CN108735652A - Chip grasping mechanism in integrated circuit board connecting equipment - Google Patents

Chip grasping mechanism in integrated circuit board connecting equipment Download PDF

Info

Publication number
CN108735652A
CN108735652A CN201810514843.1A CN201810514843A CN108735652A CN 108735652 A CN108735652 A CN 108735652A CN 201810514843 A CN201810514843 A CN 201810514843A CN 108735652 A CN108735652 A CN 108735652A
Authority
CN
China
Prior art keywords
rod segment
integrated circuit
circuit board
plate
grasping mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810514843.1A
Other languages
Chinese (zh)
Other versions
CN108735652B (en
Inventor
裘诚晨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Industrial Regulation Technology Co Ltd
Original Assignee
Zhejiang Industrial Regulation Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Industrial Regulation Technology Co Ltd filed Critical Zhejiang Industrial Regulation Technology Co Ltd
Priority to CN201810514843.1A priority Critical patent/CN108735652B/en
Publication of CN108735652A publication Critical patent/CN108735652A/en
Application granted granted Critical
Publication of CN108735652B publication Critical patent/CN108735652B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

The present invention provides the chip grasping mechanisms in a kind of integrated circuit board connecting equipment, belong to field of mechanical technique.It is poor that it solves the problems, such as the prior art there is stability.Chip grasping mechanism in this integrated circuit board connecting equipment includes lower connecting plate, holder, upper junction plate, actuator one, actuator two and adsorption piece, above-mentioned lower connecting plate is contacted with rack face and the two is fixedly connected with by fastener, above-mentioned holder includes the rod segment one and rod segment two of straight section shape, rod segment two is arranged in parallel with lower connecting plate, the both ends of above-mentioned rod segment one are respectively fixedly connected in rod segment two and lower connecting plate, and the guide frame that upper junction plate is translated along two length direction of rod segment can be made by having between upper junction plate and rod segment two.Chip grasping mechanism stability in this integrated circuit board connecting equipment is high.

