CN108832291A - A substrate integrated waveguide filter antenna - Google Patents
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- H—ELECTRICITY
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Abstract
本发明涉及一种基片集成波导滤波天线,属于滤波天线技术领域,该天线包含上、下层介质基板,金属通孔,金属耦合探针,互补裂口谐振环,激励源和接地板;上、下层介质基板的表面为矩形,上、下层介质基板上下紧密贴合,上层介质基板的上表面设置有接地板,下层介质基板的上下表面均设置有接地板;金属通孔用来在上、下层介质基板上构成上、下谐振腔体的金属壁;互补裂口谐振环蚀刻在上层介质基板上表面的接地板上;金属耦合探针用以连接下层介质基板下表面的金属接地板和上层介质基板上表面的金属接地板;激励源包含依次连接的50欧姆微带线,共面波导和矩形槽。本发明滤波天线匹配良好,并且具有良好的带外抑制以及平坦的通带增益。
The invention relates to a substrate-integrated waveguide filter antenna, which belongs to the technical field of filter antennas. The antenna includes upper and lower dielectric substrates, metal through holes, metal coupling probes, complementary split resonant rings, excitation sources and grounding plates; upper and lower layers The surface of the dielectric substrate is rectangular, and the upper and lower dielectric substrates are closely attached. The upper surface of the upper dielectric substrate is provided with a grounding plate, and the upper and lower surfaces of the lower dielectric substrate are provided with a grounding plate; metal through holes are used to connect the upper and lower dielectric substrates. The metal walls that form the upper and lower resonant cavities on the substrate; the complementary split resonant ring is etched on the ground plate on the upper surface of the upper dielectric substrate; the metal coupling probe is used to connect the metal ground plate on the lower surface of the lower dielectric substrate and the upper dielectric substrate Metal ground plane on the surface; the excitation source consists of sequentially connected 50-ohm microstrip lines, coplanar waveguides and rectangular slots. The filter antenna of the invention has good matching, good out-of-band suppression and flat passband gain.
Description
技术领域technical field
本发明属于滤波天线技术领域,涉及一种基片集成波导滤波天线。The invention belongs to the technical field of filter antennas and relates to a substrate integrated waveguide filter antenna.
背景技术Background technique
近年来,随着通信设备小型化、紧凑化的发展,要求射频前端器件具备多功能化。天线与滤波器作为射频前端重要组成部分,其集成化、一体化设计受到了广泛的关注。具有带外抑制功能的滤波天线设计成为了当前的研究热点。In recent years, with the development of miniaturization and compactness of communication equipment, RF front-end devices are required to be multifunctional. Antennas and filters are important components of the RF front-end, and their integrated and integrated design has received extensive attention. The design of filter antenna with out-of-band suppression has become a current research hotspot.
发明内容Contents of the invention
有鉴于此,本发明的目的在于提供一种具有良好的带外抑制功能以及平坦的通带增益的一种基片集成波导滤波天线,同时实现天线剖面高度低,尺寸紧凑,易于与其他平面电路集成的目的。In view of this, the object of the present invention is to provide a kind of substrate integrated waveguide filter antenna with good out-of-band suppression function and flat passband gain, and realize antenna profile height is low simultaneously, and size is compact, and it is easy to integrate with other planar circuits integration purpose.
为达到上述目的,本发明提供如下技术方案:To achieve the above object, the present invention provides the following technical solutions:
一种基片集成波导滤波天线,该天线包含上、下层介质基板,金属通孔,金属耦合探针,互补裂口谐振环,激励源和接地板;A substrate-integrated waveguide filter antenna, which includes upper and lower dielectric substrates, metal through holes, metal coupling probes, complementary split resonant rings, excitation sources and grounding plates;
所述上、下层介质基板的表面为矩形,所述上、下层介质基板上下紧密贴合,上层介质基板的上表面设置有接地板,下层介质基板的上下表面均设置有接地板;The surfaces of the upper and lower dielectric substrates are rectangular, and the upper and lower dielectric substrates are closely attached up and down, the upper surface of the upper dielectric substrate is provided with a grounding plate, and the upper and lower surfaces of the lower dielectric substrate are provided with grounding plates;
所述金属通孔用来在所述上、下层介质基板上构成上、下谐振腔体的金属壁,上、下层介质基板的金属通孔位置不对称,构成上谐振腔体的金属通孔贯穿所述上层介质基板及其接地板,并呈直线分布在所述上层介质基板的四周,上层介质基板及其接地板,上层介质基板的金属通孔,下层介质基板上表面的接地板构成所述上谐振腔体;The metal through holes are used to form the metal walls of the upper and lower resonant cavities on the upper and lower dielectric substrates. The positions of the metal through holes of the upper and lower dielectric substrates are asymmetrical, and the metal through holes constituting the upper resonant cavity penetrate through The upper dielectric substrate and its grounding plate are distributed in a straight line around the upper dielectric substrate, the upper dielectric substrate and its grounding plate, the metal through holes of the upper dielectric substrate, and the grounding plate on the upper surface of the lower dielectric substrate constitute the Upper resonant cavity;
构成下谐振腔体的金属通孔贯穿所述下层介质基板及其上、下表面的接地板,并呈直线分布在所述下层介质基板的四周,下层介质基板及其上、下表面的接地板,下层介质基板的金属通孔构成所述下谐振腔体;The metal through holes constituting the lower resonant cavity run through the lower dielectric substrate and the grounding plates on its upper and lower surfaces, and are distributed in a straight line around the lower dielectric substrate, and the lower dielectric substrate and the grounding plates on its upper and lower surfaces , the metal through holes of the lower dielectric substrate constitute the lower resonant cavity;
所述互补裂口谐振环蚀刻在上层介质基板上表面的接地板上,所述互补裂口谐振环不闭合,所述互补裂口谐振环设置在靠近上层介质基板的金属通孔周围;The complementary split resonant ring is etched on the ground plate on the upper surface of the upper dielectric substrate, the complementary split resonant ring is not closed, and the complementary split resonant ring is arranged around the metal through hole close to the upper dielectric substrate;
所述金属耦合探针由下层介质基板下表面的接地板贯穿到上层介质基板上表面的接地板,金属耦合探针位置靠近互补裂口谐振环裂口处,用以连接下层介质基板下表面的金属接地板和上层介质基板上表面的金属接地板;The metal coupling probe penetrates from the ground plate on the lower surface of the lower dielectric substrate to the ground plate on the upper surface of the upper dielectric substrate, and the metal coupling probe is located close to the gap of the resonant ring with complementary gaps to connect the metal ground on the lower surface of the lower dielectric substrate. Metal ground plate on the upper surface of the floor and upper dielectric substrate;
所述激励源包含依次连接的50欧姆微带线,共面波导和矩形槽,所述50欧姆微带线,共面波导和矩形槽由外向内设置在所述下层介质基板下表面的接地板上。The excitation source includes sequentially connected 50-ohm microstrip lines, coplanar waveguides and rectangular slots, and the 50-ohm microstrip lines, coplanar waveguides and rectangular slots are arranged on the ground plate on the lower surface of the lower dielectric substrate from outside to inside superior.
进一步,所述上、下层介质基板为边长68mm的正方形,大小相同,厚度为1.575mm,三层所述接地板的完全覆盖所述上、下层介质基板的表面。Further, the upper and lower dielectric substrates are squares with a side length of 68 mm, the same size, and a thickness of 1.575 mm. The three layers of ground plates completely cover the surfaces of the upper and lower dielectric substrates.
进一步,所述上层介质基板的金属通孔的半径为0.5mm,金属通孔中心间间距为1.7mm,所述下层介质基板的金属通孔的半径为0.5mm,金属通孔中心间间距为1.8mm。Further, the radius of the metal through holes of the upper dielectric substrate is 0.5mm, and the distance between the centers of the metal through holes is 1.7mm; the radius of the metal through holes of the lower dielectric substrate is 0.5mm, and the distance between the centers of the metal through holes is 1.8 mm. mm.
进一步,所述互补裂口谐振环的宽边缝隙长度为42.6mm,宽边缝隙宽度为0.8mm,窄边缝隙长度为33.6mm,窄边缝隙宽度为1.5mm,互补裂口谐振环的裂口位置关于窄边中心对称,裂口长度为3mm。Further, the length of the wide-side slit of the complementary slit resonant ring is 42.6 mm, the width of the wide-side slit is 0.8 mm, the length of the narrow-side slit is 33.6 mm, and the width of the narrow-side slit is 1.5 mm. The center of the side is symmetrical, and the length of the gap is 3mm.
进一步,所述金属耦合探针半径为0.3mm,金属耦合探针距离互补裂口谐振环最近的宽边缝隙为12.1mm,窄边缝隙为1.7mm。Further, the radius of the metal coupling probe is 0.3 mm, the gap between the metal coupling probe and the complementary split resonant ring is 12.1 mm on the wide side, and the narrow side gap is 1.7 mm.
进一步,所述矩形槽关于共面波导馈线的中轴线镜像对称,所述50欧姆微带线长度为10.5mm,宽度为3mm,共面波导长度为15.7mm,宽度为3mm,共面波导的缝隙宽度为0.5mm,矩形槽长度为4.5mm,宽度为1.3mm。Further, the rectangular groove is mirror-symmetrical to the central axis of the coplanar waveguide feeder line, the length of the 50 ohm microstrip line is 10.5mm, and the width is 3mm, the length of the coplanar waveguide is 15.7mm, and the width is 3mm, and the gap of the coplanar waveguide The width is 0.5mm, the length of the rectangular slot is 4.5mm, and the width is 1.3mm.
本发明的有益效果在于:The beneficial effects of the present invention are:
1、通过在竖直放置的两块介质基板上分别构建谐振腔体,两个谐振之间通过金属耦合探针实现电磁能量的耦合,从而引入滤波的功能,为了形成有效的电磁能量辐射,采用在上层介质基板的上金属表面蚀刻互补裂口谐振环。1. By constructing resonant cavities on two vertically placed dielectric substrates, the coupling of electromagnetic energy is realized through metal coupling probes between the two resonators, thereby introducing the function of filtering. In order to form effective electromagnetic energy radiation, adopt A complementary split resonant ring is etched on the upper metal surface of the upper dielectric substrate.
2、滤波天线匹配良好,并且具有良好的带外抑制以及平坦的通带增益,峰值增益达到6.7dBi,-10dB阻抗带宽超过6%,使滤波天线可以应用于复杂电磁信号环境中。2. The filter antenna is well matched, and has good out-of-band rejection and flat passband gain. The peak gain reaches 6.7dBi, and the -10dB impedance bandwidth exceeds 6%, so that the filter antenna can be applied to complex electromagnetic signal environments.
3、滤波天线具有紧凑的结构,剖面高度仅为0.03λ0,易于加工集成。3. The filter antenna has a compact structure with a section height of only 0.03λ 0 , which is easy to process and integrate.
附图说明Description of drawings
为了使本发明的目的、技术方案和有益效果更加清楚,本发明提供如下附图进行说明:In order to make the purpose, technical scheme and beneficial effect of the present invention clearer, the present invention provides the following drawings for illustration:
图1为本发明滤波天线的整体结构三维视图;Fig. 1 is a three-dimensional view of the overall structure of the filter antenna of the present invention;
图2为本发明滤波天线上层金属接地板的俯视图;Fig. 2 is the top view of the upper metal ground plate of the filter antenna of the present invention;
图3为本发明滤波天线中层金属接地板的俯视图;Fig. 3 is the top view of the middle metal ground plate of the filter antenna of the present invention;
图4为本发明滤波天线下层金属接地板的俯视图;Fig. 4 is the top view of the metal ground plate of the lower floor of the filter antenna of the present invention;
图5为本发明滤波天线的S参数和可实现增益曲线图;Fig. 5 is the S parameter of filter antenna of the present invention and achievable gain graph;
图6为本发明滤波天线中心频点的E平面、H平面辐射场方向图。Fig. 6 is a radiation field diagram of the E plane and the H plane at the center frequency point of the filter antenna of the present invention.
具体实施方式Detailed ways
下面将结合附图,对本发明的优选实施例进行详细的描述。The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
一种基片集成波导滤波天线,包括两块介质基板1、2、金属通孔6、金属耦合探针8、互补裂口谐振环7、激励源、接地板等结构;两块介质基板竖直紧密贴合,下层介质基板2的上下表面均设置有金属材质的接地板4、5,而上层介质基板1仅有上表面设置有金属材质的接地板3;金属通孔6用来分别在上下基板上构成谐振腔体的金属壁,下腔体由下层介质基板2、下层介质基板2上下表面的接地板4、5、四周的金属通孔6组成,上腔体由上层介质基板1、上层介质基板1上表面接地板3、下层介质基板2的上表面接地板4、四周的金属通孔6组成;金属耦合探针8用以连接下层介质基板下表面的接地板和上层介质基板1上表面的接地板3;互补裂口谐振环7蚀刻在上层介质基板的上表面金属接地板上;激励源由50欧姆微带线9、共面波导馈线以10及蚀刻在下层介质基板下表面接地板上关于共面波导馈线中心对称的两个矩形槽11组成。A substrate-integrated waveguide filter antenna, including two dielectric substrates 1, 2, metal through holes 6, metal coupling probes 8, complementary split resonant ring 7, excitation source, grounding plate and other structures; the two dielectric substrates are vertically compact Bonding, the upper and lower surfaces of the lower dielectric substrate 2 are provided with metal grounding plates 4, 5, while the upper dielectric substrate 1 is only provided with a metal grounding plate 3 on the upper surface; metal through holes 6 are used to connect the upper and lower substrates respectively. The upper part constitutes the metal wall of the resonant cavity, the lower cavity consists of the lower dielectric substrate 2, the grounding plates 4, 5 on the upper and lower surfaces of the lower dielectric substrate 2, and the surrounding metal through holes 6, and the upper cavity consists of the upper dielectric substrate 1, the upper dielectric The ground plate 3 on the upper surface of the substrate 1, the ground plate 4 on the upper surface of the lower dielectric substrate 2, and the surrounding metal through holes 6; the metal coupling probe 8 is used to connect the ground plate on the lower surface of the lower dielectric substrate and the upper surface of the upper dielectric substrate 1 The ground plate 3; the complementary gap resonant ring 7 is etched on the upper surface metal ground plate of the upper dielectric substrate; the excitation source is composed of 50 ohm microstrip line 9, coplanar waveguide feeder line 10 and etched on the lower surface ground plate of the lower dielectric substrate It consists of two rectangular slots 11 symmetrical to the center of the coplanar waveguide feeder line.
两块介质基板竖直紧密贴合,下层介质基板的上下表面均设置接地板,下表面接地板尺寸为68mm×58mm,上表面接地板尺寸为68mm×68mm,相应介质基板的尺寸为68mm×68mm,厚度为1.575mm,上层介质基板的上表面设置接地板,上表面接地板尺寸为68mm×68mm,相应介质基板的尺寸为68mm×68mm,厚度为1.575mm。The two dielectric substrates are vertically attached tightly, and the upper and lower surfaces of the lower dielectric substrate are provided with grounding plates. The size of the grounding plate on the lower surface is 68mm×58mm, the size of the grounding plate on the upper surface is 68mm×68mm, and the size of the corresponding dielectric substrate is 68mm×68mm , the thickness is 1.575mm, the upper surface of the upper dielectric substrate is provided with a grounding plate, the size of the upper surface grounding plate is 68mm×68mm, the size of the corresponding dielectric substrate is 68mm×68mm, and the thickness is 1.575mm.
金属通孔组成的上下两谐振腔体,上谐振腔体由上层介质基板、上层介质基板上表面接地板、下层介质基板的上表面接地板、上层介质基板内的金属通孔组成,金属通孔半径为0.5mm,金属通孔中心间距为1.7mm,下谐振腔体由下层介质基板、下层介质基板上下表面接地板、下层介质基板内的金属通孔组成,金属通孔半径为0.5mm,金属通孔中心间距为1.8mm。Two upper and lower resonant cavities composed of metal through holes. The upper resonant cavity is composed of the upper dielectric substrate, the upper surface grounding plate of the upper dielectric substrate, the upper surface grounding plate of the lower dielectric substrate, and the metal through holes in the upper dielectric substrate. The metal through holes The radius is 0.5mm, and the distance between the centers of metal through holes is 1.7mm. The lower resonant cavity is composed of the lower dielectric substrate, the upper and lower surface grounding plates of the lower dielectric substrate, and the metal through holes in the lower dielectric substrate. The radius of the metal through hole is 0.5mm. The center-to-center spacing of the through-holes is 1.8mm.
互补裂口谐振环蚀刻在上层介质基板上表面接地板上,宽边缝隙长度为42.6mm,缝隙宽度为0.8mm,窄边缝隙长度为33.6mm,缝隙宽度为1.5mm,裂口位置处于窄边,关于窄边中心对称,裂口长度为3mm。The complementary split resonant ring is etched on the grounding plate on the upper surface of the upper dielectric substrate. The length of the gap on the wide side is 42.6 mm, the width of the gap is 0.8 mm, the length of the slot on the narrow side is 33.6 mm, and the width of the gap is 1.5 mm. The position of the gap is on the narrow side. The center of the narrow side is symmetrical, and the length of the gap is 3mm.
金属耦合探针由下层介质基板下表面接地板贯穿到上层介质基板上表面接地板,金属耦合探针位置靠近互补裂口谐振环裂口处,金属耦合探针半径为0.3mm,金属耦合探针距离互补裂口谐振环最近的宽边缝隙为12.1mm,窄边缝隙为1.7mm。The metal coupling probe runs through the ground plate on the lower surface of the lower dielectric substrate to the upper surface ground plate of the upper dielectric substrate. The position of the metal coupling probe is close to the gap of the complementary gap resonant ring. The radius of the metal coupling probe is 0.3mm, and the distance between the metal coupling probe is complementary The nearest wide-side gap of the split resonant ring is 12.1mm, and the narrow-side gap is 1.7mm.
激励源由50欧姆微带线、共面波导馈线以及蚀刻在下层介质基板下表面接地板上关于共面波导馈线中心对称的两个矩形槽组成,相应的50欧姆微带线长度为10.5mm,宽度为3mm,共面波导长度为15.7mm,宽度为3mm,缝隙宽度为0.5mm,矩形槽长度为4.5mm,宽度为1.3mm。The excitation source consists of a 50-ohm microstrip line, a coplanar waveguide feeder line, and two rectangular slots etched on the ground plate on the lower surface of the lower dielectric substrate, which are symmetrical to the center of the coplanar waveguide feeder line. The length of the corresponding 50-ohm microstrip line is 10.5mm. The width is 3mm, the length of the coplanar waveguide is 15.7mm, the width is 3mm, the slot width is 0.5mm, the length of the rectangular slot is 4.5mm, and the width is 1.3mm.
具体实施例specific embodiment
图1为本发明的滤波天线的整体结构三维视图,如图所示:本发明滤波天线,包括上层介质基板1、下层介质基板2、上层金属接地板3、中层金属接地板4、下层金属接地板5、金属通孔6、互补裂口谐振环7、金属耦合探针8、50欧姆微带线9、共面波导10、矩形槽11。1 is a three-dimensional view of the overall structure of the filter antenna of the present invention, as shown in the figure: the filter antenna of the present invention includes an upper dielectric substrate 1, a lower dielectric substrate 2, an upper metal ground plate 3, a middle metal ground plate 4, and a lower metal ground plate. Floor 5, metal via 6, complementary split resonant ring 7, metal coupling probe 8, 50 ohm microstrip line 9, coplanar waveguide 10, rectangular slot 11.
上层介质基板1的厚度为1.575mm,基板上表面紧贴上层金属接地板3,基板下表面紧贴中层金属接地板4,互补裂口谐振环蚀刻在上层金属接地板3上,上谐振腔体由上层介质基板1、上层金属接地板3、中层金属接地板4、金属通孔组成,金属耦合探针8直接连接下层金属接地板5和上层金属接地板3。The thickness of the upper dielectric substrate 1 is 1.575 mm, the upper surface of the substrate is close to the upper metal ground plate 3, the lower surface of the substrate is close to the middle metal ground plate 4, the complementary split resonant ring is etched on the upper metal ground plate 3, and the upper resonant cavity is formed by The upper dielectric substrate 1 , the upper metal ground plate 3 , the middle metal ground plate 4 , and metal through holes, the metal coupling probe 8 directly connects the lower metal ground plate 5 and the upper metal ground plate 3 .
下层介质基板2的厚度为1.575mm,基板上表面紧贴中层金属接地板4,下表面紧贴下层金属接地板5,下谐振腔体由下层介质基板2、中层金属接地板4、下层金属接地板5、金属通孔组层,激励源是由50欧姆微带线9、共面波导10、矩形槽11组成。The thickness of the lower dielectric substrate 2 is 1.575mm. The upper surface of the substrate is close to the middle metal ground plate 4, and the lower surface is close to the lower metal ground plate 5. The lower resonant cavity is composed of the lower dielectric substrate 2, the middle metal ground plate 4, and the lower metal ground plate. The floor 5, the metal through-hole group layer, the excitation source is composed of a 50 ohm microstrip line 9, a coplanar waveguide 10, and a rectangular slot 11.
