CN108925048A - A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole - Google Patents
A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole Download PDFInfo
- Publication number
- CN108925048A CN108925048A CN201810793320.5A CN201810793320A CN108925048A CN 108925048 A CN108925048 A CN 108925048A CN 201810793320 A CN201810793320 A CN 201810793320A CN 108925048 A CN108925048 A CN 108925048A
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- China
- Prior art keywords
- hole
- layers
- production method
- base board
- flexible base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of production method for being avoided that COF flexible base board empty in through-hole, includes the following steps：(1) laser drilling；(2) plated film in hole；(3) filling perforation electro-coppering.The present invention also provides the products that the production method obtains.The present invention can it is radium-shine go out the different through-hole in aperture up and down, to effectively avoid empty in through-hole.
Description
Technical field
The present invention relates to a kind of production methods and products thereof for being avoided that COF flexible base board empty in through-hole.
Background technique
COF (Chip on film, membrane of flip chip technology) is to realize chip by chip attachment on flexible film substrates
The output of I/O is widely used on the electronic product panels such as mobile phone, TV, ipad.The production of COF flexible base board is grasped at present
Technology and the enterprise for having scale of mass production condition all concentrate on South Korea, Japan and TaiWan, China；Domestic individual enterprises have system
The production capacity for making COF flexible base board can be increasingly to the demand of COF flexible base board with the rise of panel industry OLED
Greatly.Domestic enterprise is badly in need of promoting the technical capability of COF flexible base board.High-density line arrangement COF flexible base board in addition to line width/
Except line-spacing develops to 10 μm/10 μm and following fine-line, while demand connects the through-hole of upper and lower copper face also to aperture direction
The through hole filling plating copper technology of development, enterprise of Japan and Korea S COF flexible base board has arrived at 25 μm of aperture rank, and domestic logical at 25 μm
Easily there is in hole empty problem in hole filling perforation copper facing when making, the reason is that the aperture up and down of through-hole is the same, upper layer when leading to copper facing
The phenomenon that hole wall is different with the copper speed of growth of lower layer's hole wall, causes to encase up and down, but intermediate gaps do not grow copper.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of production sides for being avoided that COF flexible base board empty in through-hole
Method, can it is radium-shine go out the different through-hole in aperture up and down, to effectively avoid empty in through-hole.
In order to solve the above technical problems, the technical scheme is that：
A kind of production method being avoided that COF flexible base board empty in through-hole, includes the following steps：
(1) laser drilling：In the upper surface of polyimides middle layer, setting is W metal/Cr layers upper, among polyimides
The lower surface setting of layer is W metal/Cr layers lower, upper layers of copper is arranged in upper W metal/Cr layers of upper surface, at lower W metal/Cr layers
Lower surface lower layers of copper is set substrate is made, on substrate it is radium-shine go out through entire substrate through-hole, it is radium-shine to use impact mode,
Number of shocks is 10-15 times, and the upper aperture of through-hole is 25 μm, and the lower aperture of through-hole is 11-20 μm；
(2) plated film in hole：Conductive film is deposited on the inner walls of the via；
(3) filling perforation electro-coppering：Filling perforation is carried out to the through-hole after step (2) to be electroplated to form copper electroplated layer.
Wherein, occur after the thermal energy of the materials absorption UV laser light such as copper and polyimides of hole site is drilled when laser drilling
It melts, gasify decomposition products, the decomposition products such as gentle slurry form through-hole after being removed.
Preferably, in the step (1), upper W metal/Cr layers, lower W metal/Cr layers of thickness be 20-30nm.
Preferably, in the step (1), upper layers of copper, lower layers of copper thickness be 1 μm.
Preferably, in the step (1), number of shocks is 12 times, and the lower aperture of through-hole is 15 μm.
Preferably, in the step (2), conductive film is carbon film.
Preferably, in the step (3), the ingredient for the liquid medicine that when plating uses includes copper sulphate, sulfuric acid, Cl ion, light
Bright dose.
The present invention also provides the products that the production method obtains.
Compared with prior art, the invention has the advantages that：
The through-hole that it is 25 μm or so that the prior art, which forms upper and lower aperture in laser drilling all, subsequent filling perforation are easy when being electroplated
There is cavity in hole, and laser drilling uses conflicting model in the present invention, produces upper 25 μ of aperture by adjusting the number of impact
The through-hole of 15 μm or so of m and lower aperture, then suitable through hole filling electroplating liquid medicine is cooperated to carry out filling perforation plating, to solve 25
The empty problem of μm aperture through hole filling plating.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, not
Inappropriate limitation of the present invention is constituted, in the accompanying drawings：
Fig. 1 is the structural schematic diagram of step of the present invention (1)；
Fig. 2 is the structural schematic diagram of step of the present invention (3).
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described in detail, herein illustrative examples and explanation of the invention
For explaining the present invention, but it is not as a limitation of the invention.
Embodiment 1
Production is avoided that COF flexible base board empty in through-hole according to the following steps：
(1) laser drilling：In the upper surface of polyimides middle layer 1, upper W metal/Cr layer 2 with a thickness of 20nm is set,
In the lower surface of polyimides middle layer 1, lower W metal/Cr layer 4 with a thickness of 20nm is set, it is upper in upper W metal/Cr layer 2
Surface setting is arranged in lower W metal/Cr layer 4 lower surface and makes with a thickness of 1 μm of lower layers of copper 5 with a thickness of 1 μm of upper layers of copper 3
Radium-shine on substrate to go out to run through the through-hole 6 of entire substrate at substrate, radium-shine to use impact mode, number of shocks is 12 times, through-hole
6 upper aperture is 25 μm, and the lower aperture of through-hole 6 is 15 μm；
(2) plated film in hole：Conductive carbon film is deposited on the inner wall of through-hole 6；
(3) filling perforation electro-coppering：It carries out filling perforation to the through-hole 6 after step (2) to be electroplated to form copper electroplated layer 7, when plating
The ingredient of the liquid medicine used includes copper sulphate, sulfuric acid, Cl ion, brightener.
