CN108732748A - Mostly band Meta Materials absorber design method based on enhancing high order resonance mould absorptivity - Google Patents

Mostly band Meta Materials absorber design method based on enhancing high order resonance mould absorptivity Download PDF

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CN108732748A
CN108732748A CN201810560923.0A CN201810560923A CN108732748A CN 108732748 A CN108732748 A CN 108732748A CN 201810560923 A CN201810560923 A CN 201810560923A CN 108732748 A CN108732748 A CN 108732748A
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ring
height
basic structural
square ring
outer diameter
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董士奎
赵磊
杨森
贺志宏
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Harbin Institute of Technology Shenzhen
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    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
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    • GPHYSICS
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Abstract

The mostly band Meta Materials absorber design method based on enhancing high order resonance mould absorptivity that the invention discloses a kind of, is related to Meta Materials field.Mostly band Meta Materials absorber design method based on enhancing high order resonance mould absorptivity is applied in the Meta Materials absorber, and the Meta Materials absorber top layer includes a periodic micro structure, and the periodic micro structure is at least made of a pair of of basic structural unit;Reduce the spacing of at least a pair of of basic structural unit in the periodic micro structure of the Meta Materials absorber top layer.The present invention forms near-field coupling to achieve the purpose that improve the absorptivity of the high-order Plasmon Resonance pattern of the basic structural unit by reducing the spacing of at least a pair of of basic structural unit.

Description

基于增强高阶共振模吸收率的多带超材料吸收体设计方法Design method of multi-band metamaterial absorber based on enhanced high-order resonant mode absorptivity

技术领域technical field

本发明涉及超材料领域,尤其涉及一种基于增强高阶共振模吸收率的多带超材料吸收体设计方法。The invention relates to the field of metamaterials, in particular to a method for designing a multi-band metamaterial absorber based on enhanced high-order resonant mode absorption rate.

背景技术Background technique

超材料拥有着自然界中没有的特殊性质,这种特殊性质通常可以通过改变纳米结构而不是化学成分来操纵。超材料完美吸收体作为一种新型的超材料,由于其在某些光谱范围能够达到超过90%的吸收率,故近些年在热辐射体,生物传感,微型辐射热流计和红外探测方面的应用引起了很大的关注。通常研究的超材料吸收体的结构都是金属-电介质-金属的三层三明治结构。底部是金属薄膜,中间层是电介质薄膜,顶部是周期性金属振子。入射的电磁波能够引起周期性金属振子中电子的集体震荡,也就是激发出表面等离子共振模式。然而,基于三明治结构中的等离子共振的超材料吸收体,一个振子通常只能有一个吸收带,这个吸收带来自于基模。单带问题极大的限制了超材料吸收体的应用。Metamaterials have special properties not found in nature, which can usually be manipulated by changing the nanostructure rather than the chemical composition. As a new type of metamaterial, the perfect absorber of metamaterials has been widely used in thermal radiators, biosensing, microbolometers and infrared detection in recent years because it can achieve an absorption rate of more than 90% in certain spectral ranges. application has attracted great attention. The structure of metamaterial absorbers usually studied is a three-layer sandwich structure of metal-dielectric-metal. The bottom is a metal film, the middle layer is a dielectric film, and the top is a periodic metal oscillator. The incident electromagnetic wave can cause the collective oscillation of electrons in the periodic metal oscillator, which is to excite the surface plasmon resonance mode. However, for metamaterial absorbers based on plasmon resonance in a sandwich structure, a vibrator usually has only one absorption band, and this absorption band comes from the fundamental mode. The single band problem greatly limits the application of metamaterial absorbers.

