CN108848619B - 复合铝基板及其生产工艺、led线路板 - Google Patents
复合铝基板及其生产工艺、led线路板 Download PDFInfo
- Publication number
- CN108848619B CN108848619B CN201810734750.XA CN201810734750A CN108848619B CN 108848619 B CN108848619 B CN 108848619B CN 201810734750 A CN201810734750 A CN 201810734750A CN 108848619 B CN108848619 B CN 108848619B
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- CN
- China
- Prior art keywords
- aluminum substrate
- composite aluminum
- aluminium sheet
- several
- production technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810734750.XA CN108848619B (zh) | 2018-07-06 | 2018-07-06 | 复合铝基板及其生产工艺、led线路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810734750.XA CN108848619B (zh) | 2018-07-06 | 2018-07-06 | 复合铝基板及其生产工艺、led线路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108848619A CN108848619A (zh) | 2018-11-20 |
CN108848619B true CN108848619B (zh) | 2019-09-17 |
Family
ID=64200310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810734750.XA Active CN108848619B (zh) | 2018-07-06 | 2018-07-06 | 复合铝基板及其生产工艺、led线路板 |
Country Status (1)
Country | Link |
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CN (1) | CN108848619B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111346967B (zh) * | 2020-05-14 | 2020-09-01 | 山东哈伊泰克广告标识有限公司 | 一种广告标识铝边带型材及制备工艺 |
CN113056104A (zh) * | 2021-04-01 | 2021-06-29 | 应淑娥 | 一种线路板的生产工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63274197A (ja) * | 1987-05-06 | 1988-11-11 | Mitsubishi Electric Corp | 金属芯印刷配線板 |
US20030137815A1 (en) * | 2002-01-18 | 2003-07-24 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and method of manufacturing the same |
CN206446211U (zh) * | 2017-02-08 | 2017-08-29 | 东莞市立基电子材料有限公司 | 一种高耐电压铝基覆铜板 |
CN107072048A (zh) * | 2017-03-24 | 2017-08-18 | 安徽林驰电子有限公司 | 一种单面铝基板的生产工艺优化方法 |
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2018
- 2018-07-06 CN CN201810734750.XA patent/CN108848619B/zh active Active
Also Published As
Publication number | Publication date |
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CN108848619A (zh) | 2018-11-20 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181126 Address after: 311300 Jincheng Street, Linan District, Hangzhou City, Zhejiang Province Applicant after: Zhejiang Junxuan Electronic Technology Co., Ltd. Address before: 322005 No. 75 Xiangyi Road, Yiting Town, Yiwu City, Jinhua City, Zhejiang Province Applicant before: Yiwu Bao Sun Electronic Technology Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210907 Address after: 310000 Qingyun Industrial Park, Taihuyuan Town, Lin'an District, Hangzhou City, Zhejiang Province Patentee after: Junxuan new material (Hangzhou) Co.,Ltd. Address before: 311300 Jincheng Street, Linan District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG JUNXUAN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |