CN108781504A - The method for handling substrate - Google Patents

The method for handling substrate Download PDF

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Publication number
CN108781504A
CN108781504A CN201780014450.8A CN201780014450A CN108781504A CN 108781504 A CN108781504 A CN 108781504A CN 201780014450 A CN201780014450 A CN 201780014450A CN 108781504 A CN108781504 A CN 108781504A
Authority
CN
China
Prior art keywords
substrate
support
vector
carrier
exterior section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780014450.8A
Other languages
Chinese (zh)
Inventor
蒂莫西·迈克尔·米勒
约瑟夫·威廉·索伯
罗斯·约翰逊·斯图尔特
加里·卡尔·韦伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of CN108781504A publication Critical patent/CN108781504A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Abstract

Method includes processing substrate, is included the following steps：Wedge piece is pressed against the exterior section that carrier is at least attached to substrate.Method further comprises the steps：It initiates to be detached from the position at the interface that the outer periphery between substrate and carrier is combined.Reach the step of initiation is detached from by providing relative movement between wedge piece and the peripheral edge portion of substrate.

Description

The method for handling substrate
Related application
The U.S. Provisional Application No. 62/281 that the application advocates to submit on January 21st, 2016 according to 35 U.S.C. § 119, The equity of No. 302 priority, content be the foundation of the application and its be incorporated by reference and be incorporated herein.
Technical field
Present disclosure relates generally to the method for handling substrate, and more particularly, to by substrate and load Outer periphery between body in conjunction with interface position at initiate to be detached from and the method that handles substrate.
Background technology
It is attracted attention using thin, flexible glass in the manufacture of flexible electronic or other devices.Flexible glass can have Have with electronic device (for example, liquid crystal display (LCD), electrophoretic display device (EPD) (EPD), organic light emitting diode display (OLED), Plasma display panel (PDP), touch sensor, photovoltaic device etc.) manufacture or performance-relevant several beneficial properties.? A use of element in flexible glass is to handle the ability of glass in sheet form.
In a kind of mode for handling flexible glass during the processing of flexible glass, flexible glass is combined using bonding agent Onto the carrier of relative stiffness.Once being incorporated into carrier, the characteristics and dimensions of the relative stiffness of carrier allow integrated structure to exist It is handled in production without causing un-desired bending or damage to flexible glass.For example, flexible glass piece can be coupled to carrier, And then functional component (for example, colour filter, touch sensor or thin film transistor (TFT) (TFT) component) could attach to flexible glass For piece to generate glass substrate, glass substrate can be used for the production of liquid crystal display (LCD).
For example, once processing and/or other processing steps are completed, it is understood that there may be remove the requirement of carrier from substrate.However, In view of the fragile nature of substrate, when attempting to remove carrier, carrier and/or the substrate for being attached to carrier may be damaged unfortunately It is bad.For example, for strong combination interface, it may be necessary to apply a large amount of power, it, may when attempting from strippable substrate carrier Damage carrier and/or substrate.In addition, with the trial of sharp objects reduction combination interface, there may be with carrier and/or in conjunction with base The further shrinkage stress of plate, to damage carrier and/or combine substrate.Accordingly, there exist for from carrier separating base plate and Not damaged substrate and/or be attached to carrier substrate the solution put into practice demand.
Invention content
Simplifying for present disclosure is given below to summarize, to provide to some embodiments for describing in embodiments Basic comprehension.Embodiments of the present invention provide processing substrate (e.g., one or more single substrates or two or more are single The stacking of substrate) method.
Single substrate in the full text of present disclosure can one include extensive substrate, including single glass substrate is (e.g., single Flexible glass substrate or single rigid glass substrate), single glass ceramic substrate, single ceramic substrate or single silicon substrate.? In some embodiments, single substrate may include single blank material substrate, and such as single blank glass substrate is (for example, packet Include the sheet glass of initial surface, may (for example) with the glass tape by pulling down smelting process or other technologies bys generates Separation), single blank glass-ceramic substrate or single blank silicon substrate (for example, single bare silicon wafer).If be provided as Single blank glass substrate then single blank glass substrate can be transparent, translucent or opaque, and can appoint Selection of land is in the whole thickness of single blank glass substrate from the first main surface of single blank glass substrate to the second main surface Including identical glass ingredient.In further embodiment, single blank glass substrate may include by chemical strengthening Single blank glass substrate.
Any single substrate of present disclosure optionally includes wide variety of functions.For example, single glass substrate can wrap Include the feature for allowing single substrate to change light or be attached in display device, touch sensor components or other devices.For example, single One glass substrate may include colour filter, polarizer, thin film transistor (TFT) (TFT) or other component.In further embodiment In, if single substrate is provided as single silicon substrate, single silicon substrate may include that it is allowed to be attached to integrated circuit, Feature in photovoltaic devices or other electronic units.
In further embodiment, substrate may include the stacking of single substrate, for example, single base discussed above Any of plate or combination.Two or more single substrates that the stacking of single substrate can stack by relative to each other It builds, wherein the facing main surface of adjacent single substrate is bonded to each other.In only one embodiment, single substrate Stacking may include the stacking of single glass substrate.For example, the first single glass substrate may include colour filter, and second is single One glass substrate may include thin film transistor (TFT).First single glass substrate and the second single glass substrate can (for example) use side Edge in conjunction with and be combined together, as be formed as show application display panel single substrate stacking.Therefore, originally The substrate of disclosure may include the stacking of any one or more single substrates or single substrate disclosed above.
Present disclosure is provided with to remove above-described substrate from the one or more carriers for being attached to substrate Various methods.In some embodiments, substrate (for example, stacking of one or more single substrates, single substrate) can be removed Ground is attached to one or more carriers.In some embodiments, the first main surface of substrate is attached to single carrier.Into one In the embodiment of step, two main surfaces of substrate can be coupled to respective carrier, and wherein substrate is located between two carriers.
The a certain moment after substrate to be attached to carrier, it may be necessary to remove carrier without damaged substrate.The disclosure Content provides the embodiment for allowing carrier of separating without contacting the substrate for being attached to carrier.It can thus be avoided because contacting base It is damaged caused by the traditional technology of plate.It can be removed from the substrate for being attached to carrier fully in addition, present disclosure provides Before (for example, passing through stripping) carrier, the technology of the disengaging between carrier and the substrate for being attached to carrier is initiated.It initiates to be detached from The initial position of combination interface desired point of weakness is provided in combination interface.Therefore, subsequent lift-off technology can be related to Notable smaller power, has been initiated because being detached from.Due to reducing for carrier fully to be removed (for example, passing through stripping) most Big applied force, being applied to the related stress of substrate can similarly reduce, and thus be further reduced the possibility damage to substrate.
In one embodiment, a kind of method for handling substrate is provided, the first main surface of wherein substrate is removable Except ground is attached to the first main surface of first vector, and the second main surface of substrate is removably coupled to the of Second support One main surface.The peripheral edge portion of substrate is arranged between the exterior section of first vector and the exterior section of Second support.Method May include step (I)：Wedge piece is pressed against on the exterior section of first vector and Second support.Method can further comprise Step (II)：It initiates to be detached from the position at the interface that the outer periphery between substrate and first vector is combined.Initiate the step being detached from Suddenly the outer of first vector and Second support can be pried open by providing relative movement between wedge piece and the peripheral edge portion of substrate Portion part and reach.