Description

Chip grasping mechanism in integrated circuit board connecting equipment
Technical field
The invention belongs to field of mechanical technique, a kind of be related in integrated circuit board connecting equipment chip grasping mechanism.
Background technology
Integrated circuit board be use semiconductor fabrication process, made on one piece of smaller monocrystalline silicon piece many transistors and The components such as resistor, capacitor, and component is combined into complete electronics according to the method that multilayer wiring or tunnel connect up Circuit.
All it is that operator by hand connects chip on circuit boards in existing integrated circuit board manufacturing process.This life It is low and time-consuming and laborious to produce mode efficiencies, moreover, the assembly precision of integrated circuit fully relies on the decision of operator's experience.
Invention content
It is high the purpose of the present invention is in view of the above-mentioned problems existing in the prior art, providing a kind of compact-sized and stability Chip grasping mechanism in integrated circuit board connecting equipment.
Object of the invention can be realized by the following technical scheme:
A kind of chip grasping mechanism in integrated circuit board connecting equipment, integrated circuit board connecting equipment includes rack, It is characterized in that, mechanism includes lower connecting plate, holder, upper junction plate, actuator one, actuator two and adsorption piece, above-mentioned lower company Fishplate bar is contacted with rack face and the two is fixedly connected with by fastener, and above-mentioned holder includes the rod segment one and rod segment two of straight section shape, bar Duan Eryu lower connecting plates are arranged in parallel, and the both ends of above-mentioned rod segment one are respectively fixedly connected in rod segment two and lower connecting plate, upper junction plate Having between rod segment two can be such that the guide frame that upper junction plate is translated along two length direction of rod segment, above-mentioned actuator one is connected in In rod segment one and actuator one is connected with upper junction plate, and actuator two is connected on upper junction plate and adsorption piece is connected to actuator On two.
The chip in integrated circuit board can easily be captured by this chip grasping mechanism.
Specifically, adsorption piece is located at the outer end of rod segment two when original state.Actuator drives adsorption piece to move up and down What the chip being connected in the process on adsorption piece can be stablized moves up and down.When chip is displaced downwardly to setting position, adsorption piece stops Only adsorb, chip stablize into its for manufacturing procedure at.
Actuator can be such that adsorption piece is followed between the two at feeding and at blowing once driving in upper junction plate translation motion Gyration is made.
Certainly, actuator one and actuator two are located at holder both ends, and such structure avoids holder unilateral side stress, has Effect improves entire mechanical stability.
The setting of lower connecting plate can make being connected in the rack of attachment device of entire mechanism stable.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, further include one be in long plate shape installation Plate, mounting plate lower end are connected in rod segment one, and actuator one is connected in mounting plate upper end.
The setting of mounting plate can be such that actuator one is stably connected on holder.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, between the rod segment one and rod segment two also Tool can increase the reinforcement structure of support intensity.
Since holder is L-shaped, limited strength.The low defect of mechanism intensity is just compensated in the effect of reinforcement structure.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, the reinforcement structure includes rectangular Two right-angle sides of the reinforcing plate of triangle, reinforcing plate are connected in rod segment one and rod segment two.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, at two right-angle sides of the reinforcing plate The extended segment extended to its bottom edge is all had, is formed between the right-angle side and extended segment of above-mentioned reinforcing plate for being connected to rod segment one Or the connection edge in rod segment two.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, one side of the rod segment has recessed Locating slot one, wherein connection is along at locating slot one together.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, two side of the rod segment has recessed Locating slot two, in addition connection edge is embedded at locating slot two together.
While reinforcing plate improves support intensity, it is also not take up space, effectively raises its structural compactness.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, the reinforcing plate is integrated with extended segment Formula structure.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, the guide frame includes being connected in bar The guide rail on two tops of section, above-mentioned upper junction plate lower part are connected on guide rail, and above-mentioned adsorption piece and actuator one are respectively positioned on rail-sides Portion.
Upper junction plate can be along the length direction stably translational of rod segment two under the action of guide rail.
In chip grasping mechanism in above-mentioned integrated circuit board connecting equipment, the adsorption piece is vacuum cup.
Compared with prior art, the chip grasping mechanism in this integrated circuit board connecting equipment is due to L-shaped holder energy Ensure that the chip adsorbed can be stablized at the manufacturing procedure of integrated circuit board, therefore, stability is relatively high.
Meanwhile support intensity is improved under the action of reinforcing plate, and reinforcing plate is not take up exceptional space, and it is steady to improve it Its structure is also compact while qualitative.
In addition, the actuator one and actuator two that are distributed at holder both sides, avoid holder unilateral side stress, further increase Its stability has very high practical value.
Description of the drawings
Fig. 1 is the structural schematic diagram of the chip grasping mechanism in this integrated circuit board connecting equipment.
In figure, 1, rack;2, lower connecting plate;3, holder;3a, rod segment one;3a1, locating slot one;3b, rod segment two;3b1, determine Position slot two;4, upper junction plate;5, actuator one;6, actuator two;7, adsorption piece;8, mounting plate;9, reinforcing plate;9a, extended segment; 10, guide rail.
Specific implementation mode
As shown in Figure 1, integrated circuit board connecting equipment includes rack 1.
Chip grasping mechanism in this integrated circuit board connecting equipment includes lower connecting plate 2, holder 3, upper junction plate 4, drives Moving part 1, actuator 26 and adsorption piece 7, above-mentioned lower connecting plate 2 is contacted with 1 face of rack and the two is fixedly connected with by fastener, Above-mentioned holder 3 includes one 3a of rod segment and rod segment two 3b of straight section shape, and two 3b of rod segment is arranged in parallel with lower connecting plate 2, above-mentioned bar The both ends of one 3a of section are respectively fixedly connected on two 3b of rod segment and lower connecting plate 2, and having between two 3b of upper junction plate 4 and rod segment can make The guide frame that connecting plate 4 is translated along two 3b length directions of rod segment, above-mentioned actuator 1 are connected on one 3a of rod segment and drive Part 1 is connected with upper junction plate 4, and actuator 26 is connected on upper junction plate 4 and adsorption piece 7 is connected on actuator 26.
Further include one be in long plate shape mounting plate 8,8 lower end of mounting plate is connected on one 3a of rod segment, and actuator 1 is connected In 8 upper end of mounting plate.
Also tool can increase the reinforcement structure of support intensity between two 3b of one 3a of the rod segment and rod segment.
The reinforcement structure includes the reinforcing plate 9 of rectangular triangle, and two right-angle sides of reinforcing plate 9 are connected to On two 3b of one 3a of rod segment and rod segment.
The extended segment 9a extended to its bottom edge is all had at two right-angle sides of the reinforcing plate 9, above-mentioned reinforcing plate 9 The connection edge for being connected on two 3b of one 3a of rod segment or rod segment is formed between right-angle side and extended segment 9a.
One sides 3a of the rod segment have recessed one 3a1 of locating slot, wherein connection is along embedded in one 3a1 of locating slot together Place.
Two sides 3b of the rod segment have recessed two 3b1 of locating slot, and in addition connection edge is embedded in two 3b1 of locating slot together Place.
The reinforcing plate 9 is an integral structure with extended segment 9a.
The guide frame includes the guide rail 10 for being connected in two tops 3b of rod segment, and 4 lower part of above-mentioned upper junction plate, which is connected to, leads On rail 10, above-mentioned adsorption piece 7 and actuator 1 are respectively positioned on 10 side of guide rail.
The adsorption piece 7 is vacuum cup.
The chip in integrated circuit board can easily be captured by this chip grasping mechanism.
Specifically, adsorption piece is located at the outer end of rod segment two when original state.Actuator drives adsorption piece to move up and down What the chip being connected in the process on adsorption piece can be stablized moves up and down.When chip is displaced downwardly to setting position, adsorption piece stops Only adsorb, chip stablize into its for manufacturing procedure at.
Actuator can be such that adsorption piece is followed between the two at feeding and at blowing once driving in upper junction plate translation motion Gyration is made.
Certainly, actuator one and actuator two are located at holder both ends, and such structure avoids holder unilateral side stress, has Effect improves entire mechanical stability.
The setting of lower connecting plate can make being connected in the rack of attachment device of entire mechanism stable.

