CN109743840A - Coreless substrate and its packaging method - Google Patents
Coreless substrate and its packaging method Download PDFInfo
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- CN109743840A CN109743840A CN201811624105.9A CN201811624105A CN109743840A CN 109743840 A CN109743840 A CN 109743840A CN 201811624105 A CN201811624105 A CN 201811624105A CN 109743840 A CN109743840 A CN 109743840A
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- Prior art keywords
- substrate
- coreless
- packaging method
- groove
- filling member
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of coreless substrate and its packaging method.The coreless substrate packaging method includes the following steps: to carry out pad pasting to the substrate；The substrate is exposed；Fluting is performed etching to the metal layer of the substrate, so that the metal layer is recessed, and forms groove；Filling member is pressed on the substrate, so that the filling member is filled the groove；The substrate is laminated, be electroplated, is processed, to form package substrate.Filling member and groove form dam configuration and completely cut off liquid medicine.It can prevent liquid medicine from penetrating into coreless substrate in this way, guarantee the performance and used life of coreless substrate, and improve product yield electrical property related to finished product to a certain extent, guarantee the Forming Quality of pcb board.
Description
Technical field
The present invention relates to substrate processing technique fields, more particularly to a kind of coreless substrate and its packaging method.
Background technique
Centreless technology in package substrate has been developed following growing lighter, smaller and former to meet electronic application
Carry out the development trend requirement of better electrical property.Then, for the manufacturing process of 3L coreless substrate, current production method is whole
After a product elder generation laminates are at 6L substrate, just carry out separating core layer and achieve the purpose that 3L.When in view of product or 6L
The process of time, centreless inevitably have liquid medicine infiltration substantially in liquid tank.Due to network system, high-end server and movement
The improvement of communications device functions and performance, the requirement to high number of pins, data transmission bauds and signal integrity also increase.Centreless
The infiltration of substrate manufacture process liquid medicine can carry out product copper face route to sting erosion or slight erosion on a small quantity, even if being examined using route
It looks into equipment to check coreless substrate, also only finds the problem on surface, and it is light with various groove body liquid medicine inside route copper
Micro- reactions change can't find at all, causes the performance and used life of product to receive influence to a certain extent, influences pcb board
Forming Quality.
Summary of the invention
Based on this, it is necessary to be penetrated into caused by copper face route for current liquid medicine and sting erosion or etching problem, provide one kind
Coreless substrate and its packaging method.
Above-mentioned purpose is achieved through the following technical solutions:
A kind of coreless substrate packaging method, includes the following steps:
Pad pasting is carried out to the substrate；
The substrate is exposed；
Fluting is performed etching to the metal layer of the substrate, so that the metal layer is recessed, and forms groove；
Filling member is pressed on the substrate, so that the filling member is filled the groove；
The substrate is laminated, be electroplated, is processed, to form package substrate.
The groove is located at the edge of the substrate or exists with the substrate edges default in one of the embodiments,
Spacing.
The depth of the groove is less than the thickness of the metal layer in one of the embodiments,.
In one of the embodiments, the depth of the groove is the 1/3~4/5 of the metal layer thickness.
The filling member is thermoplastic material in one of the embodiments,.
The filling member is PP prepreg in one of the embodiments,.
The substrate has the first area and second area, the first area in one of the embodiments,
Positioned at the inside of the second area, the step of being exposed to the substrate further include:
Manage the exposure area of the substrate；
The first area is exposed, the second area does not expose, and so that the substrate is formed exposure and stays side.
The width of the second area is 1.5mm~3.5mm in one of the embodiments,.
The coreless substrate packaging method further includes following steps in one of the embodiments:
Before carrying out pad pasting to the substrate, first time pre-treatment is carried out to substrate；
After slotting to the substrate, second of pre-treatment is carried out to the substrate.
A kind of coreless substrate, the coreless substrate is using the coreless substrate packaging method as described in any of the above-described technical characteristic
It is process.
