CN109004396A - Elastic conduction terminal and its manufacturing method - Google Patents
Elastic conduction terminal and its manufacturing method Download PDFInfo
- Publication number
- CN109004396A CN109004396A CN201710422457.5A CN201710422457A CN109004396A CN 109004396 A CN109004396 A CN 109004396A CN 201710422457 A CN201710422457 A CN 201710422457A CN 109004396 A CN109004396 A CN 109004396A
- Authority
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- China
- Prior art keywords
- metal layer
- conduction terminal
- elastic conduction
- silicon rubber
- conductive silicon
- Prior art date
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- Pending
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims description 145
- 229910052751 metal Inorganic materials 0.000 claims description 145
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920000260 silastic Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses a kind of elastic conduction terminals, which includes elastic body, which is made of Conductive silicon rubber material, and is formed at least one through-hole.In the present invention, the ontology of elastic conduction terminal is hollow conductive silicon rubber, and this improves the compressibility of elastic conduction terminal and elasticity, ensure that the electrical contact performance of elastic conduction terminal.The invention also discloses the methods of manufacture aforementioned flexible conductive terminal.
Description
Technical field
The present invention relates to a kind of elastic conduction terminal and its manufacturing methods.
Background technique
Currently, the volume of electronic product is smaller and smaller, the elastic conduction terminal for being electrically connected electronic product is also required to get over
It is next smaller, and the requirement to the electrical connection properties of elastic conduction terminal is higher and higher.
In the prior art, it is often necessary to which an electronic device is electrically connected to by circuit board by an elastic conduction terminal
On, the side of the elastic conduction terminal and electronic device resilient electrical contact, the other side is then welded on circuit board.Due to existing
Electronic product volume very little, therefore, the elastic conduction terminal are more and more challenged at many aspects, such as the contact of welding
Area, the compressibility of connection, elasticity, miniaturization etc..
In the prior art, which is usually made of metal clips, still, when this metal clips terminal
Size it is smaller when, compressibility and elasticity will become excessively poor, lead to poor electric contact.In addition, its bonding area
It will receive limitation, it is unreliable to cause to weld.
Summary of the invention
The purpose of the present invention aims to solve the problem that at least one aspect of the above-mentioned problems in the prior art and defect.
A purpose according to the present invention, provides a kind of elastic conduction terminal, has in the lesser situation of size excellent
Good compressibility and elasticity, ensure that the electrical contact performance of elastic conduction terminal.
According to an aspect of the present invention, a kind of elastic conduction terminal is provided, comprising: elastic body, by conductive silicon rubber
Material is made, and is formed at least one through-hole.
The embodiment of an exemplary according to the present invention, the elastic conduction terminal further include being bonded to the elasticity originally
Metal film on the bottom surface of body.
The embodiment of another exemplary according to the present invention, the metal film utilize the Conductive silicon rubber material itself
Viscosity be bonded directly on the bottom surface of the elastic body.
The embodiment of another exemplary according to the present invention, the metal film include the first metal layer and are formed in described
Second metal layer on the bottom surface of the first metal layer, the top surface of the first metal layer are bonded to the bottom surface of the elastic body
On.
The welding performance of the embodiment of another exemplary according to the present invention, the second metal layer is better than described first
Metal layer.
The embodiment of another exemplary according to the present invention, the first metal layer and the second metal layer are by two kinds
Different metal materials are made.
The embodiment of another exemplary according to the present invention, the first metal layer are made of copper or nickel, and described second
Metal layer is made of gold or tin.
The embodiment of another exemplary according to the present invention, the second metal layer are formed in institute by way of plating
It states on the bottom surface of the first metal layer.
The embodiment of another exemplary according to the present invention, the metal film include the first metal layer, be formed in it is described
Second metal layer on the bottom surface of the first metal layer and the third metal layer being formed on the bottom surface of the second metal layer, it is described
The top surface of the first metal layer is bonded on the bottom surface of the elastic body.
The embodiment of another exemplary according to the present invention, the first metal layer are made of copper, second metal
Layer is made of nickel, and the third metal layer is made of gold or tin.