上层介质基板1和下层介质基板2两个介质基板竖直紧密贴合,材料均选用了TheRogers Duroid 5880,相对介电常数为2.2,相对磁导率为1.0,损耗角正切为0.0009。The two dielectric substrates, the upper dielectric substrate 1 and the lower dielectric substrate 2, are vertically and tightly bonded. The material is TheRogers Duroid 5880, the relative permittivity is 2.2, the relative permeability is 1.0, and the loss tangent is 0.0009.
金属接地板、50欧姆微带线金属条带均为厚度相同的覆铜薄膜。The metal ground plate and the 50-ohm microstrip line metal strips are all copper-clad films with the same thickness.
完成上述的初始设计之后,使用高频电磁仿真软件HFSS13.0进行仿真分析,经过仿真优化之后得到各项参数尺寸如下表所示:After completing the above initial design, use the high-frequency electromagnetic simulation software HFSS13.0 for simulation analysis. After simulation optimization, the parameters and sizes are obtained as shown in the following table:
参照附图2、3、4,W1、L1分别代表下谐振腔体的宽度和长度,W2、L2分别代表上谐振腔体的宽度和长度,Wp、Lp分别代表互补裂口谐振环的宽度和长度,gy、gx分别代表互补裂口谐振环缝隙宽度,d、s分别代表金属通孔的直接和金属通孔之间的间距,p代表金属耦合探针直径,fw代表共面波导的宽度,pw代表共面波导缝隙宽度,mw、ml代表矩形槽的宽度和长度。Referring to accompanying drawings 2, 3 and 4, W1 and L1 represent the width and length of the lower resonant cavity respectively, W2 and L2 represent the width and length of the upper resonant cavity respectively, and Wp and Lp represent the width and length of the complementary split resonant ring respectively , gy and gx respectively represent the gap width of the complementary split resonant ring, d and s represent the distance between the metal vias and the metal vias respectively, p represents the diameter of the metal coupling probe, fw represents the width of the coplanar waveguide, and pw represents Coplanar waveguide slot width, mw, ml represent the width and length of the rectangular slot.
表1本发明各参数最佳尺寸表Table 1 The optimal size table of each parameter of the present invention
依照上述参数,使用HFSS对所设计的一种基片集成波导滤波天线的反射系数|S11|特性参数和可实现增益进行仿真分析,其分析结果如下:According to the above parameters, HFSS is used to simulate and analyze the reflection coefficient |S 11 | characteristic parameters and achievable gain of a substrate-integrated waveguide filter antenna designed. The analysis results are as follows:
图5为本发明的仿真得到的S参数和可实现增益随频率变化的曲线图。如图所示,所涉及的天线工作频段为2.855GHz~3.040GHz,谐振中心频点为2.95GHz,-10dB带宽为185MHz;从可实现增益曲线可以看出,可实现增益曲线具有良好的带外抑制功能,最大增益为7.18dBi,且通带内增益较为平坦。图6为仿真的天线在谐振频点2.95GHz时分别在E面和H面的方向图,从图中可以看出,天线具有良好的边射辐射特性。Fig. 5 is a graph of S parameters and achievable gain varying with frequency obtained from the simulation of the present invention. As shown in the figure, the working frequency band of the antenna involved is 2.855GHz to 3.040GHz, the resonance center frequency is 2.95GHz, and the -10dB bandwidth is 185MHz; it can be seen from the achievable gain curve that the achievable gain curve has a good out-of-band Suppression function, the maximum gain is 7.18dBi, and the gain in the passband is relatively flat. Figure 6 is the radiation pattern of the simulated antenna on the E plane and the H plane respectively at the resonant frequency point of 2.95 GHz. It can be seen from the figure that the antenna has good side-firing radiation characteristics.
最后说明的是,以上优选实施例仅用以说明发明的技术方案而非限制,尽管通过上述优选实施例已经对本发明进行了详细的描述,但本领域技术人员应当理解,可以在形式上和细节上对其作出各种各样的改变,而不偏离本发明权利要求书所限定的范围。Finally, it is noted that the above preferred embodiments are only used to illustrate the technical solutions of the invention and not limit them. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that it may be possible in form and details. Various changes can be made to it without departing from the scope defined by the claims of the present invention.
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