CN108878372B - 挠性散热盖 - Google Patents
挠性散热盖 Download PDFInfo
- Publication number
- CN108878372B CN108878372B CN201810454031.2A CN201810454031A CN108878372B CN 108878372 B CN108878372 B CN 108878372B CN 201810454031 A CN201810454031 A CN 201810454031A CN 108878372 B CN108878372 B CN 108878372B
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- central region
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/593,969 | 2017-05-12 | ||
US15/593,969 US10224262B2 (en) | 2017-05-12 | 2017-05-12 | Flexible heat spreader lid |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108878372A CN108878372A (zh) | 2018-11-23 |
CN108878372B true CN108878372B (zh) | 2022-03-22 |
Family
ID=63962718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810454031.2A Active CN108878372B (zh) | 2017-05-12 | 2018-05-14 | 挠性散热盖 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10224262B2 (zh) |
CN (1) | CN108878372B (zh) |
DE (1) | DE102018207345B4 (zh) |
TW (1) | TWI672777B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018063213A1 (en) * | 2016-09-29 | 2018-04-05 | Intel Corporation | Methods of forming flexure based cooling solutions for package structures |
US11011447B2 (en) * | 2018-08-14 | 2021-05-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor package and method for forming the same |
US10658303B1 (en) * | 2018-11-08 | 2020-05-19 | Nxp Usa, Inc. | High aspect ratio connection for EMI shielding |
US11302600B2 (en) * | 2019-12-18 | 2022-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and manufacturing method thereof |
US11430710B2 (en) | 2020-01-27 | 2022-08-30 | International Business Machines Corporation | Lid/heat spreader having targeted flexibility |
CN114582815B (zh) * | 2022-05-05 | 2022-11-01 | 甬矽电子(宁波)股份有限公司 | 散热盖、封装结构和封装结构制作方法 |
WO2023214468A1 (ja) * | 2022-05-06 | 2023-11-09 | 日本電信電話株式会社 | マルチチップモジュール |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101635284A (zh) * | 2008-07-24 | 2010-01-27 | 环旭电子股份有限公司 | 晶片封装结构 |
CN101930953A (zh) * | 2009-06-25 | 2010-12-29 | 国际商业机器公司 | 半导体器件组件以及散热器组件 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4415025A (en) * | 1981-08-10 | 1983-11-15 | International Business Machines Corporation | Thermal conduction element for semiconductor devices |
US6215180B1 (en) * | 1999-03-17 | 2001-04-10 | First International Computer Inc. | Dual-sided heat dissipating structure for integrated circuit package |
US6882041B1 (en) | 2002-02-05 | 2005-04-19 | Altera Corporation | Thermally enhanced metal capped BGA package |
TWI273680B (en) * | 2003-03-27 | 2007-02-11 | Siliconware Precision Industries Co Ltd | Semiconductor package with embedded heat spreader abstract of the disclosure |
US6906413B2 (en) * | 2003-05-30 | 2005-06-14 | Honeywell International Inc. | Integrated heat spreader lid |
US7271479B2 (en) * | 2004-11-03 | 2007-09-18 | Broadcom Corporation | Flip chip package including a non-planar heat spreader and method of making the same |
US8018072B1 (en) | 2008-12-23 | 2011-09-13 | Amkor Technology, Inc. | Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate |
JP5263895B2 (ja) * | 2010-01-12 | 2013-08-14 | ルネサスエレクトロニクス株式会社 | 半導体装置、及び半導体装置の製造方法 |
JP5633210B2 (ja) | 2010-06-28 | 2014-12-03 | 富士通セミコンダクター株式会社 | 半導体装置 |
US9658000B2 (en) | 2012-02-15 | 2017-05-23 | Abaco Systems, Inc. | Flexible metallic heat connector |
US8736048B2 (en) | 2012-02-16 | 2014-05-27 | International Business Machines Corporation | Flexible heat sink with lateral compliance |
US9041192B2 (en) * | 2012-08-29 | 2015-05-26 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
US9024436B2 (en) * | 2013-06-19 | 2015-05-05 | Broadcom Corporation | Thermal interface material for integrated circuit package |
US9831190B2 (en) * | 2014-01-09 | 2017-11-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device package with warpage control structure |
JP6421050B2 (ja) * | 2015-02-09 | 2018-11-07 | 株式会社ジェイデバイス | 半導体装置 |
-
2017
- 2017-05-12 US US15/593,969 patent/US10224262B2/en active Active
-
2018
- 2018-03-12 TW TW107108259A patent/TWI672777B/zh active
- 2018-05-11 DE DE102018207345.7A patent/DE102018207345B4/de not_active Expired - Fee Related
- 2018-05-14 CN CN201810454031.2A patent/CN108878372B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101635284A (zh) * | 2008-07-24 | 2010-01-27 | 环旭电子股份有限公司 | 晶片封装结构 |
CN101930953A (zh) * | 2009-06-25 | 2010-12-29 | 国际商业机器公司 | 半导体器件组件以及散热器组件 |
Also Published As
Publication number | Publication date |
---|---|
DE102018207345A1 (de) | 2018-11-15 |
US10224262B2 (en) | 2019-03-05 |
US20180331011A1 (en) | 2018-11-15 |
TW201901886A (zh) | 2019-01-01 |
TWI672777B (zh) | 2019-09-21 |
DE102018207345B4 (de) | 2021-02-18 |
CN108878372A (zh) | 2018-11-23 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201010 Address after: Singapore City Applicant after: Marvell Asia Pte. Ltd. Address before: Greater Cayman Islands, British Cayman Islands Applicant before: Kawam International Inc. Effective date of registration: 20201010 Address after: Greater Cayman Islands, British Cayman Islands Applicant after: Kawam International Inc. Address before: Hamilton, Bermuda Applicant before: Marvell International Ltd. Effective date of registration: 20201010 Address after: Hamilton, Bermuda Applicant after: MARVELL INTERNATIONAL Ltd. Address before: Greater Cayman Islands, British Cayman Islands Applicant before: GLOBALFOUNDRIES INC. |
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