size of 4 can be made larger than the inner portion of the lead 3 of the first frame A.

  In forming the hollow package of the present invention using these frames, when the first and second frames shown in FIGS. 6 and 7 are used, the second frame B is the lower side, The first frame A and the second frame B are set at predetermined positions in the resin mold so that the frame A is on the upper side, and then the lead 3 of the first frame A is formed by injection molding or transfer molding. The metal plate 4 of the second frame B is insert-molded into the package body. When the frame shown in FIG. 8 is used, this frame is set at a predetermined position in the resin molding die, and the lead 3 and the metal plate 4 are similarly insert-molded into the package body by injection molding or transfer molding. In any case, the hollow package of the present invention can be obtained by cutting and removing the hanging pins 8 after molding.

  The conditions for insert molding vary depending on the type of resin used. Generally, molding temperature: 150 to 200 ° C., molding pressure: 1 to 50 MPa, molding time: 1 to 40 seconds, preferably molding temperature: 165 to 185 ° C., molding pressure: 5 to 30 MPa, molding time: Perform for 3-20 seconds. After molding by the above molding method, heat may be applied as necessary to cure the resin.

  EXAMPLES Hereinafter, although an Example demonstrates this invention more concretely, the scope of the present invention is not limited by a following example.

  As an example, the following types of packages were manufactured using the following first and second frames. Further, as a comparative example, a package of the following type was manufactured using a conventional frame in which a metal plate was formed by processing a first frame shown below. Table 1 shows the specifications of the hollow packages of the example and the comparative example.

(A) First frame 1-1: Thickness: 0.10 mm Material: Ni alloy 1-2: Thickness: 0.25 mm Material: Ni alloy 1-3: Thickness: 0.20 mm Material: Ni alloy ( B) Second frame 2-1: Thickness: 0.4 mm Material: Ni alloy 2-2: Thickness: 0.4 mm Material: Cu alloy 2-3: Thickness: 0.1 mm Material: Ni alloy 2- 4: Thickness: 0.1 mm Material: Cu alloy (C) Package type Package (1): 10 × 10 mm t = 2.0 mm Thin portion thickness: 0.775 mm
Package (2): 10 × 10 mm t = 1.0 mm Thin portion thickness: 0.3 mm

  Based on the specifications of the examples and comparative examples shown in Table 1, each frame is set at a predetermined position of a resin molding die and integrally molded by transfer molding. Then, the suspension pin of the obtained hollow package is cut and the frame is cut. The hollow package in which the lead and the metal plate were inserted was obtained.

  About the hollow package of the obtained Example and the comparative example, thermal conductivity, thermal resistivity, and filling property were evaluated.

The results are shown in Table 2.

  Here, the thermal conductivity was measured using a laser flash method physical property measuring apparatus (manufactured by Kyoto Electronics Industry). The thermal resistivity R was determined by the formula R = d / λ (d: thickness, λ: thermal conductivity). The filling property was evaluated by confirming the filling property of the resin with a stereomicroscope.

  As shown in Table 2, in the examples of the present invention, favorable results were obtained in terms of thermal conductivity, thermal resistivity, and filling properties, as compared with the comparative example according to the prior art.

It is sectional drawing which shows an example of the hollow package of this invention. It is sectional drawing which shows the other example of the hollow package of this invention. It is sectional drawing which shows the other example of the hollow package of this invention. It is sectional drawing which shows the further another example of the hollow package of this invention. It is sectional drawing which shows the semiconductor device using the hollow package of this invention. The 1st flame | frame used with the manufacturing method of the hollow package of this invention is shown. The 2nd flame | frame used with the manufacturing method of the hollow package of this invention is shown. The other example of the flame | frame used with the manufacturing method of the hollow package of this invention is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Package main body 1a Bottom surface of package main body 2 Hollow part 2a Bottom surface of hollow part 3 Lead 4 Metal plate 5 Semiconductor element 6 Electrical joining material 7 Lid 8 Suspension pin A 1st frame B 2nd frame

Claims (5)

A semiconductor element in which a lead and a metal plate for electrical connection between a semiconductor element mounted on the bottom surface of the hollow part and the outside are inserted into a resin package body having a hollow part for housing the semiconductor element In the hollow resin package for storage,
The said metal plate is comprised from the frame member different from the said lead | read | reed, The resin-made hollow package for semiconductor element accommodation inserted in the lower side of the bottom face of the said hollow part.   The resin-made hollow package for semiconductor element storage according to claim 1, wherein the size of the metal plate is larger than the size of the bottom surface of the hollow portion.   A semiconductor device in which a semiconductor element is mounted on the bottom surface of the hollow part of the resin-made hollow package for housing a semiconductor element according to claim 1 and the hollow part is sealed with a lid. A semiconductor element in which a lead and a metal plate for electrical connection between a semiconductor element mounted on the bottom surface of the hollow part and the outside are inserted into a resin package body having a hollow part for housing the semiconductor element A method of manufacturing a hollow resin package for storage,
After the first frame having the lead and the second frame having the metal plate are set at predetermined positions in a resin molding die, the lead and the metal plate are packaged by injection molding or transfer molding. A method of manufacturing a resin-made hollow package for housing a semiconductor element, including a step of inserting into a semiconductor device. A semiconductor element having a resin package body having a hollow part for housing a semiconductor element, with a lead and a metal plate inserted between the semiconductor element mounted on the bottom surface of the hollow part and the outside for electrical conduction. A method of manufacturing a hollow resin package for storage,
The metal plate is connected to and integrated with the first frame having the leads, and after the first frame is set at a predetermined position in the resin molding die, the leads and the molding are performed by injection molding or transfer molding. A method for manufacturing a resin-made hollow package for housing a semiconductor element, comprising a step of inserting a metal plate into a package body.

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