In another embodiment, step (I) and (II) be can perform without making any part of substrate be contacted with wedge piece.
In another embodiment, the first part for being inserted into tool may include the tapered thickness for limiting wedge piece.
In another embodiment, after step (II), method can further comprise the steps：Increased with the tool of insertion Greatly at a distance from the disengaging of first vector part is between Second support, so that the other part of first vector is detached from from substrate.
In another embodiment, insertion tool can further comprise the second part with constant thickness.Method can be again Further comprise reducing at a distance between the peripheral edge portion in wedge piece with substrate, at least up to first vector and Second support The facing inner surface for the exterior section pried open is spaced apart the distance of the constant thickness of the second part equal to insertion tool.
In another embodiment, be inserted into the constant distance of the second part of tool than when step (I) starts the About 20 microns to about 40 microns of the distance between facing inner surface of exterior section of one carrier and Second support.
In another embodiment, the second part for being inserted into tool may include limit constant thickness opposite parallel Outer surface.
In another embodiment, after step (II), the method can further comprise the steps：Increase the The distance between the disengaging part of one carrier and Second support, wherein the surface of the second part of the tool of insertion engages first vector Exterior section inner surface so that the other part of first vector from substrate be detached from.
In another embodiment, method can further comprise the steps：Inhibit Second support during step (II) Bending.
In another embodiment, method can further comprise the second main surface of Second support being removably attached to Plate, to inhibit the bending of Second support during step (II).
In another embodiment, plate may include evacuated panel, and method can further comprise the of Second support Two main surface vacuum attachments are to evacuated panel, to inhibit the bending of Second support during step (II).
In another embodiment, substrate may include at least one of glass substrate and silicon substrate.
In another embodiment, substrate may include that have thickness be the single glass from about 50 microns to about 300 micron Glass substrate.
In another embodiment, at least one of first vector and Second support may include from about 200 microns to About 700 microns of thickness.
In another embodiment, substrate and first vector and Second support it is at least one between step back laterally away from From can be from about 2mm to about 10mm.
In another embodiment, after step (II), method can further comprise step (III)：By in wedge shape Relative movement is provided between part and the peripheral edge portion of substrate to pry open the exterior section of first vector and Second support and in substrate It initiates to be detached from the position at the interface that the outer periphery between Second support combines.
In another embodiment, method may comprise steps of：Inhibit the curved of first vector during step (III) It is bent.
In another embodiment, method can further comprise the second main surface vacuum attachment of first vector to vacuum Plate during step (III) to inhibit the bending of first vector.
In another embodiment, after step (III), method can further comprise step (IV)：Fully from base Plate removes one in first vector and Second support.
In another embodiment, after step (IV), method can further comprise step (V)：Fully from substrate Remove another in first vector and Second support.
In another embodiment, a kind of method for handling glass substrate, wherein the first of glass substrate are provided with Main surface is removably coupled to the first main surface of first vector, and the second main surface of glass substrate removedly combines To the first main surface of Second support.Exterior section and Second support in first vector is arranged in the peripheral edge portion of glass substrate Between exterior section.Method includes the following steps (I)：Second main surface of Second support is removably attached to plate, with suppression The bending of Second support processed.Method further comprises the steps (II)：The wedge piece for the tool that is inserted into is pressed against first vector On the exterior section of Second support, while the second main surface of Second support is attached to plate.Method further comprises following step Suddenly (III)：It initiates to be detached from the position at the interface that the outer periphery between glass substrate and first vector is combined, while second carries Second main surface of body is attached to plate.Initiate disengaging can be by providing relative movement between wedge piece and the outer rim of glass substrate Reached with prying open the exterior section of first vector and Second support.Executable step (II) and (III) are without making glass substrate Any part contacted with wedge piece.
In another embodiment, insertion tool may include first part and second part, and first part includes wedge shape Part, second part have constant thickness.Method can further comprise reducing between wedge piece and the peripheral edge portion of glass substrate Distance, at least up to the facing inner surface of first vector and the exterior section of Second support pried open be spaced apart be equal to insert Enter the distance of the constant thickness of the second part of tool.
In another embodiment, after step (III), further comprise the steps：Increase in first vector It is detached from the distance between part and Second support.Increasing distance can be carried by being inserted into the surface engagement first of the second part of tool The inner surface of the exterior section of body and reach so that the other part of first vector from glass substrate be detached from.
In another embodiment, it is provided with a kind of method for handling substrate, the first main surface of wherein substrate can It is attached to the first main surface of carrier with removing.Method includes the following steps (I)：The of substrate is removedly attached relative to plate Two main surfaces, to inhibit the bending of substrate.Once being removedly attached, the exterior section in carrier is arranged in the peripheral edge portion of substrate Between the surface of plate.Method can further comprise the steps (II)：Wedge piece is pressed against to the table of the outside and plate of carrier Face.Method can also further comprise the steps (III)：It is opposite between wedge piece and the peripheral edge portion of substrate by providing The position at the interface that the mobile outer periphery to pry open the exterior section of carrier and the surface of plate and between substrate and carrier combines Place initiates to be detached from, while the second main surface of substrate maintains removedly to be attached relative to the surface of plate.
In another embodiment, step (II) and (III) be can perform without making any part of substrate be connect with wedge piece It touches.
In another embodiment, the first part for being inserted into tool may include the tapered thickness for limiting wedge piece.
In another embodiment, after step (III), method can further comprise the steps：With the tool of insertion Increase at a distance between the disengaging part of carrier and the surface of plate, so that the other part of carrier is detached from from substrate.
In another embodiment, insertion tool can further comprise the second part with constant thickness.Method may be used also Further comprise reducing at a distance between the peripheral edge portion in wedge piece with substrate, the table of inner surface and plate at least up to carrier Face interval opens the distance of the constant thickness of the second part equal to insertion tool.
In another embodiment, the constant distance of the second part of tool is inserted into than being carried when step (II) starts About 20 microns to about 40 microns of the distance between the inner surface of body and the surface of plate.
In another embodiment, the second part for being inserted into tool may include limit constant thickness opposite parallel Outer surface.
In another embodiment, after step (III), method can further comprise the steps：Increase in carrier Disengaging part the distance between with the surface of plate, wherein the inner surface of the exterior section of the tool of insertion engagement carrier, so as to carry The other part of body is detached from from substrate.
In another embodiment, plate may include evacuated panel, and step (I) includes that the second main surface of substrate is true Sky is attached to evacuated panel.
In another embodiment, substrate may include at least one of glass substrate and silicon substrate.
In another embodiment, substrate may include single substrate.
In another embodiment, substrate may include glass substrate.
In another embodiment, substrate may include that have thickness be the single base from about 50 microns to about 300 micron Plate.
In another embodiment, carrier may include the thickness from about 200 microns to about 700 micron.
In another embodiment, the lateral distance of stepping back between substrate and carrier can be from about 2mm to about 10mm.
In another embodiment, after step (III), method can further comprise the steps (IV)：Fully Carrier is removed from substrate.
