CN108832291B - Substrate integrated waveguide filter antenna - Google Patents
Substrate integrated waveguide filter antenna Download PDFInfo
- Publication number
- CN108832291B CN108832291B CN201810661593.4A CN201810661593A CN108832291B CN 108832291 B CN108832291 B CN 108832291B CN 201810661593 A CN201810661593 A CN 201810661593A CN 108832291 B CN108832291 B CN 108832291B
- Authority
- CN
- China
- Prior art keywords
- dielectric substrate
- metal
- grounding plate
- substrate
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 135
- 239000002184 metal Substances 0.000 claims abstract description 98
- 230000000295 complement effect Effects 0.000 claims abstract description 28
- 230000008878 coupling Effects 0.000 claims abstract description 25
- 238000010168 coupling process Methods 0.000 claims abstract description 25
- 238000005859 coupling reaction Methods 0.000 claims abstract description 25
- 239000000523 sample Substances 0.000 claims abstract description 24
- 230000005284 excitation Effects 0.000 claims abstract description 10
- 238000001914 filtration Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention relates to a substrate integrated waveguide filter antenna, which belongs to the technical field of filter antennas and comprises an upper dielectric substrate, a lower dielectric substrate, a metal through hole, a metal coupling probe, a complementary split resonant ring, an excitation source and a ground plate; the surfaces of the upper layer dielectric substrate and the lower layer dielectric substrate are rectangular, the upper layer dielectric substrate and the lower layer dielectric substrate are tightly attached up and down, the upper surface of the upper layer dielectric substrate is provided with a grounding plate, and the upper surface and the lower surface of the lower layer dielectric substrate are both provided with grounding plates; the metal through hole is used for forming metal walls of the upper resonant cavity and the lower resonant cavity on the upper dielectric substrate and the lower dielectric substrate; the complementary split resonant ring is etched on the grounding plate on the upper surface of the upper-layer dielectric substrate; the metal coupling probe is used for connecting the metal grounding plate on the lower surface of the lower dielectric substrate and the metal grounding plate on the upper surface of the upper dielectric substrate; the excitation source comprises a 50 ohm microstrip line, a coplanar waveguide and a rectangular groove which are connected in sequence. The filter antenna has good matching, good out-of-band rejection and flat passband gain.
Description
Technical Field
The invention belongs to the technical field of filter antennas, and relates to a substrate integrated waveguide filter antenna.
Background
In recent years, with the progress of miniaturization and compactness of communication equipment, there is a demand for a multi-functional rf front-end device. The antenna and the filter are important components of the radio frequency front end, and the integrated and integrated design of the antenna and the filter is concerned widely. The design of a filter antenna with out-of-band rejection function has become a current research hotspot.
Disclosure of Invention
In view of the above, the present invention provides a substrate integrated waveguide filter antenna with good out-of-band rejection and flat passband gain, and achieves the objectives of low profile, compact size, and easy integration with other planar circuits.
In order to achieve the purpose, the invention provides the following technical scheme:
a substrate integrated waveguide filter antenna comprises an upper dielectric substrate, a lower dielectric substrate, a metal through hole, a metal coupling probe, a complementary split resonant ring, an excitation source and a grounding plate;
the surfaces of the upper and lower dielectric substrates are rectangular, the upper and lower dielectric substrates are tightly attached up and down, the upper surface of the upper dielectric substrate is provided with a grounding plate, and the upper and lower surfaces of the lower dielectric substrate are both provided with grounding plates;
the metal through holes are used for forming metal walls of an upper resonant cavity and a lower resonant cavity on the upper dielectric substrate and the lower dielectric substrate, the metal through holes of the upper dielectric substrate and the lower dielectric substrate are asymmetric in position, the metal through holes forming the upper resonant cavity penetrate through the upper dielectric substrate and the grounding plate thereof and are linearly distributed on the periphery of the upper dielectric substrate, the upper dielectric substrate and the grounding plate thereof, the metal through holes of the upper dielectric substrate and the grounding plate on the upper surface of the lower dielectric substrate form the upper resonant cavity;
the metal through holes forming the lower resonant cavity penetrate through the lower-layer dielectric substrate and the grounding plates on the upper surface and the lower surface of the lower-layer dielectric substrate and are linearly distributed on the periphery of the lower-layer dielectric substrate, the lower-layer dielectric substrate and the grounding plates on the upper surface and the lower surface of the lower-layer dielectric substrate, and the metal through holes of the lower-layer dielectric substrate form the lower resonant cavity;
the complementary split resonant ring is etched on the grounding plate on the upper surface of the upper-layer dielectric substrate, the complementary split resonant ring is not closed, and the complementary split resonant ring is arranged around the metal through hole close to the upper-layer dielectric substrate;
the metal coupling probe penetrates through the grounding plate on the lower surface of the lower dielectric substrate to the grounding plate on the upper surface of the upper dielectric substrate, and the metal coupling probe is close to the crack of the complementary split resonant ring and used for connecting the metal grounding plate on the lower surface of the lower dielectric substrate and the metal grounding plate on the upper surface of the upper dielectric substrate;
the excitation source comprises a 50 ohm microstrip line, a coplanar waveguide and a rectangular groove which are connected in sequence, wherein the 50 ohm microstrip line, the coplanar waveguide and the rectangular groove are arranged on the grounding plate on the lower surface of the lower-layer dielectric substrate from outside to inside.
Furthermore, the upper and lower dielectric substrates are square with the side length of 68mm, the size is the same, the thickness is 1.575mm, and the three layers of the grounding plates completely cover the surfaces of the upper and lower dielectric substrates.
Furthermore, the radius of the metal through holes of the upper-layer dielectric substrate is 0.5mm, the distance between the centers of the metal through holes is 1.7mm, the radius of the metal through holes of the lower-layer dielectric substrate is 0.5mm, and the distance between the centers of the metal through holes is 1.8 mm.
Further, the length of the wide-side gap of the complementary split resonant ring is 42.6mm, the width of the wide-side gap is 0.8mm, the length of the narrow-side gap is 33.6mm, the width of the narrow-side gap is 1.5mm, the split position of the complementary split resonant ring is symmetrical about the center of the narrow side, and the split length is 3 mm.
Further, the radius of the metal coupling probe is 0.3mm, the width gap of the metal coupling probe closest to the complementary split resonant ring is 12.1mm, and the width gap is 1.7 mm.
Further, the rectangular groove is mirror-symmetrical about the central axis of the coplanar waveguide feeder, the length of the 50-ohm microstrip line is 10.5mm, the width of the 50-ohm microstrip line is 3mm, the length of the coplanar waveguide is 15.7mm, the width of the coplanar waveguide is 3mm, the gap width of the coplanar waveguide is 0.5mm, the length of the rectangular groove is 4.5mm, and the width of the rectangular groove is 1.3 mm.
The invention has the beneficial effects that:
1. the resonant cavities are respectively constructed on the two vertically placed dielectric substrates, the coupling of electromagnetic energy is realized between the two resonances through the metal coupling probe, so that the filtering function is introduced, and in order to form effective electromagnetic energy radiation, a complementary split resonant ring is etched on the upper metal surface of the upper-layer dielectric substrate.
2. The filter antenna has good matching, good out-of-band rejection and flat passband gain, the peak gain reaches 6.7dBi, the-10 dB impedance bandwidth exceeds 6 percent, and the filter antenna can be applied to a complex electromagnetic signal environment.
3. The filter antenna has compact structure and cross-sectional height of 0.03 lambda0And the processing and integration are easy.
Drawings
In order to make the object, technical scheme and beneficial effect of the invention more clear, the invention provides the following drawings for explanation:
fig. 1 is a three-dimensional view of the overall structure of the filtering antenna of the present invention;
fig. 2 is a top view of an upper metal ground plate of a filtering antenna according to the present invention;
FIG. 3 is a top view of a metal ground plate in a layer of the filtering antenna of the present invention;
fig. 4 is a top view of the lower metal ground plate of the filtering antenna of the present invention;
FIG. 5 is a graph of S-parameters and achievable gain for a filtering antenna of the present invention;
fig. 6 shows E-plane and H-plane radiation field patterns of the central frequency point of the filter antenna according to the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
A substrate integrated waveguide filter antenna comprises two dielectric substrates 1 and 2, a metal through hole 6, a metal coupling probe 8, a complementary split resonant ring 7, an excitation source, a grounding plate and other structures; the two dielectric substrates are vertically and tightly attached, the upper surface and the lower surface of the lower dielectric substrate 2 are both provided with metal grounding plates 4 and 5, and only the upper surface of the upper dielectric substrate 1 is provided with a metal grounding plate 3; the metal through holes 6 are used for forming metal walls of the resonant cavity on the upper substrate and the lower substrate respectively, the lower cavity is composed of a lower dielectric substrate 2, grounding plates 4 and 5 on the upper surface and the lower surface of the lower dielectric substrate 2 and metal through holes 6 on the periphery, and the upper cavity is composed of an upper dielectric substrate 1, a grounding plate 3 on the upper surface of the upper dielectric substrate 1, a grounding plate 4 on the upper surface of the lower dielectric substrate 2 and metal through holes 6 on the periphery; the metal coupling probe 8 is used for connecting the grounding plate on the lower surface of the lower dielectric substrate and the grounding plate 3 on the upper surface of the upper dielectric substrate 1; the complementary split resonant ring 7 is etched on the metal grounding plate on the upper surface of the upper dielectric substrate; the excitation source consists of a 50 ohm microstrip line 9, a coplanar waveguide feeder line 10 and two rectangular grooves 11 which are etched on a ground plate on the lower surface of the lower-layer dielectric substrate and are symmetrical about the center of the coplanar waveguide feeder line.
Two vertical inseparable laminating of dielectric substrate, the upper and lower surface of lower floor's dielectric substrate all sets up the ground plate, lower surface ground plate size is 68mm 58mm, upper surface ground plate size is 68mm, corresponding dielectric substrate size is 68mm, thickness is 1.575mm, the upper surface of upper dielectric substrate sets up the ground plate, upper surface ground plate size is 68mm, corresponding dielectric substrate size is 68mm, thickness is 1.575 mm.
The upper resonant cavity body and the lower resonant cavity body are composed of an upper medium substrate, an upper surface grounding plate of the upper medium substrate, an upper surface grounding plate of a lower medium substrate and metal through holes in the upper medium substrate, the radius of each metal through hole is 0.5mm, the center distance between every two metal through holes is 1.7mm, the lower resonant cavity body is composed of a lower medium substrate, upper and lower surface grounding plates of the lower medium substrate and metal through holes in the lower medium substrate, the radius of each metal through hole is 0.5mm, and the center distance between every two metal through holes is 1.8 mm.
The complementary split resonant ring is etched on the upper surface ground plate of the upper-layer dielectric substrate, the length of a wide-edge gap is 42.6mm, the width of the gap is 0.8mm, the length of a narrow-edge gap is 33.6mm, the width of the gap is 1.5mm, the split position is located on a narrow edge, the narrow edge is centrosymmetric, and the split length is 3 mm.
The metal coupling probe penetrates through the grounding plate on the lower surface of the lower medium substrate to the grounding plate on the upper surface of the upper medium substrate, the position of the metal coupling probe is close to the crack of the complementary split resonant ring, the radius of the metal coupling probe is 0.3mm, the width gap of the metal coupling probe closest to the complementary split resonant ring is 12.1mm, and the width gap of the metal coupling probe is 1.7 mm.
The excitation source consists of a 50 ohm microstrip line, a coplanar waveguide feeder line and two rectangular grooves which are etched on a ground plate on the lower surface of the lower medium substrate and are symmetrical about the center of the coplanar waveguide feeder line, the length of the corresponding 50 ohm microstrip line is 10.5mm, the width of the corresponding 50 ohm microstrip line is 3mm, the length of the coplanar waveguide is 15.7mm, the width of the corresponding coplanar waveguide line is 3mm, the width of the corresponding slot is 0.5mm, the length of the rectangular groove is 4.5mm, and the width of the rectangular groove is 1.3 mm.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Fig. 1 is a three-dimensional view of the overall structure of the filtering antenna of the present invention, as shown in the figure: the invention relates to a filter antenna, which comprises an upper-layer dielectric substrate 1, a lower-layer dielectric substrate 2, an upper-layer metal grounding plate 3, a middle-layer metal grounding plate 4, a lower-layer metal grounding plate 5, a metal through hole 6, a complementary split resonant ring 7, a metal coupling probe 8, a 50-ohm microstrip line 9, a coplanar waveguide 10 and a rectangular groove 11.
The thickness of the upper dielectric substrate 1 is 1.575mm, the upper surface of the substrate is tightly attached to the upper metal grounding plate 3, the lower surface of the substrate is tightly attached to the middle metal grounding plate 4, the complementary split resonant ring is etched on the upper metal grounding plate 3, the upper resonant cavity is composed of the upper dielectric substrate 1, the upper metal grounding plate 3, the middle metal grounding plate 4 and metal through holes, and the metal coupling probe 8 is directly connected with the lower metal grounding plate 5 and the upper metal grounding plate 3.
The thickness of the lower dielectric substrate 2 is 1.575mm, the upper surface of the substrate is tightly attached to the middle metal grounding plate 4, the lower surface of the substrate is tightly attached to the lower metal grounding plate 5, the lower resonant cavity is composed of the lower dielectric substrate 2, the middle metal grounding plate 4, the lower metal grounding plate 5 and a metal through hole group layer, and the excitation source is composed of a 50 ohm microstrip line 9, a coplanar waveguide 10 and a rectangular groove 11.
The upper dielectric substrate 1 and the lower dielectric substrate 2 are vertically and tightly attached, the materials are both selected from TheRogers Duroid 5880, the relative dielectric constant is 2.2, the relative magnetic permeability is 1.0, and the loss tangent is 0.0009.
The metal grounding plate and the 50 ohm microstrip line metal strip are copper-clad films with the same thickness.
After the initial design is completed, high-frequency electromagnetic simulation software HFSS13.0 is used for simulation analysis, and the dimensions of various parameters obtained after simulation optimization are shown in the following table:
referring to fig. 2, 3 and 4, W1 and L1 respectively represent the width and length of the lower resonant cavity, W2 and L2 respectively represent the width and length of the upper resonant cavity, Wp and Lp respectively represent the width and length of the complementary split resonant ring, gy and gx respectively represent the gap width of the complementary split resonant ring, d and s respectively represent the distance between the metal via and the metal via, p represents the diameter of the metal coupling probe, fw represents the width of the coplanar waveguide, pw represents the gap width of the coplanar waveguide, and mw and ml represent the width and length of the rectangular slot.
TABLE 1 table of optimum dimensions for various parameters of the invention
Using HFSS for the reflection coefficient | S of a substrate integrated waveguide filter antenna designed in accordance with the parameters11And carrying out simulation analysis on the characteristic parameters and the achievable gains, wherein the analysis result is as follows:
fig. 5 is a graph of simulated S-parameters and achievable gain versus frequency for the present invention. As shown in the figure, the working frequency band of the related antenna is 2.855 GHz-3.040 GHz, the resonance center frequency point is 2.95GHz, and the-10 dB bandwidth is 185 MHz; as can be seen from the achievable gain curve, the achievable gain curve has a good out-of-band rejection function, the maximum gain is 7.18dBi, and the gain in the pass band is relatively flat. Fig. 6 is a diagram of the patterns of the simulated antenna on the E plane and the H plane respectively at the resonant frequency of 2.95GHz, and it can be seen from the diagram that the antenna has good edge-emitting radiation characteristics.
Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims (6)
1. A substrate integrated waveguide filter antenna, comprising: the antenna comprises an upper dielectric substrate, a lower dielectric substrate, a metal through hole, a metal coupling probe, a complementary split resonant ring, an excitation source and a grounding plate;
the surfaces of the upper and lower dielectric substrates are rectangular, the upper and lower dielectric substrates are tightly attached up and down, the upper surface of the upper dielectric substrate is provided with a grounding plate, and the upper and lower surfaces of the lower dielectric substrate are both provided with grounding plates;
the metal through holes are used for forming metal walls of an upper resonant cavity and a lower resonant cavity on the upper dielectric substrate and the lower dielectric substrate, the metal through holes of the upper dielectric substrate and the lower dielectric substrate are not overlapped in position, the metal through holes forming the upper resonant cavity penetrate through the upper dielectric substrate and the grounding plate thereof and are linearly distributed on the periphery of the upper dielectric substrate, the upper dielectric substrate and the grounding plate thereof, the metal through holes of the upper dielectric substrate and the grounding plate on the upper surface of the lower dielectric substrate form the upper resonant cavity;
the metal through holes forming the lower resonant cavity penetrate through the lower-layer dielectric substrate and the grounding plates on the upper surface and the lower surface of the lower-layer dielectric substrate and are linearly distributed on the periphery of the lower-layer dielectric substrate, the lower-layer dielectric substrate and the grounding plates on the upper surface and the lower surface of the lower-layer dielectric substrate, and the metal through holes of the lower-layer dielectric substrate form the lower resonant cavity;
the complementary split resonant ring is etched on the grounding plate on the upper surface of the upper-layer dielectric substrate, the complementary split resonant ring is not closed, and the complementary split resonant ring is arranged around the metal through hole close to the upper-layer dielectric substrate;
the metal coupling probe penetrates through the grounding plate on the lower surface of the lower dielectric substrate to the grounding plate on the upper surface of the upper dielectric substrate, and the metal coupling probe is close to the crack of the complementary split resonant ring and used for connecting the metal grounding plate on the lower surface of the lower dielectric substrate and the metal grounding plate on the upper surface of the upper dielectric substrate;
the excitation source comprises a 50 ohm microstrip line, a coplanar waveguide and a rectangular groove which are connected in sequence, wherein the 50 ohm microstrip line, the coplanar waveguide and the rectangular groove are arranged on the grounding plate on the lower surface of the lower-layer dielectric substrate from outside to inside.
2. The substrate integrated waveguide filter antenna of claim 1, wherein: the upper and lower dielectric substrates are square with the side length of 68mm, the size is the same, and the thickness is 1.575 mm.
3. The substrate integrated waveguide filter antenna of claim 1, wherein: the radius of the metal through holes of the upper-layer dielectric substrate is 0.5mm, the distance between the centers of the metal through holes is 1.7mm, the radius of the metal through holes of the lower-layer dielectric substrate is 0.5mm, and the distance between the centers of the metal through holes is 1.8 mm.
4. The substrate integrated waveguide filter antenna of claim 1, wherein: the length of a wide-edge gap of the complementary split resonant ring is 42.6mm, the width of the wide-edge gap is 0.8mm, the length of a narrow-edge gap is 33.6mm, the width of the narrow-edge gap is 1.5mm, the split position of the complementary split resonant ring is symmetrical about the center of the narrow edge, and the length of the split is 3 mm.
5. The substrate integrated waveguide filter antenna of claim 4, wherein: the radius of the metal coupling probe is 0.3mm, the width gap of the metal coupling probe closest to the complementary split resonant ring is 12.1mm, and the width gap of the metal coupling probe is 1.7 mm.