为了解决单带问题,人们一般将不同尺寸大小的振子结合在一起,每一个尺寸的振子都可以形成一个吸收带,这样通过振子组合的方式得到多带。这种振子组合的方法只是利用了基模,所以当吸收带数多时,相对应的周期单元结构会非常复杂。实际上,除了基模外,振子也是能够激发出高阶共振模式的,只是高阶共振模式的吸收率非常低,所以振子组合的方法不能够利用高阶模。In order to solve the single-band problem, people usually combine oscillators of different sizes, and each size of oscillator can form an absorption band, so that multiple bands can be obtained through the combination of oscillators. This method of oscillator combination only utilizes the fundamental mode, so when there are many absorption bands, the corresponding periodic unit structure will be very complicated. In fact, in addition to the fundamental mode, the vibrator can also excite high-order resonance modes, but the absorption rate of the high-order resonance modes is very low, so the method of combining vibrators cannot use high-order modes.

发明内容Contents of the invention

针对上述问题,现提供一种旨在提高高阶等离子激元共振模式吸收率来设计多带吸收体的基于增强高阶共振模吸收率的多带超材料吸收体设计方法。In view of the above problems, a multi-band metamaterial absorber design method based on enhancing the high-order resonant mode absorptivity is provided, which aims to improve the high-order plasmon resonance mode absorptivity to design a multi-band absorber.

一种基于增强高阶共振模吸收率的多带超材料吸收体设计方法,所述超材料吸收体顶层包括一周期性微结构,所述周期性微结构至少由一对基本结构单元组成;A method for designing a multi-band metamaterial absorber based on enhanced high-order resonant mode absorptivity, the top layer of the metamaterial absorber includes a periodic microstructure, and the periodic microstructure is at least composed of a pair of basic structural units;

缩小所述超材料吸收体顶层的周期性微结构中至少一对基本结构单元的间距。reducing the distance between at least one pair of basic structural units in the periodic microstructure of the top layer of the metamaterial absorber.

优选的,经缩小后至少一对基本结构单元的间距在5nm至80nm之间。Preferably, the distance between at least one pair of basic structural units after shrinking is between 5nm and 80nm.

优选的,所述超材料吸收体包括:Preferably, the metamaterial absorber includes:

金属基底层,电介质薄膜沉积于所述金属基底层上电介质薄膜,所述周期性微结构刻蚀于所述电介质薄膜表面。The metal base layer, the dielectric film is deposited on the metal base layer, and the periodic microstructure is etched on the surface of the dielectric film.

优选的,所述周期性微结构由一对基本结构单元组成。Preferably, the periodic microstructure consists of a pair of basic structural units.

优选的,所述一对基本结构单元包括一矩形环和一圆环,所述圆环位于所述矩形环内,所述圆环中心与所述矩形环中心重合。Preferably, the pair of basic structural units includes a rectangular ring and a circular ring, the circular ring is located in the rectangular ring, and the center of the circular ring coincides with the center of the rectangular ring.

优选的,所述金属基底层采用银膜层,所述电介质薄膜采用硫化锌薄膜,所述周期性微结构采用银材质制成,或Preferably, the metal base layer is made of silver film, the dielectric film is made of zinc sulfide film, and the periodic microstructure is made of silver material, or

所述金属基底层采用铝膜层,所述电介质薄膜采用硫化锌薄膜,所述周期性微结构采用铝材质制成。The metal base layer is made of aluminum film, the dielectric film is made of zinc sulfide film, and the periodic microstructure is made of aluminum.

优选的,矩形环为正方环;Preferably, the rectangular ring is a square ring;

所述金属基底层高度为200nm;The height of the metal base layer is 200nm;

所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm;

基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm;

正方环高为200nm,内径为600nm,外径为740nm;The height of the square ring is 200nm, the inner diameter is 600nm, and the outer diameter is 740nm;

圆环与正方环间距为70nm。The distance between the circular ring and the square ring is 70nm.

优选的,矩形环为正方环;Preferably, the rectangular ring is a square ring;

所述金属基底层高度为200nm;The height of the metal base layer is 200nm;

所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm;

基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm;

正方环高为200nm,内径为560nm,外径为700nm;The height of the square ring is 200nm, the inner diameter is 560nm, and the outer diameter is 700nm;

圆环与正方环间距为50nm。The distance between the circular ring and the square ring is 50nm.

优选的,矩形环为正方环;Preferably, the rectangular ring is a square ring;

所述金属基底层高度为200nm;The height of the metal base layer is 200nm;

所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm;

基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm;

正方环高为200nm,内径为520nm,外径为660nm;The height of the square ring is 200nm, the inner diameter is 520nm, and the outer diameter is 660nm;

圆环与正方环间距为30nm。The distance between the circular ring and the square ring is 30nm.

优选的,矩形环为正方环;Preferably, the rectangular ring is a square ring;

所述金属基底层高度为200nm;The height of the metal base layer is 200nm;

所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm;

基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm;

正方环高为200nm,内径为480nm,外径为620nm;The height of the square ring is 200nm, the inner diameter is 480nm, and the outer diameter is 620nm;

圆环与正方环间距为10nm。The distance between the circular ring and the square ring is 10nm.

上述技术方案的有益效果:The beneficial effect of above-mentioned technical scheme:

本技术方案中,通过缩小至少一对基本结构单元的间距形成近场耦合从而达到提高该基本结构单元的高阶等离子激元共振模式的吸收率的目的。In the technical solution, the near-field coupling is formed by reducing the distance between at least one pair of basic structural units, so as to achieve the purpose of improving the absorption rate of the high-order plasmon resonance mode of the basic structural unit.

附图说明Description of drawings

图1是本发明所述超材料吸收体的一种实施例的立体图;Fig. 1 is a perspective view of an embodiment of a metamaterial absorber of the present invention;

图2是所述超材料吸收体的俯视图;Figure 2 is a top view of the metamaterial absorber;

图3是本发明中当缩小圆环和正方环间距时,第一种实施例的高阶等离子激元共振模式吸收率增强的示意图;Fig. 3 is a schematic diagram of the enhancement of the absorption rate of the high-order plasmon resonance mode of the first embodiment when the distance between the circular ring and the square ring is reduced;

图4(a-d)是本发明中当缩小圆环和正方环间距时,第一种实施例的高阶等离子激元共振模式的电场强度分布图;Figure 4 (a-d) is the electric field intensity distribution diagram of the high-order plasmon resonance mode of the first embodiment when the distance between the circular ring and the square ring is reduced in the present invention;

图5为第一种实施例的高阶等离子激元共振模式的吸收率的曲线图;Fig. 5 is a graph of the absorption rate of the high-order plasmon resonance mode of the first embodiment;

图6是本发明中当缩小圆环和正方环间距时,第二种实施例的高阶等离子激元共振模式吸收率增强的示意图;Fig. 6 is a schematic diagram of the enhancement of the absorption rate of the high-order plasmon resonance mode of the second embodiment when the distance between the circular ring and the square ring is reduced;

图7(a-d)时本发明中当缩小圆环和正方环间距时,第二种实施例的高阶等离子激元共振模式的电场强度分布图;Fig. 7 (a-d) is the electric field intensity distribution diagram of the high-order plasmon resonance mode of the second embodiment when the distance between the circular ring and the square ring is reduced in the present invention;

图8为第二种实施例的高阶等离子激元共振模式的吸收率的曲线图。FIG. 8 is a graph of the absorption rate of the high-order plasmon resonance mode of the second embodiment.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

需要说明的是,在不冲突的情况下,本发明中的实施例及实施例中的特征可以相互组合。It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

下面结合附图和具体实施例对本发明作进一步说明,但不作为本发明的限定。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

如图1-2所示,一种基于增强高阶共振模吸收率的多带超材料吸收体设计方法,所述超材料吸收体顶层包括一周期性微结构,所述周期性微结构至少由一对基本结构单元组成;As shown in Figure 1-2, a multi-band metamaterial absorber design method based on enhanced high-order resonance mode absorption rate, the top layer of the metamaterial absorber includes a periodic microstructure, and the periodic microstructure is at least composed of Composed of a pair of basic structural units;

缩小所述超材料吸收体顶层的周期性微结构中至少一对基本结构单元的间距。reducing the distance between at least one pair of basic structural units in the periodic microstructure of the top layer of the metamaterial absorber.

进一步地,经缩小后至少一对基本结构单元的间距在5nm至80nm之间。基本结构单元即为金属振子。Further, the distance between at least one pair of basic structural units after shrinking is between 5nm and 80nm. The basic structural unit is the metal vibrator.

在本实施例中,通过缩小至少一对基本结构单元的间距形成强烈的近场耦合从而达到提高该基本结构单元的高阶等离子激元共振模式的吸收率的目的。每一基本结构单元对应一基膜吸收带,当缩小成对基本结构单元间的距离时,在基本结构单元之间会形成强烈的近场耦合,可以增强高阶等离子激元共振模式的吸收率,形成一个额外的高阶吸收带。高阶吸收带和基模吸收带共同构成多带超材料完美吸收体。In this embodiment, a strong near-field coupling is formed by reducing the distance between at least one pair of basic structural units so as to achieve the purpose of increasing the absorption rate of the high-order plasmon resonance mode of the basic structural units. Each basic structural unit corresponds to an absorption band of the base film. When the distance between a pair of basic structural units is reduced, a strong near-field coupling will be formed between the basic structural units, which can enhance the absorption rate of the high-order plasmon resonance mode , forming an additional higher-order absorption band. The higher-order absorption bands and the fundamental mode absorption bands together constitute the perfect absorber of multi-band metamaterials.

优选的,所述超材料吸收体包括:Preferably, the metamaterial absorber includes:

金属基底层,电介质薄膜沉积于所述金属基底层上电介质薄膜,所述周期性微结构刻蚀于所述电介质薄膜表面。The metal base layer, the dielectric film is deposited on the metal base layer, and the periodic microstructure is etched on the surface of the dielectric film.

优选的,所述周期性微结构由一对基本结构单元组成。Preferably, the periodic microstructure consists of a pair of basic structural units.

作为第一种实施例,所述一对基本结构单元可以是但不限于一矩形环和一圆环,当基本结构单元包括一矩形环和一圆环时,所述圆环位于所述矩形环内,所述圆环中心与所述矩形环中心重合。As a first embodiment, the pair of basic structural units may be, but not limited to, a rectangular ring and a circular ring. When the basic structural unit includes a rectangular ring and a circular ring, the circular ring is located at the Inside, the center of the circular ring coincides with the center of the rectangular ring.

进一步地,所述金属基底层采用银(Ag)膜层,所述电介质薄膜采用硫化锌(ZnS)薄膜,所述周期性微结构采用银(Ag)材质制成。Further, the metal base layer is made of silver (Ag) film, the dielectric film is made of zinc sulfide (ZnS) film, and the periodic microstructure is made of silver (Ag).

情况1:矩形环为正方环;Case 1: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P is 1000nm, and the width P is 1000nm;

基本结构单元圆环高T1为200nm,内径L1为250nm,外径L2为460nm; The ring height T1 of the basic structural unit is 200nm, the inner diameter L1 is 250nm, and the outer diameter L2 is 460nm ;

正方环高为200nm,内径L3为600nm,外径L4为740nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 600nm, the outer diameter L4 is 740nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=70nm。The distance D between the circular ring and the square ring is (L 3 -L 2 )/2=70nm.

情况2:矩形环为正方环;Case 2: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,所述电介质薄膜的长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P of the dielectric film is 1000nm, and the width P is 1000nm;

基本结构单元圆环高T1为200nm,内径L1为250nm,外径L2为460nm; The ring height T1 of the basic structural unit is 200nm, the inner diameter L1 is 250nm, and the outer diameter L2 is 460nm ;

正方环高为200nm,内径L3为560nm,外径L4为700nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 560nm, the outer diameter L4 is 700nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=50nm。The distance D between the circular ring and the square ring is (L 3 -L 2 )/2=50nm.