Brief description
When with reference to schema reading the following embodiments and the accompanying drawings is attached, it is better understood the above and other feature, wherein：
Fig. 1 is schematic plan view of the vacuum attachment to the Second support of evacuated panel, and wherein a part for substrate, first carry Body and Second support are broken away to show the vacuum ports of evacuated panel；
Fig. 2 is schematic cross sectional view along the line 2-2 of Fig. 1；
Fig. 3 is the enlarged diagram of the view 3 along Fig. 2, shows wedge piece being pressed against first vector and Second support Exterior section on before some position at wedge piece；
Fig. 4 shows the wedge piece of any embodiment of present disclosure and/or the outside of first vector and Second support The embodiment of partial replacement section profile；
Fig. 5 shows the wedge piece of any embodiment of present disclosure and/or the outside of first vector and Second support Another embodiment of partial replacement section profile；
Fig. 6 is analogous to the enlarged diagram of Fig. 3, but shows wedge piece being pressed against the outer of first vector and Second support The step of portion part；
Fig. 7 is analogous to the enlarged diagram of Fig. 6, but the step of showing to initiate to be detached between first vector and substrate；
Fig. 8 is analogous to the enlarged diagram of Fig. 7, but shows to be further inserted into insertion tool so that first vector and The exterior sections pried open of two carriers be spaced apart the constant thickness of the second part equal to insertion tool apart from the step of；
Fig. 9 is analogous to the enlarged diagram of Fig. 8, but show with insertion tool increase the disengaging part of first vector with The step of the distance between Second support；
Figure 10 is analogous to the enlarged diagram of Fig. 9, but the step of showing fully to remove first vector from substrate；
Figure 11 shows that the substrate relative to evacuated panel vacuum attachment, wherein wedge piece are compressed against the external portion of Second support Divide on the surface with evacuated panel；
Figure 12 shows the embodiment of the replacement section profile of the wedge piece of Figure 11 and/or the exterior section of carrier；
Figure 13 shows another embodiment of the replacement section profile of the wedge piece of Figure 11 and/or the exterior section of carrier；
Figure 14 is analogous to the enlarged diagram of Figure 11, but shows the step for initiating to be detached between Second support and substrate Suddenly；
Figure 15 is analogous to the enlarged diagram of Figure 11, but the step of showing to be further inserted into insertion tool；
Figure 16 is analogous to the enlarged diagram of Figure 11, but shows to increase on the surface for being detached from part and plate of Second support The distance between the step of；
Figure 17 is the enlarged diagram for showing the step of fully substrate from Figure 16 removes Second support；
The block diagram for the step of Figure 18 is the alternate embodiments for showing present disclosure；With
Figure 19 is the curve graph for the percentage for showing to initiate relative to the disengaging for stepping back lateral distance.
Specific implementation mode
Embodiment now is described more fully with below with reference to subsidiary schema, various realities are shown in subsidiary schema Apply mode.As long as possible, using identical component symbol in entire schema, to refer to same or analogous component.However, each A aspect can be implemented in many different forms, and should not be construed as limited to the embodiment illustrated at this.
In order to handle substrate during processing, substrate can be coupled to one or more carriers.The relative stiffness of carrier Feature and size allow the substrate for handling combination in production, without bending substantially, otherwise its may cause to substrate and/ Or it is installed to the damage of the component on substrate.The substrate of any embodiment of present disclosure can as described above include one or The stacking of multiple single substrates or two or more single substrates.Single substrate can have micro- from about 50 microns to about 300 The thickness of rice, but other thickness can be provided in further embodiment.In one embodiment, single flexible glass (wherein each single flexible glass substrate has micro- from about 50 microns to about 300 the stacking of substrate or single flexible glass substrate The thickness of rice) bonding agent (such as polymeric binders, or in U.S. Patent Application Publication No. US2014/0170378 can be used Number, the bonding agent disclosed in No. US2015/0329415, or in International Patent Application Publication No. WO2015/113020 Number, No. WO2015/113023, No. WO2015/112958, the bonding agent disclosed in No. WO2015/157202, or U.S. Provisional Patent Application US62/185095, the US62/ submitted on May 19th, 2015 that on June 26th, 2015 submits 163821, the bonding agent disclosed in the US62/201245 submitted on the 5th of August in 2015) and it is removably coupled to rigid load Body.Similarly, bonding agent may include the silicone material being such as described in detail in EP2025650, or be described in detail in KR2013044774 Surface roughness mechanism.Carrier can be by that can resist the glass of the condition during the processing for the substrate for being removably coupled to carrier Made by glass, resin or other materials.Carrier through the disclosure optionally introduces desired rigidity by providing carrier Level, the carrier have the thickness for the thickness for being more than the substrate for being removably coupled to carrier.As shown, carrier may include The plate (for example, rigid plate) with thickness between the first main surface and the second main surface of carrier.In some embodiments In, the thickness that may include from about 200 microns to about 700 micron through the carrier of present disclosure.In some further implementations In mode, carrier may include the thickness for being more than the thickness for the single substrate for being attached to carrier.In addition, in some embodiments, The thickness of carrier may be selected, the overall thickness of wherein carrier and the substrate for being attached to carrier can be used for being configured to processing relatively In the range of the existing processing machinery of thick glass substrate, the relatively thick glass substrate has in carrier and is attached to carrier Substrate overall thickness in the range of thickness.
As shown in figs. 1 and 2 shown in meaning property, substrate 301 optionally includes the stacking of single substrate or single substrate. In only one embodiment, Fig. 3 show by the stacking of two single substrates it is optional in the form of substrate 301, substrate 301 includes It is attached to the first single glass substrate 315a of the second single glass substrate 315b.The substrate of Fig. 3 can be in a wide variety of ways And it is formed.For example, the first single flexible glass piece can be coupled to first vector 307, to generate the first integrated structure 323a.Equally Ground, the second flexible glass piece can be coupled to Second support 313, to generate the second integrated structure 323b.First integrated structure 323a It can be handled with the existing machinery for being designed to the first integrated structure of processing, to add one or more work(to the first flexible glass piece Energy component (such as colour filter 317), to generate the first single glass substrate 315a.In some embodiments, the first single glass Glass substrate 315a can be but if complete from first vector 307 since the knot of the first vector 307 with rigidity is combined into inflexible It is detached from entirely, then will be single flexible glass substrate.
Second integrated structure 323b can use the existing machine processing for being designed to the second integrated structure of processing, and soft to second Property sheet glass addition one or more functions component (such as thin film transistor (TFT) (TFT) component 319), to generate the second single glass Substrate 315b.In some embodiments, the second single glass substrate 315b can due to rigidity Second support 313 in conjunction with and To be single flexible glass substrate to be inflexible, but if be completely disengaged from from Second support 313.
The outer surface of the first single glass substrate 315a of first integrated structure 323a can be coupled to the second integrated structure The outer surface of the second single glass substrate 315b of 323b, to form substrate 301 (stacking of single substrate shown in for example), It includes the first single substrate 315a for being attached to the second single substrate 315b.As shown, with the stacking of single glass substrate The substrate 301 of form can form the glass panel for display application, but can be formed in further embodiment Other structures.In some embodiments, due to being combined with the Second support 313 of the first vector 307 of rigidity and rigidity, with list The substrate 301 of the form of the stacking of one substrate can be inflexible, but if complete from first vector 307 and Second support 313 Ground is detached from, then by being stacked for the flexibility of single substrate.As shown, substrate 301 includes the first main surface 303 and the second main table Face 309, the first main surface 303 are removably coupled to the first main surface 305 of first vector 307, and the second main surface 309 is removable Except ground is attached to the first main surface 311 of Second support 313.
