CN108947522A - 一种超低损耗巨介电常数介质材料及其制备方法 - Google Patents
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Abstract
本发明公开了一种超低损耗巨介电常数介质材料,以TiO2粉体为基料,在此基础上,按化学式(Nd0.5Nb0.5)xTi1‑xO2进行三价Nd3+、五价Nb5+元素共掺杂,其中x=0.005~0.05。先将Nd2O3、Nb2O5和TiO2按摩尔比x/4:x/4:1‑x,其中x=0.005~0.05进行配料,经球磨、烘干、过筛,再进行造粒,压制成坯体,坯体于1400~1450℃烧结,得到超低损耗巨介电常数介质材料。本发明具有介电常数高,损耗低的特性,且工艺简单、重复性好,有利于工业化大规模生产。
Description
技术领域
本发明属于一种以成分为特征的陶瓷组合物,特别涉及一种超低损耗巨介电常数材料及其制备方法。
背景技术
随着器件向小型化方面的发展和对高储能密度存储器件的应用需要,往往是在很小的芯片上集成数以万计的元器件,因此包括电容器在内的元器件微型化和小型化是必然趋势。材料介电常数越大,较小的体积就能够具有超高的电容容量,因而具有巨大的体积优势,大大降低了原材料成本,集成度也得到很大提高。因此,选择超高介电常数材料对于电子电路小型化与微型化、大规模集成电路技术的发展有着十分重要的意义,并促进电能存储设备通过材料的不断创新实现突破,向着更高能量密度的方向发展。对巨介电材料的探索是近年国内外新材料研究领域的一个热点,巨介电常数材料凭借超高介电常数使微型化电容器的制备成为可能,而电容器作为电路中的基本元件,其微型化的实现得以推动电子元器件小型化的发展。因此,具有高介电常数、低介电损耗、优良温度和频率特性的电介质材料的发现与制备被国内外众多学者所关注。
常规材料在介电常数(ε<4000)方面远远不能满足现代通信设备小型化的需求。因此如何突破传统材料的极限,开发具有巨介电常数及其他优良介电性能的新材料体系,研究材料的组分、结构、制备方法、性能与结构的相互影响因素等成为当前亟需解决的课题。
截止至今,被人们广泛研究的巨介材料有基于内阻挡层理论的CaCu3Ti4O12、基于居里峰左移的BaTiO3、SrTiO3基构成的Y5V型巨介电常数电容器介质材料、基于“渗流理论”模型的材料以及基于缺陷-电子偶极子模型(A(4-5n)/3Bn)xTi1-xO2体系等。但CaCu3Ti4O12体系在高温高频下介电性能恶化严重且损耗较高、Y5V型巨介电常数材料因居里峰左移使其工作温区较窄,使其难以得到实际生产应用。基于“渗流理论”制备的巨介材料由于内部存在金属,在实际操作中会导致材料内部金属同外部电极发生扩散,导致器件的损坏使其得以在现实中生产难以得到实际应用。基于“局域电子钉扎效应模型”的(A(4-5n)/3Bn)xTi1-xO2体系具有超高介电常数、低损耗、优异的温度稳定性和频率特性,可望解决当前器件产生信号衰减、发热以及失效等问题,在高储能密度电容器方面显示出巨大的应用潜力。
发明内容
本发明的目的,拓宽(A(4-5n)/3Nbn)xTi1-xO2体系,解决目前巨介电常数材料损耗通常过高的问题,提供一种高性能的超低损耗巨介电常数介质材料。
本发明通过如下技术方案予以实现。
一种超低损耗巨介电常数介质材料,以TiO2粉体为基料,在此基础上,按化学式(Nd0.5Nb0.5)xTi1-xO2进行三价Nd3+、五价Nb5+元素共掺杂,其中x=0.005~0.05。
2.权利要求1的一种超低损耗巨介电常数介质材料的制备方法,具有如下步骤:
(1)将Nd2O3、Nb2O5和TiO2按摩尔比x/4:x/4:1-x,其中x=0.005~0.05进行配料,混合球磨10小时后烘干、过40目分样筛;
(2)将步骤(1)过筛后的粉料,添加7wt%石蜡作为粘结剂,过80目筛进行造粒,再用粉末压片机压制成坯体,坯体于1400~1450℃烧结,得到超低损耗巨介电常数介质材料。
所述步骤(2)的坯体为Ф10×1.5~2.1mm的圆片坯体。
所述步骤(2)的坯体经3.5小时升温至550℃排胶,再经2℃/min升温速率至1400~1450℃烧结,保温10小时。