Claims (10)

1. the chip grasping mechanism in a kind of integrated circuit board connecting equipment, integrated circuit board connecting equipment include rack, special Sign is that mechanism includes lower connecting plate, holder, upper junction plate, actuator one, actuator two and adsorption piece, above-mentioned lower connection Plate is contacted with rack face and the two is fixedly connected with by fastener, and above-mentioned holder includes the rod segment one and rod segment two of straight section shape, rod segment Two are arranged in parallel with lower connecting plate, and the both ends of above-mentioned rod segment one are respectively fixedly connected in rod segment two and lower connecting plate, upper junction plate with Having between rod segment two can make the guide frame that upper junction plate is translated along two length direction of rod segment, above-mentioned actuator one be connected in bar In section one and actuator one is connected with upper junction plate, and actuator two is connected on upper junction plate and adsorption piece is connected to actuator two On.
2. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 1, which is characterized in that further include One is in the mounting plate of long plate shape, and mounting plate lower end is connected in rod segment one, and actuator one is connected in mounting plate upper end.
3. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 2, which is characterized in that the bar Also tool can increase the reinforcement structure of support intensity between Duan Yiyu rod segments two.
4. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 3, which is characterized in that described Reinforcement structure includes the reinforcing plate of rectangular triangle, and two right-angle sides of reinforcing plate are connected to rod segment one and rod segment two On.
5. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 4, which is characterized in that described to add The extended segment extended to its bottom edge, shape between the right-angle side and extended segment of above-mentioned reinforcing plate are all had at two right-angle sides of strong plate At the connection edge for being connected in rod segment one or rod segment two.
6. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 5, which is characterized in that the bar One side of section has recessed locating slot one, wherein connection is along at locating slot one together.
7. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 6, which is characterized in that the bar Two sides of section have recessed locating slot two, are in addition connected together along at locating slot two.
8. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 7, which is characterized in that described to add Strong plate is an integral structure with extended segment.
9. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 8, which is characterized in that described to lead Include being connected in the guide rail on two top of rod segment to structure, above-mentioned upper junction plate lower part is connected on guide rail, above-mentioned adsorption piece and drive Moving part one is respectively positioned on guide rail side.
10. the chip grasping mechanism in integrated circuit board connecting equipment according to claim 1, which is characterized in that described Adsorption piece be vacuum cup.
CN201810514843.1A 2018-05-25 2018-05-25 Chip grabbing mechanism in integrated circuit board connecting device Active CN108735652B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810514843.1A CN108735652B (en) 2018-05-25 2018-05-25 Chip grabbing mechanism in integrated circuit board connecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810514843.1A CN108735652B (en) 2018-05-25 2018-05-25 Chip grabbing mechanism in integrated circuit board connecting device

