CN110552000A - method for manufacturing ultrathin single-sided conductive polymer film - Google Patents
method for manufacturing ultrathin single-sided conductive polymer film Download PDFInfo
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- CN110552000A CN110552000A CN201910832542.8A CN201910832542A CN110552000A CN 110552000 A CN110552000 A CN 110552000A CN 201910832542 A CN201910832542 A CN 201910832542A CN 110552000 A CN110552000 A CN 110552000A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 229920001940 conductive polymer Polymers 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052709 silver Inorganic materials 0.000 claims abstract description 30
- 239000004332 silver Substances 0.000 claims abstract description 30
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000009713 electroplating Methods 0.000 claims abstract description 25
- 229920006254 polymer film Polymers 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- -1 polyphenylene ethylene Polymers 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229920002799 BoPET Polymers 0.000 claims description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- 229920001197 polyacetylene Polymers 0.000 claims description 2
- 229920000767 polyaniline Polymers 0.000 claims description 2
- 229920000128 polypyrrole Polymers 0.000 claims description 2
- 229920000123 polythiophene Polymers 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- RCMPDPZUFZOHKM-BTVCFUMJSA-N (2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanal;sulfuric acid Chemical compound OS(O)(=O)=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O RCMPDPZUFZOHKM-BTVCFUMJSA-N 0.000 description 3
- 244000248349 Citrus limon Species 0.000 description 3
- 235000005979 Citrus limon Nutrition 0.000 description 3
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 3
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 3
- 235000011130 ammonium sulphate Nutrition 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 229910000160 potassium phosphate Inorganic materials 0.000 description 3
- 235000011009 potassium phosphates Nutrition 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- AAMTXHVZOHPPQR-UHFFFAOYSA-N 2-(hydroxymethyl)prop-2-enoic acid Chemical compound OCC(=C)C(O)=O AAMTXHVZOHPPQR-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- 239000004801 Chlorinated PVC Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000015 polydiacetylene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B22F1/0007—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a preparation method of an ultrathin single-sided conductive polymer film. The method comprises the following steps: (1) coating silver-coated copper paste on the surface of the polymer film, drying and curing, and controlling the resistance of the film layer to be 1-50 ohm; (2) and (2) after the step (1) is finished, electroplating copper or nickel on the film layer to obtain the single-sided conductive ultrathin film. The invention firstly coats the silver-coated copper paste on the surface of the polymer film, controls the resistance of the film layer, and then combines with the electroplating of copper or nickel to obtain the single-sided conductive ultrathin film, the thickness of the film layer is less than 10 mu m, the bonding property and the uniformity between the polymer film and the conductive layer are excellent, and the conductivity of the film is excellent.
Description
Technical Field
The invention belongs to the field of conductive films, and particularly relates to a manufacturing method of an ultrathin single-sided conductive polymer film.
Background
As electronic products such as smart phones become thinner and thinner, requirements for electromagnetic shielding materials also become thinner and thinner. The traditional method for manufacturing the conductive film with the thickness of less than 10 micrometers faces challenges, firstly, the magnetron sputtering method is influenced by the temperature of a sputtering area, the film with the thickness of less than 10 micrometers is easy to shrink, deform and wrinkle, and is difficult to directly plate to more than 1 micrometer, otherwise, the cost is high, and the evaporation plating film has the defects of poor bonding property and poor uniformity.
Therefore, there is a need to provide a new preparation method to improve the technical problems existing in the prior art.
Disclosure of Invention
The invention provides a preparation method of an ultrathin single-sided conductive polymer film, which comprises the following steps:
(1) Coating silver-coated copper paste on the surface of the polymer film, drying and curing, and controlling the resistance of the film layer to be 1-50 ohm;
(2) and (2) after the step (1) is finished, electroplating copper or nickel on the film layer to obtain the single-sided conductive ultrathin film.
in the step (1), the polymer film may be made of any one of a PET film, polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene ethylene, and a polydiacetylene conductive polymer film. Further, the thickness of the polymer film is 1-6 μm.
Wherein, in the step (1), the silver-coated copper paste comprises the following components: the silver-coated copper powder comprises an organic carrier and silver-coated copper powder in a mass ratio of 1 (1-1.5), wherein the organic carrier is prepared from saturated polyester resin, vinyl chloride-vinyl acetate copolymer, DBE solvent and silica gel in a weight ratio of 2:15:80: 3. Further, the fineness of the silver-coated copper paste is 10-20 μm.
In the step (1), the drying and curing conditions include: curing at 70-90 deg.c for 10-30 hr.
In step (2), any one of the methods known in the art may be used for the method for electroplating copper or nickel. For example, the method of electroplating copper includes: and (2) putting the polymer film coated with the silver-coated copper paste in the step (1) into a citrate electroplating solution for electrodeposition, wherein the citrate electroplating solution comprises 150g/L of copper sulfate 120-L, 10-25g/L of glucose sulfate, 25-35g/L of potassium phosphate lemon and 35-45g/L of ammonium sulfate. For example, the method of electroplating nickel includes: and (2) putting the polymer film coated with the silver-coated copper paste in the step (1) into an electroplating solution for electrodeposition, wherein the electroplating solution comprises 130-150mg/L of sodium hydroxide, 15-30mg/L of nickel chloride, 40-50mg/L of sodium chloride, 60-70mg/L of phosphorous acid, 30-50mg/L of succinic acid, 80-90mg/L of hydroxymethyl acrylic acid, 120-140mg/L of boric acid and 10-30mg/L of sodium dodecyl benzene sulfonate.
wherein, in the step (2), the thickness of the copper layer or the nickel layer is 0.2-2 μm.
In the step (2), after the copper or nickel electroplating is finished, cleaning the film.
Wherein, in the step (2), the thickness of the single-sided conductive ultrathin film is within 10 μm, for example, the thickness is less than 8 μm, and preferably less than 6 μm.
The invention has the beneficial effects that:
The invention firstly coats the silver-coated copper paste on the surface of the polymer film, controls the resistance of the film layer, and then combines with the electroplating of copper or nickel to obtain the single-sided conductive ultrathin film, the thickness of the film layer is less than 10 mu m, the bonding property and the uniformity between the polymer film and the conductive layer are excellent, and the conductivity of the film is excellent.
Detailed Description
the compounds of the general formula and the preparation and use thereof according to the present invention will be described in further detail with reference to the following examples. It is to be understood that the following examples are only illustrative and explanatory of the present invention and should not be construed as limiting the scope of the present invention. All the technologies realized based on the above-mentioned contents of the present invention are covered in the protection scope of the present invention.
Unless otherwise indicated, the raw materials and reagents used in the following examples are all commercially available products or can be prepared by known methods.
Example 1
The process comprises the following steps:
(1) coating 3 mu m silver-coated copper paste on the surface of the 1.9 mu m PET film; the silver-coated copper paste comprises an organic carrier and silver-coated copper powder in a mass ratio of 1:1.5, wherein the organic carrier is prepared from saturated polyester resin, vinyl chloride-vinyl acetate copolymer resin, DBE solvent and silica gel in a weight ratio of 2:15:80: 3; the fineness of the silver-coated copper paste is 10-20 mu m;
(2) Curing at 80 ℃ for 20h, and measuring the resistance at 40-50 ohm;
(3) after the step (2) is finished, electroplating copper with the thickness of 1 mu m on the film layer to obtain a single-side conductive film with the total thickness of about 6 mu m;
The copper electroplating process comprises the following steps: and (3) putting the polymer film coated with the silver-coated copper paste in the step (2) into a citrate electroplating solution for electrodeposition, wherein the citrate electroplating solution comprises 130g/L of copper sulfate, 15g/L of glucose sulfate, 30g/L of potassium phosphate lemon and 40g/L of ammonium sulfate.
The bonding property and uniformity between the PET film and the copper layer are excellent, and the conductivity of the film is measured by a four-probe method, and is 0.90S/cm.
Example 2
the process comprises the following steps:
(1) Coating 3 mu m silver-coated copper paste on the surface of the 3 mu m polyethylene film; the silver-coated copper paste comprises an organic carrier and silver-coated copper powder in a mass ratio of 1:1.2, wherein the organic carrier is prepared from saturated polyester resin, vinyl chloride-vinyl acetate copolymer resin, DBE solvent and silica gel in a weight ratio of 2:15:80: 3; the fineness of the silver-coated copper paste is 13-18 mu m;
(2) curing for 15h at 90 ℃, and measuring the resistance at 30-35 ohm;
(3) After the step (2) is finished, electroplating nickel of 1 mu m on the film layer to obtain a single-sided conductive film with the total thickness of about 7 mu m;
The process of electroplating nickel: and (3) putting the polymer film coated with the silver-coated copper paste in the step (2) into an electroplating solution for electrodeposition, wherein the electroplating solution comprises 140mg/L of sodium hydroxide, 20mg/L of nickel chloride, 45mg/L of sodium chloride, 60mg/L of phosphorous acid, 40mg/L of succinic acid, 85mg/L of hydroxymethyl acrylic acid, 130mg/L of boric acid and 20mg/L of sodium dodecyl benzene sulfonate.