本发明公开的超低损耗巨介电常数介质材料,相对于现有技术具有介电常数高,损耗低的特性,并且工艺简单、重复性好,利于工业化大规模生产。
具体实施方式
下面结合具体实施例对本发明作进一步的详细描述:
首先,按照摩尔比例(Nd0.5Nb0.5)xTi1-xO2(x=0.005~0.05),用电子天平称量分析纯级(≥99%)的Nd2O3、Nb2O5和TiO2,并进行混合,以去离子水作为球磨介质,球磨10小时后烘干、过40目筛,外加质量百分比为7%的石蜡,过80目分样筛造粒。
再将造粒后的粉料取0.5g~0.8g在4MPa下压制成Ф10×1.5~2.1mm的圆片生坯,经3.5小时升温至550℃排胶,再经15小时升至1400~1450℃烧结(按2℃/min升温速率),保温10小时,制得低损耗、巨介电常数介质材料。
在所得制品上下表面均匀涂覆银浆,经850℃烧渗制备电极,制得待测样品,测试介电性能及TC特性。
本发明的测试方法和检测设备如下:
(1)介电性能测试(交流测试信号:频率为1kHz,电压为1V)
使用HEWLETT PACKARD 4278A型电容量测试仪测试样品的电容量C和损耗tanδ,并计算出样品的介电常数,计算公式为:
(2)TC特性测试
利用GZ-ESPEC MPC-710P型高低温循环温箱、HM27002型电容器C-T/V特性专用测试仪和HEWLETT PACKARD 4278A进行测试。测量样品在温区-55℃~150℃内的电容量,采用下述公式计算电容量变化率:
本发明具体实施例的原料配比详见表1,实施例1~12的不同组分及其介电性能详见表2,其他制作工艺完全相同。
表1
表2
本发明并不局限于上述实施例,很多细节的变化是可能的,但这并不因此违背本发明的范围和精神。
Claims (4)
1.一种超低损耗巨介电常数介质材料,以TiO2粉体为基料,在此基础上,按化学式(Nd0.5Nb0.5)xTi1-xO2进行三价Nd3+、五价Nb5+元素共掺杂,其中x=0.005~0.05。
2.权利要求1的一种超低损耗巨介电常数介质材料的制备方法,具有如下步骤:
(1)将Nd2O3、Nb2O5和TiO2按摩尔比x/4:x/4:1-x,其中x=0.005~0.05进行配料,混合球磨10小时后烘干、过40目分样筛;
(2)将步骤(1)过筛后的粉料,添加7wt%石蜡作为粘结剂,过80目筛进行造粒,再用粉末压片机压制成坯体,坯体于1400~1450℃烧结,得到超低损耗巨介电常数介质材料。
3.根据权利要求2所述的一种超低损耗巨介电常数介质材料的制备方法,其特征在于,所述步骤(2)的坯体为Ф10×1.5~2.1mm的圆片坯体。
4.根据权利要求2所述的一种超低损耗巨介电常数介质材料的制备方法,其特征在于,所述步骤(2)的坯体经3.5小时升温至550℃排胶,再经2℃/min升温速率至1400~1450℃烧结,保温10小时。
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CN104478431A (zh) * | 2014-11-26 | 2015-04-01 | 四川大学 | 具有高介电常数的离子改性二氧化钛陶瓷材料及制备方法 |
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CN107399967A (zh) * | 2017-08-11 | 2017-11-28 | 天津大学 | 一种超低损耗巨介电常数温度稳定型电容器介质材料 |
CN108178626A (zh) * | 2018-01-20 | 2018-06-19 | 陕西科技大学 | 一种低损耗高介电常数x9r陶瓷电容器介质材料及其制备方法 |
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CN103958414A (zh) * | 2011-09-16 | 2014-07-30 | 澳大利亚国立大学 | 巨介电常数材料 |
CN104478431A (zh) * | 2014-11-26 | 2015-04-01 | 四川大学 | 具有高介电常数的离子改性二氧化钛陶瓷材料及制备方法 |
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