The embodiment of another exemplary according to the present invention, the metal film include the first metal layer, be formed in it is described
Second metal layer on the bottom surface of the first metal layer, the third metal layer being formed on the bottom surface of the second metal layer and formation
The 4th metal layer on the bottom surface of the third metal layer, the top surface of the first metal layer are bonded to the elastic body's
On bottom surface.
The embodiment of another exemplary according to the present invention, the first metal layer are made of nickel, second metal
Layer is made of copper, and the third metal layer is made of nickel, and the 4th metal layer is made of gold or tin.
The embodiment of another exemplary according to the present invention is formed with multiple through-holes in the elastic body.
The embodiment of another exemplary according to the present invention, the Conductive silicon rubber material include the silicon rubber as substrate
Glue and the conducting particles being blended in the silicon rubber.
The embodiment of another exemplary according to the present invention, the conducting particles are copper particle, nickel particles or silver particles.
According to another aspect of the present invention, a kind of method manufacturing elastic conduction terminal is provided, comprising the following steps:
Use extrusion molding process by Conductive silicon rubber material extrusion molding for the conductive silicon rubber at least one through-hole
Adhesive tape；
The binding metal film on the bottom surface of the conductive silicon rubber item；
The conductive silicon rubber item is cut into the elastic conduction terminal with predetermined size.
According to another aspect of the present invention, a kind of method manufacturing elastic conduction terminal is provided, comprising the following steps:
Metal film is placed in injection mold；
Conductive silicon rubber material is injected in the injection mold, to form the conductive silicon rubber at least one through-hole
Adhesive tape；
The conductive silicon rubber item is cut into the elastic conduction terminal with predetermined size.
In the embodiment of aforementioned each exemplary according to the present invention, the ontology of elastic conduction terminal is hollow conduction
Silicon rubber, this improves the compressibility of elastic conduction terminal and elasticity, ensure that the electrical contact of elastic conduction terminal
Energy.
By the description made for the present invention of below with reference to attached drawing, other objects and advantages of the present invention will be aobvious and easy
See, and can help that complete understanding of the invention will be obtained.
Detailed description of the invention
Fig. 1 shows the stereoscopic schematic diagram of the conductive silicon rubber item of the embodiment of an exemplary according to the present invention；
Fig. 2 shows conductive silicon rubber item shown in FIG. 1 and by the metal film on the bottom surface for being bonded to conductive silicon rubber item
Stereoscopic schematic diagram；
Fig. 3 shows the schematic diagram being bonded to metal film shown in Fig. 2 on the bottom surface of conductive silicon rubber item shown in FIG. 1；
Fig. 4 shows the stereoscopic schematic diagram by cutting conductive silicon rubber item elastic conduction terminal obtained shown in Fig. 3；
Fig. 5 shows another embodiment for the metal film being bonded on the bottom surface of conductive silicon rubber item；
Fig. 6 shows another embodiment for the metal film being bonded on the bottom surface of conductive silicon rubber item；
Fig. 7 shows that the bottom surface of the embodiment of another exemplary according to the present invention is pasted with the conductive silicon rubber of metal film
The stereoscopic schematic diagram of item；With
Fig. 8 shows the stereoscopic schematic diagram by cutting conductive silicon rubber item elastic conduction terminal obtained shown in Fig. 7.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.Illustrating
In book, the same or similar drawing reference numeral indicates the same or similar component.Following reference attached drawings are to embodiment of the present invention
Illustrate to be intended to explain present general inventive concept of the invention, and is not construed as to a kind of limitation of the invention.
In addition, in the following detailed description, to elaborate many concrete details to provide to present disclosure convenient for explaining
The comprehensive understanding of embodiment.It should be apparent, however, that one or more embodiments without these specific details can also be with
It is carried out.In other cases, well known construction and device is diagrammatically embodied to simplify attached drawing.
General technical design according to the present invention, provides a kind of elastic conduction terminal, which includes
Elastic body, the elastic body are made of Conductive silicon rubber material, and are formed at least one through-hole.
Fig. 4 shows the stereoscopic schematic diagram of the elastic conduction terminal 100 of the embodiment of an exemplary according to the present invention.
As shown in figure 4, in the illustrated embodiment, which mainly includes elastic body 10.The elasticity
Ontology 10 is made of Conductive silicon rubber material, and is formed at least one through-hole 11.
