CN108990259B - 一种pcb电路板 - Google Patents
一种pcb电路板 Download PDFInfo
- Publication number
- CN108990259B CN108990259B CN201811051145.9A CN201811051145A CN108990259B CN 108990259 B CN108990259 B CN 108990259B CN 201811051145 A CN201811051145 A CN 201811051145A CN 108990259 B CN108990259 B CN 108990259B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- main body
- board main
- dissipation mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 100
- 230000017525 heat dissipation Effects 0.000 claims abstract description 95
- 238000009434 installation Methods 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 239000003973 paint Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 44
- 239000004020 conductor Substances 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 28
- 238000003466 welding Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 230000005489 elastic deformation Effects 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 230000006870 function Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 239000002120 nanofilm Substances 0.000 description 2
- 230000035508 accumulation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- OFCNXPDARWKPPY-UHFFFAOYSA-N allopurinol Chemical compound OC1=NC=NC2=C1C=NN2 OFCNXPDARWKPPY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811051145.9A CN108990259B (zh) | 2018-09-10 | 2018-09-10 | 一种pcb电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811051145.9A CN108990259B (zh) | 2018-09-10 | 2018-09-10 | 一种pcb电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108990259A CN108990259A (zh) | 2018-12-11 |
CN108990259B true CN108990259B (zh) | 2020-01-10 |
Family
ID=64545900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811051145.9A Active CN108990259B (zh) | 2018-09-10 | 2018-09-10 | 一种pcb电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108990259B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109921143B (zh) * | 2019-03-15 | 2023-12-26 | 福建南平南孚电池有限公司 | 一种具有改进的散热结构的可充电电池 |
CN110176258A (zh) * | 2019-07-06 | 2019-08-27 | 温州科技职业学院 | 一种移动式电子信息存储器 |
CN110461099A (zh) * | 2019-09-02 | 2019-11-15 | 昆山纬亚智能科技有限公司 | 一种柔性电路板的加工方法 |
CN111400781B (zh) * | 2020-04-16 | 2023-06-02 | 南京瑞浦景科技有限公司 | 一种存储芯片防拆自毁密封体安全防护系统及其工作方法 |
CN112020204B (zh) * | 2020-08-13 | 2022-03-18 | 深圳微步信息股份有限公司 | 一种具有三防功能的主板、电子设备及防水制备方法 |
CN113810201A (zh) * | 2021-09-16 | 2021-12-17 | 善悦(武汉)高新技术有限公司 | 一种5g加速卡通信模块、加速卡及通信传输方法 |
CN216872085U (zh) * | 2021-12-28 | 2022-07-01 | 宁德时代新能源科技股份有限公司 | 传感器、电池及用电设备 |
CN116545263B (zh) * | 2022-03-31 | 2023-10-13 | 安徽奥源电子科技有限公司 | 一种安全性高的快充电源 |
CN114977374A (zh) * | 2022-04-12 | 2022-08-30 | 安徽奥源电子科技有限公司 | 一种无桥pfc开关电源电路 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2848029B2 (ja) * | 1991-07-04 | 1999-01-20 | 松下電器産業株式会社 | 電子機器のシールド装置 |
CN201797680U (zh) * | 2010-08-26 | 2011-04-13 | 张方荣 | 一种电路板的避震机构 |
CN202487558U (zh) * | 2012-03-26 | 2012-10-10 | 成都飞鱼星科技开发有限公司 | 芯片散热器安装结构 |
CN203261609U (zh) * | 2013-04-26 | 2013-10-30 | 东莞市时运佳五金有限公司 | 一种pcb线路板固定支架结构 |
CN207201062U (zh) * | 2017-06-08 | 2018-04-06 | 昆山市华涛电子有限公司 | 一种液晶显示器超薄线路板 |
-
2018
- 2018-09-10 CN CN201811051145.9A patent/CN108990259B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108990259A (zh) | 2018-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191212 Address after: 314000 No. 972, gang Shan Road, Xiuzhou District, Jiaxing, Zhejiang. Applicant after: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Address before: 321408 No. 146, Chencun Village East, Rongjiang Township, Jinyun County, Lishui City, Zhejiang Province Applicant before: JINYUN COUNTY YUANDU AUTOMATION TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A PCB circuit board Effective date of registration: 20211103 Granted publication date: 20200110 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2021330002146 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200110 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2021330002146 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A PCB circuit board Granted publication date: 20200110 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |