CN108982555B - 一种用于无损检测铸铁件内部缺陷的检测设备 - Google Patents
一种用于无损检测铸铁件内部缺陷的检测设备 Download PDFInfo
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- CN108982555B CN108982555B CN201810746001.9A CN201810746001A CN108982555B CN 108982555 B CN108982555 B CN 108982555B CN 201810746001 A CN201810746001 A CN 201810746001A CN 108982555 B CN108982555 B CN 108982555B
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
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CN201810746001.9A CN108982555B (zh) | 2018-07-09 | 2018-07-09 | 一种用于无损检测铸铁件内部缺陷的检测设备 |
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CN201810746001.9A CN108982555B (zh) | 2018-07-09 | 2018-07-09 | 一种用于无损检测铸铁件内部缺陷的检测设备 |
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CN108982555A CN108982555A (zh) | 2018-12-11 |
CN108982555B true CN108982555B (zh) | 2021-03-16 |
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CN110333293B (zh) * | 2019-08-12 | 2021-08-24 | 河海大学常州校区 | 一种正方网格相控超声阵列激发与检测混凝土缺陷的方法 |
CN113363024B (zh) * | 2021-06-02 | 2021-11-16 | 广州市广惠通线缆有限公司 | 一种线缆发泡层充氮控制方法及系统 |
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CN107505341A (zh) * | 2017-09-14 | 2017-12-22 | 中国科学院苏州生物医学工程技术研究所 | 一种基于x射线的led芯片缺陷自动检测设备及方法 |
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JP3729168B2 (ja) * | 2002-09-26 | 2005-12-21 | 株式会社島津製作所 | X線透視装置 |
JP4087286B2 (ja) * | 2003-05-12 | 2008-05-21 | 日本電子株式会社 | 試料保持具及び観察装置並びに試料回転方法 |
DE102009040769A1 (de) * | 2009-09-09 | 2011-03-17 | Siemens Aktiengesellschaft | Vorrichtung und Verfahren zur Untersuchung eines Objektes auf Materialfehler mittels Röntgenstrahlen |
CN108095748A (zh) * | 2018-01-31 | 2018-06-01 | 邦盛医疗装备(天津)股份有限公司 | X射线dr机器人系统及其检测方法 |
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CN107505341A (zh) * | 2017-09-14 | 2017-12-22 | 中国科学院苏州生物医学工程技术研究所 | 一种基于x射线的led芯片缺陷自动检测设备及方法 |
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Inventor after: Xu Kangping Inventor after: Other inventor requests not to publish the name Inventor before: Request for anonymity |
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Effective date of registration: 20210210 Address after: 332000 room 901, unit 1, 109 Dutian lane, Xunyang District, Jiujiang City, Jiangxi Province Applicant after: Xu Kangping Address before: No.013, Fenshui formation, Zishu village, Toutuo Town, Yuexi County, Anqing City, Anhui Province 246600 Applicant before: Wang Peng |
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Effective date of registration: 20210412 Address after: No. 121, Changcheng Road, Jiujiang Development Zone, Jiangxi Province Patentee after: Jiujiang Hengyuan Construction Engineering Quality Inspection Co.,Ltd. Address before: 332000 room 901, unit 1, 109 Dutian lane, Xunyang District, Jiujiang City, Jiangxi Province Patentee before: Xu Kangping |