The a certain moment after substrate to be attached to carrier, it may be necessary to remove carrier without damaged substrate.In fact, Before processing single substrate (for example, by adding one or more functions component), it may be necessary to remove single base from carrier Plate.In another embodiment, it is understood that there may be after by processing substrate at the single substrate with functional component and by base Plate is created as before the stacking of single substrate, and the requirement of single substrate is removed from carrier.It, can in embodiment further Can exist from the substrate (such as substrate 301 discussed above) of the stacking including single substrate and remove one or more carriers It is required that.
There may be the requirements that carrier is finally removed from any substrate discussed above.Due to the fragile nature of substrate, In some embodiments, it is understood that there may be remove the requirement of peripheral edge portion 321 of the carrier without engaging substrate.
In some embodiments, it is understood that there may be wanted what the pre-position at the interface that outer periphery combines initiated to be detached from It asks.This disengaging initiation can reduce stress, and may be in the case where not having to be detached from step of initiating to substrate and/or carrier Possible damage.It can be directed to the relatively small position at the interface that outer periphery combines in fact, providing and being detached from step of initiating, to permit Perhaps originated and be detached from the first power in zonule, thus provide a point of weakness in junction, this it is permissible with the first power phase Than the second power for reduction (for example, passing through stripping) carrier is more easily removed completely from substrate.
The method that processing substrate is now described referring initially to Figure 18, because it is applied to substrate shown in Fig. 3-10 301, but similar or identical step can be applied to any other substrate discussed above.As shown, method can pass through It optionally includes the step 1803 for the bending for inhibiting Second support 313 and starts from 1801.For example, Second support 313 can be substantive Ground is fixed, to resist the bending under bending moment.In this way, method allows which carrier of rational prediction that will release first It puts.In fact, the bending by inhibiting Second support 313, the bending of carrier are primarily limited to first vector 307.Therefore, inhibit The bending of Second support 313 can promote to be detached from, with the interface of the outer periphery combination between substrate 301 and first vector 307 It is initiated at position.
Inhibit the step 1803 of the bending of Second support 313 that can reach in many ways.For example, method and step 1803 can Include that the second main surface 325 of Second support 313 is removably attached to plate, to inhibit the bending of Second support 313.Plate can Include by the rigid plate made by metal (for example, stainless steel, aluminium etc.), plastic cement, resin or other materials.Removable attachment can By sticker in conjunction with or other technologies bys reach.In one embodiment, as shown, plate may include evacuated panel 327.Such as Shown in figure, evacuated panel 327 can vacuum attachment to Second support 313 the second main surface 325, with relative to evacuated panel 327 by Two carriers 313 releasedly stationary positioned.
As shown in figs. 1 and 2, evacuated panel 327 may include one or more vacuum ports, for example, shown in a plurality of vacuum Port 101 is open at the surface of evacuated panel 327 103 (for example, surface of substantial planar).A plurality of vacuum ports 101 can be set It is set to and is selectively in fluid communication with vacuum source 201 (referring to Fig. 2) (such as vacuum tank or vacuum pump).As shown in Figure 2, vacuum is led Pipe 203 (such as flexible hose) can provide fluid communication between a plurality of vacuum ports 101 and vacuum source 201.In a reality It applies in mode, as shown in Figure 2, evacuated panel may include that vacuum chamber 205, vacuum chamber 205 can be set to and a plurality of vacuum Port 101 is in fluid communication so that a plurality of vacuum ports 101 are in fluid communication with vacuum pipeline 203.
Although it is not shown, one or more bearings can be provided to prevent the second main surface 325 in Second support 313 Actual engagement between the surface 103 of evacuated panel 327.This bearing may include outer periphery bearing, such as surround a plurality of true The ring of dead end mouth 101.Additionally or alternatively, bearing may include being distributed between vacuum ports, all over and in the figure of vacuum ports 101 The column of case.Column may include a variety of materials, such as polymer material.Bearing may extend away about 1.6 millimeters (mm) (for example, 1/16 inch) Distance, but other distances can be used in further embodiment.
As shown in the arrow 1805 in Figure 18, method is optionally from the step 1803 for the bending for inhibiting Second support 313 Proceed to and wedge piece 601 (referring to Fig. 6) (such as being inserted into the wedge piece of tool 329) is pressed against the external portion of first vector 307 Divide the step 1807 of the exterior section 603b of 603a and Second support 313.Alternatively, as shown in arrow 1809, method can start In the step 1807 for exterior section 603a, 603b that wedge piece 601 is pressed against to first vector 307 and Second support 313.This can Can be desired, to reduce processing time and if without preferentially selecting which carrier to discharge first.However, in order to capture substrate 301 and the preferential disengaging of first vector 307 being pre-selected is provided, can (for example) be used in discussed evacuated panel 327 and press down Second support 313 processed is bent.
Referring to Fig.1, wedge piece 601 can be on direction 105 towards respectively including first vector 307 and Second support 313 The chamfering turning 107 of exterior section 603a, 603b are inserted into.This angle of approach can reduce the stress at the point engaged with carrier It concentrates, while maximizing the stress concentration in the corner of substrate 301, to promote carrier to initiate to be detached from from substrate.As shown in Fig. 1 Shown in meaning property, in addition to chamfering turning, any or all turning of carrier may include cavetto turning 109 or other corner shapes.This Outside, any or all turning of carrier may include chamfering, such as chamfering turning 107,110a, 110b.In addition, can be at one or more A carrier corner provides alternative form.As shown in the dotted line in Fig. 1, the turning of substrate 301 optionally includes repairing Circle turning 113, chamfering turning 115 or other corner shapes.In addition, substrate may include cavetto turning or chamfering turning mixing or The mixing of other corner shapes.Further, all turnings may include cavetto turning, chamfering turning or other turning shapes Shape.
Figure 18 is returned to, after step 1807, method can proceed to step 1811, by providing in 601 He of wedge piece Relative movement between the peripheral edge portion 321 of substrate 301 is to pry open at least one of first vector 307 and Second support 313 Exterior section 603a, 603b and interface 605 (referring to Fig. 6) that outer periphery between substrate 301 and first vector 307 combines It initiates to be detached from position 701 (referring to Fig. 7)., can be above with respect to as described in step 1803 during step 1811, inhibition second carries The bending of body.For example, as previously discussed, during step 1803, method may include the second of Second support 313 the main table 325 vacuum attachment of face is to evacuated panel 327, to inhibit the bending of Second support 313 during step 1803.
Prying open at least one action of exterior section 603a, 603b of first vector 307 and Second support 313 can pass through It will linearly be pressed against exterior section 603a, 603b on the wedge piece 601 (for example) direction 105 shown in Fig. 1,6 and 7 and reaches At.Relative contour shape of the action by exterior section 603a, 603b and wedge piece 601 is pried open by what wedge piece 601 was provided And reach.In only one embodiment, the tapered thickness for being inserted into tool limits wedge piece 601.For example, as shown in Figure 3, inserting Enter tool 329 and may include that the outer end for being provided with wedge piece 601, wedge piece 601 are tapered from larger thickness T1 on outward direction 331 At relatively small thickness T2.It can be defined by the tapered thickness of insertion tool 329 and be supplied to the various alternative forms of wedge piece.Example Such as, Fig. 4 shows another embodiment of insertion tool 401, and with chamfering wedge piece 403, chamfering wedge piece 403 includes can be whole Terminate in the inclined side 405 of blunt end 407.Fig. 5 shows another embodiment of insertion tool 501, has round wedge piece 503, round wedge piece 503 includes the cavetto turning 505 that may terminate at blunt end 507.There is provided conically shaped wedge for insertion tool can The sharp corner of stress point may be provided by reducing, and sharp corner may cause insertion tool and/or exterior section 603a, 603b Damage.In addition, conically shaped wedge allows exterior section 603a, 603b to be pried open, because being inserted into the maximum gauge 607 of tool 329 (see Fig. 6) is more than when step 1807 starts in the phase of first vector 307 and exterior section 603a, 603b of Second support 313 The distance between inner surface faced " D1 " (referring to Fig. 6).
