JPH0195170A - Conductive paint - Google Patents
Conductive paintInfo
- Publication number
- JPH0195170A JPH0195170A JP25200887A JP25200887A JPH0195170A JP H0195170 A JPH0195170 A JP H0195170A JP 25200887 A JP25200887 A JP 25200887A JP 25200887 A JP25200887 A JP 25200887A JP H0195170 A JPH0195170 A JP H0195170A
- Authority
- JP
- Japan
- Prior art keywords
- metal particles
- diameter
- particle size
- metallic particles
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003973 paint Substances 0.000 title claims abstract description 31
- 239000002923 metal particle Substances 0.000 claims abstract description 59
- 239000002245 particle Substances 0.000 claims abstract description 50
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 229910052709 silver Inorganic materials 0.000 abstract description 6
- 239000004332 silver Substances 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 2
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 2
- 150000002576 ketones Chemical class 0.000 abstract description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 2
- 239000013528 metallic particle Substances 0.000 abstract 5
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、プリント配線材料や帯電防止材料などに利
用される導電性塗料に関し、特に電磁波ンールドが向上
し、高い導電性が得られるようにしたしのである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a conductive paint used for printed wiring materials, antistatic materials, etc. This is Shishino.
［従来の技術］
従来より導電性塗料は、その施工性の容易さから、化学
メツキ、電解メツキあるいはアルミ蒸着や金属箔などの
代替として使用が試みられている。[Prior Art] Conventionally, conductive paints have been used as a substitute for chemical plating, electrolytic plating, aluminum vapor deposition, metal foil, etc. because of their ease of application.
このような導電性塗料は一般に、塗料用樹脂に顔料とし
て導電性の金属粒子を分散させてなるものである。ここ
で、塗料用樹脂としてはアクリル系やウレタン系のもの
が、また金属粒子としては、例えば銀、銅、ニッケル等
からなる球状、樹枝状あるいはフレーク状のものが広く
使用されている。Such conductive paints are generally made by dispersing conductive metal particles as pigments in paint resin. Acrylic and urethane resins are widely used as paint resins, and spherical, dendritic, or flake metal particles made of, for example, silver, copper, nickel, etc. are widely used.
そして、これらの金属粒子相互の接触により導電性が発
現するようになっている。Conductivity is developed by contact between these metal particles.
ここで従来より一般に使用されている金属粒子としては
、２〜２０μｍ程変の平均粒子径を有する金属粒子であ
り、このような金属粒子の粒径分布は例えば第５図に示
すようなものである。そしてこのような金属粒子にあっ
ては、導電性塗料中に分散された場合、第６図に示すよ
うな分散形態をとる。第６図中符号ｌが、上記金属粒子
である。Here, the metal particles commonly used heretofore are metal particles having an average particle size varying from 2 to 20 μm, and the particle size distribution of such metal particles is, for example, as shown in Figure 5. be. When such metal particles are dispersed in a conductive paint, they take a dispersion form as shown in FIG. The symbol l in FIG. 6 is the metal particle.
［発明が解決しようとする問題点］
ところが、従来の導電性塗料にあっては、同一の用途に
用いられている化学メツキ、電解メッキあるいはアルミ
蒸着や金属箔などに比べ、その施工は手軽であるが、そ
の半面、電磁波シールド性能が低く、導電性が不良であ
る問題があった。[Problems to be solved by the invention] However, conventional conductive paints are easier to apply than chemical plating, electrolytic plating, aluminum vapor deposition, metal foil, etc., which are used for the same purpose. However, on the other hand, there were problems with low electromagnetic shielding performance and poor conductivity.
これは、上記従来例の導電性塗料においては、導電性の
発現が金属粒子間の接触点によるものであるが、上述の
ように、この導電性塗料の場合には上記のような粒子径
および粒径分布を有する金属粒子を使用しているため、
第６図に示したように金属粒子同士の接触点数が少なく
なり、高い導電性が得られないためとされている。これ
に対し、化学メツキ、電解メツキあるいはアルミ蒸着や
金属箔などの場合は、その導電性の発現が完全な連続面
によるものであるために、高い導電性が得られるとされ
ている。This is because, in the conventional conductive paint mentioned above, conductivity is due to the contact points between metal particles, but as mentioned above, in the case of this conductive paint, the above particle diameter and Because we use metal particles with a particle size distribution,
This is said to be because the number of contact points between metal particles decreases, as shown in FIG. 6, and high conductivity cannot be obtained. On the other hand, in the case of chemical plating, electrolytic plating, aluminum vapor deposition, metal foil, etc., high conductivity is said to be obtained because the conductivity is achieved through a completely continuous surface.