Publications (2)

Publication Number Publication Date
CN108735652A true CN108735652A (en) 2018-11-02
CN108735652B CN108735652B (en) 2020-08-25

Family

ID=63935368

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810514843.1A Active CN108735652B (en) 2018-05-25 2018-05-25 Chip grabbing mechanism in integrated circuit board connecting device

Country Status (1)

Country Link
CN (1) CN108735652B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140082417A (en) * 2012-12-24 2014-07-02 주식회사 에이에스티젯텍 Pick-up Device
CN203753965U (en) * 2014-02-19 2014-08-06 苏州博众精工科技有限公司 Part grasping and inspection mechanism
CN107900571A (en) * 2017-12-19 2018-04-13 无锡奥特维科技股份有限公司 Link handling device and cell piece string welding machine
CN108847399A (en) * 2018-05-24 2018-11-20 浙江工规科技有限公司 The attachment device of integrated circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140082417A (en) * 2012-12-24 2014-07-02 주식회사 에이에스티젯텍 Pick-up Device
CN203753965U (en) * 2014-02-19 2014-08-06 苏州博众精工科技有限公司 Part grasping and inspection mechanism
CN107900571A (en) * 2017-12-19 2018-04-13 无锡奥特维科技股份有限公司 Link handling device and cell piece string welding machine
CN108847399A (en) * 2018-05-24 2018-11-20 浙江工规科技有限公司 The attachment device of integrated circuit board

Also Published As

Publication number Publication date
CN108735652B (en) 2020-08-25

Similar Documents

Publication Publication Date Title
CN105158249A (en) Device for simultaneously detecting front and back surfaces of workpiece
US20190027388A1 (en) Electronic component mounting apparatus
CN108701620A (en) Electronic component processing unit
CN108847399A (en) The attachment device of integrated circuit board
KR20060120408A (en) Chip bonding device
CN108735652A (en) Chip grasping mechanism in integrated circuit board connecting equipment
TWI527661B (en) Material jacking apparatus
CN203467079U (en) Double-head surface mounting machine
CN218048716U (en) Double-valve full-asynchronous glue dispensing mechanism
CN208135464U (en) A kind of anti-two panels manipulator of unloader
CN217699890U (en) Multifunctional glue dispensing mechanism
CN215548004U (en) Clamp for printed circuit board
KR101925996B1 (en) Collect Transfer Device For PCB Automatic Input Device
CN210959335U (en) Full-automatic double track paster production line system of SM
CN212798582U (en) Automatic accurate unloading mechanism of going up of PCB board
CN212558402U (en) Tray loading attachment
CN102271489A (en) Translation mechanism of component inserter
CN210042733U (en) Material taking mechanism in chip mounter
CN107255783B (en) Flying probe testing device
CN214398917U (en) Display panel adsorption equipment
CN106944417B (en) A kind of dust suction jig for pcb board
CN220858528U (en) Circuit board processing device
CN206125630U (en) Two system's labellers that drive
CN106211745B (en) Sectional mounting workbench
CN113950240B (en) Conical external surface mounting equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant