CN111625153A - Touch device and method for improving yield of double-line laser splicing positions - Google Patents

Touch device and method for improving yield of double-line laser splicing positions Download PDF

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CN111625153A
CN111625153A CN202010385086.XA CN202010385086A CN111625153A CN 111625153 A CN111625153 A CN 111625153A CN 202010385086 A CN202010385086 A CN 202010385086A CN 111625153 A CN111625153 A CN 111625153A
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silver paste
laser
line
layer
ito
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CN111625153B (en
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蔡飞扬
丁雷
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Wuhu Lunfeng Electronic Technology Co ltd
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Wuhu Lunfeng Electronic Technology Co ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The invention relates to the field of capacitive touch screens, in particular to a touch device and a method for improving the yield of double-line laser splicing positions, the touch device comprises a capacitive touch screen, the capacitive touch screen is provided with a window area, the edge area of the window area is provided with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver paste layer through a touch connecting channel, the silver paste layers are connected with the corresponding touch sensing unit electrodes after being led out from the touch connecting channels, the silver paste layers are in a double-end leading-out mode, first silver paste laser lines and broken silver paste laser lines which are equal in number are arranged in the silver paste layers, the first silver paste laser lines are a complete segment, a plurality of splicing cutting points are arranged on the broken silver paste laser lines, and the splicing cutting points divide the broken silver paste laser lines into a plurality of segments, the problem caused by splicing delay can not occur.

Description

Touch device and method for improving yield of double-line laser splicing positions
Technical Field
The invention relates to the field of capacitive touch screens, in particular to a touch device and a method for improving the yield of a double-line laser splicing position.
Background
The capacitive touch screen technology works by using current induction of a human body. The capacitive touch screen is a four-layer composite glass screen, the inner surface and the interlayer of the glass screen are respectively coated with one layer of ITO, the outermost layer is a thin-layer silica glass protective layer, the interlayer ITO coating serves as a working surface, four electrodes are led out from four corners, and the inner layer of ITO serves as a shielding layer to guarantee a good working environment. When a finger touches the metal layer, a coupling capacitance is formed between the user and the touch screen surface due to the electric field of the human body, and for high frequency currents, the capacitance is a direct conductor, so that the finger draws a small current from the contact point. The currents respectively flow out of the electrodes on the four corners of the touch screen, the currents flowing through the four electrodes are in direct proportion to the distances from the fingers to the four corners, and the controller obtains the position of a touch point through accurate calculation of the proportion of the four currents. The capacitive screen is to realize multi-point touch by increasing electrodes of mutual capacitance, in short, the screen is divided into blocks, and a group of mutual capacitance modules are arranged in each area and work independently, so that the capacitive screen can independently detect the touch condition of each area, and after processing, the multi-point touch is simply realized. The capacitive touch panel ctp (capacitytouchpanel) operates by using current induction of a human body. The capacitive screen is a four-layer composite glass screen, the inner surface and the interlayer of the glass screen are respectively coated with a layer of ITO (nanometer indium tin metal oxide), the outermost layer is only 0, the touch device and the method for improving the yield of the double-line laser splicing position are a silica glass protective layer with the thickness of 15mm, the interlayer ITO coating is used as a working surface, four electrodes are led out from four corners, and the inner layer ITO is used as a screen layer to ensure the working environment. When a user touches the capacitive screen, due to a human body electric field, a coupling capacitor is formed between the finger of the user and the working surface, because the working surface is connected with a high-frequency signal, a very small current is absorbed by the finger, the current flows out of the electrodes on the four corners of the screen respectively, theoretically, the current flowing through the four electrodes is proportional to the distance from the finger to the four corners, and the controller obtains the position through precise calculation of the proportion of the four currents. 99% accuracy can be achieved with a response speed of less than 3 ms.
With the development and maturity of electronic products, the application range of touch screens is gradually expanded, and the production and manufacturing technologies thereof are diversified. Currently, common capacitive touch screen structures include an external capacitive screen represented by G + G (glass-to-glass capacitive touch screen), OGS (single-sheet glass capacitive touch screen), GF (glass-to-film capacitive touch screen), GFF (glass-to-double-layer film capacitive touch screen), and the like, and an embedded capacitive screen represented by an Oncell (touch panel function is embedded between a color filter substrate and a polarizing plate), and an Incell (touch panel function is embedded in a liquid crystal pixel). The performance of the product is stably improved, the larger the product size is, the larger the screen area of the product is, the more the screen area of the product is, the area of the BM (black matrix) area of the cover plate is reduced as much as possible, and the improvement of the area of the display area becomes a target which is continuously pursued by the industry staff.