As shown in figure 4, in the illustrated embodiment, which further includes being bonded to elastic body 10
Metal film 20 on bottom surface.In this way, elastic conduction terminal 100 can be welded to circuit board (not shown) by the metal film 20
On.
As shown in figure 4, in the illustrated embodiment, since before curing, Conductive silicon rubber material itself has good
Viscosity, therefore, the viscosity that metal film 20 can use Conductive silicon rubber material itself is bonded directly to elastic body's 10
On bottom surface.
As shown in figure 4, in the illustrated embodiment, metal film 20 includes the first metal layer 21 and is formed in the first metal layer
Second metal layer 22 on 21 bottom surface, the top surface of the first metal layer 21 are bonded on the bottom surface of elastic body 10.
As shown in figure 4, in the illustrated embodiment, the welding performance of second metal layer 22 is better than the first metal layer 21.The
One metal layer 21 and second metal layer 22 are made of two different metal materials.The first metal layer 21 is made of copper or nickel, the
Two metal layers 22 are made of gold or tin.
As shown in figure 4, in the illustrated embodiment, second metal layer 22 can be formed in the first gold medal by way of plating
On the bottom surface for belonging to layer 21.
In the embodiment of an example of the present invention, aforesaid conductive silastic material includes the silicon rubber as substrate
With the conducting particles being blended in silicon rubber.
In the embodiment of an example of the present invention, aforesaid conductive particle can be copper particle, nickel particles or silver granuel
Son.
Fig. 8 shows the three-dimensional signal of the elastic conduction terminal 100 ' of the embodiment of another exemplary according to the present invention
Figure.
The difference of elastic conduction terminal 100 ' shown in Fig. 8 and elastic conduction terminal 100 shown in Fig. 4 is only that elasticity originally
The quantity of through-hole on body is different.
Single through-hole 11 is simply formed on the elastic body 10 of elastic conduction terminal 100 shown in Fig. 4, and it is shown in Fig. 8
Elastic conduction terminal 100 ' elastic body 10 ' on formed there are two through-hole 11 '.However, it is noted that elastic conducting of the invention
The structure of electric terminal is not limited to the embodiment of diagram, for example, can be formed with three on the elastic body of elastic conduction terminal
A or more through-hole.
Fig. 1 to Fig. 3 display manufactures the process of elastic conduction terminal 100 shown in Fig. 4, wherein Fig. 1 is shown according to the present invention
An exemplary embodiment conductive silicon rubber item stereoscopic schematic diagram；Fig. 2 show conductive silicon rubber item shown in FIG. 1 and
By the stereoscopic schematic diagram of the metal film on the bottom surface for being bonded to conductive silicon rubber item；Fig. 3, which is shown, bonds metal film shown in Fig. 2
Schematic diagram onto the bottom surface of conductive silicon rubber item shown in FIG. 1.
1 to Fig. 4 it is described in detail the process for manufacturing elastic conduction terminal 100 shown in Fig. 4 below with reference to accompanying drawings.
Firstly, as shown in Figure 1, using extrusion molding process by Conductive silicon rubber material extrusion molding for at least one
The conductive silicon rubber item 1 of through-hole 11；
Then, as shown in Figures 2 and 3, the binding metal film 20 on the bottom surface of conductive silicon rubber item 1；
Finally, conductive silicon rubber item 1 to be cut into the elastic conduction terminal 100 with predetermined size.
However, it is noted that the manufacturing process of elastic conduction terminal 100 is not limited to embodiment shown in Fig. 1 to Fig. 4.Example
Such as, in another embodiment of the present invention, the manufacturing process of elastic conduction terminal 100 may include steps of:
Firstly, metal film 20 is placed in injection mold；
Then, Conductive silicon rubber material is injected, in injection mold to form the conduction at least one through-hole 11
Silicon rubber bar 1；
Finally, conductive silicon rubber item 1 to be cut into the elastic conduction terminal 100 with predetermined size.
In the embodiment shown in Fig. 1 to Fig. 4, metal film 20 includes the first metal layer 21 and is formed in the first metal layer 21
Bottom surface on second metal layer 22, the top surface of the first metal layer 21 is bonded on the bottom surface of conductive silicon rubber item 1, the second metal
The welding performance of layer 22 is better than the first metal layer 21.