情况3:矩形环为正方环;Case 3: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,所述电介质薄膜的长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P of the dielectric film is 1000nm, and the width P is 1000nm;

基本结构单元圆环高T1为200nm,内径L1为250nm,外径L2为460nm; The ring height T1 of the basic structural unit is 200nm, the inner diameter L1 is 250nm, and the outer diameter L2 is 460nm ;

正方环高为200nm,内径L3为520nm,外径L4为660nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 520nm, the outer diameter L4 is 660nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=30nm。The distance D between the circular ring and the square ring is (L 3 -L 2 )/2=30nm.

情况4:矩形环为正方环;Case 4: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,所述电介质薄膜的长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P of the dielectric film is 1000nm, and the width P is 1000nm;

基本结构单元圆环T1高为200nm,内径L1为250nm,外径L2为460nm;The basic structural unit ring T1 has a height of 200nm, an inner diameter L1 of 250nm, and an outer diameter L2 of 460nm ;

正方环高为200nm,内径L3为480nm,外径L4为620nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 480nm, the outer diameter L4 is 620nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=10nm。The distance D between the circular ring and the square ring is (L 3 −L 2 )/2=10 nm.

基于上述的情况1-4,也就是当圆环与正方环间距D从70nm缩小为50nm,30nm,10nm时,超材料吸收体的光谱吸收率如图3所示,吸收峰f3的电场z方向的分布如图4(a-d)所示。吸收峰f1对应于正方的环基本等离子激元共振模式,f2对应于圆环的基本等离子激元共振模式,也就是基模。吸收峰f3对应于正方环的高阶等离子激元共振模式,也就是高阶模。当缩短正方环和圆环的距离时,在正方环和圆环之间形成强烈的近场耦合作用,导致高阶等离子激元共振模式的z方向的电场强度的最大值从5.6增加到10,16,21,而高阶等离子激元共振模式的吸收率也从17.6%增加到37.4%,67.7%,95.3%。Based on the above situations 1-4, that is, when the distance D between the ring and the square ring is reduced from 70nm to 50nm, 30nm, and 10nm, the spectral absorptivity of the metamaterial absorber is shown in Figure 3, and the electric field z direction of the absorption peak f3 The distribution of is shown in Fig. 4(ad). The absorption peak f 1 corresponds to the fundamental plasmon resonance mode of the square ring, and f 2 corresponds to the fundamental plasmon resonance mode of the ring, that is, the fundamental mode. The absorption peak f 3 corresponds to the higher-order plasmon resonance mode of the square ring, that is, the higher-order mode. When the distance between the square ring and the ring is shortened, a strong near-field coupling is formed between the square ring and the ring, resulting in an increase in the maximum value of the electric field intensity in the z direction of the high-order plasmon resonance mode from 5.6 to 10, 16, 21, and the absorption of higher-order plasmon resonance modes also increased from 17.6% to 37.4%, 67.7%, and 95.3%.

综上所述,如图5所示,当方环振子和圆环振子的间距从110nm缩小到80nm时,高阶模式的吸收率刚开始基本没有变化,当方环振子和圆环振子的间距从80nm缩小到5nm时,吸收率随着间距的缩小急剧增加。在本实施例中,利用了振子进场耦合的方法,可将高阶等离子激元共振模式的吸收率从17.6%增加到了95.3%,实现了利用两个振子产生的三个吸收带的目的。In summary, as shown in Figure 5, when the distance between the square ring oscillator and the circular ring oscillator is reduced from 110nm to 80nm, the absorption rate of the high-order mode basically does not change at the beginning. When shrinking to 5nm, the absorptivity increases sharply with the shrinking pitch. In this embodiment, the method of in-field coupling of oscillators is used to increase the absorption rate of the high-order plasmon resonance mode from 17.6% to 95.3%, realizing the purpose of using three absorption bands generated by two oscillators.

结合图1-图2所示,作为第二种实施例,所述金属基底层可采用铝(Al)膜层,所述电介质薄膜采用硫化锌(ZnS)薄膜,所述周期性微结构采用铝(Al)材质制成。As shown in Fig. 1-Fig. 2, as a second embodiment, the metal base layer can adopt aluminum (Al) film layer, the dielectric thin film adopts zinc sulfide (ZnS) thin film, and the periodic microstructure adopts aluminum (Al) material.

