CN109003912A - 晶片输送压紧检测装置 - Google Patents
晶片输送压紧检测装置 Download PDFInfo
- Publication number
- CN109003912A CN109003912A CN201810902493.6A CN201810902493A CN109003912A CN 109003912 A CN109003912 A CN 109003912A CN 201810902493 A CN201810902493 A CN 201810902493A CN 109003912 A CN109003912 A CN 109003912A
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- chip
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- 238000001514 detection method Methods 0.000 title claims abstract description 64
- 230000007246 mechanism Effects 0.000 claims abstract description 90
- 239000002699 waste material Substances 0.000 claims abstract description 46
- 238000002054 transplantation Methods 0.000 claims abstract description 37
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 239000000523 sample Substances 0.000 claims description 45
- 230000003028 elevating effect Effects 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 abstract description 31
- 238000009826 distribution Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008450 motivation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Specific Conveyance Elements (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810902493.6A CN109003912B (zh) | 2018-08-09 | 2018-08-09 | 晶片输送压紧检测装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810902493.6A CN109003912B (zh) | 2018-08-09 | 2018-08-09 | 晶片输送压紧检测装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109003912A true CN109003912A (zh) | 2018-12-14 |
CN109003912B CN109003912B (zh) | 2024-05-10 |
Family
ID=64596338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810902493.6A Active CN109003912B (zh) | 2018-08-09 | 2018-08-09 | 晶片输送压紧检测装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109003912B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102062794A (zh) * | 2009-11-13 | 2011-05-18 | 旺矽科技股份有限公司 | 垂直式探针卡 |
CN102654559A (zh) * | 2012-05-10 | 2012-09-05 | 致茂电子(苏州)有限公司 | 测试半导体封装堆叠晶片的测试系统及其半导体自动化测试机台 |
CN108020782A (zh) * | 2017-12-26 | 2018-05-11 | 浙江奔龙自动化科技有限公司 | 一种用于电能表外置断路器综合检测设备 |
CN208753269U (zh) * | 2018-08-09 | 2019-04-16 | 江苏天奇氢电装备有限公司 | 晶片输送压紧检测装置 |
-
2018
- 2018-08-09 CN CN201810902493.6A patent/CN109003912B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102062794A (zh) * | 2009-11-13 | 2011-05-18 | 旺矽科技股份有限公司 | 垂直式探针卡 |
CN102654559A (zh) * | 2012-05-10 | 2012-09-05 | 致茂电子(苏州)有限公司 | 测试半导体封装堆叠晶片的测试系统及其半导体自动化测试机台 |
CN108020782A (zh) * | 2017-12-26 | 2018-05-11 | 浙江奔龙自动化科技有限公司 | 一种用于电能表外置断路器综合检测设备 |
CN208753269U (zh) * | 2018-08-09 | 2019-04-16 | 江苏天奇氢电装备有限公司 | 晶片输送压紧检测装置 |
Also Published As
Publication number | Publication date |
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CN109003912B (zh) | 2024-05-10 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240318 Address after: Room 106A, Enterprise Incubation Service Center, Xinrong Economic and Technological Development Zone, Datong City, Shanxi Province, 037000 Applicant after: Datong Xichun New Material Co.,Ltd. Country or region after: China Address before: 214000 No. 88, Yuxi Road, Qianzhou Street, Huishan District, Wuxi City, Jiangsu Province Applicant before: JIANGSU TIANQI HYDROGEN ELECTRIC EQUIPMENT Co.,Ltd. Country or region before: China |
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GR01 | Patent grant | ||
GR01 | Patent grant |