In the embodiment shown in Fig. 1 to Fig. 4, second metal layer 22 is glued to conductive silicon rubber in the first metal layer 21
It is electroplated on the bottom surface of the first metal layer 21 in advance before on the bottom surface of item 1；Or second metal layer 22 is in the first metal layer
21 be glued on the bottom surface of conductive silicon rubber item 1 after be plated on the bottom surface of the first metal layer 21.
The manufacturing process of elastic conduction terminal 100 ' shown in Fig. 8 can be with the system of elastic conduction terminal 100 shown in Fig. 4
It is identical to make process.
In one embodiment of the invention, the manufacturing process of elastic conduction terminal 100 ' shown in Fig. 8 may include with
Lower step:
Firstly, one bottom surface as shown in Figure 7 of manufacture is pasted with the conductive silicon rubber item 1 ' of metal film 20 '；
Then, as shown in figure 8, conductive silicon rubber item 1 ' shown in Fig. 7 is cut into the elastic conduction with predetermined size
Terminal 100 '.
In the embodiment shown in Fig. 1-4 and Fig. 7-8, the metal film being bonded on the bottom surface of conductive silicon rubber item has two
Layer metal layer, still, the present invention is not limited to this.For example, the metal film being bonded on the bottom surface of conductive silicon rubber item can also be with
With three layers or more metal layers.
Fig. 5 shows another embodiment for the metal film being bonded on the bottom surface of conductive silicon rubber item.As shown in figure 5,
In this embodiment, the metal film 20 being bonded on the bottom surface of conductive silicon rubber article 10 includes the first metal layer 21, is formed in the
Second metal layer 22 on the bottom surface of one metal layer 21 and the third metal layer 23 being formed on the bottom surface of second metal layer 22.The
The top surface of one metal layer 21 is bonded on the bottom surface of elastic body 10.
In the embodiment shown in fig. 5, the first metal layer 21 is made of copper, and second metal layer 22 is made of nickel, third gold
Belong to layer 23 to be made of gold or tin.
Fig. 6 shows another embodiment for the metal film being bonded on the bottom surface of conductive silicon rubber item.As shown in fig. 6,
In the illustrated embodiment, the metal film 20 being bonded on the bottom surface of conductive silicon rubber item 10 includes the first metal layer 21, is formed
On the bottom surface of the first metal layer 21 second metal layer 22, be formed in second metal layer 22 bottom surface on third metal layer 23
Be formed in third metal layer 23 bottom surface on the 4th metal layer 24.The top surface of the first metal layer 21 is bonded to elastic body 10
Bottom surface on.
In the embodiment shown in fig. 6, the first metal layer 21 is made of nickel, and second metal layer 21 is made of copper, third gold
Belong to layer 22 to be made of nickel, the 4th metal layer 23 is made of gold or tin.
It will be understood to those skilled in the art that embodiment described above is all exemplary, and this field
Technical staff can make improvements, the rushing in terms of not recurring structure or principle of structure described in various embodiments
It can be freely combined in the case where prominent.
Although in conjunction with attached drawing, the present invention is described, and embodiment disclosed in attached drawing is intended to preferred to the present invention
Embodiment illustrates, and should not be understood as to a kind of limitation of the invention.
Although some embodiments of this present general inventive concept have been shown and have illustrated, those of ordinary skill in the art will be managed
Solution can make a change these embodiments in the case where the principle and spirit without departing substantially from this present general inventive concept, of the invention
Range is limited with claim and their equivalent.
It should be noted that word " comprising " is not excluded for other element or steps, word "a" or "an" is not excluded for multiple.Separately
Outside, the range that any element label of claim should not be construed as limiting the invention.
Claims (18)
1. a kind of elastic conduction terminal, which is characterized in that the elastic conduction terminal includes:
Elastic body (10), is made of Conductive silicon rubber material, and is formed at least one through-hole (11).
2. elastic conduction terminal according to claim 1, it is characterised in that:
The elastic conduction terminal further includes the metal film (20) being bonded on the bottom surface of the elastic body (10).
3. elastic conduction terminal according to claim 2, it is characterised in that:
The metal film (20) is bonded directly to the elastic body using the viscosity of the Conductive silicon rubber material itself
(10) on bottom surface.
