CN108735652B - Chip grabbing mechanism in integrated circuit board connecting device - Google Patents
Chip grabbing mechanism in integrated circuit board connecting device Download PDFInfo
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- CN108735652B CN108735652B CN201810514843.1A CN201810514843A CN108735652B CN 108735652 B CN108735652 B CN 108735652B CN 201810514843 A CN201810514843 A CN 201810514843A CN 108735652 B CN108735652 B CN 108735652B
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- rod section
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- circuit board
- integrated circuit
- pole section
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a chip grabbing mechanism in an integrated circuit board connecting device, and belongs to the technical field of machinery. It has solved prior art and has had the poor problem of stability. This chip among integrated circuit board connecting device snatchs mechanism includes lower connecting plate, and a support, the upper junction plate, driving piece one, driving piece two and absorption piece, above-mentioned lower connecting plate links firmly with the frame face contact and both mutually through the fastener, above-mentioned support includes straight section form pole section one and pole section two, pole section two and lower connecting plate parallel arrangement, the both ends of above-mentioned pole section one link firmly respectively on pole section two and lower connecting plate, have between upper junction plate and the pole section two and enable the upper junction plate along the guide structure of two length direction translations of pole section. The chip grabbing mechanism in the integrated circuit board connecting device is high in stability.
Description
Technical Field
The invention belongs to the technical field of machinery, and relates to a chip grabbing mechanism in an integrated circuit board connecting device.
Background
The integrated circuit board is made by using semiconductor manufacturing process to manufacture many transistors, resistors, capacitors and other components on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by multilayer wiring or tunnel wiring.
In the existing integrated circuit board manufacturing process, an operator manually connects a chip to a circuit board. This mode of production is inefficient, time consuming and labor intensive, and the accuracy of the assembly of the integrated circuit is determined entirely by the operator's experience.
Disclosure of Invention
The present invention is directed to solve the above problems in the prior art, and an object of the present invention is to provide a chip grabbing mechanism in an integrated circuit board connection apparatus with a compact structure and high stability.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a chip among integrated circuit board connecting device snatchs mechanism, integrated circuit board connecting device includes the frame, a serial communication port, this mechanism includes lower connecting plate, and a support, the upper junction plate, driving piece one, driving piece two and absorption piece, above-mentioned lower connecting plate links firmly with the frame face contact and both mutually through the fastener, above-mentioned support includes straight section form pole section one and pole section two, pole section two and lower connecting plate parallel arrangement, the both ends of above-mentioned pole section one link firmly respectively on pole section two and lower connecting plate, have between upper junction plate and the pole section two and enable the upper junction plate along the guide structure of two length direction translations of pole section, above-mentioned driving piece one links firmly on pole section one and driving piece one links to each other with the upper junction plate, driving piece two links firmly on the upper junction plate and absorbs the piece and connects on driving piece two.
The chip in the integrated circuit board can be conveniently grabbed through the chip grabbing mechanism.
Specifically, the adsorption member is located at the outer end of the second rod segment in the initial state. The driving piece drives the adsorption piece to move up and down, and the chip connected to the adsorption piece can stably move up and down. When the chip moves down to the set position, the adsorption piece stops adsorbing, and the chip stably enters the corresponding processing procedure.
The adsorption piece can circularly act between the material taking position and the material placing position as soon as the driving piece drives the upper connecting plate to move horizontally.
Certainly, driving piece one and driving piece two are located the support both ends respectively, and such structure avoids support unilateral atress, has effectively improved whole mechanism stability.
The arrangement of the lower connecting plate enables the whole mechanism to be stably connected to the frame of the connecting device.
The chip grabbing mechanism in the integrated circuit board connecting device further comprises a long plate-shaped mounting plate, the lower end of the mounting plate is fixedly connected to the rod section I, and the driving piece I is fixedly connected to the upper end of the mounting plate.
The mounting plate is arranged to enable the driving part to be stably connected to the bracket.
In the above chip grabbing mechanism in the integrated circuit board connecting device, a reinforcing structure capable of increasing the strength of the bracket is further arranged between the first rod section and the second rod section.
Because the bracket is L-shaped, the strength is limited. The defect of low strength of the mechanism is overcome under the action of the reinforcing structure.
