JP2008041817A - Resin-made hollow package for housing semiconductor element, semiconductor device, manufacturing method thereof, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-made hollow package of an MID (molded interconnect device) structure capable of easily realizing cost reduction, reduction in thickness and size, and multiple pins of the MID-structured resin-molded hollow package, and a manufacturing method thereof. <P>SOLUTION: A conductive ink is applied by printing to a resin surface from the internal surface of a concave portion 3 housing a semiconductor element 2 to the bottom surface of a package body 1 through the upper and external surface of the package body 1 to form a wiring pattern 6. Further, one or more conductive thin film layers are laminated on the wiring pattern 6. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a resin hollow package for housing a semiconductor element having a recess for housing a semiconductor element, a semiconductor device and an electronic device using the same, and a method for manufacturing the resin hollow package for housing a semiconductor element and a semiconductor device. .

  It is known that the functional characteristics of a semiconductor element are greatly affected by changes in the temperature and humidity of the outside air, or minute dust, and are easily deteriorated by receiving mechanical vibrations and impacts. In order to protect the semiconductor element from these external factors, a package made of ceramics, a package sealed with resin, or the like is used.

  A semiconductor element such as a CCD or CMOS requires a light path from the outside of the package, and cannot be sealed with ceramics or resin, unlike a general LSI element that does not require a light path. Accordingly, these semiconductor elements are generally packaged by being mounted in a hollow type package in which one side is open and hermetically sealing the concave portion with a transparent lid such as glass.

  However, among the hollow type packages, the ceramic hollow package has the disadvantage that the material cost and the manufacturing cost are high, which is one of the factors hindering the reduction of the manufacturing cost of the semiconductor device. For this reason, replacement of a ceramic hollow package with a resin hollow package with lower material cost and manufacturing cost is under study.

  As a form of this resin hollow package, instead of the conventional DIP (Dual Inline Package) type, a surface mount type, thin and small resin hollow package has been required. ing. Therefore, resin-made hollow packages such as surface mount type SOP (Small Outline Package) type and SON (Small Outline Non Leaded Package) type are used.

  However, resin-made hollow packages are limited in terms of reliability, such as moisture resistance and heat dissipation, and structural problems. There are limits to thinning, downsizing, and increasing the number of pins, and there is flexibility in wiring patterns. Ceramic hollow packages are often used.

  As a form of the surface mount type ceramic hollow package, there is an LCC (Leadless chip carrier) type. This is formed, for example, using a plurality of unsintered packaging sheets. That is, a wiring film is formed on each sheet as necessary, and a plurality of sheets are stacked and sintered to form a package body having a recess for housing a semiconductor element. Thereafter, the semiconductor element is die bonded to the recess, and the wiring film on the inner surface of the recess is connected to the semiconductor element pad portion by wire bonding. Further, a sealant is applied to the upper surface of the package body, and the recess is hermetically sealed with a transparent lid such as glass. Thereby, an LCC type semiconductor device is completed.

  Ceramics are essentially impermeable to moisture, and have better thermal conductivity and better heat dissipation than resins. However, as described above, the ceramic hollow package has drawbacks such as high manufacturing cost and poor product dimensional accuracy.

  Therefore, in order to replace the ceramic hollow package with a resin hollow package that has low material cost, low manufacturing cost, excellent product dimensional accuracy, and is mounted on the surface, it has a MID (Molded Interconnect Device) structure. A hollow package made of metal is attracting attention. The MID structure is a lead frameless resin package in which a wiring pattern is formed on the surface of a resin package body and a lead frame is not inserted as a lead wiring.

  Conventionally, as disclosed in Patent Document 1, as a resin hollow package having an MID structure, a resist is applied on a resin package body, a wiring pattern is formed by a photomask, and a wiring layer is formed by electroless plating. Is known. However, when forming a wiring pattern by plating in this way, it is necessary to form the wiring pattern using a three-dimensional mask before performing the plating process, and the manufacturing cost increases because the number of processes increases. There is a problem that the manufacturing time becomes high and the manufacturing period becomes long.

  On the other hand, Patent Document 2 uses a conductive resin in which lead-free solder is intermittently finely dispersed in a thermoplastic resin, and performs secondary molding only on a portion where a wiring pattern is to be formed. Thus, a technique for performing plating only on the surface of the secondary molded part is disclosed. According to this technique, the process of applying a resist on a resin package body and forming a wiring pattern using a photomask can be reduced, and the cost of the plating process can be reduced. However, a new cost is required for performing secondary molding as a molding means for the resin hollow package.

