CN108811303A - Package substrate and its processing method - Google Patents
Package substrate and its processing method Download PDFInfo
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- CN108811303A CN108811303A CN201810609826.6A CN201810609826A CN108811303A CN 108811303 A CN108811303 A CN 108811303A CN 201810609826 A CN201810609826 A CN 201810609826A CN 108811303 A CN108811303 A CN 108811303A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of package substrate and its processing method, which includes：Bearing substrate is processed, is made between the edges of boards of the first metal layer and the edges of boards of second metal layer and forms sealing structure, forms loading plate；First substrate and second substrate is respectively set in two plate faces of loading plate；The first daughter board is processed on the first substrate, the second daughter board is processed on second substrate, and formed in advance at plate；Remove the corresponding pre- edges of boards at plate of sealing structure；First daughter board and the second daughter board are detached from the plate face of loading plate and form package substrate.Thus processing method is process the package substrate.The setting of sealing structure, when subsequently carrying out wet flow, liquid medicine cannot be introduced into the gap between the first metal layer and second metal layer due to the sealing of sealing structure, the problems such as polluting loading plate and influencing following process quality is infiltrated into loading plate so as to avoid liquid medicine, improves the processing quality of package substrate.
Description
Technical field
The present invention relates to wiring board processing technique fields, more particularly to a kind of package substrate and its processing method.
Background technology
PCB (Printed Circuit Board), is often referred to wiring board, also known as printed wiring board or printed circuit board, is
The carrier of electronic component electrical connection.It is also higher and higher to the product requirement of wiring board with the continuous development of electronic industry,
Such as high-performance, slimming and low cost requirement.Package substrate is one kind of wiring board, and coreless substrate can be used in package substrate
Mode is processed.Compared to traditional circuit plate, coreless substrate eliminates middle layer core plate, and insulating layer and layers of copper is used only using half
Addition extrusion process realizes high-density wiring, meets the requirements such as high-performance, slimming and low cost.
Embedment Line technology (Embedded Trance Substrate, abbreviation ETS) is that one kind of making coreless substrate adds
Work technology, can make minimum feature/line-spacing be machined to 15 μm/15 μm hereinafter, and circuit control accuracy it is high, and meet high property
The requirement that can and be thinned.And loading plate need to be used when using embedment Line technology processing PCB, it is processed in the both sides of loading plate
Circuit daughter board, after processing is completed by the circuit daughter board of both sides from loading plate stripping, to form the finished product of two pieces of package substrates.So
And be also required to when processing coreless substrate using embedment Line technology by multiple wet flow, liquid medicine is easy to when wet flow is processed
The bonding layer between loading plate and circuit daughter board is infiltrated into, to pollute plate face and the problem of influence following process.
Invention content
Based on this, it is necessary to which providing a kind of package substrate and its processing method, the processing method of the package substrate can keep away
Liquid medicine is oozed to carrying plate face when exempting from wet flow, the problems such as avoiding liquid medicine from polluting plate face, and improves processing quality；The encapsulation base
Plate is process using this processing method, improves the processing quality of package substrate.
Its technical solution is as follows：
On the one hand, a kind of processing method of package substrate is provided, is included the following steps：
(S1), the first metal layer and second metal layer of bearing substrate are processed according to preset requirement, make the first gold medal
Sealing structure is formed between the edges of boards and the edges of boards of second metal layer of category layer and forms loading plate；
(S2), first substrate and second substrate is respectively set in two plate faces of loading plate；
(S3), it processes on the first substrate and forms the first daughter board, the second daughter board is processed and formed on second substrate,
First daughter board, loading plate and the second daughter board form pre- at plate；
(S4), the corresponding pre- edges of boards at plate of removal sealing structure；
(S5), the first daughter board and the second daughter board are detached from the plate face of loading plate and forms package substrate.
The processing method of above-mentioned package substrate passes through the plate edge machined shape of edges of boards and second metal layer to the first metal layer
At sealing structure, when subsequently carrying out wet flow, liquid medicine cannot be introduced into due to the sealing of sealing structure the first metal layer and
Gap between second metal layer infiltrates into loading plate so as to avoid liquid medicine and pollutes loading plate and influence following process
The problems such as quality, improves the processing quality of package substrate.
Technical solution is illustrated further below：
In one of the embodiments, in step (S1), the processing to the first metal layer and second metal layer further include with
Lower step：
(S11), edges of boards slot is processed in the edges of boards predeterminated position of the first metal layer according to preset requirement, edges of boards grooved ring is around holding
The edges of boards of carried base board are arranged, and the slot bottom depth of edges of boards slot extends to the predetermined depth of second metal layer；
(S12), sealant, the edges of boards of sealant and the first metal layer are processed in the cell wall of edges of boards slot according to preset requirement
Sealing structure is formed with the edges of boards of second metal layer.