As further shown, exterior section 603a, 603b can have and be discussed with any embodiment discussed above The similar circular contour of wedge piece stated.That is, exterior section 603a, 603b can have any such as Fig. 4,5,12 or 13 Profile shown in a.In addition, it is also conceivable that in the wedge piece of the tool of insertion include tapered thickness institute by the end of insertion tool In the embodiment of the wedge piece of restriction, exterior section 603a, 603b can be with the planar edges at the turning of 90 degree of band.It substitutes Ground, in the embodiment that exterior section 603a, 603b include tapering point, the wedge piece for being inserted into tool may include end, described End has the planar edge at the turning of 90 degree of band.However, for exterior section 603a, 603b and wedge piece 601 of insertion tool Stress point can be reduced (for example, as shown in the figure) by providing tapered profiles, to reduce abrasion and the damage to being inserted into tool and/or carrier It is bad, while also providing and desired prying open action.
In some embodiments, method and step 1807 and 1811 any parts and wedge that can implement without making substrate 301 Shape part 601 contacts.In fact, for example, as shown in Figure 8, at fully inserted position, the vertex 601a and base of wedge piece 601 The peripheral edge portion 321 of plate 301 is spaced apart.Prevent the contact between substrate 301 and wedge piece 601 from can avoid applying substrate 301 Plus-pressure, to reduce the possibility of damage substrate 301, otherwise with blade combination substrate and/or carrier to attempt to break through periphery Side combine interface 605 other technologies may this thing happens.In addition, reducing the point on the wedge piece of the tool of insertion If sharp point can be further reduced or prevent the damage to substrate 301 when somehow contact occurs.For example, providing has blunt end 407,570 or the wedge piece of the insertion tool with rounded vertex 601a can reduce or eliminate sharp edge, point or turning, and And if damage when to avoid unintentional contact from occurring to the peripheral edge portion 321 of substrate 301.
As shown in Figure 18, initiate be detached from step 1811 after, method optionally proceeds to step 1813, with insert Enter the increase of tool 329 and is detached from the partly distance between Second support 313 in first vector 307, so that first vector 307 Other part is detached from from substrate 301.For the promotion interface for obtaining more reliable, tool is inserted into optionally in direction of insertion 105 It is further inserted into, the maximum gauge until being inserted into tool 329 is located at 305 lower section of the first main surface of first vector 307.Such as Fig. 8 Shown in, in some embodiments, it includes perseverance that insertion tool, which includes in the length of the second part 801 of insertion tool 329, Determine the second part 801 of thickness 609.As shown, in some embodiments, it is constant in the length of second part 801 Thickness 609 may include the maximum gauge of insertion tool.In some embodiments, as shown in Figure 8, constant thickness 609 can be by Two opposite parallel outer surface 803a, 803b are provided.Parallel surfaces can provide constant thickness 609, and constant thickness 609 can Desired interval is provided between first vector 307 and exterior section 603a, 603b of Second support 313.In some embodiment party In formula, constant thickness 609 than when step 1807 starts between the facing inner surface of exterior section 603a, 603b About 20 microns to about 40 microns of distance " D1 ".Although the thickness difference of wide scope can be used, the thickness less than 20 microns is provided Difference may not be able to successfully be initiated to be detached from some applications, and may to be inserted into when providing the thickness difference more than 40 microns Tool is difficult to very much be inserted into some applications.
As shown in Figure 8, in some embodiments, method can further comprise reducing in wedge piece 601 and substrate 301 The distance between peripheral edge portion 321, at least up to the exterior section 603a of first vector 307 and Second support 313 pried open, The facing inner surface of 603b is spaced apart the distance of the constant thickness 609 of the second part 801 equal to insertion tool 329 "D2".The planar interface 805 of overlapping can be provided by reducing distance, and the planar interface 805 of overlapping can reduce stress to be inserted into reduction The possibility that tool is unintentionally detached from from first vector 307 during promotion operation as described below.Reducing distance can be (for example) Reached by being further inserted into insertion tool along direction 105.What the pluggable degree of tool may depend on substrate 301 steps back cross To distance.For the purpose of present disclosure, with reference to figure 6, step back lateral distance " L1 " be considered as insertion tool be inserted into It initiates at the position being detached from, in the peripheral edge portion of the outermost point and substrate 301 of carrier (for example, first vector 307) to be hoisted Lateral distance between 321 outermost point.Lateral distance can be stepped back according to present disclosure and using wide scope.For example, In some embodiments, stepping back lateral distance can be from about 2mm to about 10mm.Figure 19 shows that successful disengaging on the vertical axis is initiated The curve graph of the set back distance in millimeters of percentage control on the horizontal axis.Square indicates real data, and bent Line shows the Function Fitting of real data.As can be seen, set back distance is higher, and substrate, which is reached, to be successfully detached from the percentage of initiation and get over Greatly.As can be seen, with stepping back in some embodiments of lateral distance from about 2mm to about 10mm, may achieve from more than 70% to about 100% impressive result.It may achieve higher using the lateral distance of stepping back from about 6mm to about 10mm Result.
In one embodiment, as shown in Figure 9, increase in the disengaging part of first vector 307 and Second support 313 The distance between step 1813 may include being promoted on the direction 901 of the first main surface 311 far from Second support 313 and be inserted into Tool 329.In some embodiments, direction 901 can be carried perpendicular to the first main surface 311 with reduction (such as preventing) first Body is relative to the lateral sliding for being inserted into tool 329.As further shown, distance can be increased until first vector 307 and second The facing inner surface of exterior section 603a, 603b for prying open of carrier 313 and the second part 801 of insertion tool 329 (surface is interior with the exterior section 603a's of first vector 307 on surface (part of parallel surfaces 803a shown in for example) Surface engages) " D3 " spaced apart, so that the other part of first vector 307 is detached from from substrate 301.
As shown in the arrow 1815 and 1817 in Figure 18, after step 1811 or 1813, method optionally proceeds to Step 1819, upset substrate to execute similar process on the opposite sides, so that Second support 313 initiates to take off from substrate 301 From.For example, process shown in Fig. 6-9 can be again carried out as described above, but first vector 307 is installed in the drawings Evacuated panel 327.In fact, method can be by providing the opposite shifting between wedge piece 601 and the peripheral edge portion 321 of substrate 301 It is dynamic to pry open exterior section 603a, 603b of first vector 307 and Second support 313 and substrate 301 and Second support 313 it Between outer periphery combine interface position at initiate be detached from.Similar to process discussed above, method may include when initiation The step of inhibiting bending (such as utilizing plate) of first vector when disengaging.
