CN106168867A - Capacitance plate and preparation method thereof - Google Patents
Capacitance plate and preparation method thereof Download PDFInfo
- Publication number
- CN106168867A CN106168867A CN201610578836.9A CN201610578836A CN106168867A CN 106168867 A CN106168867 A CN 106168867A CN 201610578836 A CN201610578836 A CN 201610578836A CN 106168867 A CN106168867 A CN 106168867A
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- China
- Prior art keywords
- capacitance plate
- metal conducting
- conducting layer
- viewing area
- layer
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a kind of capacitance plate and preparation method thereof, by arranging the ITO layer that surface is metal conducting layer on the transparent substrate, metal conducting layer and ITO layer are carried out chemical etching and forms viewing area and the periphery routing region thereof of capacitance plate, and further periphery routing region is carried out laser-induced thermal etching, form touch-control sensing circuit.By the way, the present invention can effectively reduce the space shared by capacitance plate touch-control sensing circuit, improves the screen accounting of product, so that product realizes the appearance of narrow frame, and also is effectively improved process rate and the technology stability of product.
Description
Technical field
The present invention relates to the production technical field of capacitance touch screen, particularly relate to a kind of capacitance plate and preparation method thereof.
Background technology
With the growing maturation of electronic product, the range of application of touch screen progressively expands, and its manufacturing technology is also
Present multiformity.The most common capacitive touch screen structure has, with G+G (glass is to glass capacitive formula touch screen), OGS
(glass is to double-deck mantle capacitive touch for (monolithic glass capacitive touch screen), GF (glass is to mantle capacitive touch screen), GFF
Touch screen) etc. for the external hanging type capacitance plate of representative, and with On cell (touch panel function be embedded into colored filter substrate and
Between Polarizer), In cell (touch panel function is embedded in liquid crystal pixel) be the embedded capacitance screen of representative.At product
While performance promotes steadily, product size is also done bigger and bigger, improves constantly the screen accounting of product, reduces cover plate BM (black as far as possible
Matrix) district's area, improves viewing area area and becomes the target that industry personnel constantly pursues.
Traditional product is mainly made by following two method:
First method is, prints on pure ITO (tin indium oxide) conducting film be etched VA (viewing area) figure layer
Brush silver slurry, has etched periphery touch-control sensing circuit by laser technology.But, owing to the thickness of printing silver slurry is wayward,
And in process of production because of processing number of times increase cause silver slurry diluent volatilization thus viscosity increase, silver slurry granule uniform
Property, dustfree environment is to reasons such as line influence are big so that the processing procedure of capacitance plate becomes more meticulous the bigger difficulty of existence, produces yield relatively
Low.
Second method is, uses metal ITO conducting film as the conducting film of capacitance plate, is completed by a chemical etching
VA district pattern and periphery cabling, then remove the metal in VA district by second etch, retains the ITO in VA district as conduction sensing
Layer.This processing procedure is plated on the ito layer by vacuum splashing and plating technique due to metal level, and metal level exists small transmission district, just
Often visual inspection cannot be got rid of, and transmission district, through a metal etch and an ITO etching, is susceptible to lateral erosion, causes transmission
District significantly increases, and causes touch-control sensing circuit to break, and impact produces yield, brings unstability to processing procedure.
Summary of the invention
In view of this, the present invention provides a kind of capacitance plate and preparation method thereof, can improve process rate and the work of product
Skill stability,.
An aspect of of the present present invention provides the preparation method of a kind of capacitance plate, including:
One transparency carrier is provided；
Form ITO layer on the transparent substrate；
Form metal conducting layer on the ito layer；
ITO layer and metal conducting layer are etched, to form viewing area and the periphery cabling being positioned at outside viewing area
Region；
Periphery routing region is carried out laser-induced thermal etching, to form touch-control sensing circuit.
Wherein, after the step be etched ITO layer and metal conducting layer, method farther includes:
Viewing area is carried out metal etch, for etching away the metal conducting layer in viewing area.
Wherein, the step being etched ITO layer and metal conducting layer includes:
ITO layer and metal conducting layer are carried out chemical etching.
Wherein, the width of touch-control sensing circuit is 20 μm, and the distance of touch-control sensing circuit is 20 μm.
Wherein, capacitance plate is GFF structure narrow frame capacitance plate.
Another aspect of the present invention provides a kind of capacitance plate, including:
Transparency carrier；
ITO layer, is arranged on the transparent substrate；
Metal conducting layer, is arranged on the ito layer；
Wherein, ITO layer and metal conducting layer include the viewing area that etching is formed and the cabling district being positioned at outside viewing area
Territory；
Routing region includes the touch-control sensing circuit that laser-induced thermal etching is formed.
Wherein, viewing area carries out metal etch further, for etching away the metal conducting layer in viewing area.
Wherein, ITO layer and metal conducting layer carry out chemical etching.
Wherein, the width of touch-control sensing circuit is 20 μm, and the distance of touch-control sensing circuit is 20 μm.
Wherein, capacitance plate is GFF structure narrow frame capacitance plate.
By such scheme, the invention has the beneficial effects as follows: be different from prior art, the capacitance plate of the present invention is by base
Forming surface on plate is the ITO layer of metal conducting layer, then metal conducting layer and ITO layer carries out chemical etching, forms electric capacity
The viewing area of screen and periphery routing region thereof, carry out laser-induced thermal etching further and form touch induction lines periphery routing region
Road, by the way, can effectively promote process rate and technology stability, and reduce shared by capacitance plate routing region
Space, improves the screen accounting of product, makes product can realize the appearance of narrow frame.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in embodiment being described below required for make
Accompanying drawing be briefly described, it should be apparent that, below describe in accompanying drawing be only some embodiments of the present invention, for
From the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other according to these accompanying drawings
Accompanying drawing.Wherein:
Fig. 1 is the schematic flow sheet of the preparation method of the capacitance plate of one embodiment of the invention；
Fig. 2 is the structural representation of transparency carrier in Fig. 1；
Fig. 3 is the structural representation forming ITO layer in Fig. 2 on the transparent substrate；
Fig. 4 is the structural representation forming metal conducting layer in Fig. 3 on the ito layer；
Fig. 5 is the structural representation after in Fig. 4 being etched ITO layer and metal conducting layer；
Fig. 6 is the structural representation after viewing area carries out in Fig. 5 metal etch；
Fig. 7 is the structural representation of the capacitance plate of one embodiment of the invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiment wholely.Based on this
Embodiment in invention, it is every other that those of ordinary skill in the art are obtained under not making performing creative labour premise
Embodiment, broadly falls into the scope of protection of the invention.
Refer to the schematic flow sheet of preparation method that Fig. 1, Fig. 1 are the capacitance plates of one embodiment of the invention.Such as Fig. 1 institute
Showing, the preparation method of the capacitance plate 20 of the present embodiment includes:
S11 a: transparency carrier 21 is provided.
As shown in Figure 2, it is provided that a transparency carrier 21, this transparency carrier 21 can use glass, PET (poly terephthalic acid
Glycol ester), the material such as PC (Merlon), PMMA (lucite).
S12: form ITO layer 22 on transparency carrier 21.
As it is shown on figure 3, coat ITO layer 22 on transparency carrier 21, the mode of coating includes but not limited to as plating, prints
Or other production technologies, ITO layer 22 is completely covered on above transparency carrier 21.
S13: form metal conducting layer 23 in ITO layer 22.
As shown in Figure 4, being coated with coated with metal conductive layer 23 on the surface of ITO layer 22, metal conducting layer 23 is completely covered on ITO
Above layer 22, the material of metal conducting layer 23 includes but not limited to use the materials such as nanometer silver.
S14: be etched metal conducting layer 23 and ITO layer 22, forms viewing area A and the week being positioned at outside viewing area
Routing region, limit B.
Metal conducting layer 23 on transparency carrier 21 and ITO layer 22 are carried out chemical etching, to form viewing area A and position
Periphery routing region B outside viewing area, as shown in Figure 5.Viewing area A is used for showing and touching, and periphery routing region B uses
In forming touch-control sensing circuit 230.Wherein, to ITO layer 22 and metal conducting layer 23 chemical etching to form the figure of viewing area A
Pattern layer, i.e. makes the ITO layer 22 on transparency carrier 21 and metal conducting layer 23 part etched, and part is retained.Transparent base
ITO layer 22 and the part of metal conducting layer 23 it is coated with on plate 21, owing to by metal conducting layer 23 not there is the transparency, therefore,
The transparency carrier 21 covered by metal conducting layer 23 does not have the transparency.
S15: viewing area A is carried out metal etch, etches away the metal conducting layer 23 in the A of viewing area.
Metal etch is carried out, with by the metallic conduction in the A of viewing area only for the metal conducting layer 23 on the A of viewing area
Layer 23 etches away, and the metal conducting layer 23 on the periphery routing region B outside the A of viewing area is retained, and touches for post-production
Control induction line 230.Wherein, the metal conducting layer 23 in the A of viewing area is carried out the structural representation such as Fig. 6 after metal etch
Shown in.
S16: periphery routing region B carries out laser-induced thermal etching, forms touch-control sensing circuit 230.
Periphery routing region B outside to viewing area A carries out laser-induced thermal etching, i.e. leads the metal on the B of periphery routing region
Electric layer 23 carries out laser-induced thermal etching, forms touch-control sensing circuit 230.Wherein, the width of touch-control sensing circuit 230 is preferably 20 μm,
Distance between any two touch-control sensing circuits 230 is 20 μm, such that it is able to effectively reduce the sky shared by the B of periphery routing region
Between, make capacitance plate 20 realize the appearance of narrow frame.In other embodiments, the width of touch-control sensing circuit 230 and touch-control
The distance of induction line 230 can also be other data, and this is not restricted.The capacitance plate 20 that the present embodiment prepares is tied for GFF
Structure narrow frame capacitance plate, its structure is as shown in Figure 7.
Therefore, the ITO conductive layer that the capacitance plate 20 of the present embodiment uses surface to be metal conducting layer 23, with traditional processing procedure
Compare, diaphanous spot that silver slurry printing process exists, membrane thickness unevenness, silver slurry viscosity can be avoided a series of the asking such as to change
Topic, reduces product cost.Additionally, relative to the production technology of traditional metallic conduction ITO material touch screen, the present embodiment uses
Laser-induced thermal etching forms touch-control sensing circuit 230, can be prevented effectively from metal etch liquid and ITO etching solution to plain conductor transmission
The lateral erosion amplification of point, effectively promotes process rate and technology stability.
The present invention also provides for a kind of capacitance plate 20 prepared by above-described embodiment, does not repeats them here.
In sum, being different from prior art, the capacitance plate of the present invention is metal by arranging surface on the transparent substrate
The ITO layer of conductive layer, thus metal conducting layer and ITO layer are carried out chemical etching and forms viewing area and the periphery thereof of capacitance plate
Routing region, and further periphery routing region is carried out laser-induced thermal etching, form touch-control sensing circuit, thus effectively improve
Product process rate and technology stability, and reduce the space shared by capacitance plate touch-control sensing circuit simultaneously, improve product
Screen accounting, make product can realize the appearance of narrow frame.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description and accompanying drawing content are made convert, or are directly or indirectly used in other relevant skills
Art field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. the preparation method of a capacitance plate, it is characterised in that described preparation method includes:
One transparency carrier is provided；
Described transparency carrier is formed ITO layer；
Described ITO layer is formed metal conducting layer；
Described ITO layer and described metal conducting layer are etched, to form viewing area and to be positioned at outside described viewing area
Periphery routing region；
Described periphery routing region is carried out laser-induced thermal etching, to form touch-control sensing circuit.
Preparation method the most according to claim 1, it is characterised in that described to described ITO layer with described metal conducting layer
After the step being etched, described method farther includes:
Described viewing area is carried out metal etch, for etching away the metal conducting layer in described viewing area.
Preparation method the most according to claim 1, it is characterised in that described to described ITO layer with described metal conducting layer
The step being etched includes:
Described ITO layer and described metal conducting layer are carried out chemical etching.
Preparation method the most according to claim 1, it is characterised in that the width of described touch-control sensing circuit is 20 μm, institute
The distance stating touch-control sensing circuit is 20 μm.
Preparation method the most according to claim 1, it is characterised in that described capacitance plate is GFF structure narrow frame capacitance plate.
6. a capacitance plate, it is characterised in that described capacitance plate includes:
Transparency carrier；
ITO layer, is arranged on described transparency carrier；
Metal conducting layer, is arranged in described ITO layer；
Wherein, described ITO layer and described metal conducting layer include the viewing area of etching formation and are positioned at outside described viewing area
Routing region；
Described routing region includes the touch-control sensing circuit that laser-induced thermal etching is formed.
Capacitance plate the most according to claim 6, it is characterised in that described viewing area carries out metal etch further, uses
Metal conducting layer in etching away described viewing area.
Capacitance plate the most according to claim 6, it is characterised in that described ITO layer and described metal conducting layer carry out chemistry
Etching.
Capacitance plate the most according to claim 6, it is characterised in that the width of described touch-control sensing circuit is 20 μm, described
The distance of touch-control sensing circuit is 20 μm.
Capacitance plate the most according to claim 6, it is characterised in that described capacitance plate is GFF structure narrow frame capacitance plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610578836.9A CN106168867A (en) | 2016-07-21 | 2016-07-21 | Capacitance plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610578836.9A CN106168867A (en) | 2016-07-21 | 2016-07-21 | Capacitance plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106168867A true CN106168867A (en) | 2016-11-30 |
Family
ID=58064894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610578836.9A Pending CN106168867A (en) | 2016-07-21 | 2016-07-21 | Capacitance plate and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106168867A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109992163A (en) * | 2019-04-15 | 2019-07-09 | 业成科技（成都）有限公司 | Touch-control sensing mould group and preparation method thereof and the electronic device for applying it |
| WO2019184146A1 (en) * | 2018-03-29 | 2019-10-03 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN111033455A (en) * | 2019-04-10 | 2020-04-17 | 深圳市汇顶科技股份有限公司 | Manufacturing method of lead in touch screen, touch screen and electronic equipment |
| CN111625153A (en) * | 2020-05-09 | 2020-09-04 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
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| EP2354899A2 (en) * | 2008-11-14 | 2011-08-10 | LG Innotek Co., Ltd. | Touch screen and manufacturing method thereof |
| CN102279684A (en) * | 2011-08-30 | 2011-12-14 | 深圳市豪威薄膜技术有限公司 | Method for manufacturing novel electrode lead capacitive screen, novel electrode lead capacitive screen and touch screen terminal |
| CN104238782A (en) * | 2013-06-07 | 2014-12-24 | 福建省辉锐材料科技有限公司 | Touch screen electrode preparation method |
-
2016
- 2016-07-21 CN CN201610578836.9A patent/CN106168867A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2354899A2 (en) * | 2008-11-14 | 2011-08-10 | LG Innotek Co., Ltd. | Touch screen and manufacturing method thereof |
| CN102279684A (en) * | 2011-08-30 | 2011-12-14 | 深圳市豪威薄膜技术有限公司 | Method for manufacturing novel electrode lead capacitive screen, novel electrode lead capacitive screen and touch screen terminal |
| CN104238782A (en) * | 2013-06-07 | 2014-12-24 | 福建省辉锐材料科技有限公司 | Touch screen electrode preparation method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019184146A1 (en) * | 2018-03-29 | 2019-10-03 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN111033455A (en) * | 2019-04-10 | 2020-04-17 | 深圳市汇顶科技股份有限公司 | Manufacturing method of lead in touch screen, touch screen and electronic equipment |
| WO2020206644A1 (en) * | 2019-04-10 | 2020-10-15 | 深圳市汇顶科技股份有限公司 | Manufacturing method for lead in touch screen, touch screen, and electronic device |
| CN109992163A (en) * | 2019-04-15 | 2019-07-09 | 业成科技（成都）有限公司 | Touch-control sensing mould group and preparation method thereof and the electronic device for applying it |
| CN111625153A (en) * | 2020-05-09 | 2020-09-04 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
| CN111625153B (en) * | 2020-05-09 | 2022-12-20 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
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Application publication date: 20161130 |