  On the other hand, in Patent Document 3, in order to improve the moisture resistance and heat dissipation of the resin hollow package, a heat radiating plate made of a vapor impermeable plate is provided below the semiconductor element mounting surface of the resin hollow package. An inserted resin hollow package is disclosed. The heat radiating plate is connected to the lead frame via a suspension pin, and the lead frame is inserted together with the heat radiating plate in the resin hollow package of Patent Document 3.

  However, as described above, there is an increasing demand for thin, small, and multi-pin resin hollow packages. In the case of a resin hollow package structure with a lead frame as described in Patent Document 3, Since the frame has a certain thickness, it cannot be structurally adapted to the requirements. For example, when a lead frame is inserted into a thin resin hollow package, the strength of the resin portion is reduced, and defects such as package cracks occur when lead cutting is performed.

  Therefore, in order to reduce the total thickness of the resin hollow package, one of the conditions is that the lead frame is not inserted. On the other hand, if the lead frame thickness is unreasonably reduced and the total thickness of the package is reduced, problems such as deformation of the lead frame occur due to a decrease in strength of the lead frame. For example, the heat radiating plate may be affected by a resin injection pressure or a clamping pressure at the time of molding and deformed. Further, when the lead frame is made thin, various problems such as poor handling properties occur.

  Further, in general, in a lead frame manufactured by stamping (punching press), an interval of 80% to 100% of the lead frame thickness is practically required because of the strength of the blade. The lead interval that can be manufactured is limited by the thickness. Another method for manufacturing the lead frame is an etching method, but 70% to 100% of the lead frame thickness is required to obtain a practical lead interval.

  Therefore, for example, the lead interval of a lead frame with a thickness of 0.25 mm is almost limited to 0.175 mm to 0.250 mm, and cannot meet the demand for a narrow lead pitch. Further, when the number of pins is increased, the interface area between the resin of the package body and the lead frame is increased, resulting in a problem that the moisture resistance of the package is significantly impaired.

Also from this point, the resin-made hollow package having the above-described MID structure that does not require the insertion of the lead frame is promising in the future, and further cost reduction is desired for its widespread use.
JP-A-4-180696 JP-A-11-284313 Japanese Patent Laid-Open No. 4-312963

  The problem to be solved by the present invention is to reduce the cost of a resin-made hollow package having an MID structure, and further, to make a thin, small, and multi-pinned resin-made hollow package having an MID structure and its manufacture It is to provide a method.

  Another object is to provide a resin hollow package having a MID structure excellent in moisture resistance and heat dissipation and a method for manufacturing the same.

  The present invention is a resin-made hollow package for housing a semiconductor element having a recess for storing a semiconductor element, on the resin surface from the inner surface of the recess to the bottom surface of the package body through the upper surface and the outer surface of the package body, It is a resin-made hollow package for housing semiconductor elements having a wiring pattern formed by printing conductive ink.

  In addition, one or more conductive thin film layers can be laminated on the wiring pattern.

  Thus, in the present invention, since the wiring pattern is formed by printing, unlike the conventional resin-made hollow package having the MID structure, the resist processing and the mask processing for forming the wiring pattern are not required, and printing is performed. A wiring pattern can be formed by a process such as drying, baking, or ultraviolet irradiation, and then a conductive thin film layer can be laminated on the wiring pattern by printing or plating, thereby reducing manufacturing costs and shortening the manufacturing period. Thus, the manufacturing cost of the resin hollow package can be reduced.

  That is, in the case of the conventional MID structure, in the plating process, it was necessary to apply a resist on the package body, form a wiring pattern by mask processing, and perform plating processing such as electroless plating and electrolytic plating. In the present invention, since the conductive ink is printed to form the wiring pattern, no resist process or mask process is required.

  Here, examples of the printing according to the present invention include dispense printing, ink jet printing, and the like.

  In particular, when inkjet printing is employed as a printing method, various wiring patterns can be easily formed by changing a program related to nozzle operation or ink application. Furthermore, since inkjet printing is non-contact with the printing surface, it is possible to easily print a wiring pattern even on a three-dimensional part of the package body. In addition, the angle between the nozzle and the wiring pattern forming surface is not particularly limited to being vertical, but the angle may be set as needed so that the width, thickness, etc. of the wiring pattern can be easily formed. Furthermore, by mounting a plurality of nozzles, there are advantages such as shortening the wiring pattern formation time and improving productivity.