After adopting the above technical scheme, the present invention at least has the following technical effect that
Coreless substrate and its packaging method of the invention performs etching fluting to substrate, and by filling member to etched open
The groove formed after slot is filled, and filling member and groove form dam configuration and completely cut off liquid medicine.The current liquid medicine of effective solution seeps
Enter and stings erosion or etching problem caused by copper face route.It can prevent liquid medicine from penetrating into coreless substrate in this way, guarantee coreless substrate
Performance and used life, and product yield electrical property related to finished product is improved to a certain extent, guarantee the molding matter of pcb board
Amount.
Detailed description of the invention
Fig. 1 is the flow chart of the coreless substrate packaging method of one embodiment of the invention；
Fig. 2 is schematic view of the front view of the substrate after grooving step；
Fig. 3 is schematic view of the front view of the substrate after pressing step；
Fig. 4 is overlooking structure diagram of the substrate before step of exposure.
Wherein:
100- substrate；
110- substrate；
120- metal layer；
The first area 121-；
122- second area；
130- groove；
140- filling member.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, by the following examples, it and combines attached
Figure, is further elaborated coreless substrate and its packaging method of the invention.It should be appreciated that described herein specific
Embodiment only to explain the present invention, is not intended to limit the present invention.
It is herein component institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any sequence or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", " left side ",
The orientation of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside", " clockwise ", " counterclockwise " or position are closed
System is merely for convenience of description of the present invention and simplification of the description to be based on the orientation or positional relationship shown in the drawings, rather than indicates
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitation of the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Referring to Fig. 1 to Fig. 3, the present invention provides a kind of coreless substrate packaging methods.The coreless substrate packaging method is used for
Processing is packaged to substrate 100 to be packaged, so that substrate 100 forms coreless substrate.Coreless substrate encapsulation side of the invention
Method can prevent liquid medicine from penetrating into coreless substrate, guarantee the performance and used life of coreless substrate, and improve produce to a certain extent
Product yield electrical property related to finished product, guarantees the Forming Quality of pcb board.
In one embodiment, coreless substrate packaging method includes the following steps:
Pad pasting is carried out to substrate 100；
Substrate 100 is exposed；
Fluting is performed etching to the metal layer 120 of substrate 100, so that metal layer 120 is recessed, and forms groove 130；
Filling member 140 is pressed on substrate 100, so that filling member 140 is filled groove 130；
Substrate 100 is laminated, be electroplated, is processed, to form package substrate 100.
It should be understood that substrate 100 includes substrate 110 and metal layer 120, metal layer 120 is located at the upper of substrate 110
Side.Usual metal layer 120 is copper.
Pad pasting processing is carried out to substrate 100, i.e., film is attached to the metal layer 120 of substrate 100.Film can play protection and make
With with the metal layer 120 on protective substrate 100, avoiding substrate 100 in subsequent etching etc., metal layer 120 is bitten off in the process.Patch
After the completion of film step, need to be exposed processing to the substrate 100 after pad pasting.It should be understood that the substrate 100 after pad pasting exposes
After processing, film can be made to be close to substrate 100, the metal layer 120 during subsequent etching etc. of substrate 100 is avoided to be bitten off.Not
The metal layer 120 at the place of being exposed can be then etched away.
Then fluting is performed etching to the metal layer 120 of substrate 100, so that the surface indentation of metal layer 120, which can
To form groove 130.At this point, the bottom of groove 130 and the surface of metal layer 120 form difference in height.It should be understood that the groove
130 be ring structure.In this way, filling member 140 can be pressed together on the surface of substrate 100 when carrying out stitching operation to substrate 100,
And it can be filled into groove 130.Filling member 140 can seal.After lamination, groove 130 is combined closely with filling member 140
The effect for forming difference in height dykes and dams isolation liquid medicine avoids having liquid medicine to penetrate into base during the subsequent progress wet process to substrate 100
Plate 100 corrodes metal layer 120.It should be understood that wet process refers to that substrate 100 crosses the processes such as liquid medicine, ability in encapsulation process
Field technique personnel are frequently referred to wet process, and which is not described herein again.
Finally a series of processing such as it is laminated, is electroplated, processes to the substrate 100 of pressing filling member 140 again, so that base
Plate 100 forms coreless substrate.It is worth noting that being laminated, being electroplated, process etc. one to the substrate 100 of pressing filling member 140
The step of processing of series is the prior art, be will not repeat them here.That is, coreless substrate packaging method of the invention is
On the basis of existing coreless substrate encapsulates process, groove 130 is etched to substrate 100, using filling member 140 to groove 130
It is pressed together.
Coreless substrate packaging method of the invention performs etching fluting to substrate 100, and by filling member 140 to etched open
The groove 130 formed after slot is filled, and filling member 140 and groove 130 form dam configuration and completely cut off liquid medicine.Effective solution mesh
Preceding liquid medicine, which penetrates into caused by copper face route, stings erosion or etching problem.It can prevent liquid medicine from penetrating into coreless substrate in this way, guarantee nothing
The performance and used life of core substrate, and product yield electrical property related to finished product is improved to a certain extent, guarantee pcb board
Forming Quality.
In one embodiment, groove 130 is located at the edge of substrate 100 or there is default spacing with substrate frontside edge.Also
It is to say, which can be edges of boards slot, the i.e. edge that is located at substrate 100 of groove 130, the side of the groove 130 and substrate 100
Border region connection, as shown in Figure 2.It can remove, and obtain into from substrate 110 in order to the circuit layer structure that the later period is formed in this way
Product.Certainly, in other embodiments of the invention, between which can also exist centainly with the edge of substrate 100
Away from.
It is worth noting that no matter groove 130 is located at the edge of substrate 100 or presets with the edge presence of substrate 100
Spacing after filling member 140 is filled groove 130, can make metal layer 120 combine closely with filling member 140, with
The sealing performance for guaranteeing substrate 100 avoids substrate 100 from having liquid medicine to penetrate into substrate 100 in procedure for wet processing, and then avoids liquid medicine
Erosion or corrosion are stung to the metal layer 120 of substrate 100, guarantee the performance and used life of coreless substrate, and to a certain extent
Product yield electrical property related to finished product is improved, guarantees the Forming Quality of pcb board.
In one embodiment, the depth of groove 130 is less than the thickness of metal layer 120.That is, substrate 100 is etching
In the process, the bottom of groove 130 can kish layer 120.It in this way can be in order to which circuit layer structure that the later period is formed be from substrate 110
Upper removing, and obtain finished product.After filling member 140 is filled into groove 130, groove 130 can closely be tied with filling member 140
It closes, guarantees sealing effect, liquid medicine is avoided to penetrate into.
Further, the depth of groove 130 is the 1/3~4/5 of 120 thickness of metal layer.The depth bounds of above-mentioned groove 130
Both it can be removed from substrate 110 in order to the circuit layer structure that the later period is formed, additionally it is possible to guarantee the filled sealing of filling member 140
Performance.
Certainly, in other embodiments of the invention, the depth of groove 130 also can be equal to the thickness of metal layer 120.?
That is substrate 110 is exposed in the bottom of groove 130, without metal layer 120 after opening up groove 130 on substrate 100.Filling member
After 140 are pressed together on substrate 100, filling member 140 can combine closely with substrate 110, guarantee sealing effect.
In one embodiment, filling member 140 is thermoplastic material.It can guarantee the inflow in pressing of filling member 140 in this way
Groove 130 is filled.Further, filling member 140 is PP (polypropylene, Polypropylene) prepreg.When pressing,
The groove 130 that etching processing is filled by PP prepreg reaches the combination effect that PP+ metal layer 120 forms dykes and dams isolation, from
And prevent liquid medicine from penetrating into.
Referring to Fig. 1 and Fig. 4, in one embodiment, substrate 100 have first area 121 and second area 122, first
The step of region 121 is located at the inside of second area 122, is exposed to substrate 100 further include:
Manage the exposure area of substrate 100；
First area 121 is exposed, second area 122 does not expose, and so that substrate 100 is formed exposure and stays side.