そこで、この発明は上述の問題点を解消し、電磁波シー
ルドを向上し、高い導電性を得ることができるような導
電性塗料を提供することを目的としている。Therefore, an object of the present invention is to provide a conductive paint that can solve the above-mentioned problems, improve electromagnetic shielding, and provide high conductivity.
［問題点を解決するための手段］
この発明では、平均粒子径が２〜２０μｍである大径金
属粒子と、平均粒子径が０．１〜１７１ｍである小径金
属粒子とを混合してなる混合金属粒子を分散させたこと
をその解決手段とする。[Means for solving the problem] In the present invention, a mixture formed by mixing large-diameter metal particles with an average particle diameter of 2 to 20 μm and small-diameter metal particles with an average particle diameter of 0.1 to 171 m. The solution is to disperse metal particles.
以下この発明の一例を、図面に基いて詳細に説明する。An example of the present invention will be explained in detail below based on the drawings.
第１図は、この発明の導電性塗料に使用される混合金属
粒子の粒径分布の一例を示すグラフであって、特に２つ
のピークを有する粒径分布の一例を示したものである。FIG. 1 is a graph showing an example of the particle size distribution of mixed metal particles used in the conductive paint of the present invention, and particularly shows an example of the particle size distribution having two peaks.
第１図中ピークＡは、主に平均粒子径が２〜２０μｍで
ある大径の金属粒子の粒径分布を示しており、またピー
クＢは、主に平均粒子径が０．１〜１μｍである小径の
金属粒子の粒径分布を示している。そして、これらの大
径金属粒子と小径金属粒子とを混合してなる混合金属粒
子の粒径分布の一例が、第１図に示したように２つのピ
ークを有する粒径分布となる。そして、このような金属
粒子は、導電性塗料とされた際、第２図のような分散形
態を示すものである。第２図中符号１は金属粒子を示し
、ｌａおよびｌｂはそれぞれ大径金属粒子および小径金
属粒子を示す。図より明らかなように、大径の金属粒子
１ａ同士の分散によって形成された空隙部分に、この空
隙部分を埋めるごとく小径の金属粒子１ｂが介入されて
なる分散形態をとっている。In Fig. 1, peak A mainly indicates the particle size distribution of large metal particles with an average particle size of 2 to 20 μm, and peak B mainly shows a particle size distribution of large metal particles with an average particle size of 0.1 to 1 μm. The particle size distribution of certain small-sized metal particles is shown. An example of the particle size distribution of mixed metal particles obtained by mixing these large-diameter metal particles and small-diameter metal particles is a particle size distribution having two peaks, as shown in FIG. When such metal particles are made into a conductive paint, they exhibit a dispersion form as shown in FIG. In FIG. 2, the reference numeral 1 indicates a metal particle, and la and lb indicate a large-diameter metal particle and a small-diameter metal particle, respectively. As is clear from the figure, the dispersion form is such that small-diameter metal particles 1b are interposed to fill the voids formed by the dispersion of large-diameter metal particles 1a.
また、この金属粒子１には、銀、銅、ニッケル等の金属
粉や酸化銀、硝酸銀などが好適に使用され、塗料用樹脂
、溶剤と混合されて、この発明の導電性塗料とされる。Further, metal powders such as silver, copper, and nickel, silver oxide, silver nitrate, and the like are suitably used as the metal particles 1, and are mixed with a paint resin and a solvent to form the conductive paint of the present invention.
ここで、塗料用樹脂としてはアクリル系やウレタン系あ
るいはエチルセルロースやフェノール樹脂などが好適に
使用され、また上記溶剤にはケトン類やベンゼン、トル
エン、塩化エヂレンなどが主に使用されろ。この際の混
合比は、金属粒子４５〜６５重量％、塗料用樹脂５〜１
５重量％、さらに溶剤３０〜４０重量％程シンされるの
が好ましい。Here, as the coating resin, acrylic, urethane, ethyl cellulose, phenol resin, etc. are preferably used, and as the solvent, ketones, benzene, toluene, ethylene chloride, etc. are mainly used. The mixing ratio at this time is 45 to 65% by weight of metal particles and 5 to 1% of paint resin.
It is preferable that the solvent be reduced by 5% by weight, and more preferably by about 30 to 40% by weight.
