CN208029314U - A kind of electromagnetic shielding film - Google Patents
A kind of electromagnetic shielding film Download PDFInfo
- Publication number
- CN208029314U CN208029314U CN201820506719.6U CN201820506719U CN208029314U CN 208029314 U CN208029314 U CN 208029314U CN 201820506719 U CN201820506719 U CN 201820506719U CN 208029314 U CN208029314 U CN 208029314U
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- Prior art keywords
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- electromagnetic shielding
- shielding film
- conductive
- conductive layer
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 230000006855 networking Effects 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 7
- 238000005234 chemical deposition Methods 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000002002 slurry Substances 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of electromagnetic shielding film comprising insulating layer, conductive layer and metal layer.Insulating layer includes the first side and second side being oppositely arranged.First side, which is concavely provided with, is interconnected into latticed groove.The underfill conductive material of groove forms conductive layer.One layer of metal layer is electroplated on conductive layer.It fills after imprinting and adds electroplated metal layer on the conductive layer of formation, the defects of it is not fine and close to compensate for the metal layers such as traditional chemical deposition, applying conductive slurry curing, leads to hallrcuts, and capability of electromagnetic shielding declines, to promote yield and quality.In addition, also disclosing a kind of preparation method of electromagnetic shielding film.
Description
Technical field
The utility model is related to a kind of electromagnetic shielding field, specially a kind of electromagnetic shielding film.
Background technology
With electronization, information-based high speed development, the volume of electronic product is smaller and smaller, and working frequency is higher and higher,
The electromagnetic radiation supervened is also increasingly stronger；Electromagnetic wave transmits the load that can not be substituted as information in current electronic information technology
The electromagnetic radiation generated in body, with electronics or electrical equipment work is interweaved, and leads to the electromagnetic environment day of human living space
Benefit deteriorates, and has become the fifth-largest dirt of the nature after water pollution, atmosphere pollution, noise pollution and solid waste pollution
Dye source seriously threatens the health or even living safety of the mankind；In addition, the circuit system of high-frequency work is at without electromagnetic shielding
In the case of reason, it is on the one hand highly prone to the interference of extraneous electromagnetic noise, so that normal signal transmission and processing is adversely affected, very
To causing circuit chip to be impacted damage failure by pulse current, it is also on the other hand easy to cause information leakage, jeopardizes information security.
In conclusion carrying out electromagnetic shielding to electronic product has become inexorable trend.
Electromagnetic shielding is to reach decaying and control electromagnetic radiation with sink effect to the reflection of electromagnetic wave using shield
Purpose, generally use shield or curtain coating made of conductive or permeability magnetic material will need the region protected to close
Come, to form electromagnetic isolation to reduce or obstruct electromagnetism wave direction spatial.Therefore, the use of electromagnetic shielding material is recognized
To be to prevent electromagnetic pollution and electromagnetic interference, realize electronic system and installation electromagnetical compatibility most directly effective mode it
One.In recent years, as large-scale application demand is presented in the fast-selling , electricity Ci screened films of the products such as mobile phone, tablet computer.
Metal conducting layer is the major function layer that electromagnetic shielding film realizes electromagnetic wave isolation.It is common to prepare electromagnetic shielding film knot
In also there is mostly the method for metal layer in structure.Such as：
(1) application No. is 201210558375.0 Chinese patents by first using Vacuum Deposition on polyester foam matrix
Mode carries out conductive treatment, reuses chemical deposition and forms continuous metal screen layer；Application No. is
201610828042.3 Chinese patent first keeps insulating basement membrane conductive using the processing mode of ionization, reuses chemical deposition
Form continuous metal layer.Shielded layer preparation process is complex in above-mentioned two patents, and is difficult to obtain thicker shielded layer.
And shielded layer is relatively thin be easy to cause shielding layer surface there are a large amount of defect points, and the bending during use also will produce it is a large amount of micro-
Slight crack declines so as to cause capability of electromagnetic shielding.