The traditional capacitive display screen is mainly manufactured by the following two methods:
the first method is to print silver paste on a pure ITO (indium tin oxide) conductive film on which a VA (display area) layer has been etched, and complete a peripheral touch sensing circuit by laser process etching. However, the film thickness of the printed silver paste is not easy to control, and the influence of the silver paste diluent on the circuit due to the increase of the processing times in the production process is large, the uniformity of silver paste particles and the dust-free environment is large, so that the fine processing of the capacitive screen is difficult, and the production yield is low.
The second method is to adopt a metal ITO conductive film as a conductive film of the capacitive screen, complete the VA area pattern and the peripheral wiring through one-time chemical etching, then remove the metal in the VA area through secondary etching, and reserve the ITO in the VA area as a conductive sensing layer. In the manufacturing process, the metal layer is plated on the ITO layer through a vacuum sputtering process, the metal layer has a tiny permeable area which cannot be removed through normal visual inspection, and the permeable area is subjected to one-time metal etching and one-time ITO etching, so that side etching is easy to occur, the permeable area is obviously increased, the touch sensing circuit is broken, the production yield is influenced, and instability is brought to the manufacturing process.
Chinese patent CN201610578836.9 discloses a capacitive screen and a method for manufacturing the same, in which an ITO layer with a metal conductive layer on the surface is disposed on a transparent substrate, the metal conductive layer and the ITO layer are chemically etched to form a display area and a peripheral wiring area of the capacitive screen, and the peripheral wiring area is further laser etched to form a touch sensing circuit. By the aid of the method, the space occupied by the touch sensing circuit of the capacitive screen can be effectively reduced, the screen occupation ratio of a product is improved, the appearance effect of a narrow frame of the product is achieved, and the process yield and the process stability of the product are effectively improved.
However, in the process of manufacturing the capacitive screen, a process of engraving a circuit by laser is adopted, and unnecessary places are burnt by light, so that a required conductive channel is left; the burnt-off size is determined by the size of a laser spot, and the size of the laser spot is generally between 0.03 and 0.035mm according to the size of the laser spot of the capacitive screen laser in the current industry, so the etched line spacing is generally about 0.035 mm; in order to improve and reduce the risk of short circuit, the etched line spacing can be enlarged for a product with space, the etched line spacing can be changed to about 0.05mm by a double-line laser method, namely designing 2 parallel laser lines with a distance of 0.01-0.02mm, and the etched line spacing can be adjusted according to actual needs, meanwhile, laser equipment of the capacitive screen is divided into blocks through a vibrating mirror, a cross-connection splicing position can be arranged between the blocks, the splicing position is the place where the whole laser has most problems, and more problems are caused under the condition of double lines, so the method for improving the yield of the double-line laser splicing position is provided.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a touch device and a method for improving the yield of a double-line laser splicing position, the technical scheme solves the problem that the existing laser etching method is easy to cause laser explosion, and the touch device and the method for improving the yield of the double-line laser splicing position break a broken silver paste laser line along a splicing line, so that the splicing position can be avoided by breaking the routing of the silver paste laser line, and the problem caused by splicing delay can be avoided.
In order to solve the technical problems, the invention provides the following technical scheme:
the utility model provides a touch device, including capacitive touch screen, capacitive touch screen has the window district, the border area of window is equipped with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver thick liquid layer through a touch interface channel, the silver thick liquid layer is followed after drawing forth in the touch interface channel and the touch sensing unit electrode that corresponds is connected, and the silver thick liquid layer is the bi-polar mode of drawing forth, and the silver thick liquid in situ is equipped with the first silver thick liquid laser line that quantity equals and breaks the silver thick liquid laser line, first silver thick liquid laser line is a complete section, be equipped with a plurality of concatenation cut-off points on breaking the silver thick liquid laser line, the concatenation cut-off point will break the silver thick liquid laser line and separate into a plurality of sections, each section break silver thick liquid laser line mutually independent and not interconnect.
As a preferable scheme of the touch device, the capacitive touch screen is a GG structure, a GF structure, a GFF structure, a GF structure, or an OGS structure.
As a preferred scheme of the touch device, the capacitive touch screen comprises a plurality of laser etching blocks, two adjacent laser etching blocks are connected together, a splicing line is arranged between the two adjacent laser etching blocks, and the splicing cutting point is arranged at the splicing line.
As an optimal scheme of a touch device, break silver thick liquid laser line and break to both ends along the concatenation line, form sunkenly, first silver thick liquid laser line constitutes the two lead-out wires of multiunit with breaking silver thick liquid laser line one-to-one, and the same inter-group first silver thick liquid laser line is 0.01-0.02mm with breaking the linear distance between the silver thick liquid laser line.
As a preferred scheme of a touch device, the silver paste laser lines are broken and arranged in the laser etching area blocks, and the number of the broken silver paste laser lines is less than or equal to the number of the laser etching area blocks.
Also provided is a method for improving the yield of the double-line laser splicing bit, which comprises the following steps:
forming an ITO circuit on an ITO thin film layer of the capacitive touch screen, wherein the ITO circuit comprises an ITO electrode wire and an ITO outgoing wire;
completely crystallizing the ITO electrode wires and the ITO outgoing lines on the ITO circuit by using shrinkage aging treatment;
attaching a dry film on the ITO circuit, and performing ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;
washing the unhardened dry film by using a developing solution to expose the ITO circuit;
etching the exposed ITO circuit by using an etching solution;
removing the film from the hardened dry film to leave only an ITO circuit layer on the ITO film layer to form a conductive circuit;
and printing conductive silver paste on a frame area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form a silver paste lapping circuit.
As an optimal solution of the method for improving the yield of the double-line laser splicing position of the touch device, the conductive silver adhesive is printed on a frame area of an ITO line layer forming the conductive circuit, and the conductive silver adhesive is subjected to laser etching to form a silver adhesive splicing line, which specifically includes:
determining the area of a frame area of the ITO circuit layer, and dividing the frame area of the ITO circuit layer into a plurality of laser etching blocks with equal areas;
determining a splicing line between two adjacent laser etching blocks;
silk-screen printing of a block-shaped silver paste block and a plurality of groups of double-channel first silver paste laser lines and interruption of the silver paste laser lines in a frame area of the ITO circuit layer;
baking the silver paste block, the first silver paste laser line and the broken silver paste laser line, and heating and drying to form a silver paste layer and a wiring silver paste;
dividing the dried broken silver paste laser line into a plurality of sections by taking the splicing line as a critical line;
and carrying out laser etching on the laser etching block with the silver paste block and the routing silver paste to form a silver paste lapping circuit.
As an optimal solution of the method for improving the yield of the double-line laser splicing position of the touch device, the method includes the steps of determining the area of a frame area of the ITO circuit layer, and dividing the frame area of the ITO circuit layer into a plurality of laser etching blocks with equal areas, and before the steps:
determining a window area and a non-window area of the ITO film layer;
printing a decorative layer on the window area;
forming a touch sensing unit electrode on the non-window area;
and printing a laser shielding layer on the surface of the printing decoration layer.
As a preferred scheme of the method for improving the yield of the double-line laser splicing position of the touch device, the edge metal layer is overlapped with the touch sensing unit electrode.
As an optimal scheme of the method for improving the yield of the double-line laser splicing position of the touch device, the method comprises the steps of silk-screen printing of the blocky silver paste blocks, the multiple groups of double-channel first silver paste laser lines and the broken silver paste laser lines in the frame area of the ITO circuit layer, and silk-screen printing of the blocky silver paste blocks, the multiple groups of double-channel first silver paste laser lines and the broken silver paste laser lines on the laser shielding layer.
Compared with the prior art, the invention has the beneficial effects that:
determining a window area and a non-window area of the ITO film layer, printing a decorative layer on the window area, forming a touch sensing unit electrode on the non-window area, wherein the edge metal layer is overlapped with the touch sensing unit electrode, and then printing a laser shielding layer on the surface of the printed decorative layer. Dividing a frame area of an ITO circuit layer into a plurality of laser etching blocks with equal areas, determining a splicing line between two adjacent laser etching blocks, finding out the splicing line between the first laser etching block and the first laser etching block, screen-printing a blocky silver paste block and a plurality of groups of double-channel first silver paste laser lines on a laser shielding layer and breaking the silver paste laser lines, baking the silver paste block, the first silver paste laser lines and the breaking silver paste laser lines, heating and drying to form the silver paste layer and routing silver paste, taking the splicing line as a critical line to break the silver paste laser lines after drying, dividing the silver paste laser lines into a plurality of sections, carrying out laser etching on the laser etching blocks with the silver paste blocks and the routing silver paste, and forming a silver adhesive splicing line.
This touch device and its method of improving double-line laser concatenation position yield, through breaking silver thick liquid laser line and going on breaking along the concatenation line, the concatenation position just can be avoided to the line of walking that breaks silver thick liquid laser line like this, the problem that the concatenation time delay brought just can not appear, through production verification, first silver thick liquid laser line is complete, and it is interrupted to break silver thick liquid laser line, thereby lead to breaking the depression point department that the laser line is interrupted and have the boss to feel, the distance of this boss can be optimized according to the precision adjustment of actual laser equipment, and this a little boss does not influence the performance of whole passageway, on the contrary, the problem of the laser explosion point of a effectual improvement concatenation position. The method for improving the yield of the double-line laser splicing position can effectively improve the problem of the explosion point of the double-line laser splicing position and improve the yield of the double-line laser etching splicing position.
Drawings
FIG. 1 is a diagram illustrating a conventional method for improving yield of a twin-line laser stitching bit in the prior art;
FIG. 2 is a partial schematic diagram of a conventional method for improving yield of a twin-line laser stitching bit in the prior art;
FIG. 3 is a diagram illustrating a prior art dual improved dual laser stitching bit yield method;
FIG. 4 is a schematic diagram of a method for improving yield of a dual-line laser stitching bit according to the present invention;
FIG. 5 is a schematic flow chart of a prior art method for improving yield of dual laser stitching bits;
FIG. 6 is a schematic flow chart of the prior art double improved dual inline laser stitching bit yield method S700');
FIG. 7 is a schematic diagram of a method for improving yield of a dual-line laser stitching bit according to the present invention;
fig. 8 is a first flowchart of the method for improving yield of the dual-line laser stitching bit of the present invention, step S700);
fig. 9 is a second flowchart illustrating the process S700) of the method for improving yield of the dual-line laser stitching bit according to the present invention;
fig. 10 is a flowchart illustrating a specific process of S707) in the method for improving yield of the double-line laser splicing bit according to the present invention.
The reference numbers in the figures are:
1-touch connection channel;
2-silver paste layer;
3-a first silver paste laser line;
4-second silver paste laser line;
5-first laser etching block;
6-first laser etching block;
7-splicing lines;
and 8-breaking the silver paste laser line.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
With the development and maturity of electronic products, the application range of touch screens is gradually expanded, and the production and manufacturing technologies thereof are diversified. Currently, common capacitive touch screen structures include an external capacitive screen represented by G + G (glass-to-glass capacitive touch screen), OGS (single-sheet glass capacitive touch screen), GF (glass-to-soft film capacitive touch screen), GFF (glass-to-double-layer soft film capacitive touch screen), and an embedded capacitive screen represented by On cell (touch panel function is embedded between a color filter substrate and a polarizing plate), and Incell (touch panel function is embedded in a liquid crystal pixel). The performance of the product is stably improved, the larger the product size is, the larger the screen area of the product is, the more the screen area of the product is, the area of the BM (black matrix) area of the cover plate is reduced as much as possible, and the improvement of the area of the display area becomes a target which is continuously pursued by the industry staff.
Referring to fig. 1 and 2, a touch device in the prior art includes a capacitive touch screen, which is a GG structure, a GF structure, a GFF structure, a GF2 structure, or an OGS structure. The capacitive touch screen is provided with a window area, the edge area of the window is provided with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver paste layer 2 through a touch connecting channel 1, the silver paste layer 2 is connected with the corresponding touch sensing unit electrode after being led out from the touch connecting channel 1, the silver paste layer 2 is in a double-end leading-out mode, first silver paste laser lines 3 and second silver paste laser lines 4 which are equal in quantity are arranged in the silver paste layer 2, the first silver paste laser lines 3 and the second silver paste laser lines 4 are complete sections, the first silver paste laser lines 3 correspond to the second silver paste laser lines 4 one to one, and a plurality of groups of double leading-out wires are formed.
After the touch device in the prior art is directly subjected to laser etching, the line distance between the first silver paste laser line 3 and the second silver paste laser line 4 of the same group is about 0.035mm (namely the size of light spots), when the touch device is used as a large-size capacitive screen (more than 15 inches), the routing space of a product is relatively large, most importantly, the situation of problems such as short circuit can be increased because the lines are relatively long and relatively many, so that the problem caused by too small line distance is solved, a double-line laser etching mode needs to be adopted, the line distance between the first silver paste laser line 3 and the second silver paste laser line 4 of the same group before laser etching is about 0.01-0.02m, and the line distance between the first laser silver paste laser line 3 and the second silver paste laser line 4 of the same group after laser etching can be increased to about 0.05 mm.
The double-line laser etching is to divide the capacitive touch screen into laser blocks, namely, the laser is divided into blocks instead of one line from head to tail regardless of the length, the laser is divided into another line, the laser can be used for dividing all the laser lines in the range into the blocks at one time, then the laser is moved to the next laser block, the size of each block can be determined according to the vibrating mirror of each device, and the size of the common block in the market at present is 120-180 mm. This also means that in the current small-sized mobile phone, the single touch screen does not need to be partitioned, and the partitioned laser is only needed when the product is larger than the partitioned range. Referring to fig. 3, the capacitive touch screen includes a plurality of laser-etched blocks, two adjacent laser-etched blocks are connected together, and a splicing line is disposed between the two adjacent laser-etched blocks, for example, the first laser-etched block 5 and the first laser-etched block 6 that are adjacent in the figure, and the splicing line 7 is a splicing line between the first laser-etched block 5 and the first laser-etched block 6. When the double-line laser etching is carried out, all the first silver paste laser lines 3 and all the second silver paste laser lines 4 in the area range of the first laser etching area 5 are subjected to laser etching firstly, then the area range of the first laser etching area 6 is moved to be subjected to laser etching, similarly, all the first silver paste laser lines 3 and all the second silver paste laser lines 4 need to be subjected to laser etching once, and the laser of a splicing position between the laser etching area and the laser etching area can be generated. The position of the splicing line 7 is just the end of the laser of the previous first laser etching block 5 and the start of the laser of the next first laser etching block 6, which is the time when the light is most unstable. In order to solve the problem, the laser etching equipment adopts a delay compensation method; i.e. let the last block end up extending into the next block by a small fraction and the next block start with a laser extending into the last block by a small fraction. At this time, the laser at the splicing position is twice the normal laser, and the laser explosion point which is not selected by design always occurs, so that the problem that the circuit is easy to open and short is caused.
Referring to fig. 5, a method for improving yield of a dual-line laser splicing site in a dual-line mode in the prior art includes the following steps:
s100 ") forming an ITO circuit on an ITO thin film layer of the capacitive touch screen, wherein the ITO circuit comprises an ITO electrode line and an ITO outgoing line;
s200') completely crystallizing the ITO electrode wires and the ITO outgoing lines on the ITO circuit by using shrinkage aging treatment;
s300 ") attaching a dry film to the ITO circuit, and performing ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;
s400'), washing the unhardened dry film by using a developing solution to expose the ITO circuit;
s500'), etching the exposed ITO circuit by using an etching solution;
s600'), removing the film from the hardened dry film, and only leaving an ITO circuit layer for forming a conductive circuit on the ITO film layer;
s700') printing conductive silver paste on a frame area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form a silver paste lapping circuit.
Referring to fig. 6, S700 ") printing conductive silver paste on a frame region of an ITO line layer on which a conductive line is formed, and performing laser etching on the conductive silver paste to form a silver paste bonding line, including the following steps:
s701'), determining the area of the frame area of the ITO circuit layer, and dividing the frame area of the ITO circuit layer into a plurality of laser etching blocks with equal areas;
s702'), determining a splicing line between two adjacent laser etching blocks;
s703') screen-printing a blocky silver paste block and a plurality of groups of double-channel first silver paste laser lines 3 and second silver paste laser lines 4 on a frame area of the ITO circuit layer;
s704'), baking the silver paste block, the first silver paste laser line 3 and the second silver paste laser line 4, and heating and drying to form a silver paste layer 2 and routing silver paste;
s705 ") laser etching the laser etched block with the silver paste block and the trace silver paste to form a silver paste lapping circuit.
Referring to fig. 4, the touch device includes a capacitive touch screen, which is a GG structure, a GF structure, a GFF structure, a GF2 structure, or an OGS structure. Capacitive touch screen has the window district, the border area of window is equipped with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver thick liquid layer 2 through a touch connecting channel 1, silver thick liquid layer 2 is drawn forth the back from touch connecting channel 1 and is connected with the touch sensing unit electrode that corresponds, silver thick liquid layer 2 is the bi-polar mode of drawing forth, be equipped with the first silver thick liquid laser line 3 that quantity equals in silver thick liquid layer 2 and break silver thick liquid laser line 8, first silver thick liquid laser line 3 is a complete section, be equipped with a plurality of concatenation cut-off points on breaking silver thick liquid laser line 8, the concatenation cut-off point will break silver thick liquid laser line 8 and separate into a plurality of sections, every section breaks silver thick liquid laser line 8 mutual independence and not interconnect.
The capacitive touch screen comprises a plurality of laser etching blocks, two adjacent laser etching blocks are connected together, a splicing line is arranged between the two adjacent laser etching blocks, and a splicing cutting point is arranged at the splicing line. As shown in the figure, the adjacent first laser-etched area 5 and the first laser-etched area 6, the splicing line 7 is the splicing line between the first laser-etched area 5 and the first laser-etched area 6.
Breaking silver thick liquid laser line 8 and breaking silver thick liquid laser line 8 one-to-one along the concatenation line and breaking, forming sunken, constituting multiunit two lead-out wires, with the same inter-group line spacing between first silver thick liquid laser line 3 and the breaking silver thick liquid laser line 8 be 0.01-0.02mm, break silver thick liquid laser line 8 and set up in the laser etching block, the quantity less than or equal to the quantity of laser etching block that breaks laser line 8.
Referring to fig. 7, the method for improving the yield of the double-line laser splicing bits of the touch device includes the following steps:
s100) forming an ITO circuit on an ITO thin film layer of the capacitive touch screen, wherein the ITO circuit comprises an ITO electrode wire and an ITO outgoing wire;
s200) completely crystallizing the ITO electrode wires and the ITO outgoing lines on the ITO circuit by using shrinkage aging treatment;
s300) attaching a dry film to the ITO circuit, and performing ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;
s400) cleaning the unhardened dry film by using a developing solution to expose the ITO circuit;
s500) etching the exposed ITO circuit by using an etching solution;
s600) removing the film of the hardened dry film to enable the ITO film layer to only remain an ITO circuit layer forming a conductive circuit;
s700) printing conductive silver paste on a frame area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form a silver paste lapping circuit.
Referring to fig. 8, S700) printing conductive silver paste on a frame region of an ITO line layer where a conductive line is formed, and performing laser etching on the conductive silver paste to form a silver paste overlap line, specifically including the steps of:
s705), determining the area of a frame area of the ITO circuit layer, and dividing the frame area of the ITO circuit layer into a plurality of laser etching blocks with equal areas;
s706) determining a splicing line between two adjacent laser etching blocks;
s707) screen printing block-shaped silver paste blocks and a plurality of groups of double-channel first silver paste laser lines 3 and breaking the silver paste laser lines 8 on a frame area of the ITO circuit layer;
s708) baking the silver paste block, the first silver paste laser line 3 and the broken silver paste laser line 8, and heating and drying to form a silver paste layer 2 and routing silver paste;
s709) dividing the dried broken silver paste laser line 8 into a plurality of sections by taking the splicing line as a critical line;
s710) carrying out laser etching on the laser etching block with the silver paste block and the routing silver paste to form a silver paste lapping circuit.
Referring to fig. 9, S705) determining an area of a frame region of the ITO circuit layer, before dividing the frame region of the ITO circuit layer into a plurality of laser-etched blocks having equal areas, the method further includes the following steps:
s701) determining a window area and a non-window area of the ITO thin film layer;
s702) printing a decorative layer in the window area;
s703) forming a touch sensing unit electrode on the non-window area, wherein the edge metal layer is lapped with the touch sensing unit electrode;
s704) printing a laser shielding layer on the surface of the printed decoration layer.
Referring to fig. 10, S707) is to screen print the block-shaped silver paste block and the multiple sets of the dual-channel first silver paste laser lines 3 and the broken silver paste laser lines 8 on the laser shielding layer.
The concatenation position just can be avoided to the line of walking that breaks silver thick liquid laser line 8 like this, the problem that the concatenation time delay brought just can not appear, through production verification, first silver thick liquid laser line 3 is complete, and break silver thick liquid laser line 8 and be interrupted, thereby it has the boss to feel to lead to breaking the depressed spot department that silver thick liquid laser line 8 is interrupted, the distance of this boss can be according to the precision adjustment optimization of actual laser equipment, and this a little boss does not influence the performance of whole passageway, the problem of the laser explosion point of a concatenation position of effectual improvement on the contrary. For a 86-inch product with the length and the width of about 2000 x 1100mm, calculated according to the maximum vibrating mirror of 180mm, about 7 x 12 x 84 blocks need to be separated, 4 splicing directions of the blocks in the middle position need to be spliced, if too many explosion points exist at the splicing positions in each direction, as long as a certain explosion point is too large, the silver paste layer 2 is cracked, the wire is broken, or the laser is exploded to the silver paste wire to cause short circuit, the product is changed into a bad product. The method for improving the yield of the double-line laser splicing position can effectively improve the problem of the explosion point of the double-line laser splicing position and improve the yield of the double-line laser etching splicing position.
The invention is manufactured: determining a window area and a non-window area of the ITO film layer, printing a decorative layer on the window area, forming a touch sensing unit electrode on the non-window area, wherein the edge metal layer is overlapped with the touch sensing unit electrode, and then printing a laser shielding layer on the surface of the printed decorative layer. Dividing a frame area of an ITO circuit layer into a plurality of laser etching blocks with equal areas, determining a splicing line between two adjacent laser etching blocks, namely finding out a splicing line 7 between a first laser etching block 5 and a first laser etching block 6, screen-printing a blocky silver paste block and a plurality of groups of double-channel first silver paste laser lines 3 and breaking the silver paste laser lines 8 on a laser shielding layer, baking the silver paste block, the first silver paste laser lines 3 and the breaking silver paste laser lines 8, heating and drying to form a silver paste layer 2 and routing silver paste, dividing the breaking silver paste laser lines 8 after drying into a plurality of sections by using the splicing line as a critical line, carrying out laser etching on the laser etching blocks with the silver paste block and the routing silver paste, and forming a silver paste splicing line.
This touch device and its method of improving double-line laser concatenation position yield, through breaking silver thick liquid laser line 8 and breaking along concatenation line 7, the concatenation position just can be avoided to the line of walking that breaks silver thick liquid laser line 8 like this, the problem that the concatenation time delay brought just can not appear, through production verification, first silver thick liquid laser line 3 is complete, and it is interrupted to break silver thick liquid laser line 8, thereby it has the boss to feel to lead to breaking the depression point department that silver thick liquid laser line 8 is interrupted, the distance of this boss can be according to the precision adjustment optimization of actual laser equipment, and this slight boss does not influence the performance of whole passageway, on the contrary, the problem of the laser explosion point of a effectual improvement concatenation position. The method for improving the yield of the double-line laser splicing position can effectively improve the problem of the explosion point of the double-line laser splicing position and improve the yield of the double-line laser etching splicing position.

Claims (10)

1. A touch device is characterized by comprising a capacitive touch screen, wherein the capacitive touch screen is provided with a window area, the edge area of the window is provided with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver paste layer (2) through a touch connecting channel (1), the silver paste layer (2) is connected with the corresponding touch sensing unit electrode after being led out from the touch connecting channel (1), the silver paste layer (2) is in a double-end leading-out mode, first silver paste laser lines (3) with the same number and silver paste laser lines (8) which are broken are arranged in the silver paste layer (2), the first silver paste laser line (3) is a complete segment, a plurality of splicing cut-off points are arranged on the broken silver paste laser line (8), the splicing cut-off point separates into a plurality of sections with breaking silver thick liquid laser line (8), and the each section breaks silver thick liquid laser line (8) mutually independent and not connected.
2. The touch device as recited in claim 1, wherein the capacitive touch screen is of a GG structure, a GF structure, a GFF structure, a GF2 structure or an OGS structure.
3. The touch device according to claim 2, wherein the capacitive touch screen comprises a plurality of laser etching blocks, two adjacent laser etching blocks are connected together, a splicing line is arranged between the two adjacent laser etching blocks, and the splicing cutting point is arranged at the splicing line.
4. The touch device according to claim 3, wherein the breaking silver paste laser lines (8) break at both ends along the splicing line to form a recess, the first silver paste laser lines (3) correspond to the breaking silver paste laser lines (8) one by one to form a plurality of groups of double outgoing lines, and the distance between the first silver paste laser lines (3) and the breaking silver paste laser lines (8) in the same group is 0.01-0.02 mm.
5. The touch device according to claim 4, wherein the silver paste laser lines (8) are arranged in the laser etching blocks, and the number of the silver paste laser lines (8) is less than or equal to the number of the laser etching blocks.
6. The method of claim 5, wherein the method comprises:
forming an ITO circuit on an ITO thin film layer of the capacitive touch screen, wherein the ITO circuit comprises an ITO electrode wire and an ITO outgoing wire;
completely crystallizing the ITO electrode wires and the ITO outgoing lines on the ITO circuit by using shrinkage aging treatment;
attaching a dry film on the ITO circuit, and performing ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;
washing the unhardened dry film by using a developing solution to expose the ITO circuit;
etching the exposed ITO circuit by using an etching solution;
removing the film from the hardened dry film to leave only an ITO circuit layer on the ITO film layer to form a conductive circuit;
and printing conductive silver paste on a frame area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form a silver paste lapping circuit.
7. The method for improving the yield of the double-line laser splicing position of the touch device according to claim 6, wherein conductive silver paste is printed on a frame area of an ITO circuit layer on which the conductive circuit is formed, and the conductive silver paste is subjected to laser etching to form a silver paste splicing circuit, and the method specifically comprises the following steps:
determining the area of a frame area of the ITO circuit layer, and dividing the frame area of the ITO circuit layer into a plurality of laser etching blocks with equal areas;
determining a splicing line between two adjacent laser etching blocks;
silk-screen printing of a blocky silver paste block and a plurality of groups of double-channel first silver paste laser lines (3) and breaking of the silver paste laser lines (8) on a frame area of the ITO circuit layer;
baking the silver paste block, the first silver paste laser line (3) and the broken silver paste laser line (8), and heating and drying to form a silver paste layer (2) and routing silver paste;
dividing the dried broken silver paste laser line (8) into a plurality of sections by taking the splicing line as a critical line;
and carrying out laser etching on the laser etching block with the silver paste block and the routing silver paste to form a silver paste lapping circuit.
8. The method of claim 7, wherein the determining the area of the border region of the ITO trace layer and the dividing the border region of the ITO trace layer into a plurality of laser-etched blocks having equal areas further comprises:
determining a window area and a non-window area of the ITO film layer;
printing a decorative layer on the window area;
forming a touch sensing unit electrode on the non-window area;
and printing a laser shielding layer on the surface of the printing decoration layer.
9. The method of claim 7, wherein the edge metal layer overlaps the touch sensing unit electrode.
10. The method for improving yield of the dual-line laser splicing site of the touch device as claimed in claim 9, wherein the step of screen printing the block-shaped silver paste blocks and the multiple sets of dual-channel first silver paste laser lines (3) and the step of breaking the silver paste laser lines (8) on the frame area of the ITO circuit layer is the step of screen printing the block-shaped silver paste blocks and the multiple sets of dual-channel first silver paste laser lines (3) and the step of breaking the silver paste laser lines (8) on the laser shielding layer.
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