6. The substrate integrated waveguide filter antenna of claim 1, wherein: the rectangular groove is mirror symmetry about the central axis of the coplanar waveguide feeder, the length of the 50 ohm microstrip line is 10.5mm, the width of the 50 ohm microstrip line is 3mm, the length of the coplanar waveguide is 15.7mm, the width of the coplanar waveguide is 3mm, the width of the slot of the coplanar waveguide is 0.5mm, the length of the rectangular groove is 4.5mm, and the width of the rectangular groove is 1.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810661593.4A CN108832291B (en) | 2018-06-25 | 2018-06-25 | Substrate integrated waveguide filter antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810661593.4A CN108832291B (en) | 2018-06-25 | 2018-06-25 | Substrate integrated waveguide filter antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108832291A CN108832291A (en) | 2018-11-16 |
| CN108832291B true CN108832291B (en) | 2020-05-19 |
Family
ID=64138526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810661593.4A Active CN108832291B (en) | 2018-06-25 | 2018-06-25 | Substrate integrated waveguide filter antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108832291B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109728425B (en) * | 2018-12-18 | 2020-06-19 | 南通大学 | Dual-polarized filtering patch antenna |
| CN109818142A (en) * | 2018-12-31 | 2019-05-28 | 瑞声科技（南京）有限公司 | A kind of filter antenna |
| CN110137637A (en) * | 2019-04-24 | 2019-08-16 | 广东曼克维通信科技有限公司 | A kind of LTCC miniaturized substrate integrated waveguide filter |
| CN110459858B (en) * | 2019-06-30 | 2021-04-13 | 南通大学 | Filtering antenna based on substrate integrated cavity |
| CN111628282B (en) * | 2020-06-02 | 2021-06-15 | 北京邮电大学 | Vertical feed's dual-frenquency filtering patch antenna |
| CN112003018A (en) * | 2020-08-26 | 2020-11-27 | 维沃移动通信有限公司 | Electronic device |
| CN113097711B (en) * | 2021-03-31 | 2022-06-14 | 华南理工大学 | Substrate integrated waveguide filter antenna with high selective radiation efficiency |
| CN113340452B (en) * | 2021-04-14 | 2024-06-18 | 中北大学 | Wireless passive high-sensitivity high-temperature sensor based on improved CSRR-SICW |
| CN113300100A (en) * | 2021-05-25 | 2021-08-24 | 内蒙古显鸿科技股份有限公司 | Tunable microstrip antenna device |
| CN113922091B (en) * | 2021-09-24 | 2023-12-12 | 南京邮电大学 | Dual-frequency broadband filter antenna based on microstrip patch and substrate integrated waveguide resonator |
| CN115051154B (en) * | 2022-07-27 | 2023-07-18 | 重庆邮电大学 | Differential broadband end-fire filter antenna based on open stepped slot |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2258022A1 (en) * | 2008-03-18 | 2010-12-08 | Cheng, Shi | Substrate integrated waveguide |
| CN201956463U (en) * | 2010-12-23 | 2011-08-31 | 东南大学 | Millimeter-wave wave filtering antenna with substrate integrated waveguide |
| CN107104275A (en) * | 2017-04-10 | 2017-08-29 | 南通大学 | A kind of multilayer fabric filter antenna and microwave telecommunication system |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170213B (en) * | 2007-11-12 | 2011-10-05 | 杭州电子科技大学 | Low profile rear cavity ring gap one-point short circuit round polarization antenna |
| WO2015183915A1 (en) * | 2014-05-27 | 2015-12-03 | The University Of Florida Research Foundation, Inc. | Glass interposer integrated high quality electronic components and systems |
| CN104638373B (en) * | 2015-02-15 | 2017-10-31 | 中天宽带技术有限公司 | Pulse filter antenna array |
| CN104638360B (en) * | 2015-02-16 | 2018-03-16 | 中天宽带技术有限公司 | Filter antenna |
| CN104733853B (en) * | 2015-03-25 | 2017-12-05 | 西安电子科技大学 | A kind of multi layer substrate integrated waveguide array antenna |
| JP2017098782A (en) * | 2015-11-25 | 2017-06-01 | 株式会社Ｎｔｔドコモ | Antenna device |
| CN105914459B (en) * | 2016-07-04 | 2018-10-23 | 清华大学 | Diesis gap cavity antenna with two-way same hand circular polarization characteristic |
| CN107799881A (en) * | 2016-09-07 | 2018-03-13 | 南京理工大学 | A kind of reflectarray antenna that Waveguide slot antenna is integrated based on medium |
| CN106816698B (en) * | 2016-12-28 | 2019-04-16 | 重庆大学 | Double polarization array antenna with high polarization isolation |
-
2018
