CN103889198A - Shielding case and manufacturing method thereof - Google Patents
Shielding case and manufacturing method thereof Download PDFInfo
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- CN103889198A CN103889198A CN201410151314.1A CN201410151314A CN103889198A CN 103889198 A CN103889198 A CN 103889198A CN 201410151314 A CN201410151314 A CN 201410151314A CN 103889198 A CN103889198 A CN 103889198A
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Abstract
The invention discloses a shielding case and a manufacturing method of the shielding case. The shielding case comprises an insulating case body and a metal conducting layer arranged on the outer side of the insulating case body. The thickness of the metal conducting layer is 0.001mm-0.003mm. The shielding case and the manufacturing method of the shielding case have the advantages that the shielding case is formed by arranging the metal conducting layer on the insulating case body, the structure is light and simple, working procedures are simple, processing efficiency is high, and assembly cost is low.
Description
Technical field
The present invention relates to electromangnetic spectrum, relate in particular to a kind of radome and preparation method thereof.
Background technology
At electronic manufacturing field, radome is with a wide range of applications, and is mainly used in the field such as mobile phone, GPS (navigation system).Use radome that the interference source of electronic unit, circuit, sub-assembly, electric wire or the whole systems such as the element on pcb board (printed circuit board (PCB)) and LCM (Liquid Crystal Module) is surrounded, prevent that interfere with electromagnetic field is to outdiffusion, prevent that they are subject to the impact of external electromagnetic field simultaneously, thereby realize the object of anti-electromagnetic interference.The material of existing radome completes according to metal material processing such as the stainless steel of the unusual employing different-thickness of use occasion, foreign copper-nickel alloy, nickel-clad steel plates.When installation, be welded direct on pcb board with SMT (surface installation technique).
Existing radome product all adopts metal material manufacture, and the price of material own is very high.Moreover, owing to being metal material, so existing radome product is all the metal stamping processing of carrying out Simulation Based On Multi-step with high-precision metal stamping die on punch press, needs high progress and large-tonnage punch press and high-precision metal stepping punching mould to carry out the punch process of Simulation Based On Multi-step.The cost that the cost of mould and mould are safeguarded is also very high, especially needs less product for product quantity, and only the overhead cost of mould is just very high.And existing radome is in use, be generally that the leg metal welding technique of radome product is welded on outside the parts that need protection, on pcb board, complex procedures, assembly cost is high.
Summary of the invention
One or more for what address the above problem, provide a kind of simple in structure, radome that production process is easy and preparation method thereof.
According to an aspect of the present invention, provide a kind of radome, comprise insulation cover body and be arranged on the metal conducting layer in the external side of insulating cover, the thickness of metal conducting layer is 0.001～0.003 millimeter.Its beneficial effect is: obtain radome by metal conducting layer being set on insulation cover body, have structure merrily and lightheartedly simple, operation is easy, the beneficial effect that working (machining) efficiency is high and assembly cost is low.
In some embodiments, the material of insulation cover body is PS or PC.Its beneficial effect is: the insulation cover body of PS or PC material has good stability and sanction property.
In some embodiments, the thickness of insulation cover body is 0.3～1.6 millimeter.Its beneficial effect is: the insulating cover weight of this thickness can reach good support strength when alleviating, also has the material of saving, cost-saving beneficial effect simultaneously.
In some embodiments, metal conducting layer comprises the first metal layer, the second metal level and the 3rd metal level, the first metal layer is nickel dam, the second metal level is copper layer, the 3rd metal level is silver layer or 18K gold layer, metal level is overlying in the external side of insulating cover, and the second metal level is overlying on the first metal layer, and the 3rd metal level is overlying on the second metal level.Its beneficial effect is: the metal conducting layer of three-decker has good spreadability, such as, while being covered with separately one deck nickel dam, may there is desultory situation, now covering the second metal level is thereon the continuity that copper layer just can increase metal conducting layer, in order to there is better conductive effect, can also on copper layer, be covered with 18k gold layer or silver layer, the product obtaining can shield electromagnetism effectively.
According to another aspect of the present invention, provide a kind of preparation method of radome, comprise the following steps:
The body formed step of insulating cover: insulation board is formed to insulation cover body by the mode of thermoforming;
Metal conducting layer forms step: on the outside of insulation cover body, cover metal conducting layer.
Its beneficial effect is: insulation board is prepared to insulation cover body by the mode of thermoforming, can change the metal material that conventional shields product uses and add the metal stamping technique adopting man-hour, simultaneously original cost is low, processing technology is simple and easy to control, die cost and low processing cost, the product obtaining can shield electromagnetism effectively.
In some embodiments, insulation cover body adopts PS plate or PC plate by the moulding of vacuum suction moulding mode.Its beneficial effect is: method of the present invention directly adopts vacuum suction moulding method that PS plate or PC plate are made to insulation cover body, it is merrily and lightheartedly simple that the numerous and diverse preparation technology who compares metallic shield has structure, operation is easy, the beneficial effect that working (machining) efficiency is high and with low cost, the product obtaining can shield electromagnetism effectively.
In some embodiments, metal conducting layer comprises the first metal layer, the second metal level and the 3rd metal level, the first metal layer is nickel dam, the second metal level is copper layer, the 3rd metal level is silver layer or 18K gold layer, the first metal layer is overlying in the external side of insulating cover by the mode of vacuum magnetic-control sputtering, and the second metal level is overlying on described the first metal layer by the mode of electroplating, and the 3rd metal level is overlying on the second metal level by the mode of electroplating.Its beneficial effect is: the first metal layer is overlying in the external side of insulating cover and can be made nickel dam be attached to more securely on insulation cover body by the mode of vacuum magnetic-control sputtering, in addition, because copper layer, silver layer or 18K gold layer have good activity, can make the process of preparation simplify by the mode of electroplating, the coating ability of rete is better.
In some embodiments, the thickness of insulation cover body is 0.3～1.6 millimeter, and the thickness of metal conducting layer is 0.001～0.003 millimeter.Its beneficial effect is: the insulating cover weight of this thickness can reach good support strength when alleviating, also has the material of saving, cost-saving beneficial effect simultaneously.
In some embodiments, vacuum suction moulding mode comprises the following steps:
1) PS plate or PC plate are heated to soft state;
2) make under external force the PS plate of soft state or PC plate be close to die face;
3) after cooling and shaping trimming finishing, make insulation cover body.
Its beneficial effect is: method of the present invention directly adopts vacuum suction moulding method that PS plate or PC plate are made to insulation cover body, it is merrily and lightheartedly simple that the numerous and diverse preparation technology who compares metallic shield has structure, operation is easy, the beneficial effect that working (machining) efficiency is high and with low cost, the product obtaining can shield electromagnetism effectively.
In some embodiments, abovementioned steps 1) in heating-up temperature be 60～130 ℃, insulation 10～15 seconds after PS plate or PC plate are softening; Abovementioned steps 2) in external force be pull of vacuum; Pull of vacuum size is 0.8～1.5 MPa, and the pumpdown time is 1～3 second; Abovementioned steps 3) in cooling and shaping mode be water-cooled.Its beneficial effect is: PS plate or PC plate when heating-up temperature is 60～130 ℃ have good mouldability, and easier modification under the effect of pull of vacuum, makes manufacturing procedure simpler.
Accompanying drawing explanation
Fig. 1 is the cross section structure schematic diagram of the radome of an embodiment of the present invention;
Fig. 2 is the structural representation of the mould that shown in Fig. 1, radome matches;
Fig. 3 is the structural representation after the mould matched moulds in Fig. 2.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further detailed explanation.
With reference to Fig. 1, the invention provides a kind of radome, comprise insulation cover body 1 and be arranged on the metal conducting layer 2 on insulation cover body 1 outside, the thickness of metal conducting layer 2 is 0.001～0.003 millimeter.The material of its insulation cover body 1 is PS or PC.The thickness of insulation cover body 1 is 0.3～1.6 millimeter.Metal conducting layer 2 comprises the first metal layer 201, the second metal level 202 and the 3rd metal level 203, the first metal layer 201 is nickel dam, the second metal level 202 is copper layer, the 3rd metal level 203 is silver layer or 18K gold layer, the first metal layer 201 is overlying on insulation cover body 1 outside, the second metal level 202 is overlying on the first metal layer 201, and the 3rd metal level 203 is overlying on the second metal level 202.Its beneficial effect is: the metal conducting layer 2 of three-decker has good spreadability and adhesiveness, such as, while coating, may there is desultory situation in nickel dam, now being covered with the second metal level 202 is thereon the continuity that copper layer just can increase metal conducting layer 2, in order to there is better conductive effect, can also on copper layer, be covered with 18k gold layer or silver layer, the product obtaining can shield electromagnetism effectively.
With reference to Fig. 2 and Fig. 3, the invention provides a kind of preparation method of radome, first adopt the mode of thermoforming, can adopt the mode of vacuum suction moulding to prepare the insulation cover body of radome.Specific as follows:
Prepare the mould for the preparation of insulation cover body 1, the male model 4 that this mould comprises a master mold 3 and matches with this master mold 3, master mold 3 is provided with die cavity 302, die cavity 302 belows are provided with two through holes 301, for being connected with vacuum absorption device (not shown), male model 4 is provided with the protuberance 401 matching with this die cavity 302.Be that PS plate or PC plate are close to and are placed on master mold 3 and heating by insulating sheet material 5, heating-up temperature is 60～130 degree, after making PS plate or PC plate become soft state, be incubated 10～15 seconds, then two through holes 301 of master mold 3 die cavity 302 belows are vacuumized, the PS plate of soft state or PC plate are along with the agency part of pull of vacuum is close in the profile in die cavity 302, the size of pull of vacuum can be 0.8～1.5 MPa, the time vacuumizing can be 1～3 second, subsequently male model 4 and the master mold 3 that is equipped with PS plate or PC plate are carried out to matched moulds and adopt water-cooling pattern to carry out cooling and shaping, as shown in Figure 3.After mold cools down, again male model 4 and master mold 3 are carried out to die sinking, take out the first product of the insulation cover body 1 of moulding, then it is carried out to trimming and repair the cover body 1 that obtains insulating, the thickness of insulation cover body 1 is 0.3～1.6 millimeter.
Utilize vacuum magnetic-control sputtering machine to plate one deck nickel dam in the outside of aforementioned dielectric cover body 1, poor continuity during due to nickel dam plating, so plate layer of copper layer by plating mode on nickel dam, on copper layer, plate one deck silver layer or 18K gold layer by the mode of electroplating, this three-layer metal layer forms the metal conducting layer 2 of radome, and thickness is 0.001～0.003 millimeter.
Utilize preparation method of the present invention to prepare radome, manufacturing processes is simple, has improved production efficiency, with low cost, and the product obtaining has good electromagnetic wave shielding.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (10)
1. radome, it is characterized in that, comprise insulation cover body (1) and be arranged on the metal conducting layer (2) on described insulation cover body (1) outside, the thickness of described metal conducting layer (2) is 0.001～0.003 millimeter.
2. radome according to claim 1, is characterized in that, the material of described insulation cover body (1) is PS or PC.
3. radome according to claim 2, is characterized in that, the thickness of described insulation cover body (1) is 0.3～1.6 millimeter.
4. radome according to claim 1, it is characterized in that, described metal conducting layer (2) comprises the first metal layer (201), the second metal level (202) and the 3rd metal level (203), described the first metal layer (201) is nickel dam, described the second metal level (202) is copper layer, described the 3rd metal level (203) is silver layer or 18K gold layer, described the first metal layer (201) is overlying on described insulation cover body (1) outside, described the second metal level (202) is overlying on described the first metal layer (201), described the 3rd metal level (203) is overlying on described the second metal level (202).
5. the preparation method of radome, is characterized in that, comprises the following steps:
Insulation cover body (1) forming step: insulating sheet material (5) is formed to insulation cover body (1) by the mode of thermoforming;
Metal conducting layer (2) forms step: on the outside of described insulation cover body (1), cover metal conducting layer (2).
6. the preparation method of radome according to claim 5, is characterized in that, described insulation cover body (1) adopts PS plate or PC plate by the moulding of vacuum suction moulding mode.
7. the preparation method of radome according to claim 6, it is characterized in that, described metal conducting layer (2) comprises the first metal layer (201), the second metal level (202) and the 3rd metal level (203), described the first metal layer (201) is nickel dam, described the second metal level (202) is copper layer, described the 3rd metal level (203) is silver layer or 18K gold layer, described the first metal layer (201) is overlying on described insulation cover body (1) outside by the mode of vacuum magnetic-control sputtering, described the second metal level (202) is overlying on described the first metal layer (201) by the mode of electroplating, described the 3rd metal level (203) is overlying on described the second metal level (202) by the mode of electroplating.
8. the preparation method of radome according to claim 6, is characterized in that, the thickness of described insulation cover body (1) is 0.3～1.6 millimeter, and the thickness of metal conducting layer (2) is 0.001～0.003 millimeter.
9. according to the preparation method of the radome described in claim 5 to 8 any one, it is characterized in that, described vacuum suction moulding mode comprises the following steps:
1) PS plate or PC plate are heated to soft state;
2) make under external force the PS plate of soft state or PC plate be close to die face;
3) after cooling and shaping trimming finishing, make insulation cover body (1).
10. the preparation method of radome according to claim 9, is characterized in that,
Described step 1) in heating-up temperature be 60～130 ℃, insulation 10～15 seconds after described PS plate or PC plate are softening;
Described step 2) in external force be pull of vacuum; Pull of vacuum size is 0.8～1.5 MPa, and the pumpdown time is 1～3 second;
Described step 3) in cooling and shaping mode be water-cooled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410151314.1A CN103889198A (en) | 2014-04-16 | 2014-04-16 | Shielding case and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410151314.1A CN103889198A (en) | 2014-04-16 | 2014-04-16 | Shielding case and manufacturing method thereof |
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| CN103889198A true CN103889198A (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410151314.1A Pending CN103889198A (en) | 2014-04-16 | 2014-04-16 | Shielding case and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105823445A (en) * | 2016-05-26 | 2016-08-03 | 马鞍山恒瑞测量设备有限公司 | X-ray thickness gauge probe |
| CN106793730A (en) * | 2016-12-28 | 2017-05-31 | 深圳天珑无线科技有限公司 | A kind of mobile phone composite shielding lid and preparation method |
| CN107018648A (en) * | 2017-06-02 | 2017-08-04 | 深圳天珑无线科技有限公司 | Radome and preparation method thereof, electronic installation |
| CN107329032A (en) * | 2017-07-20 | 2017-11-07 | 北京送变电公司 | Arrester direct current leakage test device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233387A (en) * | 1996-08-18 | 1999-10-27 | 赫尔穆特·卡尔 | Process for shielding an electric or electronic circuit and shielding cap |
| US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
| CN1810068A (en) * | 2003-06-19 | 2006-07-26 | 波零公司 | EMI absorbing shielding for a printed circuit board |
| CN201729673U (en) * | 2010-04-26 | 2011-02-02 | 徐永明 | Combined plastic sewage processing pond |
| CN204119719U (en) * | 2014-04-16 | 2015-01-21 | 曾芳勤 | Radome |
-
2014
- 2014-04-16 CN CN201410151314.1A patent/CN103889198A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233387A (en) * | 1996-08-18 | 1999-10-27 | 赫尔穆特·卡尔 | Process for shielding an electric or electronic circuit and shielding cap |
| US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
| CN1810068A (en) * | 2003-06-19 | 2006-07-26 | 波零公司 | EMI absorbing shielding for a printed circuit board |
| CN201729673U (en) * | 2010-04-26 | 2011-02-02 | 徐永明 | Combined plastic sewage processing pond |
| CN204119719U (en) * | 2014-04-16 | 2015-01-21 | 曾芳勤 | Radome |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105823445A (en) * | 2016-05-26 | 2016-08-03 | 马鞍山恒瑞测量设备有限公司 | X-ray thickness gauge probe |
| CN105823445B (en) * | 2016-05-26 | 2018-04-10 | 马鞍山恒瑞测量设备有限公司 | A kind of X-ray ga(u)ging instrument probe |
| CN106793730A (en) * | 2016-12-28 | 2017-05-31 | 深圳天珑无线科技有限公司 | A kind of mobile phone composite shielding lid and preparation method |
| CN107018648A (en) * | 2017-06-02 | 2017-08-04 | 深圳天珑无线科技有限公司 | Radome and preparation method thereof, electronic installation |
| CN107329032A (en) * | 2017-07-20 | 2017-11-07 | 北京送变电公司 | Arrester direct current leakage test device |
| CN107329032B (en) * | 2017-07-20 | 2019-09-17 | 北京送变电公司 | Arrester direct current leakage test device |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170413 Address after: 215000 Jiangsu city of Suzhou province Xiangcheng District Town Road No. 2988 yellow too Applicant after: Leader technology (Suzhou) Co., Ltd. Address before: Changping Road Suzhou city Jiangsu province 215000 Xiangcheng District Huang Tai town No. 8 Applicant before: Zeng Fangqin |
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Application publication date: 20140625 |
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