Embodiment 2
Unlike the first embodiment：In step (1), number of shocks is 10 times, and the lower aperture of through-hole 6 is 11 μm.
Embodiment 3
Unlike the first embodiment：In step (1), number of shocks is 11 times, and the lower aperture of through-hole 6 is 14 μm.
Embodiment 4
Unlike the first embodiment：In step (1), upper W metal/Cr layer 2 and lower W metal/Cr layer 4 thickness are
30nm, number of shocks are 13 times, and the lower aperture of through-hole 6 is 17 μm.
Embodiment 5
Unlike the first embodiment：In step (1), upper W metal/Cr layer 2 and lower W metal/Cr layer 4 with a thickness of
30nm, number of shocks are 15 times, and the lower aperture of through-hole 6 is 20 μm.
The principle of the present invention and effect is only illustrated in above-described embodiment, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (7)
1. a kind of production method for being avoided that COF flexible base board empty in through-hole, it is characterised in that：Include the following steps：
(1) laser drilling：In the upper surface of polyimides middle layer, setting is W metal/Cr layers upper, in polyimides middle layer
Lower surface setting is W metal/Cr layers lower, upper layers of copper is arranged in upper W metal/Cr layers of upper surface, under lower W metal/Cr layers
Surface is arranged lower layers of copper and substrate is made, radium-shine on substrate to go out to run through the through-hole of entire substrate, radium-shine to use impact mode, impact
Number is 10-15 times, and the upper aperture of through-hole is 25 μm, and the lower aperture of through-hole is 11-20 μm；
(2) plated film in hole：Conductive film is deposited on the inner walls of the via；
(3) filling perforation electro-coppering：Filling perforation is carried out to the through-hole after step (2) to be electroplated to form copper electroplated layer.
2. the production method according to claim 1 for being avoided that COF flexible base board empty in through-hole, it is characterised in that：
In the step (1), upper W metal/Cr layers, lower W metal/Cr layers of thickness be 20-30nm.
3. the production method according to claim 2 for being avoided that COF flexible base board empty in through-hole, it is characterised in that：
In the step (1), upper layers of copper, lower layers of copper thickness be 1 μm.
4. the production method according to claim 3 for being avoided that COF flexible base board empty in through-hole, it is characterised in that：
In the step (1), number of shocks is 12 times, and the lower aperture of through-hole is 15 μm.
5. the production method according to claim 4 for being avoided that COF flexible base board empty in through-hole, it is characterised in that：
In the step (2), conductive film is carbon film.
6. the production method according to claim 5 for being avoided that COF flexible base board empty in through-hole, it is characterised in that：
In the step (3), the ingredient for the liquid medicine that when plating uses includes copper sulphate, sulfuric acid, Cl ion, brightener.
7. the product that production method described in -6 any one obtains according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810793320.5A CN108925048A (en) | 2018-07-18 | 2018-07-18 | A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810793320.5A CN108925048A (en) | 2018-07-18 | 2018-07-18 | A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108925048A true CN108925048A (en) | 2018-11-30 |
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ID=64416184
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810793320.5A Pending CN108925048A (en) | 2018-07-18 | 2018-07-18 | A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167286A (en) * | 2019-06-27 | 2019-08-23 | 浪潮商用机器有限公司 | A kind of pcb board hole wall method for processing plating layer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202535641U (en) * | 2011-12-13 | 2012-11-14 | 台湾立体电路股份有限公司 | Three-dimensional curved surface lead through hole and metal layer structure |
| CN104602446A (en) * | 2013-10-30 | 2015-05-06 | 旭德科技股份有限公司 | Substrate structure and manufacturing method thereof |
| CN104703391A (en) * | 2014-06-10 | 2015-06-10 | 上海美维电子有限公司 | Circuit board and production method thereof |
| CN105307423A (en) * | 2015-10-28 | 2016-02-03 | 安捷利电子科技（苏州）有限公司 | Preparation method for HDI rigid-flex PCB interlayer blind hole all-copper filling |
-
2018
- 2018-07-18 CN CN201810793320.5A patent/CN108925048A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202535641U (en) * | 2011-12-13 | 2012-11-14 | 台湾立体电路股份有限公司 | Three-dimensional curved surface lead through hole and metal layer structure |
| CN104602446A (en) * | 2013-10-30 | 2015-05-06 | 旭德科技股份有限公司 | Substrate structure and manufacturing method thereof |
| CN104703391A (en) * | 2014-06-10 | 2015-06-10 | 上海美维电子有限公司 | Circuit board and production method thereof |
| CN105307423A (en) * | 2015-10-28 | 2016-02-03 | 安捷利电子科技（苏州）有限公司 | Preparation method for HDI rigid-flex PCB interlayer blind hole all-copper filling |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167286A (en) * | 2019-06-27 | 2019-08-23 | 浪潮商用机器有限公司 | A kind of pcb board hole wall method for processing plating layer |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181130 |
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| RJ01 | Rejection of invention patent application after publication |