In the chip grabbing mechanism in the integrated circuit board connecting device, the reinforcing structure comprises a reinforcing plate in a right triangle shape, and two right-angle sides of the reinforcing plate are respectively connected to the first rod section and the second rod section.
In the above chip catching mechanism in the ic board connecting device, the reinforcing plate has extending sections extending to the bottom edges of the reinforcing plate at two right-angle edges, and a connecting edge for connecting to the first rod section or the second rod section is formed between the right-angle edge and the extending section of the reinforcing plate.
In the above chip catching mechanism of the ic board connecting device, a side portion of the rod segment has a first concave positioning groove, and one of the connecting edges is embedded in the first concave positioning groove.
In the chip grabbing mechanism in the integrated circuit board connecting device, the side parts of the two rod sections are provided with concave positioning grooves II, and the other connecting edge is embedded in the positioning grooves II.
The reinforcing plate improves the strength of the bracket, occupies no space and effectively improves the structural compactness.
In the above chip catching mechanism in the ic board connecting device, the stiffener and the extension section are of an integral structure.
In the chip grabbing mechanism in the integrated circuit board connecting device, the guide structure comprises a guide rail fixedly connected to the upper part of the second rod section, the lower part of the upper connecting plate is connected to the guide rail, and the first adsorption part and the first driving part are both located on the side part of the guide rail.
The upper connecting plate can stably translate along the length direction of the second rod section under the action of the guide rail.
In the above chip gripping mechanism in the ic board connecting device, the suction member is a vacuum chuck.
Compared with the prior art, the chip grabbing mechanism in the integrated circuit board connecting device has the advantages that the L-shaped support can ensure that the adsorbed chip can be stably positioned at the processing procedure of the integrated circuit board, and therefore, the stability is higher.
Meanwhile, the strength of the bracket is improved under the action of the reinforcing plate, the reinforcing plate does not occupy extra space, the stability of the bracket is improved, and the structure of the bracket is compact.
In addition, the driving parts I and the driving parts II which are distributed on the two sides of the support avoid the stress on the single side of the support, further improve the stability of the support and have high practical value.
Drawings
Fig. 1 is a schematic structural diagram of a chip catching mechanism in the present integrated circuit board connecting device.
In the figure, 1, a frame; 2. a lower connecting plate; 3. a support; 3a, a first rod section; 3a1 and a first positioning groove; 3b, a second rod section; 3b1 and a second positioning groove; 4. an upper connecting plate; 5. a first driving part; 6. a driving part II; 7. an adsorbing member; 8. mounting a plate; 9. a reinforcing plate; 9a, an extension section; 10. a guide rail.
Detailed Description
As shown in fig. 1, the integrated circuit board connection device includes a chassis 1.
This chip among integrated circuit board connecting device snatchs mechanism includes lower connecting plate 2, support 3, upper junction plate 4, driving piece one 5, driving piece two 6 and absorption piece 7, above-mentioned lower connecting plate 2 links firmly through the fastener with 1 face contact of frame and both mutually, above-mentioned support 3 includes straight section form pole section one 3a and pole section two 3b, pole section two 3b and lower connecting plate 2 parallel arrangement, the both ends of above-mentioned pole section one 3a link firmly respectively on pole section two 3b and lower connecting plate 2, have between upper junction plate 4 and the pole section two 3b and enable upper junction plate 4 along the guide structure of pole section two 3b length direction translation, above-mentioned driving piece one 5 links firmly on pole section one 3a and driving piece one 5 links to each other with upper junction plate 4, driving piece two 6 links firmly on upper junction plate 4 and absorption piece 7 is connected on driving piece two 6.
The device also comprises a long plate-shaped mounting plate 8, the lower end of the mounting plate 8 is fixedly connected to the first rod section 3a, and the first driving piece 5 is fixedly connected to the upper end of the mounting plate 8.
And a reinforcing structure capable of increasing the strength of the bracket is arranged between the first rod section 3a and the second rod section 3 b.
The reinforcing structure comprises a reinforcing plate 9 in the shape of a right triangle, and two right-angle sides of the reinforcing plate 9 are respectively connected to the first rod section 3a and the second rod section 3 b.
The reinforcing plate 9 has extension sections 9a extending to the bottom edge at two edges, and a connecting edge for connecting to the first rod section 3a or the second rod section 3b is formed between the edges of the reinforcing plate 9 and the extension sections 9 a.