(2) application No. is the Chinese patents of 201210443949.X is used as shielding by the way that one layer of copper foil is arranged on the insulating layer
Layer, since commercialization copper foil is thicker, generally higher than 8 μm, direct use can be such that product thickness increases, and it is ultra-thin not meet electronic product
Demand, also result in bending resistance reduction, therefore, which is etched further through to copper foil to obtain extra thin copper foil, should
The thickness of shielding metal leve made from technique is 1~3 μm.Although the moderate shielded layer of thickness can be prepared in the patent,
Preparation section is complex.
(3) application No. is 201710942087.8 Chinese patents is made by slurry curing on the insulating layer at conductive metal
For shielded layer, this is simple for process, but metal is not fine and close after curing, and gently rolls over easily broken, and capability of electromagnetic shielding declines, and process yields are low etc.
Disadvantage.
Utility model content
Based on this, the utility model provides a kind of electromagnetic shielding film, and to solve hallrcuts, capability of electromagnetic shielding, which declines, to be lacked
It falls into.
The utility model provides a kind of technical solution：
A kind of electromagnetic shielding film comprising：
Insulating layer has the first side and second side being oppositely arranged, and the first side is concavely provided with interconnected
At latticed groove；
The underfill conductive material of conductive layer, the groove forms the conductive layer；
Metal layer, plating are set on the conductive layer in the groove.
Preferably, the thickness of the conductive layer is less than the thickness of the metal layer.
Preferably, the total thickness of the conductive layer and metal layer is 1-4 μm.
Preferably, the base is located at the second side for carrying the insulating layer.
Preferably, the electromagnetic shielding film is transparent, and transmitance is more than 80%.
In addition, a kind of preparation method of electromagnetic shielding film is also disclosed in the utility model, include the following steps：
Step S1 forms the insulating layer with latticed groove；
Step S2 fills conductive material in the trench, forms conductive layer；
Step S3 forms electroplated layer on the electrically conductive by electroplating technology.
Preferably, further include step S0, the step S0 is to provide base.
Preferably, the insulating layer of the step S1 formation with latticed groove includes：
One layer of gum polymers are arranged in step S11 in base；
Step S12, using gum polymers described in die marks, the insulating layer with latticed groove after solidification demoulding.
Preferably, the step S2 is specially applying conductive material on the insulating layer, and low-temperature setting is at conductive layer.
Preferably, the step S3 is specially that insulating layer is linked into electroplating bath, the conduction of energization electroplating technology after hardening
Metal layer is formed on layer.
Compared with prior art, the utility model has the beneficial effects that：By electroplated metal layer on the electrically conductive, compensate for
The metal layers such as traditional chemical deposition, applying conductive slurry curing are not fine and close, and hallrcuts, capability of electromagnetic shielding decline etc. is caused to lack
It falls into, to promote yield and quality.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model electromagnetic shielding film；
Fig. 2 is the schematic cross-section of the utility model electromagnetic shielding film；
Fig. 3 a- Fig. 3 d are the flow diagram of the preparation method of the utility model electromagnetic shielding film；
Fig. 4 is the process step figure of the preparation method of the utility model electromagnetic shielding film.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
It please join Fig. 1 to Fig. 4, a kind of electromagnetic shielding film of the utility model announcement includes insulating layer 1, conductive layer 2 and metal layer
3.Insulating layer 1 includes the first side 11 being oppositely arranged and second side 12.First side 11 is concavely provided with interconnected networking
The groove 13 of trellis.The underfill conductive material of groove 13 forms conductive layer 2.One layer of metal layer 3 is electroplated on conductive layer 2.?
Addition electroplated metal layer 3 on the conductive layer 2 of formation is filled after coining, compensates for traditional chemical deposition, applying conductive slurry curing
The defects of equal metal layers are not fine and close, lead to hallrcuts, and capability of electromagnetic shielding declines, to promote yield and quality.
Preferably, the thickness of conductive layer 2 is less than the thickness of metal layer 3.
Preferably, the total thickness of conductive layer 2 and metal layer 3 is 1-4 μm, meets slimming, and bending resistance is good.
Preferably, electromagnetic shielding film is transparent, and transmitance is more than 80%.
Preferably, conductive material includes electrically conductive ink or conductive glue etc..
Preferably, metal layer is the preferable metal layer of electric conductivity such as nickel, chromium, copper, silver, titanium or aluminium, and generally simple metal
Layer.
Preferably, grid spacing range is 0.1-0.5mm, and the line width of grid is less than 5 μm.
Please continue to refer to Fig. 1 and Fig. 2, electromagnetic shielding film further includes base 4, and base 4 is located at second side 12 for carrying
Insulating layer 1.Base 4 is preferably that optical grade fexible film does carrier layer, and there are commonly PET, PC, PMMA etc..
The electromagnetic shielding film of the utility model has the following effects that：
1) metal layer is set on conductive layer, keeps electromagnetic shielding film electric conductivity excellent, sheet resistance is extremely low, can accomplish 0.1 Ou Fang
It is suitble to large scale below, to have a wide range of application；
2) grid spacing 0.1-0.5mm, line width can accomplish 5 μm hereinafter, to which transmitance is more than 80% or more, can accomplish
Similar transparent；
3) efficient, energization electroplating time is generally within 2 minutes；
4) yield is high, and a yield is suitble to large-scale production up to 98% or more.
Such as Fig. 4, the utility model also discloses a kind of preparation method of electromagnetic shielding film, includes the following steps：
Step S1 forms the insulating layer 1 with latticed groove；
Step S2 fills conductive material in the trench, forms conductive layer；
Step S3 forms electroplated layer on the electrically conductive by electroplating technology.
Coining filling uses electroplating technology after forming conductive layer, makes to increase one layer of metal layer on original conductive layer, except to leading
Electric line plays a protective role accident, improves electrical property, reduces sheet resistance, and bending is excellent, and yield is high.
Preferably, before step S1 further include step S0, step S0 is to provide base.Step S0 further includes layout and opens
Mould forms and has figuratum imprint mold.
Preferably, insulating layer of the step S1 formation with latticed groove includes：
One layer of gum polymers are arranged in step S11 in base.Preferably, it is that heat curing copolymer or photocuring polymerize
Object, such as UV glue.
Step S12, using die marks gum polymers, the insulating layer with latticed groove after solidification demoulding.Pass through
Pattern on mold is transferred on insulating layer by this step.For example use ultraviolet curing.
Preferably, step S2 is specially applying conductive material on the insulating layer, and low-temperature setting is at conductive layer.
Preferably, step S3 is specially that insulating layer is linked into electroplating bath, on the conductive layer of energization electroplating technology after hardening
Form metal layer.
Preferably, conductive material includes electrically conductive ink or conductive glue etc..
Preferably, metal layer is the pure metal layers such as nickel, chromium, copper, silver, titanium or aluminium.
Preferably, grid spacing range is 0.1-0.5mm, and the line width of grid is less than 5 μm.
Preferably, electroplating time was generally limited within 2 minutes.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing in the equivalent requirements of the claims will be fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (5)
1. a kind of electromagnetic shielding film, which is characterized in that it includes：
There is insulating layer the first side and second side being oppositely arranged, the first side to be concavely provided with interconnected networking
The groove of trellis；
The underfill conductive material of conductive layer, the groove forms the conductive layer；
Metal layer, plating are set on the conductive layer in the groove.
2. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the conductive layer is less than the metal layer
Thickness.
3. electromagnetic shielding film according to claim 2, which is characterized in that the total thickness of the conductive layer and metal layer
It is 1-4 μm.
4. electromagnetic shielding film according to claim 1 or 2 or 3, which is characterized in that the electromagnetic shielding film further includes base
Layer, the base are located at the second side for carrying the insulating layer.
5. electromagnetic shielding film according to claim 4, which is characterized in that the electromagnetic shielding film is transparent, and is penetrated
Rate is more than 80%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820506719.6U CN208029314U (en) | 2018-04-11 | 2018-04-11 | A kind of electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820506719.6U CN208029314U (en) | 2018-04-11 | 2018-04-11 | A kind of electromagnetic shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208029314U true CN208029314U (en) | 2018-10-30 |
Family
ID=63909591
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820506719.6U Expired - Fee Related CN208029314U (en) | 2018-04-11 | 2018-04-11 | A kind of electromagnetic shielding film |
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| Country | Link |
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| CN109743872A (en) * | 2018-11-06 | 2019-05-10 | 睿惢思工业科技（苏州）有限公司 | A kind of preparation method of electromagnetic shielding film |
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