- 2018-06-25 CN CN201810661593.4A patent/CN108832291B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2258022A1 (en) * | 2008-03-18 | 2010-12-08 | Cheng, Shi | Substrate integrated waveguide |
| CN201956463U (en) * | 2010-12-23 | 2011-08-31 | 东南大学 | Millimeter-wave wave filtering antenna with substrate integrated waveguide |
| CN107104275A (en) * | 2017-04-10 | 2017-08-29 | 南通大学 | A kind of multilayer fabric filter antenna and microwave telecommunication system |
Non-Patent Citations (2)
| Title |
|---|
| "A 3-D Millimeter-Wave Filtering Antenna With High Selectivity and Low Cross-Polarization";Hui Chu, Chen Jin, Jian-Xin Chen, Yong-Xin Guo;《IEEE Transactions on Antennas and Propagation ( Volume: 63 , Issue: 5 , May 2015 )》;20150309;第1-3页 * |
| "基于基片集成波导的单腔体滤波天线设计";胡坤志，陈晓明，熊汉，李道通，唐明春;《2017年全国天线年会》;20171016;第1-6页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108832291A (en) | 2018-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108832291B (en) | Substrate integrated waveguide filter antenna | |
| CN110474137B (en) | Multilayer three-way power division filter based on SIW | |
| CN111883914B (en) | Dielectric resonator broadband antenna with filter characteristic based on SIW feeding | |
| CN110504515B (en) | Ridge gap waveguide to microstrip line broadband transition structure based on probe current coupling | |
| CN108923126A (en) | A kind of four molds based on substrate integration wave-guide have the filter antenna of double zero points | |
| CN108400411B (en) | Integrated substrate waveguide band-pass filter based on triangular complementary split resonant ring | |
| CN110676589B (en) | High-gain differential dual-polarized dielectric patch antenna based on higher-order mode | |
| CN105070993B (en) | Compact dual-frequency bandpass filter based on stack medium integrated waveguide | |
| CN106299705A (en) | A kind of planar broad band filter antenna | |
| CN110212273B (en) | Dual-band duplexer based on substrate integrated waveguide | |
| CN114335955B (en) | Unequal-division band-pass filtering power divider based on HMSIW-SSPP mixed mode | |
| CN109830789B (en) | Broadband band-pass filter based on folded substrate integrated waveguide and complementary split ring resonator | |
| CN113764850B (en) | Grounded coplanar waveguide-rectangular waveguide filtering transition structure | |
| CN113097711B (en) | Substrate integrated waveguide filter antenna with high selective radiation efficiency | |
| CN110957565B (en) | Broadband polarization reconfigurable high-gain antenna for 5G base station | |
| WO2008048226A2 (en) | Integrated microstrip circulator and antenna assembly | |
| CN109755711B (en) | Double-layer half-module substrate integrated waveguide broadband filter coupler | |
| CN114744404A (en) | Dual-band substrate integrated waveguide filter antenna | |
| CN112086717B (en) | Capacitive patch loaded dual-mode substrate integrated waveguide band-pass filter | |
| CN112366432B (en) | Three-mode HMSIW balanced band-pass filter with common-mode rejection and compact structure | |
| CN210092342U (en) | Double-frequency filtering antenna based on SIW resonant cavity | |
| US11923589B2 (en) | Electric coupling of a substrate integrated waveguide cavity resonator to a suspended substrate stripline low pass filter for introducing a notch response | |
| CN115051153B (en) | Differential circular polarization filter antenna | |
| CN215579070U (en) | SIW horn antenna based on surface wave excitation | |
| CN115173032B (en) | SIW miniaturized filter antenna with high selectivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201222 Address after: No. 10, Yingbin Avenue, Dongtai Development Zone, Yancheng City, Jiangsu Province Patentee after: Jiangsu Chuangqi Testing Technology Co.,Ltd. Address before: 400044 No. 174 Shapingba street, Shapingba District, Chongqing Patentee before: Chongqing University |
|
| TR01 | Transfer of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20181116 Assignee: DONGTAI GAOKE TECHNOLOGY INNOVATION PARK Co.,Ltd. Assignor: Jiangsu Chuangqi Testing Technology Co.,Ltd. Contract record no.: X2023980048819 Denomination of invention: A substrate integrated waveguide filtering antenna Granted publication date: 20200519 License type: Common License Record date: 20231202 |
|
| EE01 | Entry into force of recordation of patent licensing contract |