WO2020134091A1

WO2020134091A1 - Coreless substrate and package method therefor

Info

Publication number: WO2020134091A1
Application number: PCT/CN2019/099315
Authority: WO
Inventors: 黄文迅; 庭玉文; 崔永涛
Original assignee: 广州兴森快捷电路科技有限公司; 深圳市兴森快捷电路科技股份有限公司
Priority date: 2018-12-28
Filing date: 2019-08-05
Publication date: 2020-07-02
Also published as: CN109743840A; CN109743840B

Abstract

A coreless substrate and a package method therefor. The package method for the coreless substrate comprises the following steps: performing film pasting on a substrate (100); exposing the substrate (100); performing etching and grooving on a metal layer (120) of the substrate (100), so that the metal layer (120) is recessed to form a groove (130); laminating a filling piece (140) at the substrate (100), so that the groove (130) is filled with the filling piece (140); and performing lamination, electroplating and processing on the substrate (100) to form a package substrate. The filling piece (140) and the groove (130) form a dam structure to isolate liquid medicine; in this way, the liquid medicine can be prevented from being permeated into the coreless substrate; the performance and the service life of the coreless substrate are ensured; the product yield and the relevant electrical performance of a finished product are improved to a certain extent, and the formation quality of a PCB is ensured.

Description

Coreless substrate and its packaging method

Technical field

The invention relates to the technical field of substrate processing, in particular to a coreless substrate and its packaging method.

Background technique

The coreless technology in the package substrate has been developed to meet the growing trend of lighter, smaller and better electrical performance in the future for electronic applications. Then, as far as the manufacturing process of the 3L coreless substrate is concerned, the current manufacturing method is to laminate the entire product into a 6L substrate before separating the core layer to achieve the purpose of 3L. Considering the processing process when the product is still 6L, the core-less liquid will inevitably penetrate into the liquid tank. As the functions and performance of network systems, high-end servers, and mobile communication devices improve, the requirements for high pin count, data transmission speed, and signal integrity also increase. The penetration of the potion in the coreless substrate manufacturing process will bite or slightly corrode the copper surface of the product. Even if the coreless substrate is inspected by the circuit inspection equipment, only the surface problems are found. The slight reaction change of the body lotion cannot be found at all, which leads to a certain degree of impact on the performance and service life of the product, affecting the molding quality of the PCB board.

Summary of the invention

Based on this, it is necessary to provide a coreless substrate and its packaging method for the bite or corrosion problems caused by the current infiltration of the copper liquid into the copper circuit.

The above objectives are achieved through the following technical solutions:

A coreless substrate packaging method includes the following steps:

Filming the substrate;

Expose the substrate;

Etching and slotting the metal layer of the substrate to recess the metal layer and form a groove;

Pressing the filler to the substrate, so that the filler fills the groove;

Laminating, plating, and processing the substrate to form a package substrate.

In one of the embodiments, the groove is located at an edge of the substrate or has a predetermined distance from the edge of the substrate.

In one of the embodiments, the depth of the groove is less than the thickness of the metal layer.

In one of the embodiments, the depth of the groove is 1/3˜4/5 of the thickness of the metal layer.

In one of the embodiments, the filler is a thermoplastic material.

In one of the embodiments, the filler is PP prepreg.

In one of the embodiments, the substrate has the first area and the second area, the first area is located inside the second area, and the step of exposing the substrate further includes:

Control the exposure area of the substrate;

The first area is exposed, and the second area is not exposed, so that the substrate is exposed to a margin.

In one of the embodiments, the width of the second area is 1.5 mm to 3.5 mm.

In one of the embodiments, the coreless substrate packaging method further includes the following steps:

Before filming the substrate, perform the first pretreatment on the substrate;

After grooving the substrate, the substrate is pre-treated a second time.

A coreless substrate. The coreless substrate is processed by the coreless substrate packaging method described in any one of the above technical features.

After adopting the above technical solutions, the present invention has at least the following technical effects:

The coreless substrate and its packaging method of the present invention etch and groove the substrate, and fill the groove formed after the etched and grooved by the filler, and the filler and the groove form a dam structure to isolate the potion. Effectively solve the problem of biting or corrosion caused by the current infiltration of the drug solution into the copper surface line. This can prevent the liquid medicine from penetrating into the coreless substrate, ensure the performance and service life of the coreless substrate, and improve the product yield and product-related electrical properties to a certain extent, and ensure the molding quality of the PCB board.

BRIEF DESCRIPTION

1 is a flowchart of a coreless substrate packaging method according to an embodiment of the invention;

2 is a schematic view of the front view of the substrate after the slotting step;

3 is a schematic view of the front view of the substrate after the pressing step;

FIG. 4 is a schematic structural view of the substrate before the exposure step.

among them:

100-substrate;

110-substrate;

120- metal layer;

121-The first area;

122-Second area;

130-groove;

140-filler.

detailed description

In order to make the objectives, technical solutions and advantages of the present invention clearer, the coreless substrate and the packaging method of the present invention will be further described in detail through the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

The serial numbers themselves, such as "first", "second", etc., are used to distinguish the described objects, and do not have any order or technical meaning. The "connection" and "connection" in this application, unless otherwise specified, include direct and indirect connection (connection). In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description Rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the present invention.

In the present invention, unless otherwise clearly specified and defined, the first feature is "on" or "below" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly through an intermediary contact. Moreover, the first feature is “above”, “above” and “above” the second feature may be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature is "below", "below", and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontal than the second feature.

Referring to FIGS. 1 to 3, the present invention provides a coreless substrate packaging method. The coreless substrate packaging method is used to perform a packaging process on the substrate 100 to be packaged, so that the substrate 100 forms a coreless substrate. The coreless substrate packaging method of the present invention can prevent the liquid medicine from infiltrating into the coreless substrate, ensure the performance and service life of the coreless substrate, improve the product yield and product-related electrical performance to a certain extent, and ensure the molding quality of the PCB board.

In an embodiment, the coreless substrate packaging method includes the following steps:

Filming the substrate 100;

Expose the substrate 100;

The metal layer 120 of the substrate 100 is etched and grooved, so that the metal layer 120 is recessed, and a groove 130 is formed;

Pressing the filler 140 to the substrate 100, so that the filler 140 fills the groove 130;

The substrate 100 is laminated, plated, and processed to form the package substrate 100.

It can be understood that the substrate 100 includes a base material 110 and a metal layer 120, and the metal layer 120 is located above the base material 110. Generally, the metal layer 120 is copper.

The film processing is performed on the substrate 100, that is, the film is applied to the metal layer 120 of the substrate 100. The film can play a protective role to protect the metal layer 120 on the substrate 100 to prevent the metal layer 120 from being bitten off during the subsequent etching and the like. After the filming step is completed, the substrate 100 after filming needs to be exposed. It can be understood that after the substrate 100 after the film is exposed, the film and the substrate 100 can be closely attached to prevent the metal layer 120 from being bitten off during the subsequent etching and the like. The metal layer 120 that is not exposed can be etched away.

Then, the metal layer 120 of the substrate 100 is etched and grooved, so that the surface of the metal layer 120 is recessed, and the recess may form a groove 130. At this time, the bottom of the groove 130 and the surface of the metal layer 120 form a height difference. It can be understood that the groove 130 is an annular structure. In this way, when the substrate 100 is pressed, the filler 140 can be pressed on the surface of the substrate 100 and can be filled into the groove 130. The filler 140 may play a sealing role. After lamination, the groove 130 and the filler 140 are closely combined to form the effect of the height difference dam to isolate the liquid medicine, so as to prevent the liquid medicine from seeping into the substrate 100 and corroding the metal layer 120 during the subsequent wet processing of the substrate 100. It can be understood that wet processing refers to a process in which the substrate 100 passes a potion and the like during the packaging process, and those skilled in the art often refer to it as a wet process, which will not be repeated here.

Finally, a series of processes such as lamination, electroplating, and processing are performed on the substrate 100 to which the filler 140 is pressed, so that the substrate 100 forms a coreless substrate. It is worth noting that the steps of performing a series of processes such as lamination, electroplating, and processing on the substrate 100 of the pressure-filling member 140 are prior art, and are not repeated here. That is to say, the coreless substrate packaging method of the present invention is based on the existing coreless substrate packaging process, the substrate 130 is etched into the groove 130, and the filler 140 is used to press-fit the groove 130.