  Furthermore, in the present invention, it is possible to improve moisture resistance and heat dissipation by inserting a heat sink on the same surface as the semiconductor element mounting surface of the recess or on the bottom surface side of the package body from the semiconductor element mounting surface. It is. The thickness of the heat radiating plate is 0.050 mm to 1.000 mm. In addition, for the insertion, a package body is formed of a resin by setting a frame in which a heat dissipation plate is connected to a mold in advance through suspension pins. At this time, the heat sink is inserted into the package main body, but the frame is not inserted into the package main body as lead wiring, and the suspension pins are cut to separate the heat sink from the frame.

  When the heat sink is inserted into the package body in this way, the heat sink is connected to the frame serving as a carrier in the manufacturing process, and thus each package body is also connected to the frame via the suspension pin of the heat sink. Therefore, flow is possible in units of frames, and process flow can be easily performed. Further, since the frame itself is not inserted as lead wiring, the interface area between the package main body and the lead frame does not increase as in the conventional case, and moisture resistance and moisture resistance reliability are improved. In addition, by inserting the heat sink on the same surface as the semiconductor element mounting surface of the recess or on the bottom surface side of the package body from the semiconductor element mounting surface, it is possible to effectively prevent moisture from entering the recess from the bottom surface of the package body. Thus, a resin hollow package having excellent moisture resistance can be obtained, and heat generated during operation of the semiconductor element is released to the outside through the heat radiating plate, so that the heat dissipation can be improved.

  On the other hand, the manufacturing method of the resin hollow package for housing a semiconductor element of the present invention basically includes a step of forming a package body having a recess for housing a semiconductor element with resin, and an upper surface of the package body from the inner surface of the recess. And a step of forming a wiring pattern by printing conductive ink on the resin surface extending from the outer surface to the bottom surface of the package body, and a step of drying, baking or irradiating the wiring pattern with the wiring pattern. .

  Moreover, the process of laminating | stacking a conductive thin film layer on the said wiring pattern by printing or plating after the process of performing a process of drying, baking, or ultraviolet irradiation to the said wiring pattern can also be included.

  Further, when the heat sink is inserted into the package body, as described above, a frame in which a heat sink having a thickness of 0.050 mm to 1.000 mm is connected to the mold in advance through a suspension pin is used. The main body is formed of resin. At this time, the heat sink is inserted into the package main body, but the frame is not inserted into the package main body as lead wiring, and the suspension pins are cut to separate the heat sink from the frame.

  Then, a semiconductor element is mounted in the concave portion of the resin-made hollow package for housing a semiconductor element thus obtained, the semiconductor element and the wiring pattern are electrically connected, and the concave portion is sealed with a lid. Thus, a semiconductor device can be obtained. Furthermore, an electronic device can be manufactured using this semiconductor device.

  According to the present invention, since the wiring pattern is formed not by plating but by printing, resist processing and masking for plating are not required, and the cost of the MID-structured resin hollow package can be reduced. Can do. Furthermore, the resin hollow package can be easily reduced in thickness, size, and number of pins.

  In addition, the pitch of the wiring pattern can be reduced, the degree of freedom of the wiring pattern is high, the wiring pattern can be routed in multiple directions, and a resin hollow package that cannot be realized with a lead frame can be provided.

  In addition, if a heat sink is inserted into the package body and the frame is not inserted as lead wiring, the heat dissipation and moisture resistance can be improved, and the resin hollow package can be made thinner and smaller. And does not inhibit multipinning.

  Embodiments of the present invention will be described below with reference to the drawings. Of course, the present invention is not limited to this embodiment.

  FIG. 1 is a sectional view of a semiconductor device using the resin hollow package of the present invention, and FIG. 2 is a perspective view of the package body.

  The package body 1 made of resin has a recess 3 for accommodating the semiconductor element 2, and the conductive surface extends from the inner surface of the recess 3 to the bottom surface of the package body 1 through the upper surface and the outer surface of the package body 1. The wiring pattern 6 is formed by ink jet printing of the conductive ink. The semiconductor element 2 and the wiring pattern 6 are electrically connected by wire bonding 7. And the recessed part 3 which accommodated the semiconductor element 2 is airtightly sealed through the sealing agent 4 with transparent lids 5, such as glass.

