CN109392250A - A kind of method, splicing print structure and the application of oversize splicing printing - Google Patents

A kind of method, splicing print structure and the application of oversize splicing printing Download PDF

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Publication number
CN109392250A
CN109392250A CN201811201254.4A CN201811201254A CN109392250A CN 109392250 A CN109392250 A CN 109392250A CN 201811201254 A CN201811201254 A CN 201811201254A CN 109392250 A CN109392250 A CN 109392250A
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CN
China
Prior art keywords
ink
printing
splicing
printing zone
fpc
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811201254.4A
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Chinese (zh)
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CN109392250B (en
Inventor
贺强
廖健皓
荀志国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhangjiagang Kangdexin Optronics Material Co Ltd
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Zhangjiagang Kangdexin Optronics Material Co Ltd
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Priority to CN201811201254.4A priority Critical patent/CN109392250B/en
Publication of CN109392250A publication Critical patent/CN109392250A/en
Application granted granted Critical
Publication of CN109392250B publication Critical patent/CN109392250B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F17/00Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The present invention relates to touch-control display component technical fields, more particularly, to a kind of method of oversize splicing printing, splicing print structure and application.The method of the oversize splicing printing, includes the steps of determining that the critical point of substrate segmentation Printing Zone, prints ink in each segmentation Printing Zone of substrate, and the ink of adjacent sectional Printing Zone is located at the two sides of substrate;It sets up FPC between the adjacent sectional Printing Zone that there is interference routing region to put up a bridge, both ends are bound to the ink of the adjacent sectional Printing Zone respectively.The present invention prints ink in each segmentation Printing Zone, and the ink of adjacent sectional Printing Zone is located at the two sides of substrate, avoids the overlapping of ink at segmentation Printing Zone critical point;Also, there are FPC is set up between the adjacent sectional Printing Zone of interference routing region, the ink on substrate two sides is bound into electrical connection;In products such as following process touch screens, the FPC of external control panel can be set according to subsequent actual demand.

Description

A kind of method, splicing print structure and the application of oversize splicing printing
Technical field
The present invention relates to touch-control display component technical field, the method printed more particularly, to a kind of splicing of oversize, Splice print structure and application.
Background technique
With the continuous development of wisdom display system, the end product under novel retail business mode comes into being, large scale Touch-control all-in-one machine has become the indispensable a part of human-computer interaction.Core in large touch all-in-one machine is that large scale touches Screen, and large scale touch screen is promoted from large scale infrared type touch screen to large size capacitive touch screen.
The large size capacitive touch screen higher cost of existing market maturation.Existing single hop printing valid interval depends on The max die travel distance of printing equipment just needs after such as encountering practical printing zone greater than the max die travel distance of printing equipment Carry out segmentation printing;The mode of existing segmentation printing is to come practical printing zone based on single max die travel distance Point;The critical point of segmentation printing can not have silver paste printing ink overlapping region, and route is led to control eventually by FPC by each sectional area In making sheet.
However, the mode of existing segmentation printing is to come practical printing zone based on single max die travel distance Point, if the outgoing line position FPC is not in lower section middle, then it will appear the problem of actual segment number increases, and be segmented printing and face Boundary's point unavoidably has ink overlapping region.
In view of this, the present invention is specifically proposed.
Summary of the invention
The first object of the present invention is to provide a kind of method of oversize splicing printing, solves and divide in the prior art Section print pass is more, segmentation printing critical point has the technical issues of ink overlapping, and method of the present invention can effectively reduce It is segmented print pass, and is segmented critical point and is overlapped without ink, while reducing production cost, improves product quality.
The second object of the present invention is to provide a kind of spelling being prepared using the oversize splice-printing method Print structure is connect, the splicing print structure is overlapped without ink, and production cost is low, is suitable for large-scale production, has biggish warp Ji benefit.
The third object of the present invention is to provide a kind of application of splicing print structure, and the splicing print structure can It is used to prepare touch control display apparatus etc..
In order to realize above-mentioned purpose of the invention, the following technical scheme is adopted:
A kind of method of oversize splicing printing, includes the following steps:
(a) critical point for determining substrate segmentation Printing Zone prints ink, and adjacent sectional in each segmentation Printing Zone of substrate The ink of Printing Zone is located at the two sides of substrate;
(b) it sets up FPC between the adjacent sectional Printing Zone that there is interference routing region to put up a bridge, the both ends for making FPC put up a bridge It is bound to the ink of the adjacent sectional Printing Zone respectively.
Oversize splice-printing method of the present invention prints ink, and adjacent sectional in each segmentation Printing Zone The ink of Printing Zone is located at the two sides of substrate, avoids the overlapping of ink at segmentation Printing Zone critical point;Also, exist FPC is set up between the adjacent sectional Printing Zone for having interference routing region, the ink on substrate two sides is bound into electrical connection;Add subsequent When the products such as work touch screen, the FPC of external control panel can be set according to subsequent actual demand.
The mode of existing segmentation printing is to divide equally practical printing zone based on single max die travel distance, segmentation Printing critical point inevitably has ink overlapping region;Also, the case where according to subsequent external control IC, FPC wire outlet position Setting generally can not be in middle.
If FPC appearance position is not at middle, it is segmented printing process according to prior art, print pass is than normal print Brush number at least increases once.
And in the present invention, the ink in adjacent sectional Printing Zone is located at the two sides of substrate respectively, avoids segmentation print The overlapping of ink at area's critical point is brushed, meanwhile, FPC is set up between adjacent sectional Printing Zone, is at least reduced compared with the prior art One-step print number.
Preferably, the method for determining the critical point of substrate segmentation Printing Zone includes: to calculate according to formula z=int (x/y)+1 It is segmented number, according to the size that segmentation number respectively needs to print, determines critical point;
Wherein, x is the size of actual needs printing, and y is maximum effective printed dimensions, and z is segmentation number.
By int function, the effective printed dimensions of the maximum of the size and printing equipment printed according to actual needs, to Under take immediate integer, add 1 to obtain needing the number that is segmented, segmentation number minimized;The size printed will be needed to remove again To be segmented number, obtains every section of size x/z, determine critical point.
Preferably, the integer that the segmentation number z is >=2.
In the splicing printing of oversize structure, using splice-printing method of the invention, distinguish on the two sides of substrate Printing, avoids the overlapping at critical point.
Also, if only two sides is printed respectively, the case where for the outgoing line position FPC not at critical point, also need it is additional again Increase one-step print.
The present invention, the case where for the outgoing line position FPC not at critical point, in the adjacent sectional that there is interference routing region FPC bridging is set up between Printing Zone, is electrically connected two adjacent surfaces ink, reduces print pass, reduces process complexity and production Cost.
Preferably, it includes two binding areas that the FPC, which puts up a bridge,.
FPC puts up a bridge setting there are two area is bound, and increases binding area, and one of binding area is bound to a segmentation Printing Zone Ink, another binding area be bound to it is aforementioned segmentation Printing Zone adjacent sectional Printing Zone ink, avoiding at critical point Overlapping while, reduce print pass.
Preferably, in the step (b), using the method for hot pressing binding.
Preferably, the material that the FPC puts up a bridge includes any one of PET, COP, PVC, PEN and TPU.
The flexible parent metal that the FPC puts up a bridge enables bridging structure to be electrically connected the interference routing region on substrate two sides.
Preferably, the ink includes silver paste printing ink.It is furthermore preferred that the print thickness of the ink is 5-6 μm.
Preferably, the substrate includes any one of PET, PI, but not limited to this, it can be adjusted according to the actual situation It is whole.
The present invention also provides a kind of splicings that the method using the splicing printing of any of the above-described oversize is prepared Print structure.
Splicing print structure of the present invention is overlapped without ink, and production cost is low, is suitable for large-scale production, is had biggish Economic benefit.
The present invention also provides a kind of application of splicing print structure, the splicing print structure is used to prepare touch-control Display device.
Touch control display apparatus is prepared using splicing print structure of the present invention, can be arranged according to practical touch control procedure etc. Outlet FPC meets the actual demand of subsequent product without increasing print pass.
Compared with prior art, the invention has the benefit that
(1) oversize splice-printing method of the present invention avoids the weight of ink at segmentation Printing Zone critical point It is folded;There are FPC is set up between the adjacent sectional Printing Zone of interference routing region, the ink binding on substrate two sides is electrically connected It connects, reduces print pass;
(2) the splicing print structure being prepared using oversize splice-printing method of the present invention, subsequent When processing the products such as touch screen, the FPC of external control panel can be set according to subsequent actual demand, without increasing print pass;
(3) splicing print structure of the present invention without ink be overlapped, production cost is low, be suitable for large-scale production, have compared with Big economic benefit can be used for preparing touch control display apparatus etc..
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of splicing print structure provided in an embodiment of the present invention;
Fig. 2 is the enlarged structure schematic diagram in Fig. 1 at A;
Fig. 3 is the structural schematic diagram that the FPC of the embodiment of the present invention puts up a bridge;
Fig. 4 be another embodiment of the present invention provides splicing print structure structural schematic diagram.
Appended drawing reference:
1- substrate;2-FPC puts up a bridge;The external FPC of 3-;
11- critical point;21- binds area.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with the drawings and specific embodiments, but Be it will be understood to those of skill in the art that it is following described embodiments are some of the embodiments of the present invention, rather than it is whole Embodiment is merely to illustrate the present invention, and is not construed as limiting the scope of the invention.Based on the embodiments of the present invention, ability Domain those of ordinary skill every other embodiment obtained without making creative work, belongs to guarantor of the present invention The range of shield.The person that is not specified actual conditions in embodiment, carries out according to conventional conditions or manufacturer's recommended conditions.Agents useful for same Or production firm person is not specified in instrument, is the conventional products that can be obtained by commercially available purchase.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical", The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ", " third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition Concrete meaning in invention.
Fig. 1 is the structural schematic diagram of splicing print structure provided in an embodiment of the present invention;Fig. 2 is the amplification knot in Fig. 1 at A Structure schematic diagram;Fig. 3 is the structural schematic diagram that the FPC of the embodiment of the present invention puts up a bridge.Filled black represents cabling in figure.
The method of oversize splicing printing of the present invention, includes the following steps:
(a) it determines that substrate 1 is segmented the critical point 11 of Printing Zone, prints ink in each segmentation Printing Zone of substrate 1, and adjacent The ink of segmentation Printing Zone is located at the two sides of substrate 1;
(b) FPC bridging 2 is set up between the adjacent sectional Printing Zone that there is interference routing region, makes the two of FPC bridging 2 End is bound to the ink of the adjacent sectional Printing Zone respectively.
Wherein, the determination method of the critical point 11 includes: to calculate segmentation number, root according to formula z=int (x/y)+1 According to the size that segmentation number respectively needs to print, critical point is determined;X is the size of actual needs printing, and y is maximum effectively printing Size, z are segmentation number.
As can be known from Fig. 1, printed dimensions, maximum effective printed dimensions according to actual needs, after calculating segmentation number, respectively Printed dimensions are needed, critical point 11 is obtained.The actual needs of substrate 1 printed dimensions interval is divided into segmentation Printing Zone by critical point 11.
There are interference routing region adjacent sectional Printing Zone between set up FPC put up a bridge 2.Fig. 2 and Fig. 3 are please referred to, The FPC bridging 2 includes two binding areas 21.FPC puts up a bridge 2 settings there are two area 21 is bound, and increases binding area, one of them is tied up Determine the ink that area 21 is bound to a segmentation Printing Zone, another binding area 21 is bound to the adjacent sectional of aforementioned segmentation Printing Zone The ink of Printing Zone reduces print pass while avoiding the overlapping at critical point 11.Refer in the presence of interference routing region, The case where for the outgoing line position FPC not at critical point, adjacent sectional Printing Zone need the case where being electrically connected.
In step (b), the both ends of FPC bridging 2 are bound to by the adjacent sectional using the method for hot pressing binding respectively and are printed Brush the ink in area.
In different embodiments of the invention, the material that the FPC puts up a bridge includes in PET, COP, PVC, PEN and TPU It is any.The flexible parent metal that the FPC puts up a bridge, enables bridging structure that the interference routing region on substrate two sides is electrically connected It connects.
In different embodiments of the invention, the ink includes silver paste printing ink.It is furthermore preferred that the printing of the ink With a thickness of 5-6 μm.
In different embodiments of the invention, the substrate includes any one of PET, PI, but not limited to this.
The present invention also provides a kind of splicings that the method using the splicing printing of any of the above-described oversize is prepared Print structure.
The splicing print structure being prepared using the above method, can be used for preparing touch control display apparatus.
Embodiment 1
The method of the splicing printing of oversize described in the present embodiment, includes the following steps:
(1) segmentation number is calculated according to formula z=int (x/y)+1, according to the segmentation number size that respectively needs to print, Determine critical point;Wherein, x is the size of actual needs printing, and y is maximum effective printed dimensions, and z is segmentation number;Such as Fig. 1 institute Show, being such as segmented number is 2, determines critical point 11;The external outgoing line position FPC3 is not at the critical point divided equally;
(2) ink is printed in each segmentation Printing Zone of substrate 1, and the ink of adjacent sectional Printing Zone is located at substrate 1 Two sides, so as to avoid segmentation Printing Zone critical point at ink overlapping;The print thickness of ink can be according to actual needs It is adjusted, can be 5-6 μm;
According in step (1), segmentation number is 2 times, need to be printed 2 times;
(3) FPC bridging 2 is set up between the adjacent sectional Printing Zone that there is interference routing region, makes the two of FPC bridging 2 A binding area 21 is bound to the ink of the adjacent sectional Printing Zone respectively.
By above-mentioned splice-printing method, ink, and the ink of adjacent sectional Printing Zone are printed in each segmentation Printing Zone It is located at the two sides of substrate, avoids the overlapping of ink at segmentation Printing Zone critical point;Also, there are interference cabling area FPC is set up between the adjacent sectional Printing Zone in domain, the ink on substrate two sides is bound into electrical connection;It is produced in following process touch screen etc. When product, the FPC of external control panel can be set according to subsequent actual demand;Also, one-step print is at least reduced compared with the prior art Number.
Embodiment 2
The method of the splicing printing of oversize described in the present embodiment, includes the following steps:
(1) segmentation number is calculated according to formula z=int (x/y)+1, according to the segmentation number size that respectively needs to print, Determine critical point;Wherein, x is the size of actual needs printing, and y is maximum effective printed dimensions, and z is segmentation number;Such as Fig. 4 institute Show, being such as segmented number is 4, determines critical point 11;The external outgoing line position FPC3 is not at the critical point divided equally;
(2) ink is printed in each segmentation Printing Zone of substrate 1, and the ink of adjacent sectional Printing Zone is located at substrate 1 Two sides, so as to avoid segmentation Printing Zone critical point at ink overlapping;The print thickness of ink can be according to actual needs It is adjusted, can be 5-6 μm;
According in step (1), segmentation number is 4 times, need to be printed 4 times;
(3) FPC bridging 2 is set up between the adjacent sectional Printing Zone that there is interference routing region, makes the two of FPC bridging 2 A binding area 21 is bound to the ink of the adjacent sectional Printing Zone respectively.
Oversize splice-printing method of the present invention prints ink, and adjacent sectional in each segmentation Printing Zone The ink of Printing Zone is located at the two sides of substrate, avoids the overlapping of ink at segmentation Printing Zone critical point;Also, exist FPC is set up between the adjacent sectional Printing Zone for having interference routing region, the ink on substrate two sides is bound into electrical connection;Add subsequent When the products such as work touch screen, the FPC of external control panel can be set according to subsequent actual demand.
If FPC appearance position is not at middle, it is segmented printing process according to prior art, print pass is than normal print Brush number at least increases once.And in the present invention, the ink in adjacent sectional Printing Zone is located at the two sides of substrate respectively, keeps away Exempt from the overlapping for being segmented ink at the critical point of Printing Zone, meanwhile, FPC is set up between adjacent sectional Printing Zone, relatively existing skill Art at least reduces one-step print number.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution The range of scheme.

Claims (10)

1. a kind of method of oversize splicing printing, which comprises the steps of:
(a) critical point for determining substrate segmentation Printing Zone prints ink in each segmentation Printing Zone of substrate, and adjacent sectional is printed The ink in area is located at the two sides of substrate;
(b) it sets up FPC between the adjacent sectional Printing Zone that there is interference routing region to put up a bridge, the both ends difference for making FPC put up a bridge It is bound to the ink of the adjacent sectional Printing Zone.
2. the method for oversize splicing printing according to claim 1, which is characterized in that determine that substrate is segmented Printing Zone Critical point method include: according to formula z=int (x/y)+1 calculate segmentation number, according to segmentation number divide equally need to print Size, determine critical point;
Wherein, x is the size of actual needs printing, and y is maximum effective printed dimensions, and z is segmentation number.
3. the method for oversize splicing printing according to claim 1, which is characterized in that the segmentation number z is >=2 Integer.
4. the method for oversize splicing printing according to claim 1, which is characterized in that it includes two that the FPC, which puts up a bridge, A binding area.
5. the method for oversize splicing printing according to claim 1, which is characterized in that in the step (b), use The method of hot pressing binding.
6. the method for oversize splicing printing according to claim 1, which is characterized in that the material that the FPC puts up a bridge Including any one of PET, COP, PVC, PEN and TPU.
7. the method for oversize splicing printing according to claim 1, which is characterized in that the ink includes silver paste oil Ink;
Preferably, the print thickness of the ink is 5-6 μm.
8. the method for oversize splicing printing according to claim 1, which is characterized in that the substrate includes PET, PI Any one of.
9. the splicing printing knot being prepared using the method for the described in any item oversize splicing printings of claim 1-8 Structure.
10. application of the splicing print structure in touch control display apparatus field described in claim 9.
CN201811201254.4A 2018-10-16 2018-10-16 Oversized splicing printing method, splicing printing structure and application Active CN109392250B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113954516A (en) * 2021-12-01 2022-01-21 深圳市卓兴半导体科技有限公司 Partitioned precision printing equipment for substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6426983A (en) * 1987-07-23 1989-01-30 Sanyo Electric Co Printed circuit board checking device
CN2693460Y (en) * 2004-05-20 2005-04-20 李新忠 Common impression cylinder flexo press
CN202282909U (en) * 2011-11-09 2012-06-20 东莞市新东方光电技术有限公司 Backlight FPC

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6426983A (en) * 1987-07-23 1989-01-30 Sanyo Electric Co Printed circuit board checking device
CN2693460Y (en) * 2004-05-20 2005-04-20 李新忠 Common impression cylinder flexo press
CN202282909U (en) * 2011-11-09 2012-06-20 东莞市新东方光电技术有限公司 Backlight FPC

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113954516A (en) * 2021-12-01 2022-01-21 深圳市卓兴半导体科技有限公司 Partitioned precision printing equipment for substrate

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