In one of the embodiments, in step (S11), the processing of edges of boards slot is further comprising the steps of：
(S111), it is sticked dry film in the plate face of bearing substrate according to preset requirement；
(S112), opened a window to dry film according to preset requirement and formed edges of boards windowing, and edges of boards windowing open up position
It is corresponding with the Working position of edges of boards slot；
(S113), according to preset requirement bearing substrate is etched or exposure imaging and edges of boards is made to open a window corresponding position
Form edges of boards slot.
In one of the embodiments, in step (S12), the processing of sealant further includes following steps：It is wanted according to default
It asks and plating processing is carried out to edges of boards slot and forms sealant.
The width of edges of boards slot extends on the outside of the edges of boards of bearing substrate in one of the embodiments,.
In one of the embodiments, before step (S4) after step (S3), further include：
The first finished product code, and the Working position of the Working position and edges of boards slot of the first finished product code are processed on the first daughter board
It is corresponding；
The second finished product code, and the Working position of the Working position and edges of boards slot of the second finished product code are processed on the second daughter board
It is corresponding.
In one of the embodiments, in step (S3), the processing of the first daughter board is further comprising the steps of：
(S211), first line layer unit is processed in the plate face of first substrate according to preset requirement；
(S212), the first coding is processed on first line layer unit according to preset requirement and forms the first circuit knot
Structure, and the Working position of the first coding is corresponding with the Working position of edges of boards slot；
(S213), the second circuit layer unit is processed on the first circuit structure according to preset requirement；
(S214), the second coding is processed on the second circuit layer unit according to preset requirement and forms the first daughter board, and
The Working position of second coding is corresponding with the Working position of edges of boards slot；
Or in step (S3), the processing of the second daughter board is further comprising the steps of：
(S221), tertiary circuit layer unit is processed in the plate face of second substrate according to preset requirement；
(S222), third is processed on tertiary circuit layer unit according to preset requirement to encode and form tertiary circuit knot
Structure, and the Working position of third coding is corresponding with the Working position of edges of boards slot；
(S223), the 4th circuit layer unit is processed in tertiary circuit structure according to preset requirement；
(S224), the 4th is processed on the 4th circuit layer unit according to preset requirement and encodes and formed the second daughter board, and
The Working position of 4th coding is corresponding with the Working position of edges of boards slot.
The Working position of the second coding is corresponding with the Working position of the first coding in one of the embodiments, and second compiles
Code includes the second basic code and the second generated code, and the second basic code is corresponding with the first coding；
Or the 4th coding Working position it is correspondings with the Working position that third encode, the 4th encode include the 4th basis code with
4th generated code, the 4th basic code are corresponding with third coding.
In one of the embodiments, in step (S3), the processing of the first coding and third coding further includes：According to default
It is required that processing the first through hole of multiple perforation first line layer units, loading plate and tertiary circuit layer unit and respectively the
One circuit layer unit and tertiary circuit layer unit form the first coding and third coding；
Or in step (S3), the processing of the second coding and the 4th coding further includes：Multiple pass through is processed according to preset requirement
Lead to the second circuit layer unit, first line layer unit, loading plate, tertiary circuit layer unit and the 4th circuit layer unit second is logical
Hole simultaneously forms the second coding and the 4th coding in the second circuit layer unit and the 4th circuit layer unit respectively.
On the other hand, a kind of package substrate is additionally provided, package substrate is used as described in any one above-mentioned technical solution
The processing method of package substrate is process.
Above-mentioned package substrate, due to being process using the processing method of the package substrate, liquid medicine when avoiding wet flow
Penetrate into loading plate cause influence processing quality the problem of, to make the quality higher of the package substrate obtained after processing,
The defect rate for also reducing processing simultaneously, reduces production cost.
Description of the drawings
Fig. 1 is a kind of processing method flow chart of package substrate in embodiment；
Fig. 2 is the cross section structure schematic diagram of the package substrate in embodiment.
100, substrate, 110, the first metal layer, 120, second metal layer, 210, first circuit layer, 300, sealant, 400,
First through hole.
Specific implementation mode
The embodiment of the present invention is described in detail below in conjunction with the accompanying drawings：
It should be noted that when alleged element is with another element " fixation " in text, it can be directly in another element
Above or there may also be elements placed in the middle.When an element is considered as with another element " connection ", it can be straight
It is connected to another element in succession or may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element
When "upper", intermediary element is not present.Term as used herein " vertically ", " horizontal ", "left", "right" and similar table
It states for illustrative purposes only, is not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant Listed Items.