  Here, in order to further improve the wire bonding property between the semiconductor element 2 and the wiring pattern 6, it is preferable to stack one or more conductive thin film layers on the wiring pattern 6. FIG. 3 schematically shows an example in which a conductive thin film layer is laminated on the wiring pattern 6. As shown in the figure, a wiring pattern 6 is formed on the package body 1 by ink jet printing using an ink containing copper. On the wiring pattern 6, a conductive thin film layer made of ink 11 containing nickel as the second layer and an ink 12 containing gold as the third layer is laminated by ink jet printing. For the second and third conductive thin film layers, nickel 11 can be laminated on the second layer, and gold 12 can be laminated on the third layer by plating such as electroless plating or electrolytic plating.

  FIG. 4 is a perspective view of an example in which a heat sink 10 is inserted into the package body 1.

  In the example of FIG. 4, the heat sink 10 is inserted slightly on the bottom side of the package body 1 from the semiconductor element mounting surface of the recess 3 of the package body 1. The heat sink 10 may be inserted so that the upper surface thereof is flush with the semiconductor element mounting surface. In addition, in the Example, the material of the heat sink 10 was 42 Alloy, and the thickness was 0.20 mm.

  The resin hollow package of the present invention described above forms the package body 1 having the recess 3 by transfer molding or injection molding using a thermosetting resin or a thermoplastic resin, and then undergoes a predetermined process. Can be obtained.

  Hereinafter, as an example of the manufacturing method, a manufacturing method by transfer molding using a thermosetting resin will be described.

  FIG. 5 shows a process flow of the manufacturing method. Moreover, FIG. 6 shows the process flow in the case of inserting a heat sink.

  First, the package body 1 having the recesses 3 is formed by transfer molding, and is baked and cured at a temperature of about 180 ° C. for about 5 hours. In addition, when the heat sink 10 is inserted, a frame 9 in which the heat sink 10 is connected to the mold via the suspension pins 8 is set in advance and the package body is formed of resin. In this case, the heat sink 10 is inserted into the package body 1, but the frame 9 is not inserted into the package body 1 as lead wiring.

  Thereafter, for example, ink containing copper is printed on the surface of the package body 1 by inkjet printing to form the wiring pattern 6, and drying, baking, ultraviolet irradiation, or the like is performed. Further, as described above with reference to FIG. 2, a conductive thin film layer is laminated on the wiring pattern 6 in order to further improve the wire bonding property. When the conductive thin film layer is formed by ink jet printing, as shown in FIG. 3, the ink 11 containing nickel is laminated on the second layer, and the ink 12 containing gold is laminated on the third layer. The conductive thin film layer is laminated by repeating baking, ultraviolet irradiation, or the like. In general, when baking, baking is performed at a temperature of about 150 ° C. to 240 ° C. for about 1 hour. In addition, the material to laminate | stack is not specifically limited, If it is a material which has an equivalent characteristic, it can substitute.

  Here, according to inkjet printing, the thickness and width of the wiring pattern 6 and the conductive thin film layer stacked thereon are determined by the nozzle operation speed, that is, the ink application speed, the application amount from the nozzle, the ink overprinting, and the like. It can be adjusted arbitrarily. Therefore, various wiring patterns 6 can be formed on the surface of the package body 1 and a conductive thin film layer can be laminated thereon. Furthermore, according to inkjet printing, since the printed surface is not contacted, the wiring pattern 6 and the conductive thin film layer can be easily printed and formed even on a three-dimensional part of the package body 1. FIG. 7 shows an example in which the wiring pattern 6 is formed in multiple directions on the surface of the package body 1.

  In addition, the angle between the nozzle and the wiring pattern forming surface in ink jet printing is not particularly limited to being vertical, but the angle may be adjusted as necessary so that the wiring pattern and the conductive thin film layer can be easily formed. You may put on. Furthermore, by mounting a plurality of nozzles, it is possible to form a wiring pattern and a conductive thin film layer in each part at a time. For example, the formation time of the wiring pattern and the conductive thin film layer is shortened and productivity is improved. There are merits such as.

  In order to improve the adhesion between the wiring pattern 6 and the surface of the package body 1, the surface of the package body 1 may be roughened before ink jet printing. The surface roughening method includes a blast method and a chemical polishing method, but is not limited thereto.

  As described above, the resin-made hollow package having the MID structure in which the wiring pattern 6 and the conductive thin film layer are formed on the surface of the package body 1 is formed. However, the conditions for forming the wiring pattern 6 and the conductive thin film layer are not limited to the above conditions.

  After forming the wiring pattern 6 and the conductive thin film layer, dicing is performed to separate the resin hollow package.

  Thereafter, the semiconductor element 2 is die-bonded to the recess 3, and the pad portion of the semiconductor element 2 and the portion that becomes the terminal of the wiring pattern 6 are connected by the wire bonding 7. Finally, in order to seal the recess 3, a sealing agent is applied to the upper surface of the package body 1, and the recess 3 is hermetically sealed with a transparent lid such as glass. Thus, the semiconductor device is completed. In general, an ultraviolet curable resin is used as the sealing agent, but it is not particularly limited.

  In addition, when inserting a heat sink, after wire bonding, the hanging pin 8 is cut and the heat sink 10 is separated from the frame 9.

  The present invention is a resin-made hollow housing next-generation semiconductor elements that requires cost reduction, size reduction, thickness reduction, weight reduction, and further improvement in mechanical strength, moisture resistance, heat dissipation, productivity, etc. The present invention can be particularly suitably used for packages and semiconductor devices.

It is sectional drawing of the semiconductor device using the resin-made hollow packages of this invention. It is a perspective view of the resin-made hollow package of this invention. It is a figure which shows typically the example which laminated | stacked the conductive thin film layer on the wiring pattern. It is a perspective view of the resin-made hollow package of this invention which inserted the heat sink. It is a process flow figure of a manufacturing method of a resin hollow package of the present invention. It is a process flow figure of the manufacturing method of the resin-made hollow package of this invention when inserting a heat sink. It is a perspective view which shows the resin-made hollow package of this invention which wired the wiring pattern to the package main body surface in multiple directions.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin hollow package 2 Semiconductor element 3 Recessed part 4 Sealing agent 5 Lid 6 Wiring pattern which consists of a conductive thin film layer 7 Wire bonding 8 Hanging pin 9 Lead frame 10 Heat sink 11 Nickel-containing ink or nickel 12 gold is contained Ink or gold

Claims (9)

  A resin element hollow package for housing a semiconductor element having a recess for storing a semiconductor element, wherein conductive ink is applied to a resin surface from the inner surface of the recess to the bottom surface of the package body through the upper surface and the outer surface of the package body. A resin-made resin hollow package having a printed wiring pattern.   The resin-made hollow package for housing a semiconductor element according to claim 1, wherein one or more conductive thin film layers are laminated on the wiring pattern.   The heat sink with a thickness of 0.050 mm to 1.000 mm is inserted in the same surface as the semiconductor element mounting surface of the recess or on the bottom surface side of the package body from the semiconductor element mounting surface. A resin hollow package for housing a semiconductor element as described.   The semiconductor device which mounted the semiconductor element in the recessed part of the resin-made hollow package for semiconductor element accommodation in any one of Claims 1-3, and sealed the said recessed part with the lid | cover.   An electronic apparatus having the semiconductor device according to claim 4. Forming a package body having a recess for housing a semiconductor element with a resin;
Forming a wiring pattern by printing conductive ink on the resin surface from the inner surface of the recess to the bottom surface of the package body through the upper surface and the outer surface of the package body;
A step of subjecting the wiring pattern to drying, baking or ultraviolet irradiation;
A method for manufacturing a resin-made hollow package for housing a semiconductor element. After the step of performing drying, baking or ultraviolet irradiation treatment on the wiring pattern,
The manufacturing method of the resin-made hollow package for semiconductor element storage of Claim 6 including the process of laminating | stacking a conductive thin film layer on the said wiring pattern by printing or plating.   In a process of forming a package body having a recess for housing a semiconductor element with a resin, a package is set by previously setting a frame in which a radiator plate having a thickness of 0.050 mm to 1.000 mm is connected via a suspension pin in a mold. The main body is made of resin. At this time, the heat sink is inserted into the package main body, but the frame is not inserted into the package main body as lead wiring, and the suspension pins are cut to separate the heat sink from the frame. The manufacturing method of the resin-made hollow package for semiconductor element storage of Claim 6 or Claim 7 to do. Mounting a semiconductor element in the recess of the resin hollow package for housing a semiconductor element according to any one of claims 1 to 3;
Electrically connecting the semiconductor element and the wiring pattern;
Sealing the recess with a lid;
A method of manufacturing a semiconductor device including:

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