こうして得られた導電性塗料は、陶磁器、ガラス、合成
樹脂などの板、紙、布などよりなる種々の基板の上にス
ピンコード法、はけ塗りあるいは吹付は等の方法により
塗布され、次いで温度２０〜１５０℃程度の条件により
焼き付けを行って導電性塗膜とされ、使用に供仕られる
。The conductive paint thus obtained is applied onto various substrates made of ceramics, glass, synthetic resin boards, paper, cloth, etc. by a spin cord method, brushing, spraying, etc., and then heated at a temperature. Baking is performed under conditions of approximately 20 to 150°C to form a conductive coating film, which is ready for use.
以上ここでは、導電性塗料中に分散されて使用される金
属粒子か、大径金属粒子と小径金属粒子とを混合してな
る混合金属粒子であって、その粒径分布か特に２つのピ
ークを有する場合について述べたが、この粒径分布につ
いては、上記のように２つのピークを有するものに限ら
れる乙のではない。すなわち、例えば第３図に示したよ
うに、２つのピーク間の谷間が埋まってあたかも平坦状
の１つのピークを持つような粒径分布を有する金属粒子
が用いられても良い。またさらに、大径粒子あるいは小
径粒子が、それ自身２つ以上のピークを有するような粒
径分布を持つ場合には、これらの混合物である金属粒子
は、不可避的に、例えば第４図に示したような３つ以上
のピークを有する粒径分布を示すことがあるが、このよ
うな３つ以上のピークを持つ粒径分布を存する金属粒子
が使用されても、同等支障はない。Above, here, we will discuss metal particles that are used dispersed in a conductive paint, or mixed metal particles that are a mixture of large-diameter metal particles and small-diameter metal particles, and whose particle size distribution has two peaks in particular. However, this particle size distribution is not limited to having two peaks as described above. That is, for example, as shown in FIG. 3, metal particles may be used that have a particle size distribution that fills the valley between two peaks and has one flat peak. Furthermore, if the large-diameter particles or small-diameter particles themselves have a particle size distribution that has two or more peaks, the metal particles that are a mixture of these particles will inevitably have the shape shown in FIG. 4, for example. Although metal particles may exhibit a particle size distribution having three or more peaks, there is no problem even if metal particles having a particle size distribution having three or more peaks are used.
このような導電性塗料にあっては、平均粒子径が２〜２
０μｍである大径金属粒子と、平均粒子径が０．１〜１
μｍである小径金属粒子とを混合してなる混合金属粒子
を分散させたものであるので、これらの金属粒子１間の
接触点数が増加し、このために導電性が良好となり、電
磁波シールド性能も向上する効果がある。In such conductive paint, the average particle size is 2 to 2
Large-diameter metal particles having a diameter of 0 μm and an average particle diameter of 0.1 to 1
Since it is a mixture of mixed metal particles mixed with small-diameter metal particles (μm), the number of contact points between these metal particles 1 increases, resulting in good conductivity and electromagnetic shielding performance. It has an improving effect.
［実施例］
平均粒子径が５μである大径の銀粒子と、平均粒子径が
０．５μｍである小径の銀粒子とを混合して粒径分布が
２つのピークを持つ混合銀粉を作成した。この混合銀粉
と、メタクリル酸メチルエステルとを、それぞれの濃度
が５５重量％、１０重量％となるように、ベンゼン溶媒
中に分散させた。[Example] A mixed silver powder having two peaks in particle size distribution was created by mixing large silver particles with an average particle size of 5 μm and small silver particles with an average particle size of 0.5 μm. . This mixed silver powder and methacrylic acid methyl ester were dispersed in a benzene solvent so that the respective concentrations were 55% by weight and 10% by weight.
こうして得られた導電性塗料を実施例１とした。The conductive paint thus obtained was designated as Example 1.
これに対し、平均粒子径が５μｍであって、その粒径分
布がピークを１つだけ持つような銀粉、および平均粒子
径が０．５μｍであって、その粒径分布がピークを１つ
だけ持つような銀粉を、それぞれ同様にしてメタクリル
酸メチルエステルとともに、ベンゼン溶媒中に分散させ
て導電性塗料を作成し、これをそれぞれ比較例２および
比較例３とした。On the other hand, silver powder has an average particle size of 5 μm and its particle size distribution has only one peak, and silver powder has an average particle size of 0.5 μm and its particle size distribution has only one peak. Conductive paints were prepared by dispersing such silver powders in a benzene solvent together with methacrylic acid methyl ester in the same manner as Comparative Example 2 and Comparative Example 3, respectively.
こうしてなる実施例（１例）および比較例（２例）の導
電性塗料を、それぞれ熱可塑性合成基板上に２０μｍの
厚さに塗布して通・電し、それぞれの導電性を測定した
ところ、以下の表に示すような結果が得られた。The conductive paints of Example (Example 1) and Comparative Example (Example 2) were each applied to a thickness of 20 μm on a thermoplastic synthetic substrate, and the conductivity of each was measured by applying electricity. The results shown in the table below were obtained.