The coreless substrate packaging method of the present invention performs etching and slotting on the substrate 100, and fills the groove 130 formed after the etching and slotting through the filler 140, and the filler 140 and the groove 130 form a dam structure to isolate the potion. Effectively solve the problem of biting or corrosion caused by the current infiltration of the drug solution into the copper surface line. This can prevent the liquid medicine from penetrating into the coreless substrate, ensure the performance and service life of the coreless substrate, and improve the product yield and product-related electrical properties to a certain extent, and ensure the molding quality of the PCB board.

In one embodiment, the groove 130 is located at the edge of the substrate 100 or has a predetermined distance from the edge of the substrate 100. That is to say, the groove 130 may be a board edge groove, that is, the groove 130 is located at the edge of the substrate 100, and the groove 130 communicates with the side area of the substrate 100, as shown in FIG. 2. In this way, the circuit layer structure formed later can be easily peeled off from the substrate 110 and the finished product can be obtained. Of course, in other embodiments of the present invention, the groove 130 may also have a certain distance from the edge of the substrate 100.

It is worth noting that no matter whether the groove 130 is located at the edge of the substrate 100 or there is a preset distance from the edge of the substrate 100, after the filler 140 fills the groove 130, the metal layer 120 and the filler 140 can be closely combined, In order to ensure the sealing performance of the substrate 100, to avoid the penetration of the chemical liquid into the substrate 100 during the wet processing of the substrate 100, and thus to prevent the chemical liquid from biting or corroding the metal layer 120 of the substrate 100, to ensure the performance and service life of the coreless substrate, and To a certain extent, improve the product yield and the relevant electrical properties of the finished product to ensure the molding quality of the PCB board.

In one embodiment, the depth of the groove 130 is less than the thickness of the metal layer 120. That is to say, during the etching process of the substrate 100, the metal layer 120 remains on the bottom of the groove 130. In this way, the circuit layer structure formed later can be easily peeled off from the substrate 110 and the finished product can be obtained. After the filling member 140 is filled into the groove 130, the groove 130 can be tightly combined with the filling member 140 to ensure the sealing effect and avoid the penetration of the medicine.

Further, the depth of the groove 130 is 1/3˜4/5 of the thickness of the metal layer 120. The depth range of the above-mentioned groove 130 can not only facilitate the peeling of the circuit layer structure formed later from the substrate 110, but also ensure the sealing performance of the filling member 140 after filling.

Of course, in other embodiments of the present invention, the depth of the groove 130 may also be equal to the thickness of the metal layer 120. That is to say, after the groove 130 is formed on the substrate 100, the bottom of the groove 130 exposes the substrate 110 without the metal layer 120. After the filler 140 is pressed against the substrate 100, the filler 140 can be tightly combined with the base material 110 to ensure the sealing effect.

In one embodiment, the filler 140 is a thermoplastic material. In this way, it can be ensured that the filler 140 flows into the groove 130 to be filled when being pressed. Further, the filler 140 is a PP (Polypropylene) prepreg. During pressing, the etched groove 130 is filled with PP prepreg to achieve the combined effect of the PP+ metal layer 120 forming a dam isolation, thereby preventing the penetration of the drug solution.

Referring to FIGS. 1 and 4, in an embodiment, the substrate 100 has a first area 121 and a second area 122. The first area 121 is located inside the second area 122. The step of exposing the substrate 100 further includes:

Control the exposure area of the substrate 100;

The first area 121 is exposed, and the second area 122 is not exposed, so that the substrate 100 is exposed to a margin.

It can be understood that the first area 121 of the substrate 100 refers to the middle area of the substrate 100, and the second area 122 of the substrate 100 refers to the edge area of the substrate 100. The first region 121 of the substrate 100 is exposed, and the metal layer 120 in the first region 121 of the substrate 100 may be in close contact with the film. Since the second region 122 of the substrate 100 is not exposed, an exposure margin can be formed to facilitate etching of the metal layer 120. Specifically, when the substrate 100 is etched, the metal layer 120 in the first region 121 of the substrate 100 will not be etched away, and the metal layer 120 in the second region 122 will be etched away. At this time, the etched metal layer 120 is recessed relative to the unetched metal layer 120 to form the groove 130. After the groove 130 is formed, the filler 140 may be filled into the groove 130, so that the filler 140 and the metal layer 120 form a dam structure to ensure the sealing effect and prevent the penetration of the medicine solution.

Further, the width of the second region 122 is 1.5 mm to 3.5 mm. That is, the width of the groove 130 to the edge of the substrate 100 is 1.5 mm to 3.5 mm. That is, in Fig. 4, the width of the groove 130 in the left-right direction is 1.5 mm to 3.5 mm. Preferably, the width of the groove 130 is 2.5 mm.

