CN108848660A - A kind of electromagnetic shielding film and preparation method thereof - Google Patents
A kind of electromagnetic shielding film and preparation method thereof Download PDFInfo
- Publication number
- CN108848660A CN108848660A CN201810780066.5A CN201810780066A CN108848660A CN 108848660 A CN108848660 A CN 108848660A CN 201810780066 A CN201810780066 A CN 201810780066A CN 108848660 A CN108848660 A CN 108848660A
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- conductive layer
- electromagnetic shielding
- shielding film
- layer
- line width
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- 238000002360 preparation method Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 238000004070 electrodeposition Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 4
- -1 Diol ester Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002086 nanomaterial Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A kind of electromagnetic shielding film, including substrate and in the first conductive layer and the second conductive layer of network, first conductive layer is arranged in substrate, second conductive layer is arranged on the first conductive layer, the sheet resistance of second conductive layer less than the first conductive layer sheet resistance, the first conductive layer with a thickness of 1 μm~7 μm；The thickness of second conductive layer is greater than 0 μm, and is less than or equal to 2 μm, and the grid line width of the first conductive layer is 1 μm~4 μm, and the grid line width of the second conductive layer is less than or equal to the grid line width of the first conductive layer.Electromagnetic shielding film of the invention can greatly improve electric conductivity and shield effectiveness.The invention further relates to a kind of production methods of electromagnetic shielding film.
Description
Technical field
The present invention relates to electromangnetic spectrum field, in particular to a kind of electromagnetic shielding film and preparation method thereof.
Background technique
In recent years, along with the fast development of informationized society, equipment associated with information rapidly develops and gradually obtains
To popularizing, the display devices such as various electronic equipments, communication device such as CRT, liquid crystal, EL, PDP, FED are widely used in TV
Machine, PC, station and the guiding on airport are shown, for providing various information.The electromagnetic wave that these electronic equipments generate is dry
It is also more and more serious to disturb (EMI) problem.
Electromagnetic Interference not only will affect the manipulation accuracy of ambient electronics, cause maloperation, but also can be to people
Body health generates adverse effect.Therefore, higher and higher to the requirement of electromagnetic shielding material, in order to adapt to such requirement, people
Have developed various electromagnetic shielding films to shield electromagnetic wave, but effect is undesirable.
Summary of the invention
In view of this, the present invention provides a kind of electromagnetic shielding film, electric conductivity and shield effectiveness can be greatly improved.
A kind of electromagnetic shielding film, including substrate and in the first conductive layer and the second conductive layer of network, first is led
Electric layer is arranged in substrate, and the second conductive layer is arranged on the first conductive layer, and the sheet resistance of the second conductive layer is led less than first
The sheet resistance of electric layer, the first conductive layer with a thickness of 1 μm~7 μm；The thickness of second conductive layer is greater than 0 μm, and is less than or waits
In 2 μm, the grid line width of the first conductive layer is 1 μm~4 μm, and the grid line width of the second conductive layer is less than or equal to the first conductive layer
Grid line width.
In an embodiment of the present invention, above-mentioned substrate includes transparent base layer and insulating layer, and the insulating layer is arranged described
On transparent base layer, the insulating layer is equipped with groove, and the first conductive layer setting is in the groove.
In an embodiment of the present invention, above-mentioned first conductive layer is arranged in such a way that conductive nano slurry is by blade coating
In the groove.
In an embodiment of the present invention, above-mentioned transparent base layer is polyethylene terephthalate or polycarbonate or poly- first
Base methyl acrylate.
In an embodiment of the present invention, above-mentioned second conductive layer is set to the table of first conductive layer by electro-deposition
Face.
In an embodiment of the present invention, above-mentioned first conductive layer is silver or copper；Second conductive layer is nickel or copper.
The present invention also provides a kind of production method of electromagnetic shielding film, the production method of the electromagnetic shielding film is for making
The step of above-mentioned electromagnetic shielding film, the production method of the electromagnetic shielding film includes：
Substrate, and the groove of fabricating patterned on the substrate are provided；
Conductive nano slurry is filled into the groove of the substrate by blade coating mode, and it is conductive to form first after being sintered
Layer, first conductive layer be in network, first conductive layer with a thickness of 1 μm~7 μm, first conductive layer
Grid line width is 1 μm~4 μm；And
The second conductive layer is formed on first conductive layer by electro-deposition mode, wherein the table of second conductive layer
Surface resistance is less than the sheet resistance of first conductive layer, and second conductive layer is in network, second conductive layer
Thickness is greater than 0 μm, and is less than or equal to 2 μm, and the grid line width of second conductive layer is less than or equal to first conductive layer
Grid line width.
In an embodiment of the present invention, the step of above-mentioned production patterned groove includes：
On the insulating layer by die marks, the mold is removed, the groove is formed.
Electromagnetic shielding film of the invention includes substrate and the first conductive layer and the second conductive layer in network, and first
Conductive layer is arranged in substrate, and the second conductive layer is arranged on the first conductive layer, and the sheet resistance of the second conductive layer is less than first
The sheet resistance of conductive layer, the first conductive layer with a thickness of 1 μm~7 μm；The thickness of second conductive layer be greater than 0 μm, and be less than or
Equal to 2 μm, the grid line width of the first conductive layer is 1 μm~4 μm, and the grid line width of the second conductive layer is less than or equal to first and leads
The grid line width of electric layer.Since the sheet resistance of the second conductive layer is less than the sheet resistance of the first conductive layer, i.e. the second conductive layer
Electric conductivity be greater than the first conductive layer electric conductivity, be greatly improved the electric conductivity and shield effectiveness of electromagnetic shielding film.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of electromagnetic shielding film of the invention.
Fig. 2 is the positive structure diagram of electromagnetic shielding film of the invention.
Fig. 3 a to Fig. 3 e is the production process schematic diagram of present invention production electromagnetic shielding film.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to implementation of the invention
Mode is further described.
First embodiment
Fig. 1 is the schematic cross-sectional view of electromagnetic shielding film of the invention.Fig. 2 is facing for electromagnetic shielding film of the invention
Structural schematic diagram.As depicted in figs. 1 and 2, electromagnetic shielding film 10 includes substrate 11, the first conductive layer 14 and the second conductive layer 15.
Substrate 11 includes transparent base layer 12 and insulating layer 13, and insulating layer 13 is arranged on transparent base layer 12, on insulating layer 13
Equipped with groove 101.Transparent base layer 12 for example, polyethylene terephthalate or polycarbonate or polymethyl methacrylate,
But it is not limited thereto.Insulating layer 13 is, for example, glue-line, for example, UV glue-line, and insulating layer 13 is equipped with patterned groove 101,
Groove 101 is formed in the surface imprint of insulating layer 13 for example, by using imprint process, or using photoetching process in insulating layer 13
Surface forms groove 101, can voluntarily select according to actual needs, but be not limited thereto.
First conductive layer 14 is arranged in the groove 101 of insulating layer 13.First conductive layer 14 is starched for example, by using conductive nano
Material is filled into groove 101 by blade coating mode, and forms the first conductive layer 14 after being sintered, and the conductive nano slurry is, for example,
Silver or copper, but be not limited thereto.In the present embodiment, the first conductive layer 14 is network, and the network is, for example,
Regular hexagon, square, irregular shape etc., but be not limited thereto.First conductive layer 14 with a thickness of 1 μm~7 μm, preferably
2μm,3μm, 4μm,5μm,6μm,7μm.The grid line width L1 of first conductive layer 14 is 1 μm~4 μm, preferably 2 μm, 3 μm.
Second conductive layer 15 is arranged on the first conductive layer 14, and the sheet resistance of the second conductive layer 15 is less than the first conductive layer
14 sheet resistance, it is preferable that the sheet resistance of the second conductive layer 15 is less than 1 Ω/sq, therefore the electric conductivity of the second conductive layer 15
The electric conductivity of the first conductive layer 14 can be greater than.The first conductive layer 14 is arranged in using electro-deposition mode in second conductive layer 15
Surface, the metal of deposition are, for example, nickel or copper, according to actual needs can unrestricted choice, but be not limited thereto.Second conductive layer
15 with a thickness of less than 2 μm.The grid line width L2 of second conductive layer 15 will not be dropped less than the grid line width L1 of the first conductive layer 14
The light transmission rate of low electromagnetic shielding film 10.In the present embodiment, the second conductive layer 15 is network, and the network is for example
For regular hexagon, square, irregular shape etc., but it is not limited thereto.
Second conductive layer 15 of electromagnetic shielding film 10 of the invention is continuous metal layer, and the first conductive layer 14 is by nanometer
Particle contact is formed, so that sheet resistance of the sheet resistance of the second conductive layer 15 less than the first conductive layer 14, i.e., second is conductive
The electric conductivity of layer 15 is greater than the electric conductivity of the first conductive layer 14, is greatly improved the electric conductivity and shielding of electromagnetic shielding film 10
Effect.Moreover, the present invention forms the first conductive layer 14 using blade coating mode and forms the second conductive layer using electro-deposition mode
15 production method can effectively improve the producing efficiency of electromagnetic shielding film 10, adapt to large-scale mass production demand.
It is noted that the thickness with a thickness of 1 μm~7 μm and the second conductive layer 15 of the first conductive layer 14 is greater than 0 μm,
And it is less than or equal to 2 μm, available naked eyes are difficult to the route differentiated, and line resistance is low；If thickness is too big, naked eyes easily divide
Distinguish, technology difficulty it is big.Moreover, the grid line width of the first conductive layer 14 is 1 μm~4 μm, the grid line width of the second conductive layer 15 is small
In or equal to the first conductive layer 14 grid line width, available naked eyes are difficult to the route differentiated, and translucent effect is good；If
Line width is too thick, then naked eyes are easily differentiated, translucent effect is poor, technology difficulty is big.
Second embodiment
Fig. 3 a to Fig. 3 e is the production process schematic diagram of present invention production electromagnetic shielding film.A to Fig. 3 e referring to figure 3., this
The production method for further relating to a kind of electromagnetic shielding film is invented, the production method of electromagnetic shielding film is for making above-mentioned electromagnetic shielding
The step of film 10, the production method of the electromagnetic shielding film includes：
Step 1 provides substrate 11, and in substrate 11 fabricating patterned groove 101.In the present embodiment, substrate 11
Including transparent base layer 12 and insulating layer 13, insulating layer 13 is arranged on transparent base layer 12, using imprint process or photoetching process
Patterned groove 101 is formed in the surface imprint of insulating layer 13, as shown in Fig. 3 a, Fig. 3 b and Fig. 3 c.
Conductive nano slurry is filled into the groove 101 of the substrate 11 by step 2 by blade coating mode, and after sintering
The first conductive layer 14 is formed, as shown in Figure 3d.In the present embodiment, the first conductive layer 14 is network, the network
For example, regular hexagon, square, irregular shape etc., but be not limited thereto；First conductive layer 14 with a thickness of 1 μm~7 μm,
Preferably 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm；The grid line width L1 of first conductive layer 14 is 1 μm~4 μm, preferably 2 μm, 3
μm。
Step 3 forms the second conductive layer 15 by electro-deposition mode, wherein the second conductive layer on the first conductive layer 14
15 sheet resistance less than the first conductive layer 14 sheet resistance, as shown in Figure 3 e.In the present embodiment, second conductive layer 15
Sheet resistance is less than 1 Ω/sq；The thickness of second conductive layer 15 is greater than 0 μm, and is less than or equal to 2 μm；Second conductive layer 15
Grid line width L2 is less than or equal to the grid line width L1 of the first conductive layer 14；Second conductive layer 15 is network, the grid
Structure is, for example, regular hexagon, square, irregular shape etc., but is not limited thereto.
The production method of electromagnetic shielding film of the invention uses blade coating mode to form the first conductive layer 14 first, uses later
Electro-deposition mode forms the second conductive layer 15, and the method can effectively improve the producing efficiency of electromagnetic shielding film 10, adapts to big
The mass production demand of scale.
Electromagnetic shielding film 10 of the invention is conductive including substrate 11 and in the first conductive layer 14 and second of network
Layer 15, the first conductive layer 14 are arranged in substrate 11, and the second conductive layer 15 is arranged on the first conductive layer 14, the second conductive layer 15
Sheet resistance less than the first conductive layer 14 sheet resistance, the first conductive layer 14 with a thickness of 1 μm~7 μm；Second conductive layer
15 thickness is greater than 0 μm, and is less than or equal to 2 μm, and the grid line width of the first conductive layer 14 is 1 μm~4 μm, the second conductive layer 15
Grid line width be less than or equal to the first conductive layer 14 grid line width.Since the sheet resistance of the second conductive layer 15 is less than first
The sheet resistance of conductive layer 14, the i.e. electric conductivity of the second conductive layer 15 are greater than the electric conductivity of the first conductive layer 14, can be significantly
Improve the electric conductivity and shield effectiveness of electromagnetic shielding film 10.
Moreover, the second conductive layer 15 is produced on the first conductive layer 14 by the way of electro-deposition, the second conductive layer 15
Grid line width L2 can be controlled according to the time of electro-deposition, will not reduce the light transmittance of electromagnetic shielding film 10.
The present invention is not limited to the specific details in the above embodiment, within the scope of the technical concept of the present invention, can be with
Various simple variants of the technical solution of the present invention are made, these simple variants all belong to the scope of protection of the present invention.Above-mentioned
Each particular technique feature described in specific embodiment can pass through any suitable side in the case of no contradiction
Formula is combined.In order to avoid unnecessary repetition, the invention will not be further described in various possible combinations.