the binding property and uniformity between the polyethylene film and the nickel layer are excellent, and the conductivity of the film is tested by adopting a four-probe method, and the result is 0.93S/cm.
example 3
The process comprises the following steps:
(1) Coating 2 μm silver-coated copper paste on the surface of 2.5 μm polyphenylene ethylene film; the silver-coated copper paste comprises an organic carrier and silver-coated copper powder in a mass ratio of 1:1, wherein the organic carrier is prepared from saturated polyester resin, vinyl chloride-vinyl acetate copolymer (CPVC), DBE solvent and silica gel in a weight ratio of 2:15:80: 3; the fineness of the silver-coated copper paste is about 15 mu m;
(2) Curing at 75 ℃ for 25h, and measuring the resistance at 30-35 ohm;
(3) After the step (2) is finished, electroplating copper with the thickness of 1 mu m on the film layer to obtain a single-side conductive film with the total thickness of about 5.5 mu m;
the copper electroplating process comprises the following steps: and (3) putting the polymer film coated with the silver-coated copper paste in the step (2) into a citrate electroplating solution for electrodeposition, wherein the citrate electroplating solution comprises 130g/L of copper sulfate, 15g/L of glucose sulfate, 30g/L of potassium phosphate lemon and 40g/L of ammonium sulfate.
The bonding property and uniformity between the polyphenylene ethylene film and the copper layer are excellent, and the conductivity of the film is tested by adopting a four-probe method, and the result is 0.98S/cm.
the embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A preparation method of an ultrathin single-sided conductive polymer film is characterized by comprising the following steps:
(1) Coating silver-coated copper paste on the surface of the polymer film, drying and curing, and controlling the resistance of the film layer to be 1-50 ohm;
(2) and (2) after the step (1) is finished, electroplating copper or nickel on the film layer to obtain the single-sided conductive ultrathin film.
2. The method according to claim 1, wherein in the step (1), the polymer film is made of any one of a PET film, polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene ethylene, and polydiyne conductive polymer film.
3. The production method according to claim 2, wherein the thickness of the polymer film is 1 to 6 μm.
4. the method according to claim 1, wherein in the step (1), the composition of the silver-coated copper paste comprises: the silver-coated copper powder comprises an organic carrier and silver-coated copper powder in a mass ratio of 1 (1-1.5), wherein the organic carrier is prepared from saturated polyester resin, vinyl chloride-vinyl acetate copolymer, DBE solvent and silica gel in a weight ratio of 2:15:80: 3.
5. The production method according to claim 4, wherein the fineness of the silver-coated copper paste is 10 to 20 μm.
6. The method according to claim 1, wherein in the step (1), the drying and curing conditions include: curing at 70-90 deg.c for 10-30 hr.
7. The production method according to claim 1, wherein in the step (2), the thickness of the copper layer or the nickel layer is 0.2 to 2 μm.
8. The method according to claim 2, wherein in the step (2), the thickness of the single-sided conductive ultrathin film is within 10 μm.
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| CN201910832542.8A CN110552000A (en) | 2019-09-04 | 2019-09-04 | method for manufacturing ultrathin single-sided conductive polymer film |
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| CN201910832542.8A CN110552000A (en) | 2019-09-04 | 2019-09-04 | method for manufacturing ultrathin single-sided conductive polymer film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111440550A (en) * | 2020-05-11 | 2020-07-24 | 深圳同兴达科技股份有限公司 | Conductive adhesive tape and preparation method thereof |
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-
2019
- 2019-09-04 CN CN201910832542.8A patent/CN110552000A/en active Pending
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|---|---|---|---|---|
| US4770751A (en) * | 1986-12-30 | 1988-09-13 | Okuno Chemical Industry Co., Ltd. | Method for forming on a nonconductor a shielding layer against electromagnetic radiation |
| CN101565576A (en) * | 2009-06-02 | 2009-10-28 | 彩虹集团公司 | Method for preparing electrically conductive ink |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111440550A (en) * | 2020-05-11 | 2020-07-24 | 深圳同兴达科技股份有限公司 | Conductive adhesive tape and preparation method thereof |
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Application publication date: 20191210 |