CN106378533A - Silver paste laser etched pattern splicing method - Google Patents
Silver paste laser etched pattern splicing method Download PDFInfo
- Publication number
- CN106378533A CN106378533A CN201610830908.4A CN201610830908A CN106378533A CN 106378533 A CN106378533 A CN 106378533A CN 201610830908 A CN201610830908 A CN 201610830908A CN 106378533 A CN106378533 A CN 106378533A
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- CN
- China
- Prior art keywords
- silver paste
- etching
- processing
- galvanometer
- laser
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- ing And Chemical Polishing (AREA)
Abstract
During laser etching processing of large-breadth high-speed high-precision silver paste galvanometer, when an etched pattern is larger than the single-time processing breadth of the galvanometer, the requirement on the splicing precision of blocked etched patterns is very high, and when the galvanometer precision of equipment is lower than the processing requirement and the galvanometer precision is reduced, and an etching yield drops badly. The invention relates to a silver paste laser etched pattern splicing method. When the galvanometer precision is lower than the processing requirement, by carrying out bending modification on splicing points where the blocked pattern elements are spliced, the splicing requirement is reduced, and the processing requirement is met. With the adoption of the silver paste laser etched pattern splicing method, during the large-breadth high-precision laser etching processing, the requirement on etching equipment is reduced substantially, a processing speed is increased substantially and very good economic benefits are brought.
Description
Technical field
The invention belongs to laser-induced thermal etching manufacture field, illustrate the present invention relates to a kind of silver paste laser-induced thermal etching graphic joining
Method.
Background technology
In the production process of touch screen, ITO is impact Product processing efficiency, yield with the making technology of silver paste line and becomes
This principal element.Technique main at present has silk screen printing process, acid etching carving technology, laser etch process etc. several.Due to precision
The reason silk screen printing process be mainly used in the wide processing of low precision thick line；Due to pollution impact, acid etching carving technology progressively by
Laser etch process is replaced.In handset touch panel processing such as below 5 cun, the application of laser-induced thermal etching is very universal, and
In the processing of the touch screen of large format, acid etching carving technology also takes up main positions, due to by laser galvanometer breadth and essence
The restriction of degree, in the high-precision etching and processing of large format, is mainly processed by the method for piecemeal acid etching, this is significantly at present
Limit efficiency and the yield of processing.
Content of the invention
In large format high-speed high-precision silver paste galvanometer laser-induced thermal etching processing, etched figure is more than galvanometer single process breadth
When, blocked etch graphic joining required precision is very high.When equipment galvanometer precision is less than processing request and galvanometer precision reduces
Etching yield can be brought drastically to decline, for solving this problem, the present invention proposes a kind of silver paste laser-induced thermal etching graphic joining side
Method, when galvanometer precision is less than process requirements, carries out bending modification by the splice point that piecemeal graphic element is spliced, makes splicing
Require to reduce, meet processing request.
A kind of silver paste laser-induced thermal etching graphic joining method is it is characterised in that the figure of etching silver paste is more than galvanometer single process
Breadth.It is etched processing by silver paste figure is divided into multiple piecemeal figures less than galvanometer breadth, pattern primitive in etching
Element is divided in multiple piecemeals and is processed, and the figure of processing needs accurate splicing.It is characterized in that Etching is processed
In journey, the positioning precision due to galvanometer is less than the requirement of graphic element splicing.It is characterized in that etched figure is not being affected product
In the case of function, the end points of element in piecemeal graphic element is carried out on demand the modification of 0-360 degree folded at arbitrary angle.Its feature
The length being element end points bending in piecemeal graphic element is in the accuracy rating of processing request.
The present invention proposes a kind of silver paste laser-induced thermal etching graphic joining method, makes in large format high-precision laser etching and processing
Requirement to etching machines is greatly lowered, and process velocity greatly improves, and brings extraordinary economic benefit.
Brief description
Fig. 1 is silver paste laser-induced thermal etching graphic joining method flow schematic diagram.
Fig. 2 is the spacing schematic diagram of the two bullion roads etching lines of the present invention.
Fig. 3 is the silver-colored pass heel ITO etching line pitch schematic diagram of the present invention.
Fig. 4 is the spacing schematic diagram of two-wire+suspension block of the present invention.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1.
1st, the spacing of two laser link should be laser-induced thermal etching live width and retains silver wire width sum, two bullion road etching line
The spacing of bar will be in more than 0.12mm.
2nd, the minimum spacing of silver-colored pass heel ITO etching lines will be in more than 0.30mm；The design of two-wire+suspension block is minimum
Distance will be in more than 0.20mm.
It should be noted last that, above example, it is merely to illustrate technical scheme and unrestricted, although ginseng
According to preferred embodiment, the present invention has been described in detail, field it is to be appreciated by one skilled in the art that can be to the present invention's
Technical scheme is modified or equivalent, and without deviating from the spirit and scope of technical solution of the present invention, it all should be covered
In the middle of scope of the presently claimed invention.
Claims (6)
1. a kind of silver paste laser-induced thermal etching graphic joining method is it is characterised in that the figure of etching silver paste is more than galvanometer single process
Breadth.
2. it is etched processing by silver paste figure is divided into multiple piecemeal figures less than galvanometer breadth, graphic element in etching
It is divided in multiple piecemeals and is processed, the figure of processing needs accurate splicing.
3. a kind of silver paste laser-induced thermal etching graphic joining method according to claim 1 is it is characterised in that be suitable for Etching
In the course of processing, the positioning precision due to galvanometer is less than the requirement of graphic element splicing.
4. a kind of silver paste laser-induced thermal etching graphic joining method according to claim 1 is it is characterised in that exist etched figure
In the case of not affecting product function, the splice point of piecemeal graphic element splicing is modified.
5. a kind of silver paste laser-induced thermal etching graphic joining method according to claim 3 will be it is characterised in that block diagram will be etched
In shape element, the end points of element carries out the modification of 0-360 degree folded at arbitrary angle on demand.
6. a kind of silver paste laser-induced thermal etching graphic joining method according to claim 4 is it is characterised in that piecemeal graphic element
The length of middle element end points bending is in the accuracy rating of processing request.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610830908.4A CN106378533A (en) | 2016-09-20 | 2016-09-20 | Silver paste laser etched pattern splicing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610830908.4A CN106378533A (en) | 2016-09-20 | 2016-09-20 | Silver paste laser etched pattern splicing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106378533A true CN106378533A (en) | 2017-02-08 |
Family
ID=57936586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610830908.4A Pending CN106378533A (en) | 2016-09-20 | 2016-09-20 | Silver paste laser etched pattern splicing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106378533A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106944745A (en) * | 2017-04-22 | 2017-07-14 | 山东拜科通新材料科技有限公司 | A kind of laser processing for processing large format circuit |
| CN108108052A (en) * | 2017-12-26 | 2018-06-01 | 张家港康得新光电材料有限公司 | Laser joint patterning and its etching wiring method |
| CN108170309A (en) * | 2017-12-26 | 2018-06-15 | 张家港康得新光电材料有限公司 | Touch screen laser joint patterning and its etching wiring method |
| CN108620745A (en) * | 2018-04-10 | 2018-10-09 | 上海柏楚电子科技股份有限公司 | A kind of the coiled strip continuous cutter and its cutting method of short stroke cutting elongated workpieces |
| CN109014590A (en) * | 2018-08-09 | 2018-12-18 | 天弘激光（宿迁）有限公司 | A kind of super breadth free splicing processing method of laser-induced thermal etching |
| CN111168247A (en) * | 2020-01-16 | 2020-05-19 | 苏州天弘激光股份有限公司 | Double-track large-breadth high-speed touch screen laser etching system and method |
| CN111625153A (en) * | 2020-05-09 | 2020-09-04 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
| WO2021169349A1 (en) * | 2020-02-24 | 2021-09-02 | 苏州苏大维格科技集团股份有限公司 | Photoetching control method and apparatus and storage medium |
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| JP2011071533A (en) * | 2008-04-03 | 2011-04-07 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing multilayer printed circuit board |
| CN102033650A (en) * | 2010-09-29 | 2011-04-27 | 南京点面光电有限公司 | Method for performing laser etching on silver paste indium tin oxide film |
| CN102500930A (en) * | 2011-12-29 | 2012-06-20 | 苏州德龙激光有限公司 | Device and method for etching silver paste conducting film layer on printing ink by pulse laser |
| CN102528296A (en) * | 2012-01-06 | 2012-07-04 | 武汉吉事达激光技术有限公司 | Laser etching method for ITO (Indium Tin Oxide) silver paste |
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2016
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| JP2011071533A (en) * | 2008-04-03 | 2011-04-07 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing multilayer printed circuit board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106944745A (en) * | 2017-04-22 | 2017-07-14 | 山东拜科通新材料科技有限公司 | A kind of laser processing for processing large format circuit |
| CN108108052A (en) * | 2017-12-26 | 2018-06-01 | 张家港康得新光电材料有限公司 | Laser joint patterning and its etching wiring method |
| CN108170309A (en) * | 2017-12-26 | 2018-06-15 | 张家港康得新光电材料有限公司 | Touch screen laser joint patterning and its etching wiring method |
| CN108170309B (en) * | 2017-12-26 | 2021-10-26 | 张家港康得新光电材料有限公司 | Laser splicing pattern structure of touch screen and etching wiring method thereof |
| CN108620745A (en) * | 2018-04-10 | 2018-10-09 | 上海柏楚电子科技股份有限公司 | A kind of the coiled strip continuous cutter and its cutting method of short stroke cutting elongated workpieces |
| CN109014590A (en) * | 2018-08-09 | 2018-12-18 | 天弘激光（宿迁）有限公司 | A kind of super breadth free splicing processing method of laser-induced thermal etching |
| CN111168247A (en) * | 2020-01-16 | 2020-05-19 | 苏州天弘激光股份有限公司 | Double-track large-breadth high-speed touch screen laser etching system and method |
| CN111168247B (en) * | 2020-01-16 | 2021-05-11 | 苏州天弘激光股份有限公司 | Double-track large-breadth high-speed touch screen laser etching equipment |
| WO2021169349A1 (en) * | 2020-02-24 | 2021-09-02 | 苏州苏大维格科技集团股份有限公司 | Photoetching control method and apparatus and storage medium |
| CN111625153A (en) * | 2020-05-09 | 2020-09-04 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
| CN111625153B (en) * | 2020-05-09 | 2022-12-20 | 芜湖伦丰电子科技有限公司 | Touch device and method for improving yield of double-line laser splicing positions |
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Application publication date: 20170208 |