Embodiment as depicted in figs. 1 and 2 provides a kind of processing method of package substrate, includes the following steps：
(S1), the first metal layer 110 and second metal layer 120 of bearing substrate are processed according to preset requirement, made
Sealing structure is formed between the edges of boards and the edges of boards of second metal layer 120 of the first metal layer 110 and forms loading plate；
(S2), first substrate and second substrate is respectively set in two plate faces of loading plate；
(S3), it processes on the first substrate and forms the first daughter board, the second daughter board is processed and formed on second substrate,
First daughter board, loading plate and the second daughter board form pre- at plate；
(S4), the corresponding pre- edges of boards at plate of removal sealing structure；
(S5), the first daughter board and the second daughter board are detached from the plate face of loading plate and forms package substrate.
Sealing structure is formed by the plate edge machined of edges of boards and second metal layer 120 to the first metal layer 110, when follow-up
When carrying out wet flow, liquid medicine cannot be introduced into due to the sealing of sealing structure the first metal layer 110 and second metal layer 120 it
Between gap, infiltrated into loading plate so as to avoid liquid medicine pollute loading plate and influence following process quality the problems such as,
Improve the processing quality of package substrate.
Wet flow refers to flows, those skilled in the art such as liquid medicine excessively in package substrate process and is frequently referred to wet flow, this
In repeat no more.
Loading plate, those skilled in the art are also called detach core, as shown in Fig. 2, loading plate includes substrate
100, two plate faces of substrate 100 are equipped with the first metal layer 110 and second metal layer 120, and the attachment of second metal layer 120 is set to
The plate face of substrate 100, the attachment of the first metal layer 110 is set on the surface of second metal layer 120, due to being embedded to the processing of Line technology
It needs, in two plate face setting first substrates of loading plate and second substrate and after processing the first daughter board and the second daughter board respectively,
Need to remove the first daughter board and the second daughter board from loading plate, and in process the first metal layer 110 and the first daughter board or
Second daughter board combines, to realize to be stripping between the first metal layer 110 and second metal layer 120 in stripping, therefore,
To meet the functional requirement, the cohesive force between the first metal layer 110 and second metal layer 120 need to be kept within a preset range,
In order to which the later stage removes.It should be noted that bearing substrate refers to the loading plate of undressed sealing structure, be here in order to illustrate
It is convenient, to distinguish the loading plate before processing and the loading plate after processing.
And as described above, because between the first metal layer 110 and second metal layer 120 cohesive force need to be maintained at preset range
Interior, in the multiple working procedure of package substrate processing, existing largely may destroy or reduce the first metal layer 110 and second metal layer
The factor of cohesive force between 120, to cause liquid medicine to infiltrate into the first metal layer 110 and second metal layer in wet flowchart process
Between 120, causes liquid medicine to pollute plate face, machining accuracy is made to decline.Simultaneously as when follow-up first daughter board and the second daughter board are processed
Further include the processes such as pressing, front can may be infiltrated into the first metal layer 110 and second metal layer 120 in bonding processes again
Liquid medicine squeeze out, the relevant device to pollute press equipment or be related to, to reduce the service life of equipment, while
Increase operation and maintenance cost.
Therefore, the present embodiment passes through in the edges of boards of the first metal layer 110 and the edges of boards setting sealing knot of second metal layer 120
Structure, namely seal the gap between the first metal layer 110 and second metal layer 120 or binding site, at this point, even if it is follow-up other
Process may influence the cohesive force between the first metal layer 110 and second metal layer 120, also due to the setting of sealing structure
So that the liquid medicine in follow-up wet flow can not infiltrate between the first metal layer 110 and second metal layer 120, so as to avoid oozing
The problems such as liquid medicine and pollution press equipment.After processing is completed, it pre- is removed sealing structure is corresponding at Board position, you can carry out the
The lock out operation of one daughter board and the second daughter board, the first daughter board and the second daughter board are smoothly detached and obtain two pieces of package substrates.Certainly,
Those skilled in the art also can be further processed to obtain final package substrate finished product to two pieces of obtained package substrates, here not
It repeats again.
Package substrate belongs to one kind of wiring board, and those skilled in the art are as needed, in the case where meeting the requirements
Processing method provided in this embodiment may be used and process other kinds of wiring board, the range protected in the application it
Interior, which is not described herein again.