情况1:矩形环为正方环;Case 1: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P is 1000nm, and the width P is 1000nm;

基本结构单元圆环高T1为200nm,内径L1为250nm,外径L2为460nm; The ring height T1 of the basic structural unit is 200nm, the inner diameter L1 is 250nm, and the outer diameter L2 is 460nm ;

正方环高为200nm,内径L3为600nm,外径L4为740nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 600nm, the outer diameter L4 is 740nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=70nm。The distance D between the circular ring and the square ring is (L 3 -L 2 )/2=70nm.

情况2:矩形环为正方环;Case 2: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,所述电介质薄膜的长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P of the dielectric film is 1000nm, and the width P is 1000nm;

基本结构单元圆环高T1为200nm,内径L1为250nm,外径L2为460nm; The ring height T1 of the basic structural unit is 200nm, the inner diameter L1 is 250nm, and the outer diameter L2 is 460nm ;

正方环高为200nm,内径L3为560nm,外径L4为700nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 560nm, the outer diameter L4 is 700nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=50nm。The distance D between the circular ring and the square ring is (L 3 -L 2 )/2=50nm.

情况3:矩形环为正方环;Case 3: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,所述电介质薄膜的长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P of the dielectric film is 1000nm, and the width P is 1000nm;

基本结构单元圆环高T1为200nm,内径L1为250nm,外径L2为460nm; The ring height T1 of the basic structural unit is 200nm, the inner diameter L1 is 250nm, and the outer diameter L2 is 460nm ;

正方环高为200nm,内径L3为520nm,外径L4为660nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 520nm, the outer diameter L4 is 660nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=30nm。The distance D between the circular ring and the square ring is (L 3 -L 2 )/2=30nm.

情况4:矩形环为正方环;Case 4: The rectangular ring is a square ring;

金属基底层高度T3为200nm;The height T3 of the metal base layer is 200nm;

电介质薄膜高度T2为80nm,所述电介质薄膜的长P为1000nm,宽P为1000nm; The height T2 of the dielectric film is 80nm, the length P of the dielectric film is 1000nm, and the width P is 1000nm;

基本结构单元圆环T1高为200nm,内径L1为250nm,外径L2为460nm;The basic structural unit ring T1 has a height of 200nm, an inner diameter L1 of 250nm, and an outer diameter L2 of 460nm ;

正方环高为200nm,内径L3为480nm,外径L4为620nm,宽度W=(L4-L3)/2=70nm;The height of the square ring is 200nm, the inner diameter L3 is 480nm, the outer diameter L4 is 620nm, and the width W = (L4 - L3)/ 2 = 70nm;

圆环与正方环间距D为(L3–L2)/2=10nm。The distance D between the circular ring and the square ring is (L 3 −L 2 )/2=10 nm.

对于上述情况1-4,也就是当圆环与正方环间距D从70nm缩小为50nm,30nm,10nm时,超材料吸收体的光谱吸收率如图6所示,吸收峰f3的电场z方向的分布如图7(a-d)所示。吸收峰f1和f2分别对应于正方环和圆环的基本等离子激元共振模式,也就是基模。吸收峰f3对应于正方环的高阶等离子激元共振模式。当缩短正方环和圆环的距离时,在正方环和圆环之间形成强烈的近场耦合作用,导致高阶等离子激元共振模式的z方向的电场强度的最大值从3.3增加到6.5,10.3至14.3,而高阶等离子激元共振模式的吸收率也成功的从14%增加到33%,60%至89%。所以本实施例中,利用了振子进场耦合的方法,成功的将高阶等离子激元共振模式的吸收率从14%增加到了89%,成功的利用两个振子实现的三个吸收带。For the above cases 1-4, that is, when the distance D between the ring and the square ring is reduced from 70nm to 50nm, 30nm, and 10nm, the spectral absorptivity of the metamaterial absorber is shown in Figure 6, and the electric field z direction of the absorption peak f 3 The distribution of is shown in Fig. 7(ad). The absorption peaks f1 and f2 correspond to the fundamental plasmon resonance modes of the square ring and the ring, that is, the fundamental mode, respectively. The absorption peak f3 corresponds to the higher-order plasmon resonance mode of the square ring. When the distance between the square ring and the ring is shortened, a strong near-field coupling is formed between the square ring and the ring, resulting in the maximum value of the electric field intensity in the z direction of the high-order plasmon resonance mode increasing from 3.3 to 6.5, 10.3 to 14.3, while the absorption of higher-order plasmon resonance modes was also successfully increased from 14% to 33%, and from 60% to 89%. Therefore, in this embodiment, the method of coupling the vibrator into the field is used to successfully increase the absorption rate of the high-order plasmon resonance mode from 14% to 89%, and successfully utilize the three absorption bands realized by two vibrators.

如图8所示,当方环振子和圆环振子的间距从110nm缩小到80nm时,高阶模式的吸收率刚开始基本没有变化,当方环振子和圆环振子的间距从80nm缩小到5nm时,吸收率随着间距的缩小急剧增加。As shown in Figure 8, when the distance between the square ring oscillator and the circular ring oscillator is reduced from 110nm to 80nm, the absorption rate of the high-order mode basically does not change at the beginning. When the distance between the square ring oscillator and the circular ring oscillator is reduced from 80nm to 5nm, The absorptivity increases sharply with the shrinking of the spacing.

进一步地,作为举例而非限定,电介质薄膜可以是但不限于二氧化硅(SiO2)、硅(Si)、三氧化二铝(Al2O3)、硫化锌(ZnS)等。Further, for example and not limitation, the dielectric film may be but not limited to silicon dioxide (SiO2), silicon (Si), aluminum oxide (Al2O3), zinc sulfide (ZnS) and the like.

金属基底层可以是但不限于金、银、铝、铜等。The metal base layer can be, but is not limited to, gold, silver, aluminum, copper, and the like.

周期性微结构可以是但不限于金、银、铝、铜等。Periodic microstructures can be, but are not limited to, gold, silver, aluminum, copper, and the like.

顶层周期性微结构中成对的金属振子可以是但不限于同心的正方环和圆环。The paired metal oscillators in the top periodic microstructure can be but not limited to concentric square rings and circular rings.

以上所述仅为本发明较佳的实施例,并非因此限制本发明的实施方式及保护范围,对于本领域技术人员而言,应当能够意识到凡运用本发明说明书及图示内容所作出的等同替换和显而易见的变化所得到的方案,均应当包含在本发明的保护范围内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the implementation and protection scope of the present invention. For those skilled in the art, they should be able to realize that all equivalents made by using the description and illustrations of the present invention The solutions obtained by replacement and obvious changes shall all be included in the protection scope of the present invention.

Claims (10)