表
表より明らかなように、この発明の実施例では、比較例
（２例）に比べ、電気抵抗が小さく、その導電性が良好
である。これに比べて、大径粒子のみからなる銀粉を用
いた比較例２では、電磁波シールド性能が低く、導電性
も不良であった。また、小径粒子のみからなる銀粉を使
用した比較例３にあっても同様に、高い導電性を得るこ
とはできなかった。As is clear from the table, the examples of the present invention have lower electrical resistance and better conductivity than the comparative examples (2 examples). In comparison, in Comparative Example 2 using silver powder consisting only of large-diameter particles, the electromagnetic shielding performance was low and the conductivity was also poor. Furthermore, even in Comparative Example 3 in which silver powder consisting only of small-diameter particles was used, high conductivity could not be obtained.
［発明の効果］
以上説明したように、この発明の導電性塗料は、平均粒
子径が２〜２０μｍである大径金属粒子と、平均粒子径
が０．１−１μｍである小径金属粒子とを混合してなる
混合金属粒子を分散させたものであるので、金属粒子間
の接触点数が増加するために、電磁波シールド性能が向
上して高い導電性を有する導電性塗料を得ることができ
る効果がある。[Effects of the Invention] As explained above, the conductive paint of the present invention comprises large metal particles having an average particle size of 2 to 20 μm and small metal particles having an average particle size of 0.1 to 1 μm. Since the mixed metal particles are dispersed, the number of contact points between the metal particles increases, which improves the electromagnetic shielding performance and makes it possible to obtain a conductive paint with high conductivity. be.
第１図は、この発明の導電性塗料に使用される金属粒子
の粒径分布の一例を表すグラフであり、第２図は、この
金属粒子の塗膜中での分散形態を示す平面図であり、
第３図および第４図は、それぞれこの発明において使用
される金属粒子の粒径分布の他の２例を示すグラフであ
り、
第５図は、従来の導電性塗料に使用されている金属粒子
の粒径分布の一例を表すグラフであり、第６図は、この
従来の金属粒子の塗膜中での分散形態を示す平面図であ
る。
ｌ・・・・・・金属粒子。
１ａ・・・・・・大径金属粒子、 Ｉｂ・・・・・・
小径金属粒子。FIG. 1 is a graph showing an example of the particle size distribution of metal particles used in the conductive paint of the present invention, and FIG. 2 is a plan view showing the dispersion form of the metal particles in the coating film. 3 and 4 are graphs showing two other examples of the particle size distribution of metal particles used in this invention, respectively, and FIG. 5 is a graph showing two other examples of particle size distribution of metal particles used in the present invention, and 6 is a graph showing an example of the particle size distribution of metal particles, and FIG. 6 is a plan view showing the dispersion form of the conventional metal particles in a coating film. l...Metal particles. 1a... Large diameter metal particles, Ib...
Small diameter metal particles.
Claims (2)
、平均粒子径が０．１〜１μｍである小径金属粒子とを
混合してなる混合金属粒子を分散させたことを特徴とす
る導電性塗料。(1) It is characterized by dispersing mixed metal particles formed by mixing large-diameter metal particles with an average particle diameter of 2 to 20 μm and small-diameter metal particles with an average particle diameter of 0.1 to 1 μm. conductive paint.
することを特徴とする特許請求の範囲第１項記載の導電
性塗料。(2) The conductive paint according to claim 1, wherein the particle size distribution of the mixed metal particles has two peaks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25200887A JPH0195170A (en) | 1987-10-06 | 1987-10-06 | Conductive paint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25200887A JPH0195170A (en) | 1987-10-06 | 1987-10-06 | Conductive paint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195170A true JPH0195170A (en) | 1989-04-13 |
Family
ID=17231286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25200887A Pending JPH0195170A (en) | 1987-10-06 | 1987-10-06 | Conductive paint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195170A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190071A (en) * | 1996-12-20 | 1998-07-21 | Aisin Seiki Co Ltd | Multistage electronic cooling device |
| JP2005203304A (en) * | 2004-01-19 | 2005-07-28 | Hitachi Chem Co Ltd | Mixed conductive powder |
| JP2010056092A (en) * | 2009-11-30 | 2010-03-11 | Hitachi Chem Co Ltd | Mixed conductive powder |
| WO2010109541A1 (en) * | 2009-03-27 | 2010-09-30 | 株式会社日立製作所 | Conductive paste and electronic part equipped with electrode wiring formed from same |
| JP2011204688A (en) * | 2011-06-08 | 2011-10-13 | Hitachi Chem Co Ltd | Mixed conductive powder |
| JP2013168369A (en) * | 2013-02-28 | 2013-08-29 | Hitachi Ltd | Conductive paste and electronic component having electrode wiring line using the same |
| KR20150061580A (en) * | 2013-11-27 | 2015-06-04 | 닛토덴코 가부시키가이샤 | Electro-conductive pressure-sensitive adhesive tape, an electronic member, and a pressure-sensitive adhesive |
| JP2017066407A (en) * | 2013-11-27 | 2017-04-06 | 日東電工株式会社 | Conductive adhesive tape, electronic member and adhesive |
| JPWO2017033374A1 (en) * | 2015-08-24 | 2018-05-24 | パナソニックＩｐマネジメント株式会社 | Conductive paint composition, conductive material, process for producing conductive paint composition, process for producing conductive material |
| JPWO2017033375A1 (en) * | 2015-08-24 | 2018-05-24 | パナソニックＩｐマネジメント株式会社 | Conductive paint composition, conductive material, process for producing conductive paint composition, process for producing conductive material |
| JP2021002446A (en) * | 2019-06-20 | 2021-01-07 | 積水化学工業株式会社 | Electroconductive material, connection structure, and method for manufacturing connection structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62145601A (en) * | 1985-12-19 | 1987-06-29 | 住友ベークライト株式会社 | Conductive resin paste |
-
1987
- 1987-10-06 JP JP25200887A patent/JPH0195170A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62145601A (en) * | 1985-12-19 | 1987-06-29 | 住友ベークライト株式会社 | Conductive resin paste |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190071A (en) * | 1996-12-20 | 1998-07-21 | Aisin Seiki Co Ltd | Multistage electronic cooling device |
| JP2005203304A (en) * | 2004-01-19 | 2005-07-28 | Hitachi Chem Co Ltd | Mixed conductive powder |
| JP5215458B2 (en) * | 2009-03-27 | 2013-06-19 | 株式会社日立製作所 | ELECTRONIC COMPONENT HAVING CONDUCTIVE PASTE AND ELECTRODE WIRING USING THE SAME |
| WO2010109541A1 (en) * | 2009-03-27 | 2010-09-30 | 株式会社日立製作所 | Conductive paste and electronic part equipped with electrode wiring formed from same |
| JPWO2010109541A1 (en) * | 2009-03-27 | 2012-09-20 | 株式会社日立製作所 | ELECTRONIC COMPONENT HAVING CONDUCTIVE PASTE AND ELECTRODE WIRING USING THE SAME |
| US8945436B2 (en) | 2009-03-27 | 2015-02-03 | Hitachi, Ltd. | Conductive paste and electronic part equipped with electrode wiring formed from same |
| DE112009004970B4 (en) * | 2009-03-27 | 2018-05-03 | Hitachi, Ltd. | Conductive paste and electronic component provided with an electrode wiring formed therefrom |
| JP2010056092A (en) * | 2009-11-30 | 2010-03-11 | Hitachi Chem Co Ltd | Mixed conductive powder |
| JP2011204688A (en) * | 2011-06-08 | 2011-10-13 | Hitachi Chem Co Ltd | Mixed conductive powder |
| JP2013168369A (en) * | 2013-02-28 | 2013-08-29 | Hitachi Ltd | Conductive paste and electronic component having electrode wiring line using the same |
| KR20150061580A (en) * | 2013-11-27 | 2015-06-04 | 닛토덴코 가부시키가이샤 | Electro-conductive pressure-sensitive adhesive tape, an electronic member, and a pressure-sensitive adhesive |
| JP2017066407A (en) * | 2013-11-27 | 2017-04-06 | 日東電工株式会社 | Conductive adhesive tape, electronic member and adhesive |
| JPWO2017033374A1 (en) * | 2015-08-24 | 2018-05-24 | パナソニックＩｐマネジメント株式会社 | Conductive paint composition, conductive material, process for producing conductive paint composition, process for producing conductive material |
| JPWO2017033375A1 (en) * | 2015-08-24 | 2018-05-24 | パナソニックＩｐマネジメント株式会社 | Conductive paint composition, conductive material, process for producing conductive paint composition, process for producing conductive material |
| JP2021002446A (en) * | 2019-06-20 | 2021-01-07 | 積水化学工業株式会社 | Electroconductive material, connection structure, and method for manufacturing connection structure |
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