It should be noted that first substrate and second substrate can be wholely set with loading plate, it can also be such as embodiment institute
The mode stated subsequently is set to two plate faces of loading plate.Specifically, it when processing, can respectively be processed in two plate faces of loading plate
Go out copper foil (or the first metal layer 110 forms copper foil layer namely first substrate or second substrate using copper foil), then processes the
One circuit layer 210；Then, the structure to form circuit embedment insulating resin is pressed by insulating resin；Then, then in the insulation tree
Subsequent circuit is manufactured on fat, is processed repeatedly, until reaching circuit layer structure (i.e. the first daughter board and second met the requirements
Daughter board) until；Circuit layer structure is removed from loading plate finally, and obtains finished product.
Therefore, the processing of the first daughter board and the second daughter board is carried out in two plate faces of loading plate respectively, and such as the first daughter board is such as
Fruit is three layers of circuit structure, then is successively processed as loading end in the plate face of loading plate, and ultimately form three layers of circuit structure, this
Field technology personnel can be processed according to existing processing method as needed, and which is not described herein again.
In addition, it is necessary to which explanation, the processing of the first daughter board and the second daughter board can be processed, can also be processed simultaneously, two respectively
Person does not have strict sequence, those skilled in the art that can be specifically chosen as needed, and which is not described herein again.
As shown in Fig. 2, the both sides of loading plate are equipped with first circuit layer 210 and the second circuit layer, as needed, can distinguish
Tertiary circuit layer, the 4th circuit layer, the 5th circuit are further processed out on the basis of first circuit layer 210 and the second circuit layer
Layer, the 6th circuit layer etc., to obtain the demand of the multilayer circuit structure met the requirements, which is not described herein again.
Further, sealing structure can be various structures, such as can be a kind of sealant 300, and sealant 300 is located at
The thickness wall position that the edges of boards of one metal layer 110 and the edges of boards of second metal layer 120 are formed can also be to realize sealing
A kind of sealing ring, certainly, those skilled in the art can select different embodiments as needed, as long as disclosure satisfy that first
The sealing technique effect in gap between the edges of boards and the edges of boards of second metal layer 120 of metal layer 110, which is not described herein again.
Further, as shown in Fig. 2, the first metal layer 110 is base layers of copper, second metal layer 120 is copper-loaded layer, base copper
Layer and copper-loaded layer have copper material to be made, and surface flatness between the two are differed only in, due to table between the two
Face smoothness is different, to keep the cohesive force between base layers of copper and copper-loaded layer poor, is detached to plate with meeting embedment Line technology
When convenience requirement.
It certainly, can also be only in the side of loading plate it should be further noted that those skilled in the art are as needed
The first daughter board is processed, without processing the second daughter board, sealing structure realization can also be used at this time, liquid medicine is avoided to enter the first metal
The mode in gap between layer 110 and second metal layer 120.It is intended merely in such a way that two plate faces are processed in the present embodiment
This example demonstrates that and other explanations convenience, the processing method for not limiting the sealing structure is simply possible to use in two plate faces and adds
The mode of work, which is not described herein again.
Further, in step (S1), the processing to the first metal layer 110 and second metal layer 120 further includes following step
Suddenly：
(S11), edges of boards slot, edges of boards grooved ring are processed in the edges of boards predeterminated position of the first metal layer 110 according to preset requirement
Edges of boards around bearing substrate are arranged, and the slot bottom depth of edges of boards slot extends to the predetermined depth of second metal layer 120；
(S12), sealant 300, sealant 300 and the first metal layer are processed in the cell wall of edges of boards slot according to preset requirement
110 edges of boards and the edges of boards of second metal layer 120 form sealing structure.
Edges of boards slot around bearing substrate is arranged, and sealing structure is in edges of boards slot around the edges of boards of bearing substrate entire one
Circle is realized better to realize the sealing to 120 bonding position of the first metal layer on bearing substrate 110 and second metal layer
Sealing technique effect, meanwhile, Machinability Evaluation is good, at low cost.
It should be noted that the depth of edges of boards slot must reach the predetermined depth of second metal layer 120, only in this way could
The sealing structure that processing obtains enough is set to realize the sealing skill of the edges of boards to the edges of boards and second metal layer 120 of the first metal layer 110
Art effect.
Further, edges of boards slot can be the slot structure being located on the inside of the edges of boards of bearing substrate, can also be to be located at plate
Side is until extend to the structure outside edges of boards, after processing is completed, by region removal.Those skilled in the art can be according to need
It is specifically chosen.
Further, in step (S11), the processing of edges of boards slot is further comprising the steps of：
(S111), it is sticked dry film in the plate face of bearing substrate according to preset requirement；
(S112), opened a window to dry film according to preset requirement and formed edges of boards windowing, and edges of boards windowing open up position
It is corresponding with the Working position of edges of boards slot；
(S113), according to preset requirement bearing substrate is etched or exposure imaging and edges of boards is made to open a window corresponding position
Form edges of boards slot.
The processing of edges of boards slot can select various ways, and patch dry film etches or the mode of exposure imaging is one of them.
For package substrate manufacturer, if using the processing method of patch dry film in process, it is aobvious in combination with other exposures
The use of shadow process reasonable arrangement equipment reduces production cost without increasing new equipment.
Further, in step (S12), the processing of sealant 300 further includes following steps：According to preset requirement to edges of boards
Slot carries out plating processing and forms sealant 300.
The mode that processing is electroplated is convenient and efficient, it should be noted that this kind of processing method should reasonably select the first metal layer
110 and second metal layer 120 metal material, in order to consider cost and on the basis of feasibility control processing cost and at
Product rate.If copper material may be selected in the first metal layer 110 and second metal layer 120, and it is processed by the way of electro-coppering
Sealant 300, which is not described herein again.
Further, the width of edges of boards slot extends on the outside of the edges of boards of bearing substrate.During actual processing, this field skill
Art personnel can directly delimit preset edge sealing region, which extends directly on the outside of edges of boards, after following process
Directly its entire edges of boards is cut off, meanwhile, the situation outside edges of boards is not extended to compared to edges of boards slot, also improves loading plate and first
The plate face utilization ratio of daughter board and the second daughter board reduces subsequently removed plate face area, to reduce production cost.
Further, before step (S4) after step (S3), further include：
The first finished product code, and the Working position of the Working position and edges of boards slot of the first finished product code are processed on the first daughter board
It is corresponding；
The second finished product code, and the Working position of the Working position and edges of boards slot of the second finished product code are processed on the second daughter board
It is corresponding.
First daughter board and the second daughter board after processing is completed, need stamp to show the information of the batch products, therefore,
As soon as getting batch information in the plate face of daughter board and the second daughter board, batch information is contained in the information of the first finished product code, is also wrapped
Containing the information that the process machines, since stamp generally use processes the mode stamp of through-hole, this stamp need to penetrate first
Daughter board, loading plate and the second daughter board, this may cause to form loading plate new damage, to influence follow-up plate face separation
Quality, therefore, the first finished product code and the second finished product code are located at corresponding position in edges of boards slot, this can be read when plate face detaches
The information of first finished product code and the second finished product code, and then cut off entire edges of boards in step (S3), also i.e. by the first finished product
The corresponding region of code and the second finished product code is cut off together, and the first finished product code and the second finished product code can not only be utilized to realize tracking,
Influence when also avoiding processing to yield rate and quality.
It should be noted that the processing of the first finished product code and the second finished product code can carry out respectively, can also be carried out at the same time, this
In repeat no more.
Further, in step (S3), the processing of the first daughter board is further comprising the steps of：
(S211), first line layer unit is processed in the plate face of first substrate according to preset requirement；
(S212), the first coding is processed on first line layer unit according to preset requirement and forms the first circuit knot
Structure, and the Working position of the first coding is corresponding with the Working position of edges of boards slot；
(S213), the second circuit layer unit is processed on the first circuit structure according to preset requirement；
(S214), the second coding is processed on the second circuit layer unit according to preset requirement and forms the first daughter board, and
The Working position of second coding is corresponding with the Working position of edges of boards slot；
Or in step (S3), the processing of the second daughter board is further comprising the steps of：
(S221), tertiary circuit layer unit is processed in the plate face of second substrate according to preset requirement；
(S222), third is processed on tertiary circuit layer unit according to preset requirement to encode and form tertiary circuit knot
Structure, and the Working position of third coding is corresponding with the Working position of edges of boards slot；
(S223), the 4th circuit layer unit is processed in tertiary circuit structure according to preset requirement；
(S224), the 4th is processed on the 4th circuit layer unit according to preset requirement and encodes and formed the second daughter board, and
The Working position of 4th coding is corresponding with the Working position of edges of boards slot.
The processing of first coding, the second coding, third coding and the 4th coding is realized in production chases after product processing
Track acts on, so as to realize the monitoring to product processing operation.