Referring to FIG. 1, in an embodiment, before slotting the substrate 100, the coreless substrate packaging method further includes the following steps:

Before filming the substrate 100, the substrate 100 is subjected to the first pretreatment.

It can be understood that the substrate 100 is subjected to the first pretreatment, that is, the substrate 100 is cleaned for the first time. In this way, the substrate 100 can be ensured to be clean and convenient for film sticking. Exemplarily, the substrate 100 is only pickled during the first cleaning, but not slightly etched. Pickling is to clean the surface of the substrate 100, which is helpful for film sticking, so as to prevent impurities from attaching to the effective area of the substrate 100 during manufacturing and causing the metal layer 120 to sag.

In an embodiment, the coreless substrate packaging method further includes:

After the substrate 100 is grooved, the substrate 100 is pre-processed a second time.

It can be understood that the substrate 100 is subjected to the second pretreatment, that is, the substrate 100 is washed for the second time. In this way, the dirt on the edge of the substrate 100 can be cleaned, and the metal layer 120 can be dented due to foreign matter after lamination.

The packaging method of the coreless substrate 100 of the present invention can etch the substrate 100. In this way, the filling member 140 fills the groove 130 during lamination, and the filling member 140+metal layer 120 is used to form a dam, thereby preventing the penetration of the drug solution Production plan. It is worth noting that, on the basis of the current process of manufacturing coreless substrates, this method only adds the structure of photo-etching and etching the grooves 130 on the substrate 100, and can use existing equipment without adding new equipment investment. In addition, the use of a coreless substrate packaging method to produce a coreless substrate can improve product yield and product-related electrical performance to a certain extent.

The invention also provides a coreless substrate. The coreless substrate is processed by the coreless substrate packaging method in any of the above embodiments.

Because the coreless substrate is processed by the coreless substrate packaging method, the problem of corrosion or biting of the copper surface circuit caused by the penetration of the chemical liquid into the substrate 100 during the wet process is avoided, and the performance and service life of the coreless substrate are guaranteed. To a certain extent, improve the product yield and the relevant electrical properties of the finished product to ensure the molding quality of the PCB board.

The technical features of the above-mentioned embodiments can be arbitrarily combined. To simplify the description, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of the description.

The above examples only express several implementations of the present invention, and their descriptions are more specific and detailed, but they should not be construed as limiting the patent scope of the present invention. It should be noted that, for a person of ordinary skill in the art, without departing from the concept of the present invention, a number of modifications and improvements can also be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the invention patent shall be subject to the appended claims.

Claims

A coreless substrate packaging method, characterized in that it includes the following steps:

Filming the substrate;

Expose the substrate;

Etching and slotting the metal layer of the substrate to recess the metal layer and form a groove;

Pressing the filler to the substrate, so that the filler fills the groove;

Laminating, plating, and processing the substrate to form a package substrate.
The method for packaging a coreless substrate according to claim 1, wherein the groove is located at an edge of the substrate or at a predetermined distance from the edge of the substrate.
The coreless substrate packaging method of claim 1, wherein the depth of the groove is smaller than the thickness of the metal layer.
The method for packaging a coreless substrate according to claim 2, wherein the depth of the groove is 1/3 to 4/5 of the thickness of the metal layer.
The coreless substrate packaging method according to any one of claims 1 to 4, wherein the filler is a thermoplastic material.
The coreless substrate packaging method according to claim 5, wherein the filler is a PP prepreg.
The coreless substrate packaging method according to any one of claims 1 to 4, wherein the substrate has the first region and a second region, the first region is located inside the second region, The step of exposing the substrate further includes:

Control the exposure area of the substrate;

The first area is exposed, and the second area is not exposed, so that the substrate is exposed to a margin.
The coreless substrate packaging method according to claim 7, wherein the width of the second region is 1.5 mm to 3.5 mm.
The coreless substrate packaging method according to any one of claims 1 to 4, wherein the coreless substrate packaging method further comprises the following steps:

Before filming the substrate, perform the first pretreatment on the substrate;

After grooving the substrate, the substrate is pre-treated a second time.
A coreless substrate, characterized in that the coreless substrate is processed by the coreless substrate packaging method according to any one of claims 1 to 9.