The side part of the first rod section 3a is provided with a concave positioning groove 3a1, wherein, a connecting edge is embedded at the position of the positioning groove 3a 1.
The side part of the second rod section 3b is provided with a concave positioning groove II 3b1, and the other connecting edge is embedded in the position of the positioning groove II 3b 1.
The reinforcing plate 9 and the extension section 9a are of an integral structure.
The guide structure comprises a guide rail 10 fixedly connected to the upper part of the second rod section 3b, the lower part of the upper connecting plate 4 is connected to the guide rail 10, and the adsorption part 7 and the driving part I5 are both located on the side part of the guide rail 10.
The adsorption piece 7 is a vacuum chuck.
The chip in the integrated circuit board can be conveniently grabbed through the chip grabbing mechanism.
Specifically, the adsorption member is located at the outer end of the second rod segment in the initial state. The driving piece drives the adsorption piece to move up and down, and the chip connected to the adsorption piece can stably move up and down. When the chip moves down to the set position, the adsorption piece stops adsorbing, and the chip stably enters the corresponding processing procedure.
The adsorption piece can circularly act between the material taking position and the material placing position as soon as the driving piece drives the upper connecting plate to move horizontally.
Certainly, driving piece one and driving piece two are located the support both ends respectively, and such structure avoids support unilateral atress, has effectively improved whole mechanism stability.
The arrangement of the lower connecting plate enables the whole mechanism to be stably connected to the frame of the connecting device.
Claims (1)
1. A chip grabbing mechanism in an integrated circuit board connecting device comprises a rack and is characterized in that the mechanism comprises a lower connecting plate, a support, an upper connecting plate, a first driving piece, a second driving piece and an adsorption piece, wherein the lower connecting plate is in contact with the surface of the rack and fixedly connected with the rack through a fastener;
the lower end of the mounting plate is fixedly connected to the first rod section, and the first driving piece is fixedly connected to the upper end of the mounting plate;
a reinforcing structure capable of increasing the strength of the bracket is arranged between the first rod section and the second rod section;
the reinforcing structure comprises a reinforcing plate in a right-angled triangle shape, and two right-angled sides of the reinforcing plate are respectively connected to the first rod section and the second rod section;
the two right-angle edges of the reinforcing plate are provided with extension sections extending towards the bottom edge of the reinforcing plate, and a connecting edge used for being connected to the first rod section or the second rod section is formed between the right-angle edges and the extension sections of the reinforcing plate;
a concave positioning groove I is formed in one side part of the rod section, and one connecting edge is embedded in the positioning groove I;
the side part of the rod section II is provided with a concave positioning groove II, and the other connecting edge is embedded in the positioning groove II;
the reinforcing plate and the extension section are of an integrated structure;
the guide structure comprises a guide rail fixedly connected to the upper part of the second rod section, the lower part of the upper connecting plate is connected to the guide rail, and the adsorption part and the driving part I are both positioned on the side part of the guide rail;
the adsorption piece is a vacuum chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810514843.1A CN108735652B (en) | 2018-05-25 | 2018-05-25 | Chip grabbing mechanism in integrated circuit board connecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810514843.1A CN108735652B (en) | 2018-05-25 | 2018-05-25 | Chip grabbing mechanism in integrated circuit board connecting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108735652A CN108735652A (en) | 2018-11-02 |
| CN108735652B true CN108735652B (en) | 2020-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810514843.1A Active CN108735652B (en) | 2018-05-25 | 2018-05-25 | Chip grabbing mechanism in integrated circuit board connecting device |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140082417A (en) * | 2012-12-24 | 2014-07-02 | 주식회사 에이에스티젯텍 | Pick-up Device |
| CN203753965U (en) * | 2014-02-19 | 2014-08-06 | 苏州博众精工科技有限公司 | Part grasping and inspection mechanism |
| CN107900571B (en) * | 2017-12-19 | 2024-03-22 | 无锡奥特维科技股份有限公司 | Linkage handling device and battery piece series welding machine |
| CN108847399A (en) * | 2018-05-24 | 2018-11-20 | 浙江工规科技有限公司 | The attachment device of integrated circuit board |
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2018
- 2018-05-25 CN CN201810514843.1A patent/CN108735652B/en active Active
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| CN108735652A (en) | 2018-11-02 |
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