Here, it should be noted that the processing of the first coding and first line layer unit can be adjusted accordingly as needed
It is whole, here first carry out first line layer processing after carry out first coding processing simply to illustrate that convenience, this field skill
Art personnel can specifically be adjusted as needed, to meet actual demand.In a kind of embodiment as shown in Figure 1, first process
First through hole 400 is encoded, the first line layer unit and the second circuit then continued after processing with forming the first coding and second
Layer unit can be further processed coding on subsequent circuit layer unit, can also not process coding as needed, completions be waited to process
Final coding such as finished product code is reprocessed afterwards, and which is not described herein again.
In addition, first line layer unit includes the insulating resin layer of first circuit layer 210 and respective layer, to form correspondence
The first circuit structure.
Further, the Working position of the second coding is corresponding with the Working position of the first coding, and the second coding includes second
Basic code and the second generated code, the second basic code are corresponding with the first coding；
Or the 4th coding Working position it is correspondings with the Working position that third encode, the 4th encode include the 4th basis code with
4th generated code, the 4th basic code are corresponding with third coding.
When due to processing, the first coding is first processed, and the second coding is just processed after processing the second circuit layer unit,
And the information of the second coding is different from the information that the first coding is included, to distinguish different processes, the present embodiment makes the volume of the latter
Include the former information comprising information in code, but also includes new the information such as information comprising this technique or current process time
Information makes information content more comprising the former completed machining information and the information currently processed in the coding to make the latter
Abundance, while convenient for the real-time tracing to entire manufacturing procedure.If the second coding includes the second basis code and the second generated code, the
Two basic codes namely the former completed machining information, therefore, the second basic code can be identical with the first coding, the second life
At code include be this layer processing technique information, such as the number of this process or this process process time.Third encode and
Similarly, which is not described herein again for 4th coding.
It should be noted that being only referred to first line layer unit, the second circuit layer unit, tertiary circuit layer unit here
More circuit layer units can be set as needed with the 4th circuit layer unit, to meet more circuit layer structure demands,
At this point, carrying out corresponding coding processing after often processing a sandwich circuit layer unit, those skilled in the art can beat accordingly
Code encoding operation, which is not described herein again.
In addition, first line layer unit, the second circuit layer unit are located at the one side of the board of loading plate, tertiary circuit layer unit
The other side of loading plate is located at the 4th circuit layer unit, the circuit layer unit of loading plate both sides identically can symmetrically be set
It sets, also can be specifically arranged as needed, which is not described herein again.
Further, in step (S3), the processing of the first coding and third coding further includes：It is processed according to preset requirement
Multiple perforation first line layer units, first through hole 400 of loading plate and tertiary circuit layer unit and respectively in first line layer
Unit and tertiary circuit layer unit form the first coding and third coding；
Or in step (S3), the processing of the second coding and the 4th coding further includes：Multiple pass through is processed according to preset requirement
Lead to the second circuit layer unit, first line layer unit, loading plate, tertiary circuit layer unit and the 4th circuit layer unit second is logical
Hole simultaneously forms the second coding and the 4th coding in the second circuit layer unit and the 4th circuit layer unit respectively.
The volume of both sides is formed when the setting of first through hole 400 and the setting of the second through-hole easy to process by time processing
Code reduces manufacturing procedure and processing cost, and meets the needs of processing simultaneously.
Further, the first coding and third are encoded while being processed, after processing is completed, when the second line layer and the 4th line
After the completion of the floor of road, bores the second coding of the second through-hole processing and the 4th in the first coding corresponding position or third coding corresponding position and compile
Code, at this point, including the information of the first coding in the information of the second coding, the information of the 4th coding includes the information of third coding,
The second through-hole of part and the first through hole 400 of the first coding or third coding are completely superposed, and remaining second through-hole represents the
The specifying information of two line layers unit or the 4th circuit layer unit is then the through-hole different from 400 position of first through hole.
It should be noted that either first through hole 400 or the second through-hole, subsequent line layer list after processing is completed
Member processing may cover the former through-hole, therefore, also current to embody it is necessary to re-work coding after subsequent handling processing
Machining information, realize preferably tracking and process control.Certainly, those skilled in the art also can only carry out primary as needed
Stamp.
In addition, in the present embodiment the processing of restricted coding in edges of boards slot, however, meet need in the case of,
Those skilled in the art can also be subject to by coding processing outside edges of boards slot and whether meet the needs of processing, not stringent limit
System coding must be processed in edges of boards slot, and the present embodiment is intended merely to meet the needs of following process, not to all technologies
Scheme carries out the restriction.
It should be noted that in actual process, it can be directly when dry film processes edges of boards slot together to the first gold medal
Belong to layer 110 to be processed and obtain first line layer, form first line layer unit with further processing, and the first coding and
The processing of third coding can be directly arranged in before processing edges of boards slot, and the first coding and third coding are once complete by processing through-hole
At the first coding and third coding processing also avoid the first coding and the within preset edges of boards groove processing position
400 process of first through hole that drills through of three codings impacts subsequent handling, such as the first through hole of the first coding and third coding
If 400 processing are outside edges of boards slot, since sealing structure is only to the engagement position of the first metal layer 110 and second metal layer 120
It sets and is sealed, and the equally perforation loading plate of first through hole 400, this results in follow-up wet flowchart process liquid medicine can be by the
The hole wall position of one through-hole 400 penetrates into, and is unable to reach and set liquid medicine is avoided to enter loading plate and pollution press equipment etc.
Effect.
Simultaneously as first through hole 400 and the second through-hole are arranged in the processed of follow-up first daughter board and the second daughter board
Cheng Zhong, may due to when resin presses resin fill to first through hole 400 or the second through-hole, so as to cause perforation loading plate
It is also filled with resin in first through hole 400 or the second through-hole, causes later separation difficult, and causes separation damaged.Therefore, first
Coding, second coding etc. are located at follow-up directly excision in edges of boards slot and also avoid the difficult problem of successive plates separation, further drop
Low production cost improves yield rate.
A kind of package substrate is additionally provided, package substrate is added using the package substrate as described in any one above-mentioned embodiment
Work method is process.
Due to being process using the processing method of the package substrate, liquid medicine penetrates into loading plate when avoiding wet flow
The problem of inside causing to influence processing quality, to make the quality higher of the package substrate obtained after processing, while also reducing and adding
The defect rate of work, reduces production cost.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of processing method of package substrate, which is characterized in that include the following steps：
(S1), the first metal layer and second metal layer of bearing substrate are processed according to preset requirement, make first gold medal
Sealing structure is formed between the edges of boards and the edges of boards of the second metal layer of category layer and forms loading plate；
(S2), first substrate and second substrate is respectively set in two plate faces of the loading plate；
(S3), it is processed on the first substrate and forms the first daughter board, processed on the second substrate and form second
Daughter board, first daughter board, the loading plate and second daughter board form pre- at plate；
(S4), the corresponding pre- edges of boards at plate of the sealing structure are removed；
(S5), first daughter board and second daughter board are detached from the plate face of the loading plate and forms package substrate.
2. the processing method of package substrate according to claim 1, which is characterized in that in the step (S1), to described
The processing of the first metal layer and the second metal layer is further comprising the steps of：
(S11), edges of boards slot, the edges of boards grooved ring are processed in the edges of boards predeterminated position of the first metal layer according to preset requirement
Edges of boards around the bearing substrate are arranged, and the slot bottom depth of the edges of boards slot extends to the default depth of the second metal layer
Degree；
(S12), sealant, the sealant and first metal are processed in the cell wall of the edges of boards slot according to preset requirement
The edges of boards of layer and the edges of boards of the second metal layer form the sealing structure.
3. the processing method of package substrate according to claim 2, which is characterized in that in the step (S11), the plate
The processing of side slot is further comprising the steps of：
(S111), it is sticked dry film in the plate face of the bearing substrate according to preset requirement；
(S112), opened a window to the dry film according to preset requirement and formed edges of boards windowing, and the edges of boards windowing open up
Position is corresponding with the Working position of edges of boards slot；
(S113), according to preset requirement the bearing substrate is etched or exposure imaging and the edges of boards windowing is made to correspond to
Position forms the edges of boards slot.
4. the processing method of package substrate according to claim 2, which is characterized in that described close in the step (S12)
The processing of sealing further includes following steps：Plating processing is carried out to the edges of boards slot according to preset requirement and forms the sealing
Layer.
5. the processing method of package substrate according to claim 2, which is characterized in that the width of the edges of boards slot extends to
On the outside of the edges of boards of the bearing substrate.
6. the processing method of package substrate according to claim 2, which is characterized in that described after the step (S3)
Before step (S4), further include：
The first finished product code, and the Working position of the first finished product code and the edges of boards slot are processed on first daughter board
Working position corresponds to；
The second finished product code, and the Working position of the second finished product code and the edges of boards slot are processed on second daughter board
Working position corresponds to.