It should be understood that the first area 121 of substrate 100 refers to the central region of substrate 100, the secondth area of substrate 100
Domain 122 refers to the fringe region of substrate 100.The first area 121 of substrate 100 is exposed, can be 100 first area of substrate
Metal layer 120 in domain 121 is close to film.Since the second area 122 of substrate 100 does not expose, exposure can be formed and stay side, side
Just operation is performed etching to metal layer 120.Specifically, when performing etching processing to substrate 100,100 first area 121 of substrate
In metal layer 120 will not be etched away, and the metal layer 120 in second area 122 can be etched away.At this point, being etched away
Metal layer 120 be recessed relative to the metal layer 120 that is not etched, to form groove 130.After forming groove 130, filling member
140 can be filled into groove 130, so that filling member 140 and metal layer 120 form dam configuration, guarantee sealing effect, avoid
Liquid medicine penetrates into.
Further, the width of second area 122 is 1.5mm~3.5mm.That is, groove 130 arrives 100 side of substrate
The width of edge is 1.5mm~3.5mm.I.e. in Fig. 4, the width of groove 130 in left-right direction is 1.5mm~3.5mm.Preferably
Ground, the width of groove 130 are 2.5mm.
Referring to Fig. 1, in one embodiment, before slotting to substrate 100, coreless substrate packaging method further include as
Lower step:
Before carrying out pad pasting to substrate 100, first time pre-treatment is carried out to substrate 100.
It should be understood that carrying out first time pre-treatment to substrate 100, i.e., first time cleaning is carried out to substrate 100.In this way,
It can guarantee that substrate 100 cleans, be convenient for pad pasting.Illustratively, substrate 100 only carries out pickling, Bu Guowei when cleaning first time
Erosion.Pickling is the surface for cleaning substrate 100, is conducive to pad pasting, and the effective district that impurity attaches substrate 100 when production is avoided to lead to metal
Layer 120 is recessed.
In one embodiment, coreless substrate packaging method further include:
After slotting to substrate 100, second of pre-treatment is carried out to substrate 100.
It should be understood that carrying out second of pre-treatment to substrate 100, i.e., second is carried out to substrate 100 and cleaned.In this way may be used
To clean the dirty of substrate frontside edge, avoid foreign matter after lamination that metal layer 120 is caused to be recessed.
100 packaging method of coreless substrate of the invention can be to 100 etching operation of substrate, in this way, filling member 140 when lamination
The characteristics of groove 130 is filled, forms dykes and dams using filling member 140+ metal layer 120, so that reaching prevents liquid medicine from penetrating into
Production program.It is worth noting that this method on the basis of production coreless substrate process at present, only increases light imaging etching
The structure of groove 130 on substrate 100 out, can be used existing equipment, without increasing new equipment investment.Also, it uses
Coreless substrate packaging method makes coreless substrate, can improve product yield electrical property related to finished product to a certain extent.
The present invention also provides a kind of coreless substrate, coreless substrate is using the coreless substrate encapsulation side in any of the above-described embodiment
Method is process.
Since coreless substrate is process using the coreless substrate packaging method, liquid medicine is penetrated into when avoiding wet process
Lead to the problem of corroding or sting erosion copper face route in substrate 100, guarantees the performance and used life of coreless substrate, and in certain journey
Product yield electrical property related to finished product is improved on degree, guarantees the Forming Quality of pcb board.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the record scope of this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of coreless substrate packaging method, which comprises the steps of:
Pad pasting is carried out to the substrate；
The substrate is exposed；
Fluting is performed etching to the metal layer of the substrate, so that the metal layer is recessed, and forms groove；
Filling member is pressed on the substrate, so that the filling member is filled the groove；
The substrate is laminated, be electroplated, is processed, to form package substrate.
2. coreless substrate packaging method according to claim 1, which is characterized in that the groove is located at the side of the substrate
There is default spacing with the substrate edges in edge.
3. coreless substrate packaging method according to claim 1, which is characterized in that the depth of the groove is less than the gold
Belong to the thickness of layer.
4. coreless substrate packaging method according to claim 2, which is characterized in that the depth of the groove is the metal
The 1/3~4/5 of thickness degree.
5. coreless substrate packaging method according to any one of claims 1 to 4, which is characterized in that the filling member is heat
Plastic material.
6. coreless substrate packaging method according to claim 5, which is characterized in that the filling member is PP prepreg.
7. coreless substrate packaging method according to any one of claims 1 to 4, which is characterized in that the substrate has institute
First area and second area are stated, the first area is located at the inside of the second area, is exposed to the substrate
The step of further include:
Manage the exposure area of the substrate；
The first area is exposed, the second area does not expose, and so that the substrate is formed exposure and stays side.
8. coreless substrate packaging method according to claim 7, which is characterized in that the width of the second area is
1.5mm~3.5mm.
9. coreless substrate packaging method according to any one of claims 1 to 4, which is characterized in that the coreless substrate envelope
Dress method further includes following steps:
Before carrying out pad pasting to the substrate, first time pre-treatment is carried out to substrate；
After slotting to the substrate, second of pre-treatment is carried out to the substrate.
10. a kind of coreless substrate, which is characterized in that the coreless substrate uses centreless as described in any one of claim 1 to 9
Substrate packaging method is process.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624105.9A CN109743840B (en) | 2018-12-28 | 2018-12-28 | Coreless substrate and packaging method thereof |
| PCT/CN2019/099315 WO2020134091A1 (en) | 2018-12-28 | 2019-08-05 | Coreless substrate and package method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624105.9A CN109743840B (en) | 2018-12-28 | 2018-12-28 | Coreless substrate and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109743840A true CN109743840A (en) | 2019-05-10 |
| CN109743840B CN109743840B (en) | 2021-05-25 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811624105.9A Active CN109743840B (en) | 2018-12-28 | 2018-12-28 | Coreless substrate and packaging method thereof |
Country Status (2)
| Country | Link |
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| CN (1) | CN109743840B (en) |
| WO (1) | WO2020134091A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134091A1 (en) * | 2018-12-28 | 2020-07-02 | 广州兴森快捷电路科技有限公司 | Coreless substrate and package method therefor |
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| JP2011199077A (en) * | 2010-03-19 | 2011-10-06 | Ngk Spark Plug Co Ltd | Method of manufacturing multilayer wiring board |
| US20120102732A1 (en) * | 2010-10-27 | 2012-05-03 | Ngk Spark Plug Co., Ltd. | Method of manufacturing multilayer wiring substrate |
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| JP4598940B2 (en) * | 2000-10-30 | 2010-12-15 | イビデン株式会社 | Method for manufacturing printed circuit board |
| CN101605430B (en) * | 2009-07-16 | 2012-01-25 | 东莞康源电子有限公司 | Method for pressing layer gasket of rigid-flexible product |
| CN104582287B (en) * | 2014-12-31 | 2018-01-30 | 广州兴森快捷电路科技有限公司 | A kind of leadless gold plating plate moves back film method |
| CN108401382B (en) * | 2018-01-23 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | Rigid-flex combined board and preparation method thereof |
| CN108811303A (en) * | 2018-06-13 | 2018-11-13 | 广州兴森快捷电路科技有限公司 | Package substrate and its processing method |
| CN109743840B (en) * | 2018-12-28 | 2021-05-25 | 广州兴森快捷电路科技有限公司 | Coreless substrate and packaging method thereof |
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2018
- 2018-12-28 CN CN201811624105.9A patent/CN109743840B/en active Active
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2019
- 2019-08-05 WO PCT/CN2019/099315 patent/WO2020134091A1/en active Application Filing
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|---|---|---|---|---|
| CN102111968A (en) * | 2009-12-28 | 2011-06-29 | 日本特殊陶业株式会社 | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| JP2011199077A (en) * | 2010-03-19 | 2011-10-06 | Ngk Spark Plug Co Ltd | Method of manufacturing multilayer wiring board |
| US20120102732A1 (en) * | 2010-10-27 | 2012-05-03 | Ngk Spark Plug Co., Ltd. | Method of manufacturing multilayer wiring substrate |
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| WO2020134091A1 (en) * | 2018-12-28 | 2020-07-02 | 广州兴森快捷电路科技有限公司 | Coreless substrate and package method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020134091A1 (en) | 2020-07-02 |
| CN109743840B (en) | 2021-05-25 |
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