In some embodiments, carrier 30 as one kind 7, one of 313 or two can fully removed during step 1821 The initiation carried out before person between each and substrate 301 of carrier 30 as one kind 7,313 is detached from.In fact, in some embodiments In, process terminates 1830, without removing carrier, as shown in arrow 1823 and 1825.If will in different times or position It is removed completely, it would be possible that such situation occurs.For example, initiating to be detached from but incompletely can permit carrier from substrate disengaging Perhaps carrier protective substrate during transport.Simultaneously as initiating the technique for being detached from but being incompletely detached from carrier, simplify in purpose Carrier is removed at position.In addition, with reference to figure 1, initiating to be detached from can be happened on the opposite corners of carrier.For example, can be in chamfering It initiates to be detached from first vector at turning 107, while can similarly carry out Second support at one of opposite corners 110a, 110b Initiation be detached from.It provides to be detached from one of opposite turning 110a, 110b and initiates that hair can be detached from the second of Second support During the process of rising, help maintains vacuum sealing to resist the substrate of evacuated panel or the rigidity of carrier.In addition, such as the arrow in Figure 18 Shown in 1810, any one carrier (for example, first vector or Second support) can be happened at from the disengaging of substrate initiation more than one A position, and this can be completed before overturning stacks, and will be appointed with the one or more positions around the outer periphery of stacking What he initiates to be detached from carrier from substrate.
Figure 10 shows fully to remove the step 1821 of first vector 307 from substrate 301.As shown, vacuum item 1001 It can be used for holding carrier and initiated the part being detached from, and continue that part being lifted up on direction 1003, with complete Ground removes (for example, passing through stripping) first vector 307 from substrate 301.Executable similar process, to remove the from substrate 301 Two carriers 313.
According to foregoing teachings, it will be understood that an embodiment of present disclosure may include handling glass substrate (such as glass Glass substrate 301 and the stacking for including above-described single glass substrate) method.In this embodiment, glass substrate 301 the first main surface 303 is removably coupled to the first main surface 305 of first vector 307, and glass substrate 301 Second main surface 309 is removably coupled to the first main surface 311 of Second support 313.As shown in Figure 3, glass substrate 301 Peripheral edge portion 321 be arranged between the exterior section 603a of first vector 307 and the exterior section 603b of Second support 313. In this embodiment, method may include step 1803, and the second main surface 325 of Second support 313 is removedly attached It is connected to plate (for example, evacuated panel), to inhibit the bending of Second support 313.As shown in Figure 6, method can further comprise step 1807, by the wedge piece 601 of insertion tool 329 be pressed against first vector 307 and Second support 313 exterior section 603a, Between 603b, while the second main surface 325 of Second support 313 is attached to plate (for example, evacuated panel).Method can further comprise Step 1811, the position at the interface 605 (referring to Fig. 6) that the outer periphery between glass substrate 301 and first vector 307 combines It initiates to be detached from 701 (referring to Fig. 7), while the second main surface 325 of Second support 313 is attached to plate (for example, evacuated panel).Such as Shown in Fig. 7, initiate be detached from the step of can by provide it is opposite between wedge piece 601 and the peripheral edge portion 321 of substrate 301 Movement is reached with prying open the exterior section of first vector 307 and Second support 313, wherein step 1807 and 1811 it is executable and Any part of glass substrate 301 is not set to be contacted with wedge piece 601.
As shown in Figure 18, the step 181 of promotion is optional.In fact, as shown in arrow 1827, method can directly from Step 1811 proceeds to the step 1821 that carrier is fully removed from substrate.For example, be not the upset substrate after step 1811, But first vector 307 can be fully removed as shown in Figure 10.Then, as shown in arrow 1829, method optionally carries out To the step 1819 of overturning.The technique for removing Second support 313 is shown in Figure 11-17.Unless otherwise specified, otherwise with figure The associated techniques of 11-17 can be similar or identical with pointed technique in figs. 1-10.In addition, when showing in Figure 11-17 Technique when showing to remove carrier from glass substrate 301, similar process can be used for any other substrate.
Return to Figure 11, method may include handling substrate, such as shown in substrate 301, wherein the second main surface of substrate 301 309 are removably coupled to the first main surface 311 of Second support 313.Method may include following steps：Relative to 327 (example of plate Such as, evacuated panel) the first main surface 303 of substrate 301 is removedly attached, to inhibit the bending of substrate 301.Implement at one In mode, at least part of the first main surface 303 of substrate 301 or the first main surface 303 of substrate 301 can not contact plate 327, and the first main surface 303 of substrate is removedly attached still in relation to plate 327.Such embodiment is with first In the application that the contact of feature (for example, component) in main surface 303 may damage during vacuum attachment by contact plate 327 May be particularly useful.Alternatively, in another embodiment, entire first main surface 303 of substrate 301 can be with plate 327 It is in direct contact, while the first main surface 303 of substrate is removedly attached still in relation to plate 327.
As shown, exterior section 603b and plate 327 in Second support 313 is arranged in the peripheral edge portion 321 of substrate 301 Between surface 103.Method can further comprise the steps：Wedge piece 601 is pressed against to the exterior section of Second support 313 Between 603b and the surface 103 of plate 327.Figure 12 shows the alternate embodiments of chamfering wedge piece 1201, is similar to institute in Fig. 4 The chamfering wedge piece 403 shown.Figure 13 shows another alternate embodiments of round wedge piece 1301, is similar to shown in Fig. 5 Round wedge piece 503.As the every other wedge piece shown, the wedge piece of Figure 12 and 13 also can be by being inserted into tool Tapered thickness and limit.In further embodiment, wedge piece 403 and 503 can be also used in the technique of Figure 11-16.
As shown in Figure 14, method can further comprise by providing the peripheral edge portion in wedge piece 601 and substrate 301 Relative movement between 321 is to pry open the exterior section 603b of Second support 313 and the surface 103 of plate 327 and in 301 He of substrate It initiates to be detached from the position 1401 at the interface 1101 (referring to Figure 11) that the outer periphery between Second support 313 combines, while substrate 301 the first main surface 303 maintains the surface 103 for being removably attached to plate 327.As shown in Figure 11,14 and 15, method can It executes without making any part of substrate 301 be contacted with wedge piece 601.
After initiating to be detached from position 1401, method can further comprise the steps：Increased with tool 329 is inserted into Second support 313 is detached from part and the distance between the surface 103 of plate 327, so that the other part of Second support 313 is from base Plate 301 is detached from.As previously mentioned, it includes the second part 801 for having constant thickness 609 to be inserted into tool 329.As shown in Figure 15, Method can further comprise reducing the distance between wedge piece 601 and the peripheral edge portion 321 of substrate 301, at least up to second The inner surface of carrier 313 and the surface 103 of plate 327 are spaced apart the constant thickness of the second part 801 equal to insertion tool 329 609 distance " D2 ".As discussed above, the constant distance 609 of the second part 801 of tool 329 is inserted into than by wedge When the pressing of shape part starts on a second carrier, the distance between the inner surface of Second support 313 and the surface 103 of plate 327 About 20 microns to about 40 microns of " D1 " (referring to Figure 11).In addition, it is as discussed above, with reference to Fig. 8, it is inserted into tool 329 Second part 801 may include opposite parallel surfaces 803a, 803b for limiting constant thickness 609.
After the disengaging for initiating Second support 313, as shown in Figure 16, method can further comprise the steps：With Insertion tool 329 increases the distance " D3 " being detached between part and the surface 103 of plate 327 in Second support 313, wherein being inserted into Tool 329 engages the inner surface of the exterior section of Second support 313, so that the other part of Second support 313 is de- from substrate 301 From.
As shown in Figure 17, the step of method can further comprise fully removing Second support 313 from substrate 301.Such as Discussed above, the technique shown in Figure 11-17 can be used for removing any substrate from carrier.In one embodiment, Substrate may include at least one of single glass substrate and single silicon wafer, but can provide it in further embodiment His substrate.In further embodiment, single substrate include include functional component single substrate (for example, with polarization The single glass substrate of device, colour filter, thin film transistor (TFT) etc.).In another embodiment, substrate may include single substrate Stack, for example, shown in single glass substrate stacking.As previously mentioned, any single substrate (for example, single glass substrate) can With the thickness from about 50 microns to about 300 micron, but there may be other thickness in further embodiment.In addition, The thickness that carrier may include from about 200 microns to about 700 micron, but other thickness can be provided in further embodiment Degree.Further, the lateral distance of stepping back between substrate and carrier can be from about 2mm to about 10mm.
Unless otherwise stated, the method and step of present disclosure can execute in various orders.For example, method and step It can be executed with any sequence shown in Figure 18.In one embodiment, have it is discussed above two carriers it Between substrate, first vector can be initiated to be detached from, and optionally by step by step 1807 and 1811 by method from substrate 1813.Method can then include overturning substrate during step 1819, and then incited somebody to action again by step 1807 and 1811 Second support initiates to be detached from from substrate, and optionally by step 1813.Then, method can proceed to step 1821, with such as It fully removes from substrate one of carrier shown in Figure 10, and then fully removes as shown in Figure 11 and 14-17 another One carrier.
In another embodiment, there is the substrate discussed above combined between two carriers, method can pass through First vector is initiated to be detached from by step 1807 and 1811 from substrate, and optionally by step 1813.Then, method can be straight It connects and proceeds to step 1821, wherein first vector is fully removed from substrate, as shown in Figure 10.Then, in step 1819 phase Between substrate may be reversed, and then Second support can be initiated to be detached from again by step 1807 and 1811 by method from substrate, And optionally by step 1813.Then, method can proceed to step 1821, fully to remove Second support from substrate, As shown in Figure 11 and 14-17.
These are only the several embodiments that can be changed to method discussed above.Without departing substantially from claims In the case of spirit and scope, other various modifications and variations can be carried out.
A kind of method of processing substrate of embodiment 1., the first main surface of wherein substrate are removably coupled to the first load First main surface of body, and the second main surface of substrate is removably coupled to the first main surface of Second support, wherein base The peripheral edge portion of plate is arranged between the exterior section of first vector and the exterior section of Second support, and method includes following step Suddenly：
(I) wedge piece is pressed against to the exterior section of first vector and Second support；With
(II) by providing relative movement between wedge piece and the peripheral edge portion of substrate to pry open first vector and second The exterior section of carrier and initiate to be detached from the position at interface that outer periphery between substrate and first vector combines.
The method of such as embodiment 1 of embodiment 2., wherein executing any part of the step (I) and (II) without making substrate It is contacted with wedge piece.
Such as method of embodiment 1 or embodiment 2 of embodiment 3., wherein the first part of the tool of insertion includes limiting The tapered thickness of wedge piece.
The method of such as embodiment 3 of embodiment 4. further comprises the steps wherein after step (II)：With Insertion tool increase first vector disengagings partly between Second support at a distance from so that the other part of first vector from Substrate is detached from.
The method of such as embodiment 4 of embodiment 5., wherein the tool of insertion further comprises second with constant thickness Part, and method further comprises reducing at a distance between the peripheral edge portion in wedge piece with substrate, is carried at least up to first The facing inner surface for the exterior section of body and Second support pried open is spaced apart the second part equal to insertion tool The distance of constant thickness.
The method of such as embodiment 5 of embodiment 6., wherein the constant distance ratio of the second part of the tool of insertion is in step (I) about 20 microns of distance when starting between the facing inner surface of the exterior section of first vector and Second support is extremely About 40 microns.
Such as method of embodiment 5 or embodiment 6 of embodiment 7., wherein the second part of the tool of insertion includes limiting The opposite parallel outer surface of constant thickness.
The method of any one of such as embodiment 5-7 of embodiment 8., wherein after step (II), further comprise with Lower step：Increase at a distance from the disengaging part of first vector is between Second support, wherein the second part of the tool of insertion Surface engages the inner surface of the exterior section of first vector, so that the other part of first vector is detached from from substrate.
The method of any one of such as embodiment 1-8 of embodiment 9., further comprises the steps：In step (II) phase Between inhibit Second support bending.
The method of such as embodiment 9 of embodiment 10., further comprises the second main surface of Second support removedly It is attached to plate, to inhibit the bending of Second support during step (II).
The method of such as embodiment 10 of embodiment 11., wherein plate includes evacuated panel, and method further comprises the Second main surface vacuum attachment of two carriers is to evacuated panel, to inhibit the bending of Second support during step (II).
The method of any one of such as embodiment 1-11 of embodiment 12., wherein substrate includes glass substrate and silicon substrate At least one of kind.
It is from about 50 that the method for any one of such as embodiment 1-12 of embodiment 13., wherein substrate, which include with thickness, The single glass substrate of micron to about 300 microns.
The method of any one of 14. embodiment 1-13 of embodiment, wherein at least the one of first vector and Second support A includes the thickness from about 200 microns to about 700 micron.
The method of any one of such as embodiment 1-14 of embodiment 15., wherein being carried in substrate and first vector and second Lateral distance of stepping back between at least one of body is from about 2mm to about 10mm.
The method of any one of such as embodiment 1-15 of embodiment 16. further comprises wherein after step (II) Step (III)：By providing the relative movement between wedge piece and the peripheral edge portion of substrate to pry open first vector and second The exterior section of carrier and initiate to be detached from the position at interface that outer periphery between substrate and Second support combines.
The method of such as embodiment 16 of embodiment 17., further comprises the steps：Inhibit during step (III) The bending of first vector.
The method of such as embodiment 17 of embodiment 18., further comprises the second main surface vacuum of first vector is attached It is connected to evacuated panel, to inhibit the bending of first vector during step (III).
The method of such as embodiment 16 of embodiment 19. further comprises the steps wherein after step (III) (IV)：One in first vector and Second support is fully removed from substrate.
The method of such as embodiment 19 of embodiment 20. further comprises the steps wherein after step (IV) (V)：Another in first vector and Second support is fully removed from substrate.
A kind of method for handling glass substrate of embodiment 21., wherein the first main surface of glass substrate can be removed Ground is attached to the first main surface of first vector, and the second main surface of glass substrate is removably coupled to Second support The exterior section of exterior section and Second support in first vector is arranged in first main surface, the peripheral edge portion of wherein glass substrate Between, method includes the following steps：
(I) the second main surface of Second support is removably attached to plate, to inhibit the bending of Second support；
(II) wedge piece for the tool that is inserted into is pressed against on the exterior section of first vector and Second support, while second carries Second main surface of body is attached to plate；With
(III) it initiates to be detached from the position at the interface that the outer periphery between glass substrate and first vector is combined, simultaneously Second main surface of Second support is attached on plate, wherein by providing opposite move between wedge piece and the outer rim of glass substrate It is dynamic to initiate to be detached to pry open the exterior section of first vector and Second support, wherein executing step (II) and (III) without making Any part of glass substrate is contacted with wedge piece.