7. the processing method of package substrate according to claim 2, which is characterized in that in the step (S3), described
The processing of one daughter board is further comprising the steps of：
(S211), first line layer unit is processed in the plate face of the first substrate according to preset requirement；
(S212), the first coding is processed on the first line layer unit according to preset requirement and forms the first circuit knot
Structure, and the Working position of first coding is corresponding with the Working position of edges of boards slot；
(S213), the second circuit layer unit is processed on first circuit structure according to preset requirement；
(S214), the second coding is processed on the second circuit layer unit according to preset requirement and forms first son
Plate, and the Working position of second coding is corresponding with the Working position of edges of boards slot；
Or in the step (S3), the processing of second daughter board is further comprising the steps of：
(S221), tertiary circuit layer unit is processed in the plate face of the second substrate according to preset requirement；
(S222), third is processed on the tertiary circuit layer unit according to preset requirement to encode and form tertiary circuit knot
Structure, and the Working position of third coding is corresponding with the Working position of edges of boards slot；
(S223), the 4th circuit layer unit is processed in the tertiary circuit structure according to preset requirement；
(S224), the 4th is processed on the 4th circuit layer unit according to preset requirement to encode and form second son
Plate, and the Working position of the 4th coding is corresponding with the Working position of edges of boards slot.
8. the processing method of package substrate according to claim 7, which is characterized in that the Working position of second coding
Correspondings with the Working position of the first coding, second coding includes the second basis code and the second generated code, and described second
Basic code is corresponding with first coding；
Or the Working position of the 4th coding is corresponding with the Working position that the third encodes, the 4th coding includes the 4th
Basic code and the 4th generated code, the described 4th basic code are corresponding with third coding.
9. the processing method of package substrate according to claim 7, which is characterized in that in the step (S3), described
One, which encodes the processing encoded with the third, further includes：Multiple perforation first line layer lists are processed according to preset requirement
The first through hole of first, the described loading plate and the tertiary circuit layer unit and respectively in the first line layer unit and described
Tertiary circuit layer unit forms first coding and third coding；
Or in the step (S3), the processing of second coding and the 4th coding further includes：It is processed according to preset requirement
Go out multiple perforations the second circuit layer unit, the first line layer unit, the loading plate, the tertiary circuit layer unit
With the second through-hole of the 4th circuit layer unit and respectively in the second circuit layer unit and the 4th circuit layer unit
Second coding and the described 4th is formed to encode.
10. a kind of package substrate, which is characterized in that the package substrate uses claim 1-9 any one of them such as to encapsulate
The processing method of substrate is process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810609826.6A CN108811303A (en) | 2018-06-13 | 2018-06-13 | Package substrate and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810609826.6A CN108811303A (en) | 2018-06-13 | 2018-06-13 | Package substrate and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108811303A true CN108811303A (en) | 2018-11-13 |
Family
ID=64085895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810609826.6A Pending CN108811303A (en) | 2018-06-13 | 2018-06-13 | Package substrate and its processing method |
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| Country | Link |
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| CN (1) | CN108811303A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020134091A1 (en) * | 2018-12-28 | 2020-07-02 | 广州兴森快捷电路科技有限公司 | Coreless substrate and package method therefor |
| CN116614939A (en) * | 2023-07-21 | 2023-08-18 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
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| EP1622431B1 (en) * | 2004-07-30 | 2008-09-17 | Phoenix Precision Technology Corporation | Circuit board with identifiable information and method for fabricating the same |
| CN104394665A (en) * | 2014-10-15 | 2015-03-04 | 上海美维电子有限公司 | Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board |
| CN107241876A (en) * | 2016-03-28 | 2017-10-10 | 上海美维科技有限公司 | A kind of processing method for printed circuit board of being sunken cord without core plate one side |
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| EP1622431B1 (en) * | 2004-07-30 | 2008-09-17 | Phoenix Precision Technology Corporation | Circuit board with identifiable information and method for fabricating the same |
| US20070296062A1 (en) * | 2006-06-21 | 2007-12-27 | Advanced Semiconductor Engineering Inc. | Substrate Strip and Substrate Structure and Method for Manufacturing the Same |
| CN104394665A (en) * | 2014-10-15 | 2015-03-04 | 上海美维电子有限公司 | Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board |
| CN107241876A (en) * | 2016-03-28 | 2017-10-10 | 上海美维科技有限公司 | A kind of processing method for printed circuit board of being sunken cord without core plate one side |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134091A1 (en) * | 2018-12-28 | 2020-07-02 | 广州兴森快捷电路科技有限公司 | Coreless substrate and package method therefor |
| CN116614939A (en) * | 2023-07-21 | 2023-08-18 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
| CN116614939B (en) * | 2023-07-21 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | Anti-seepage liquid medicine structure for outer frame of core plate of printed circuit board and design method thereof |
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Application publication date: 20181113 |