CN108796477B - 一种表面多孔结构的钇系高温超导带材的制备方法 - Google Patents
一种表面多孔结构的钇系高温超导带材的制备方法 Download PDFInfo
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- CN108796477B CN108796477B CN201810530515.0A CN201810530515A CN108796477B CN 108796477 B CN108796477 B CN 108796477B CN 201810530515 A CN201810530515 A CN 201810530515A CN 108796477 B CN108796477 B CN 108796477B
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- Prior art keywords
- temperature superconducting
- strip
- copper
- solution
- yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810530515.0A CN108796477B (zh) | 2018-05-29 | 2018-05-29 | 一种表面多孔结构的钇系高温超导带材的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810530515.0A CN108796477B (zh) | 2018-05-29 | 2018-05-29 | 一种表面多孔结构的钇系高温超导带材的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN108796477A CN108796477A (zh) | 2018-11-13 |
CN108796477B true CN108796477B (zh) | 2020-01-14 |
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Family Applications (1)
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CN201810530515.0A Expired - Fee Related CN108796477B (zh) | 2018-05-29 | 2018-05-29 | 一种表面多孔结构的钇系高温超导带材的制备方法 |
Country Status (1)
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CN (1) | CN108796477B (zh) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1010232B (zh) * | 1987-04-14 | 1990-10-31 | 中国科学院化学研究所 | 液氮温区超导线材,带材及其制法 |
CN100460198C (zh) * | 2005-04-13 | 2009-02-11 | 湖南科力远新能源股份有限公司 | 一种多孔金属铜材及其制造方法 |
CN102837093B (zh) * | 2012-09-29 | 2014-11-05 | 中国东方电气集团有限公司 | 一种钇系高温超导带材的焊接方法 |
CN104671818B (zh) * | 2014-12-19 | 2017-03-15 | 上海大学 | 扩散焊银层连接ybco高温超导薄膜带材工艺 |
CN105810360A (zh) * | 2016-03-23 | 2016-07-27 | 苏州新材料研究所有限公司 | 一种rebco超导带材稳定层的制备方法 |
CN107012450A (zh) * | 2017-04-21 | 2017-08-04 | 中国科学院深圳先进技术研究院 | 一种聚合物基底表面金属化的方法及其用途 |
CN107190249B (zh) * | 2017-06-13 | 2019-08-06 | 沈阳建筑大学 | 一种多孔金属泡沫铜的制备方法 |
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2018
- 2018-05-29 CN CN201810530515.0A patent/CN108796477B/zh not_active Expired - Fee Related
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CN108796477A (zh) | 2018-11-13 |
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Inventor after: Dai Shaotao Inventor after: Xiong Xuming Inventor after: Mo Siming Inventor after: Cai Yuan Inventor after: Yuan Wen Inventor after: Zhang Teng Inventor after: Ma Tao Inventor after: Hu Lei Inventor after: Wang Bangzhu Inventor after: Chen Huijuan Inventor before: Dai Shaotao Inventor before: Xiong Xuming Inventor before: Mo Siming Inventor before: Cai Yuan Inventor before: Yuan Wen Inventor before: Zhang Teng Inventor before: Ma Tao Inventor before: Hu Lei Inventor before: Wang Bangzhu Inventor before: Chen Huijuan |
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Granted publication date: 20200114 |