4. elastic conduction terminal according to claim 2 or 3, it is characterised in that:
The metal film (20) include the first metal layer (21) and be formed on the bottom surface of the first metal layer (21) second
The top surface of metal layer (22), the first metal layer (21) is bonded on the bottom surface of the elastic body (10).
5. elastic conduction terminal according to claim 4, it is characterised in that: the welding performance of the second metal layer (22)
Better than the first metal layer (21).
6. elastic conduction terminal according to claim 5, it is characterised in that:
The first metal layer (21) and the second metal layer (22) are made of two different metal materials.
7. elastic conduction terminal according to claim 6, it is characterised in that:
The first metal layer (21) is made of copper or nickel, and the second metal layer (22) is made of gold or zinc.
8. elastic conduction terminal according to claim 5, it is characterised in that:
The second metal layer (22) is formed on the bottom surface of the first metal layer (21) by way of plating.
9. elastic conduction terminal according to claim 2 or 3, it is characterised in that:
The metal film (20) includes the first metal layer (21), the second gold medal being formed on the bottom surface of the first metal layer (21)
The third metal layer (23) for belonging to layer (22) and being formed on the bottom surface of the second metal layer (22), the first metal layer (21)
Top surface be bonded on the bottom surface of the elastic body (10).
10. elastic conduction terminal according to claim 9, it is characterised in that:
The first metal layer (21) is made of copper, and the second metal layer (22) is made of nickel, the third metal layer (23)
It is made of gold or tin.
11. elastic conduction terminal according to claim 2 or 3, it is characterised in that:
The metal film (20) includes the first metal layer (21), the second gold medal being formed on the bottom surface of the first metal layer (21)
Belong to layer (22), the third metal layer (23) being formed on the bottom surface of the second metal layer (22) and is formed in the third metal
The 4th metal layer (24) on the bottom surface of layer (23), the top surface of the first metal layer (21) is bonded to the elastic body (10)
Bottom surface on.
12. elastic conduction terminal according to claim 11, it is characterised in that:
The first metal layer (21) is made of nickel, and the second metal layer (21) is made of copper, the third metal layer (22)
It is made of nickel, the 4th metal layer (23) is made of gold or tin.
13. elastic conduction terminal according to claim 1, it is characterised in that: be formed in the elastic body (10 ')
Multiple through-holes (11 ').
14. elastic conduction terminal according to claim 1, it is characterised in that:
The Conductive silicon rubber material includes the silicon rubber and the conducting particles that is blended in the silicon rubber as substrate.
15. elastic conduction terminal according to claim 14, it is characterised in that: the conducting particles is copper particle, Nickel particle
Son or silver particles.
16. a kind of method for manufacturing elastic conduction terminal, comprising the following steps:
Use extrusion molding process by Conductive silicon rubber material extrusion molding for the conductive silicon rubber at least one through-hole (11)
Adhesive tape (1)；
The binding metal film (20) on the bottom surface of the conductive silicon rubber item (1)；
The conductive silicon rubber item (1) is cut into the elastic conduction terminal (100) with predetermined size.
17. a kind of method for manufacturing elastic conduction terminal, comprising the following steps:
Metal film (20) is placed in injection mold；
Conductive silicon rubber material is injected in the injection mold, to form the conductive silicon rubber at least one through-hole (11)
Adhesive tape (1)；
The conductive silicon rubber item (1) is cut into the elastic conduction terminal (100) with predetermined size.
18. method according to claim 16 or 17, it is characterised in that:
The elastic conduction terminal is elastic conduction terminal described in any one of preceding claims 1-15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710422457.5A CN109004396A (en) | 2017-06-07 | 2017-06-07 | Elastic conduction terminal and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710422457.5A CN109004396A (en) | 2017-06-07 | 2017-06-07 | Elastic conduction terminal and its manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN109004396A true CN109004396A (en) | 2018-12-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710422457.5A Pending CN109004396A (en) | 2017-06-07 | 2017-06-07 | Elastic conduction terminal and its manufacturing method |
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| US20130105198A1 (en) * | 2010-08-27 | 2013-05-02 | Fuji Polymer Industries Co., Ltd. | Conductive rubber component and method for mounting same |
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