The method of such as embodiment 21 of embodiment 22., wherein the tool of insertion includes first part and second part, first Part includes wedge piece, and second part has constant thickness, and method further comprises reducing in wedge piece and glass substrate The distance between peripheral edge portion, at least up to the exterior section of first vector and Second support pried open it is facing in Surface is spaced apart the distance of the constant thickness of the second part equal to insertion tool.
The method of such as embodiment 22 of embodiment 23. further comprises the steps wherein after step (III)： Surface by being inserted into the second part of tool engages the inner surface of the exterior section of first vector, to increase in first vector It is detached from the distance between part and Second support, so that the other part of first vector is detached from from glass substrate.
A kind of method for handling substrate of embodiment 24., the first main surface of wherein substrate are removably coupled to First main surface of carrier, method include the following steps：
(I) the second main surface of substrate is removedly attached relative to plate, to inhibit the bending of substrate, wherein substrate is outer Edge, which is set up separately, sets between the exterior section of carrier and the surface of plate；
(II) wedge piece is pressed against to the surface of the exterior section and plate of carrier；With
(III) by providing the relative movement between wedge piece and the peripheral edge portion of substrate to pry open the external portion of carrier Point and plate surface and initiate to be detached from the position at interface that outer periphery between substrate and carrier combines, while the of substrate Two main surfaces maintain removedly to be attached relative to the surface of plate.
The method of such as embodiment 24 of embodiment 25., wherein executing step (II) and (III) without making any of substrate Part is contacted with wedge piece.
Such as method of embodiment 24 or embodiment 25 of embodiment 26., wherein the first part of the tool of insertion includes Limit the tapered thickness of wedge piece.
The method of such as embodiment 26 of embodiment 27. further comprises the steps wherein after step (III)： Increased at a distance between the disengaging part of carrier and the surface of plate with the tool of insertion, so that the other part of carrier is de- from substrate From.
The method of such as embodiment 27 of embodiment 28., wherein the tool of insertion further comprises having the of constant thickness Two parts, and method further comprises reducing at a distance between the peripheral edge portion in wedge piece with substrate, at least up to carrier Inner surface and the surface of plate be spaced apart at a distance from the constant thickness equal to the second part of insertion tool.
The method of such as embodiment 28 of embodiment 29., wherein the constant distance ratio of the second part of the tool of insertion is in step Suddenly when (II) starts about 20 microns to about 40 microns at a distance from the inner surface of carrier is between the surface of plate.
Such as method of embodiment 28 or embodiment 29 of embodiment 30., wherein the second part of the tool of insertion includes Limit the opposite parallel outer surface of constant thickness.
The method of any one of such as embodiment 28-30 of embodiment 31. is further wrapped wherein after step (III) Include following steps：Increased at a distance between the disengaging part of carrier and the surface of plate with the tool of insertion, wherein the tool of insertion connects The inner surface of the exterior section of carrier is closed, so that the other part of carrier is detached from from substrate.
The method of any one of such as embodiment 24-31 of embodiment 32., wherein plate includes evacuated panel, and step (I) Include by the second main surface vacuum attachment of substrate to evacuated panel.
The method of any one of such as embodiment 24-32 of embodiment 33., wherein substrate includes glass substrate and silicon substrate At least one of kind.
The method of any one of such as embodiment 24-33 of embodiment 34., wherein substrate includes single substrate.
The method of any one of such as embodiment 24-34 of embodiment 35., wherein substrate includes glass substrate.
It is from about 50 microns that the method for any one of such as embodiment 24-35 of embodiment 36., wherein substrate, which include thickness, To about 300 microns of single substrate.
The method of any one of such as embodiment 24-36 of embodiment 37., wherein carrier includes from about 200 microns to about 700 microns of thickness.
The method of any one of such as embodiment 24-37 of embodiment 38., wherein stepping back cross between substrate and carrier To distance for from about 2mm to about 10mm.
The method of any one of such as embodiment 24-38 of embodiment 39. is further wrapped wherein after step (III) Include following steps (IV)：Fully carrier is removed from substrate.

Claims (17)

1. a kind of method of processing substrate, wherein the first main surface of the substrate is removably coupled to the first of first vector Main surface, and the second main surface of the substrate is removably coupled to the first main surface of Second support, wherein the base The peripheral edge portion of plate is arranged between the exterior section and the exterior section of the Second support of the first vector, the method Include the following steps：
(I) wedge piece is pressed against to the exterior section of the first vector and the Second support；With
(II) by providing relative movement between the wedge piece and the peripheral edge portion of the substrate to pry open described the The exterior section of one carrier and the Second support and the outer periphery between the substrate and the first vector is combined Interface position at initiate be detached from.
2. the method as described in claim 1, wherein executing any part and institute of the step (I) and (II) without making the substrate State wedge piece contact.
3. method as claimed in claim 1 or 2, wherein the substrate includes at least one of glass substrate and silicon substrate.
4. method as claimed in any one of claims 1-3, wherein in the first vector and the Second support at least One includes thickness from about 200 microns to about 700 micron.
5. the method as described in any one of claim 1-4, wherein in the substrate and the first vector and described second Lateral distance of stepping back between at least one of carrier is from about 2mm to about 10mm.
6. the method as described in any one of claim 1-5, wherein it is from about 50 microns to about 300 that the substrate, which includes thickness, The single substrate of micron.
7. the method as described in any one of claim 1-6 further comprises the steps wherein after step (II) (III)：Fully the carrier is removed from the substrate.
8. the method as described in any one of claim 1-7, wherein the first part of the tool of insertion includes limiting the wedge shape The tapered thickness of part.
9. method as claimed in claim 8 further comprises the steps wherein after step (II)：With the insertion Tool increase the disengaging part of the first vector and the distance between the Second support with by the first vector in addition Part is detached from from the substrate.
10. method as claimed in claim 10, wherein the insertion tool further comprises second with constant thickness Point, and the method further includes reducing at a distance between the peripheral edge portion of the wedge piece with the substrate, At least up between the facing inner surface quilt of the exterior section pried open of the first vector and the Second support Separate the distance of the constant thickness of the second part equal to the insertion tool.
11. method as claimed in claim 10, wherein the constant distance ratio of the second part of the insertion tool When step (I) starts in the facing inner surface of the exterior section of the first vector and the Second support The distance between about 20 microns to about 40 microns.
12. the method as described in claim 10 or 11, wherein the second part of the insertion tool includes described in restriction The opposite parallel outer surface of constant distance.
13. the method as described in any one of claim 10-12 further comprises following step wherein after step (II) Suddenly：Increase the distance between the disengaging part of the first vector and the Second support, wherein the insertion tool is described The surface of second part in conjunction with the exterior section of the first vector inner surface so that the first vector other portion Divide and is detached from from the substrate.
14. the method as described in any one of claim 1-13, further comprises the steps：Inhibit during step (II) The bending of the Second support, and the second main surface of the Second support is removably attached to plate in step (II) Period inhibits the bending of the Second support.
15. method as claimed in claim 14, wherein the plate includes evacuated panel, and the method further includes by institute The second main surface vacuum attachment of Second support is stated to the evacuated panel to inhibit described second to carry during step (II) The bending of body.
16. the method as described in any one of claim 1-15, wherein the substrate includes single substrate.
17. the method described in claim 16, wherein the substrate includes glass substrate.
CN201780014450.8A 2016-01-21 2017-01-19 The method for handling substrate Pending CN108781504A (en)

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