Claims (8)
1. a kind of electromagnetic shielding film, which is characterized in that including substrate (11) and in network the first conductive layer (14) and
Second conductive layer (15), first conductive layer (14) are arranged on the substrate (11), the second conductive layer (15) setting
On first conductive layer (14), the sheet resistance of second conductive layer (15) is less than the table of first conductive layer (14)
Surface resistance, first conductive layer (14) with a thickness of 1 μm~7 μm；The thickness of second conductive layer (15) be greater than 0 μm, and
Less than or equal to 2 μm, the grid line width of first conductive layer (14) is 1 μm~4 μm, the grid of second conductive layer (15)
Line width is less than or equal to the grid line width of first conductive layer (14).
2. electromagnetic shielding film as described in claim 1, which is characterized in that the substrate (11) include transparent base layer (12) and absolutely
Edge layer (13), the insulating layer (13) are arranged on the transparent base layer (12), and the insulating layer (13) is equipped with groove
(101), the first conductive layer (14) setting is in the groove (101).
3. electromagnetic shielding film as claimed in claim 2, which is characterized in that first conductive layer (14) is starched using conductive nano
Material is arranged in the groove (101) by way of blade coating.
4. electromagnetic shielding film as claimed in claim 2, which is characterized in that the transparent base layer (12) is poly terephthalic acid second
Diol ester or polycarbonate or polymethyl methacrylate.
5. electromagnetic shielding film as described in claim 1, which is characterized in that second conductive layer (15) is arranged by electro-deposition
In the surface of first conductive layer (14).
6. the electromagnetic shielding film as described in claim 1 to 5 any one, which is characterized in that first conductive layer (14) is
Silver or copper；Second conductive layer (15) is nickel or copper.
7. a kind of production method of electromagnetic shielding film, which is characterized in that the production method of the electromagnetic shielding film is for making power
The step of benefit requires electromagnetic shielding film described in 1 to 6 any one, the production method of the electromagnetic shielding film include：
There is provided substrate (11), and on the substrate (11) fabricating patterned groove (101)；
Conductive nano slurry is filled into the groove (101) of the substrate (11) by blade coating mode, and forms the after being sintered
One conductive layer (14), first conductive layer (14) be in network, first conductive layer (14) with a thickness of 1 μm~7 μm,
The grid line width of first conductive layer (14) is 1 μm~4 μm；And
The second conductive layer (15) are formed on first conductive layer (14) by electro-deposition mode, wherein second conductive layer
(15) sheet resistance is less than the sheet resistance of first conductive layer (14), and second conductive layer (15) is in network,
The thickness of second conductive layer (15) is greater than 0 μm, and is less than or equal to 2 μm, the grid line width of second conductive layer (15)
Less than or equal to the grid line width of first conductive layer (14).
8. the production method of electromagnetic shielding film as claimed in claim 7, which is characterized in that the production patterned groove
(101) the step of includes：
By die marks on insulating layer (13), the mold is removed, forms the groove (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780066.5A CN108848660B (en) | 2018-07-16 | 2018-07-16 | Electromagnetic shielding film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780066.5A CN108848660B (en) | 2018-07-16 | 2018-07-16 | Electromagnetic shielding film and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN108848660A true CN108848660A (en) | 2018-11-20 |
| CN108848660B CN108848660B (en) | 2024-04-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729706A (en) * | 2019-01-28 | 2019-05-07 | 青岛九维华盾科技研究院有限公司 | A kind of preparation method of high light transmission electromagnetic wave shield film |
| CN110047625A (en) * | 2019-03-06 | 2019-07-23 | 苏州蓝沛光电科技有限公司 | The production method of transparent conductive film structure |
| CN110552000A (en) * | 2019-09-04 | 2019-12-10 | 湖南省凯纳方科技有限公司 | method for manufacturing ultrathin single-sided conductive polymer film |
| CN112105247A (en) * | 2019-06-18 | 2020-12-18 | 昇印光电（昆山）股份有限公司 | Electromagnetic shielding film |
| CN112449566A (en) * | 2019-09-05 | 2021-03-05 | 苏州维业达触控科技有限公司 | Shielding film and manufacturing method thereof |
| CN113792516A (en) * | 2021-08-13 | 2021-12-14 | 深圳市志凌伟业光电有限公司 | Method for optimizing electromagnetic shielding member circuit and electromagnetic shielding member |
| CN113811172A (en) * | 2021-09-28 | 2021-12-17 | 长沙韶光铬版有限公司 | Preparation method of electromagnetic shielding grid and electromagnetic shielding film |
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