1.一种增强高阶共振模式吸收率设计多带超材料吸收体的方法,所述超材料吸收体顶层包括一周期性微结构,所述周期性微结构至少由一对基本结构单元组成;其特征在于:1. A method for enhancing high-order resonance mode absorptivity to design multi-band metamaterial absorbers, the metamaterial absorber top layer includes a periodic microstructure, and the periodic microstructure is at least made up of a pair of basic structural units; It is characterized by: 缩小所述超材料吸收体顶层的周期性微结构中至少一对基本结构单元的间距。reducing the distance between at least one pair of basic structural units in the periodic microstructure of the top layer of the metamaterial absorber. 2.根据权利要求1所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,经缩小后至少一对基本结构单元的间距在5nm至80nm之间。2. The method for designing a multi-band metamaterial absorber for enhancing high-order resonance mode absorptivity according to claim 1, wherein the distance between at least one pair of basic structural units is between 5nm and 80nm after shrinking. 3.根据权利要求1所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,所述超材料吸收体包括:3. the method for designing multi-band metamaterial absorbers according to claim 1, wherein the metamaterial absorbers comprise: 金属基底层,电介质薄膜沉积于所述金属基底层上电介质薄膜,所述周期性微结构刻蚀于所述电介质薄膜表面。The metal base layer, the dielectric film is deposited on the metal base layer, and the periodic microstructure is etched on the surface of the dielectric film. 4.根据权利要求1或3所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,所述周期性微结构由一对基本结构单元组成。4. The method for designing a multi-band metamaterial absorber for enhancing high-order resonance mode absorptivity according to claim 1 or 3, wherein the periodic microstructure is composed of a pair of basic structural units. 5.根据权利要求4所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,所述一对基本结构单元包括一矩形环和一圆环,所述圆环位于所述矩形环内,所述圆环中心与所述矩形环中心重合。5. the method for designing multi-band metamaterial absorbers with enhanced high-order resonance mode absorptivity according to claim 4, is characterized in that, the pair of basic structural units comprises a rectangular ring and a circular ring, and the circular ring Located in the rectangular ring, the center of the circular ring coincides with the center of the rectangular ring. 6.根据权利要求5所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,所述金属基底层采用银膜层,所述电介质薄膜采用硫化锌薄膜,所述周期性微结构采用银材质制成,或6. the method for designing multi-band metamaterial absorbers according to the enhanced high-order resonance mode absorptivity according to claim 5, is characterized in that, described metal base layer adopts silver film layer, and described dielectric thin film adopts zinc sulfide thin film, so The periodic microstructure is made of silver material, or 所述金属基底层采用铝膜层,所述电介质薄膜采用硫化锌薄膜,所述周期性微结构采用铝材质制成。The metal base layer is made of aluminum film, the dielectric film is made of zinc sulfide film, and the periodic microstructure is made of aluminum. 7.根据权利要求6所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,矩形环为正方环;7. the method for designing multi-band metamaterial absorbers according to claim 6, wherein the rectangular ring is a square ring; 所述电介质薄膜的长为1000nm,宽为1000nm;The length of the dielectric film is 1000nm, and the width is 1000nm; 基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm; 正方环高为200nm,内径为600nm,外径为740nm;The height of the square ring is 200nm, the inner diameter is 600nm, and the outer diameter is 740nm; 圆环与正方环间距为70nm。The distance between the circular ring and the square ring is 70nm. 8.根据权利要求6所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,矩形环为正方环;8. The method for designing multi-band metamaterial absorbers according to claim 6, wherein the rectangular ring is a square ring; 所述金属基底层高度为200nm;The height of the metal base layer is 200nm; 所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm; 基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm; 正方环高为200nm,内径为560nm,外径为700nm;The height of the square ring is 200nm, the inner diameter is 560nm, and the outer diameter is 700nm; 圆环与正方环间距为50nm。The distance between the circular ring and the square ring is 50nm. 9.根据权利要求6所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,矩形环为正方环;9. The method for designing multi-band metamaterial absorbers according to claim 6, wherein the rectangular ring is a square ring; 所述金属基底层高度为200nm;The height of the metal base layer is 200nm; 所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm; 基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm; 正方环高为200nm,内径为520nm,外径为660nm;The height of the square ring is 200nm, the inner diameter is 520nm, and the outer diameter is 660nm; 圆环与正方环间距为30nm。The distance between the circular ring and the square ring is 30nm. 10.根据权利要求6所述的增强高阶共振模式吸收率设计多带超材料吸收体的方法,其特征在于,矩形环为正方环;10. The method for designing multi-band metamaterial absorbers according to claim 6, wherein the rectangular ring is a square ring; 所述金属基底层高度为200nm;The height of the metal base layer is 200nm; 所述电介质薄膜高度为80nm,长为1000nm,宽为1000nm;The height of the dielectric film is 80nm, the length is 1000nm, and the width is 1000nm; 基本结构单元圆环高为200nm,内径为250nm,外径为460nm;The ring height of the basic structural unit is 200nm, the inner diameter is 250nm, and the outer diameter is 460nm; 正方环高为200nm,内径为480nm,外径为620nm;The height of the square ring is 200nm, the inner diameter is 480nm, and the outer diameter is 620nm; 圆环与正方环间距为10nm。The distance between the circular ring and the square ring is 10nm.
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